TWI576931B - Method for manufacturing electronic component package - Google Patents

Description

Method for manufacturing electronic component package

The present invention relates to a method of manufacturing a package for sealing an electronic component such as a semiconductor wafer with a resin, and more particularly to a method for forming a shield for a shield of a wafer in an electromagnetic shielding package, and a PoP (Package on Package; A method of forming a via hole for electrically connecting upper and lower packages in a stacking technique.

In a package in which an electronic component such as a semiconductor wafer is placed in a horizontal direction (surface direction) and sealed with a resin, in order to prevent interference of components close to each other, it is necessary to electromagnetically shield (shield) the components in the package.

A general configuration example of the case where electromagnetic shielding is performed in the package will be described with reference to Fig. 1 . In addition, in each of the drawings referred to in the following description, the size ratio of each part is appropriately changed for the sake of simplicity, and the shape of the actual product is not accurately indicated. 1(a) is a cross-sectional view of the semiconductor package 1, and FIG. 1(b) is a top view (top view) of the semiconductor package 1 shown in FIG. 1(a). Fig. 1(a) is a cross-sectional view taken along line A-A' of Fig. 1(b). In the manufacturing process of the semiconductor package 1, first, the electrode terminal 21 provided in the semiconductor wafer 20 is connected to the wiring 11 on the substrate 10 through a bump 22, and is made of a thermosetting resin. A resin layer 30 composed of a material such as epoxy is sealed. Next, in the resin layer 30 The surface 301 (upper surface) forms a groove 31 of a predetermined pattern and exposes the ground electrode 12 on the substrate 10. Then, the shield member 32 is embedded in the formed groove 31, and a coating film or the like is applied. By the above steps, electromagnetic interference between the components in the semiconductor package 1 can be shielded.

In addition, with the miniaturization of the electronic device, the demand for the high density of the semiconductor package is greatly increased. As a technique for responding to such a demand, a TMV (Through Mold Via) using a PoP type wafer laminate structure is provided. Round perforated conduction method.

An example of a PoP type wafer laminate structure of the TMV method will be described with reference to Fig. 2 . Fig. 2(a) shows the lower package 1a and the upper package 1b in the PoP, and Fig. 2(b) shows a state in which the two are laminated. The electronic components and the like disposed on the upper package 1b are appropriately omitted, and members having the same or similar functions as those of FIG. 1 are distinguished by adding predetermined characters to the end of the same symbol. The resin sealing step for the semiconductor wafer 20a or various wirings and the like is the same as the example shown in FIG. In FIG. 2(a), in the lower package 1a, a hole 31a (for example, a circular opening) that reaches the upper and lower connection electrodes 13a on the substrate 10a is formed instead of the groove 31. In the upper package 1b, the bead 33 is mounted on the upper and lower connection electrodes 13b provided on the back surface (the lower surface in the drawing). Next, the upper package 1b is placed on the lower package 1a so that the beads 33 on the upper and lower connection electrodes 13b are fitted in the holes 31a. When it is confirmed that the positional relationship between the upper and lower packages 1b and 1a is appropriate, the bead 33 is melted by reflow heating to fill the hole 31a, and the lower connection electrode is connected to the upper and lower packages 1b and 1a. The connection holes 34 of 13b, 13a. Further, instead of the bead 33 on the upper and lower connection electrodes 13b, a conductive material may be filled in the hole 31a.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-26805

In the above examples, the formation of the shielding trench or the via hole is conventionally performed by laser processing. This processing method is carried out by melting the resin material by laser irradiation, and is widely used because it is not deteriorated by abrasion of the cutting tool or the like.

However, the laser processing is easily affected by the thickness deviation or the bending of the package. For example, if the thickness of the package is smaller than the assumed value, there is a case where the laser intensity is too large, and the wiring is cut, the substrate is damaged, and the like. There is a problem that it is necessary to perform precise control to complicate processing.

In one of the methods for avoiding such a problem, Patent Document 1 describes a method of coating a sealing resin in a sealed space between a substrate frame and a molding die by crimping the wiring on the substrate frame. The columnar protrusions are provided in the mold to form through holes for the through holes.

However, in the method described in Patent Document 1, when there is a slight gap between the front end of the columnar projection and the wiring, the through hole is not formed, and in order to avoid this, the crimping is caused by the strong pressure bonding. Happening.

In order to correctly form the depth of the groove or the hole, although it is currently best to perform the milling process, the worn cutting tool must be frequently replaced.

The present invention has been made in view of the above circumstances, and an object thereof is to form a shield trench or a pass on a sealing resin without causing damage to a wiring on a substrate or the substrate in a manufacturing step of the electronic component package. Hole for hole.

In order to solve the above problems, the method for manufacturing an electronic component package of the present invention is to form a trench or a hole reaching the electrode pad on a surface of a sealing resin that seals an electronic component and an electrode pad that are disposed on a substrate. Method, characterized in that it comprises: (a) a first step of forming a groove or a hole on the surface of the sealing resin to form a preliminary groove or a preliminary hole which does not reach the electrode pad by molding; and (b) The second step of exposing the electrode pad by processing the depth of the preliminary trench or the preliminary hole formed in the first step.

In the method of manufacturing an electronic component package of the present invention, a position at which a groove or a hole for exposing an electrode pad on a surface of a sealing resin for sealing an electronic component and an electrode pad is formed by molding of the mold A preliminary groove or a preliminary hole having a depth to the extent of the electrode pad (first step). Then, the electrode pad is exposed by processing the depth of the preliminary trench or the preliminary hole, whereby the preliminary trench or the preliminary hole is used as a shield trench or a via hole (second step) . In the second step, the depth of the preliminary trench or the preliminary hole can be increased, for example, by grinding or laser processing.

Here, the term "surface of the sealing resin" means the surface of the sealing resin on the side opposite to the surface in contact with the substrate in each electronic component package (in the example shown in FIGS. 1 and 2, 301, Symbols of 301a and 301b). Further, the above-mentioned "electrode pad" includes a ground electrode, a terminal provided in the electronic component, and a wiring electrode connected thereto. Further, the above-mentioned "sealing resin" can contain a filler (for example, particles such as SiO ₂ ) which prevents bending of the package due to shrinkage of the resin in a high ratio, and is well known in the art.

According to the above configuration, in the formation of the trench or the hole reaching the electrode pad on the substrate, since the preliminary trench or the preliminary hole formed in the first step does not need to reach the electrode pad, there is no such thing as in Patent Document 1. The case where the mold is pressed against the electrode pad to give a flaw. Further, by performing the processing in the first step in the first step to complete the processing in the middle, it is possible to suppress the wear of the cutting tool when the second step is performed by the polishing process. In addition, in laser processing In the case of performing the second step, since the intensity of the irradiation laser can be suppressed depending on the depth of the preliminary groove or the preliminary hole, it is difficult to cause damage to the substrate or the wiring. Therefore, it is possible to form a shield trench or a via hole on the sealing resin without damaging the wiring on the substrate or the substrate.

The first step preferably includes the step of holding the substrate from the back side by using a mold and another mold having a protruding pin having a height lower than the depth of the groove or the hole at the bottom of the chamber. The mold abuts the other mold and fastens the mold, and the chamber is filled with a resin material. Thereby, the preliminary groove or the preliminary hole can be formed easily.

The above-mentioned "one mold" and "another mold" are, for example, an upper mold (or a lower mold) and a lower mold (or an upper mold), and their respective correspondences are not intended to change the scope of the present invention. For example, in the case where the "other mold" is the upper mold, the "bottom" is located above the vertical line, and the term "bottom" in the present invention is not synonymous with the lower portion.

Further, the "bottom" of the above-mentioned "bottom" also includes a top surface of the head such as an ejector pin which is flush with the bottom surface of the chamber. The terms "bottom", "head" and "top" are also defined in the vertical line as in the above.

In the above first step, the preliminary groove or the preliminary hole may be formed by the projecting pin provided on the top surface of the head of the ejector pin projecting from the bottom surface of the chamber. Thereby, it is easy to take out the electronic component package from the chamber.

According to the method of manufacturing an electronic component package of the present invention, it is possible to form a shield trench or a via hole on the sealing resin without damaging the wiring on the substrate or the substrate.

1, 1a, 1b‧‧‧ semiconductor package

10, 10a, 10b‧‧‧ substrate

11, 11a, 11b‧‧‧ wiring

12‧‧‧Ground electrode

13a, 13b‧‧‧ upper and lower connecting electrodes

20, 20a‧‧‧ semiconductor wafer

21, 21a‧‧‧ electrode terminals

22, 22a‧‧‧Bumps

30, 30a, 30b‧‧‧ resin layer

31‧‧‧ trench

31a‧‧‧ hole

32‧‧‧Shielding materials

33‧‧‧ welding beads

34‧‧‧Connecting through holes

301, 301a, 301b‧‧‧ surface of the resin layer

40, 40b, 40c, 40d, 40e‧‧‧

41, 41b, 41d, 51b‧‧‧ Keeping Department

50, 50b, 50d, 500, 500a‧‧‧

51, 41b, 41d‧‧‧ chamber

52, 42b, 42d‧‧‧ side gate

53, 43b, 53c, 43d, 53e‧‧‧

54, 54a, 44b, 44d‧‧‧ top sales

55, 55a, 45b, 45d‧‧‧ head

56, 46b, 56c, 46d, 56e‧‧‧ fish eye pit

57, 47b, 57c, 47d, 57e‧‧‧ through holes

58, 58a‧‧‧Flange

501, 501a‧‧‧ chamber side members

502, 502a‧‧‧ chamber bottom member

503, 503a‧‧‧ base plate

504, 504a, 505, 505a‧‧‧ elastic members

61, 61b, 61c‧‧‧ substrates

61d, 61e‧‧‧ single substrate

62, 62b, 62c, 62d, 62e‧‧‧ semiconductor wafer

63, 63b, 63c, 63d, 63e‧‧‧ upper and lower connecting electrodes

64, 64b, 64c, 64d, 64e‧‧‧ resin materials

65, 65b, 65c, 65d, 65e‧‧‧ resin layer

66, 66b, 66d‧‧‧ Gates

67‧‧‧Preparation hole

68, 68b, 68c, 68d, 68e‧ ‧ holes

Surface of 651, 651b, 651c, 651d, 651e‧‧‧ resin layer

652‧‧‧Residual resin layer

700, 700a‧‧‧ release film

800‧‧‧through holes

801‧‧‧Metal frame

802‧‧‧Adhesive film

Fig. 1 is a cross-sectional view (a) and a plan view (b) showing a structural example of a semiconductor package in which a general trench for shielding is formed.

2 is a cross-sectional view (a) in a state in which a lower package is inlaid with solder beads, and a cross-sectional view in a state in which an upper package is connected to a lower package volume layer, in an example of a PoP type wafer laminated structure of the TMV method. (b).

3 is a first stage (a), a second stage (b), a third stage (c), and a fourth stage (d) of the first step of the method of manufacturing the electronic component package according to the embodiment of the present invention. .

Fig. 4 is a perspective view (a) and a modification (b) of the ejector pin provided with the projection pin in the same embodiment.

Fig. 5 is a cross-sectional view (a) of a preliminary hole formed in the same embodiment, and a cross-sectional view (b) of a hole formed by increasing the depth of the preliminary hole by machining.

Fig. 6 shows a first stage (a), a second stage (b), a third stage (c), and a fourth stage (d) in another example of the method of manufacturing the electronic component package.

Fig. 7 is a first stage (a), a second stage (b), and a third stage (c) in still another example of the method of manufacturing the electronic component package.

Fig. 8 is a plan view (a) and a cross-sectional view (b) of a metal plate and an adhesive sheet in a state in which a plurality of single-piece substrates are arranged in a hollow region.

Fig. 9 is a first stage (a), a second stage (b), a third stage (c), and a fourth stage (d) in an example of a method of manufacturing an electronic component package in which a plurality of single-piece substrates are sealed.

Fig. 10 is a first stage (a), a second stage (b), and a third stage (c) in still another example of a method of manufacturing an electronic component package in which a plurality of single-piece substrates are sealed.

Hereinafter, a method of manufacturing an electronic component package according to an embodiment of the present invention will be described with reference to FIGS. 3 to 5. In the following description, members having the same or similar functions as those of the above-described drawings are denoted by appropriately adding predetermined characters at the end of the same or similar symbols, and the description thereof will be omitted. In the present embodiment, a method of forming the via hole used in the PoP type wafer laminated structure of the TMV method will be described. However, a similar method can be applied to the formation of the trench for shielding as described below.

In Fig. 3, there is shown a cross-sectional view for explaining each stage of the first step of the present invention. In addition, illustration of the electrode terminal, the wiring, and the bump for mounting the semiconductor wafer 62 on the substrate 61 is omitted.

First, as shown in FIG. 3(a), a state in which the substrate 61 can be held upside down is reversed (that is, the semiconductor wafer 62 and the upper and lower connection electrodes 63 mounted on the substrate 61 are placed on the lower surface side). The upper mold 40 of the holding portion 41 of the state) and the lower mold 50 having the chamber 51 are heated to a predetermined temperature (above the melting point of the resin material 64) (the pre-heating of the mold is also performed in each of the following examples). Next, the lower mold 50 is raised with respect to the fixed upper mold 40 (in the direction of the black thick arrow in the drawing), and is abutted as shown in Fig. 3(b), and the mold is fastened. Then, the resin material 64 is filled in the chamber 51 from the side gate 52 provided on the lower mold 50. Further, the chamber 51 may be covered by a release film for preventing the resin material 64 from adhering to the lower mold 50 during demolding, but the illustration is omitted.

At the bottom of the chamber 51, a plurality of projecting pins 53 having a predetermined height are provided at positions opposing the upper and lower connecting electrodes 63 on the substrate 61. The predetermined height differs depending on the depth of the chamber 51 or the thickness of the upper and lower connection electrodes 63. However, as shown in FIG. 3(b), it is preferable that the upper and lower molds 40 and 50 are brought into contact with each other. When the mold is fastened, a height of, for example, a gap of 100 to 300 μm is formed with respect to the upper and lower connection electrodes 63.

Further, a through hole 57 having a fish face portion 56 is provided at the bottom of the chamber 51, and before the first step, the ejector pin 54 is inserted into the through hole 57 from the upper direction in the drawing, and the top is pushed. The head 55 of the delivery pin 54 is housed in the fisheye pit portion 56. The depth of the fisheye sump 56 or the height of the head 55, and the shape thereof, is preferably such that the upper surface of the head portion 55 and the chamber 51 are placed when the head portion 55 has been received in the fish eye sump portion 56. The bottom surface is formed in the same horizontal plane and is appropriately determined. After a predetermined period of time required for the resin material 64 to harden, as shown in FIG. 3(c), the lower mold 50 is lowered while maintaining the substrate 61 held in the holding portion 41 of the upper mold 40 (the white thick arrow in the drawing) The direction) is applied to the ejector pin 54 by applying a force in the direction of the black thin arrow in the drawing to perform mold opening. When the lower mold 50 is further lowered from this state, a preliminary hole is formed on the surface 651 of the resin layer 65 (corresponding to the sealing resin of the present invention) and immediately above the upper and lower connection electrodes 63 (the lower side in FIG. 3). The package structure of 67 is taken out while being held by the holding portion 41 (Fig. 3(d)). The gate portion 66 that is released from the side gate 52 can be removed in any step.

Further, in the present embodiment, the projection pin 53 is also provided on the head portion 55 of the ejector pin 54. An enlarged perspective view of the ejector pin 54 is shown in Fig. 4(a). The protruding pin 53 preferably has a pulling slope (tapering) of, for example, about 5 degrees so as to be easily released from the resin layer 65. Further, the shape of the upper surface of the head portion 55 is not limited to the circular shape as shown in the drawing, as in the case of the head portion 55a shown in FIG. 4(b), and may be a shape lacking a part of the circle, Either an elliptical shape or other polygonal shape prevents the rotation of the ejector pin 54a from shifting the position of the protruding pin 53.

Fig. 5(a) is a cross-sectional view showing a preliminary hole 67 formed by the first step shown in Fig. 3 and the projection pin 53 shown in Fig. 4. In addition, in the figure, the upper and lower lines in the figure are reversed from FIG. In the preliminary hole 67, the deepest portion does not reach the upper and lower connection electrodes 63, and at this time, the upper and lower connection electrodes 63 are covered and protected by the residual resin layer 652.

By removing the preliminary hole 67 by laser processing or low-intensity laser processing, the residual resin layer 652 between the bottom of the preliminary hole 67 and the upper surface of the upper and lower connection electrodes 63 is removed, as shown in FIG. 5(b). The upper and lower connection electrodes 63 are exposed. By this second step, a hole 68 having the same function as the hole 31a shown in Fig. 2 is formed. That is, when the depth of the preliminary hole 67 is D1, the depth of the hole 68 is D2, and the thickness of the residual resin layer 652 is T (preferably 100 to 300 μm), T=D2-D1 is established.

In the polishing process, since the cutting depth in the height direction (the vertical direction in FIG. 5) can be accurately controlled, it is difficult to break the upper and lower connection electrodes 63 or the substrate 61, or the residual of the filler particles generated during the laser processing. Therefore, it is particularly suitable as the processing method employed in the second step. Further, according to the present embodiment, since the thickness of the residual resin layer 652 to be cut is small, the wear of the cutting tool can be suppressed.

Further, in the case where the laser processing is used in the second step, since the thickness of the molten residual resin layer 652 is small, the laser intensity can be suppressed, and the damage of the upper and lower connection electrodes 63 or the substrate 61 can be reduced.

Therefore, by the first and second steps described above, the hole 68 for connecting the through holes can be formed on the surface 651 of the resin layer 65 of the semiconductor package without breaking the upper and lower connection electrodes 63 or the substrate 61.

In addition, the components of the upper and lower connection electrodes 13a, 13b, and 63 shown in FIGS. 2, 3, and 5 are the same as those of a general wiring electrode, and these names are for convenience of indicating functional features.

[Modification]

In the above embodiment, since the ejector pin 54 has a larger diameter core portion 55, therefore, although the fish eye hole portion 56 is provided at the bottom of the chamber 51, the head portion 55 may be the same diameter as the core portion of the ejector pin 54. In other words, when the ejector pin 54 is a rod-shaped pin as a whole, the fish eye hole portion 56 is not required, and the ejector pin 54 can be inserted into the through hole 57 from the lower direction in the drawing. In this case, it is only necessary to provide a support for preventing falling on the lower portion of the ejector pin 54.

Further, the height of the projection pin 53 shown in FIGS. 3 and 4 may be changed to reach the upper and lower connection electrodes 63, and the hole 68 may be formed only by the mold. Alternatively, the holes 68 may be formed only by grinding.

[Example of a configuration in which a trench for shielding is formed]

In the above-described embodiment, the method of forming the hole for connecting the through hole has been described. However, when the groove for shielding is formed in the resin layer, the corresponding groove is required in the first step. The linear protrusion of the pattern is provided at the bottom of the chamber 51. The second step is the same as the above embodiment.

As an example of further application, the electrode may be exposed at any position on the preliminary trench by grinding or laser processing on the premise that a wiring pattern corresponding to the upper and lower connection electrodes is formed instead of the wiring pattern of the ground electrode. , becomes a hole for connecting through holes.

Further, a preliminary hole or a preliminary groove may be formed by laser processing, followed by a grinding process.

In the above, it is mentioned that the height of the protruding pin 53 can also be changed and the content of the hole 68 can be formed only by the mold. Specific examples thereof are described below.

[Case where the hole is formed only by the mold: Composition Example 1-1]

An example of a configuration in which a hole is formed only by a mold will be described with reference to Fig. 6 . In Fig. 6, although the upper and lower molds are reversed from Fig. 3, for example, the functions of the upper mold 40b and the lower mold 50b in the forming step are the same, and which one of the mold holding substrates 61b can be used. However, the projecting pin 43b must be provided in a mold facing the die of the holding substrate 61b.

In the present configuration example, in a state where the holding portion 51b of the lower mold 50b holds the substrate 61b (Fig. 6(a)), the lower mold 50b is raised (the direction of the black thick arrow in the drawing), and the upper mold 40b and the lower mold 50b are caused. When the mold is abutted and fastened, the front end of the projection pin 43b abuts against the upper and lower connection electrodes 63b (Fig. 6(b)). That is, the height of the projection pin 43b is equal to the distance from the top surface of the chamber 41b in the state in which the mold has been fastened to the upper surface of the upper and lower connection electrodes 63b. Therefore, after the resin material 64b is cured, as shown in FIG. 6(c), the lower mold 50b is lowered in the state in which the substrate 61b is held by the holding portion 51b of the lower mold 50b (the direction of the white thick arrow in the drawing), and The ejector pin 44b applies a force in the direction of the white thin arrow in the drawing to perform the mold opening, and once the lower mold 50b is further lowered, the resin layer 65b (corresponding to the sealing resin of the present invention) is released from the upper mold 40b (Fig. 6 (Fig. 6 d)), a hole 68b reaching the upper and lower connection electrodes 63b is formed on the surface 651b of the resin layer 65b.

According to this configuration, the substrate 61b is fixed to the bottom surface of the holding portion 51b by abutting the projection pins 43b against the plurality of upper and lower connection electrodes 63b. Therefore, thermal bending of the substrate 61b can be suppressed. Further, by determining the height of the projection pin 43b as described above, the amount of work for forming the hole 68b can be suppressed.

[Case where the hole is formed only by the mold: Composition Example 1-2]

Referring to Fig. 7, another configuration example of a case where a hole is formed only by a mold will be described. Although the resin layer 65 is formed by transfer molding in FIGS. 3 and 6 and Although an example of 65b has been described, in the present configuration example, the resin layer 65c is formed by compression molding. The compression molding die in this configuration example is composed of an upper die 40c and a lower die 500. A substrate setting portion (not shown) is provided in the upper mold 40c, and the substrate 61c is fixed to the substrate setting portion such that the semiconductor wafer 62c and the lower mold 500 face each other.

The lower mold 500 includes a chamber side member 501, a chamber bottom member 502, and a base plate 503 for collecting the members and moving them up and down. A through hole 57c having a fisheye hole portion 56c is provided in the chamber bottom surface member 502, and a protruding pin 53c having a flange portion 58 is inserted through the through hole 57c from the lower side in the drawing, and the flange portion 58 is received in the fish eye. Pit portion 56c. The through hole 57c penetrates the position opposite to the upper and lower connection electrodes 63c on the substrate 61c. The chamber side member 501, the projection pin 53c, and the base plate 503 are connected to the elastic members 504 and 505 realized by a coil spring or the like.

First, as shown in Fig. 7(a), a mold chamber (symbol omitted) is formed by the cavity side member 501 and the chamber bottom surface member 502 to supply a predetermined amount of the resin material 64c, so that the lower mold 500 is raised (Fig. 7(a)) In the direction of the black arrow). Further, before the supply of the resin material 64c, the release film 700 may be adsorbed and fixed on the surface constituting the lower mold chamber and its periphery as shown in the figure. Thereby, the release of the resin layer 65c is facilitated.

When the lower mold 500 is raised as described above, first, the projection pin 53c abuts against the upper and lower connection electrodes 63c and is pressed against each other, and then the upper surface of the chamber side surface member 501 abuts and is fastened to the peripheral edge portion of the substrate 61c held by the upper mold 40c. Mold. Next, when the base plate 503 is raised, the semiconductor wafer 62c is immersed in the resin material 64c, and the chamber bottom surface member 502 is compression-molded by pressurizing the resin material 64c (Fig. 7(b)). At this time, since the abutting surface of the protruding pin 53c and the upper and lower connecting electrode 63c is pressed by the elastic force of the elastic member 505, the resin material 64c (melted by heating) is prevented from entering the abutting surface. After the resin material 64c is hardened, once the lower mold 500 is lowered (In the direction of the white arrow in the figure), a semiconductor package in which a hole 68c is formed on the surface 651c of the resin layer 65c by compression molding can be obtained (Fig. 7(c)). Further, the chamber side member 501 and the projection pin 53c are returned to the original position with respect to the base plate 503 by the elastic forces of the elastic members 504 and 505.

According to this configuration, the same effects as the above-described configuration example 1-1 can be obtained by compression molding.

Further, the upper surface of the chamber side surface member 501 may be in contact with the peripheral edge portion of the substrate 61c before the projection pin 53c comes into contact with the upper and lower connection electrodes 63c, and the order thereof is not limited. In addition, when the projection pin 53c is pressed against the upper and lower connection electrodes 63c, the elastic force of the elastic member 505 may be appropriately adjusted so that the upper and lower connection electrodes 63c are not broken.

[Case where a plurality of single-piece substrates are sealed as one package: Configuration Example 2-1]

Among the plurality of electronic components that have been placed on one substrate, there may be cases where defective products are included. In the case where the yield is lowered due to the occurrence of such a defective product, the substrate is cut into a single piece before the resin sealing step, and the good and defective products are discriminated, and only the single-piece substrate of the good product is resin-sealed. technique. As a stage before the resin sealing step in such a method, for example, as shown in FIG. 8, the adhesive sheet 802 is adhered from the back surface of the metal frame 801, and a single piece is placed on the adhesive layer of the adhesive sheet 802 exposed in the through hole 800. In the substrate 61d, the metal frame 801 has a rectangular through hole 800 in which a hollow region in which a plurality of individual substrates 61d are arranged in the horizontal direction is formed. Fig. 8(b) is a cross-sectional view taken along line B-B' of Fig. 8(a). The metal frame 801 and the adhesive sheet 802 to which the plurality of single-piece substrates 61d are fixed as described above are set in a molding die to perform resin sealing.

However, since the single substrate 61d is adhesively fixed to the adhesive sheet 802, there is There is a case where the positional deviation in the horizontal plane occurs due to the flow of the resin during molding. Such a positional shift has been found to be particularly noticeable in the transfer molding, and it is feared that the single substrate 61d which is sealed and fixed at a position different from the previously determined position when the product is cut for each package is feared. Mistakenly cut off. Further, when the preliminary hole or the hole is formed in the resin layer by the protruding pin on the bottom surface of the cavity of the mold, there is also a positional deviation of the single-piece substrate 61d, and the preliminary hole cannot be formed immediately above the upper and lower connection electrodes. Or a problem like a hole.

Therefore, the inventors have proposed a forming method as shown in Fig. 9. First, in the state in which the metal frame 801 and the adhesive sheet 802 are held by the holding portion 51d of the lower mold 50d as in Fig. 9(a), the lower mold 50d is raised (the direction of the black thick arrow in the drawing) and the upper mold 40d is lowered. The mold 50d abuts and fastens the mold. Thereby, as shown in FIG. 9(b), the front end of the projection pin 43d abuts against the upper surface of the upper and lower connection electrodes 63d. In this state, the resin material 64d is filled in the chamber 41d (and the through hole 800 of the metal frame 801 in the lower mold 50d side), and after the resin material 64d is cured, as in the lower mold 50d as shown in Fig. 9(c) The holding portion 51d maintains the lower metal mold 801 and the adhesive sheet 802, and lowers the lower mold 50d (in the direction of the white thick arrow in the drawing), and applies a force in the direction of the white thin arrow in the drawing to the ejector pin 44d. When the lower mold 50d is further lowered and the resin layer 65d (corresponding to the sealing resin of the present invention) is released from the upper mold 40d (Fig. 9(d)), the surface 651d of the resin layer 65d is formed to reach the upper and lower connections. The hole 68d of the electrode 63d.

According to this configuration, the front end of the projection pin 43d is in contact with the upper and lower connection electrodes 63d before the filling of the resin material 64d. Therefore, the single-piece substrate 61d and the adhesive sheet 802 are sandwiched by the projection pin 43d and the holding portion 51d, and the adhesive sheet 802 is adhered. The position of the upper single substrate 61d is fixed. Therefore, it is possible to prevent the positional displacement of the single-piece substrate 61d on the adhesive sheet 802 due to the flow of the resin. Further, similarly to the above-described configuration examples 1-1 and 1-2, it also has the effect of suppressing thermal bending. fruit.

[Case where a plurality of single-piece substrates are sealed as a package: Configuration Example 2-2]

Also in this example, a configuration similar to the configuration example 1-2 described above can be applied. The same portions as those of the above configuration example 1-2 will be appropriately omitted. As shown in Fig. 10 (a), first, a compression molding die composed of an upper die 40e and a lower die 500a is used, and a metal frame 801 and an adhesive sheet 802 to which a plurality of single-piece substrates 61e are adhered and fixed are fixed to the upper die. A setting unit (not shown) provided in 40e. Next, the chamber side surface member 501a and the projection pin 53e are brought into contact with the metal frame 801 and the upper and lower connection electrodes 63e, respectively. At this time, the single-piece substrate 61e and the adhesive sheet 802 are sandwiched by the projection pins 53e and the setting portion of the upper mold 40e, and are fixed at the position of the single-piece substrate 61e on the adhesive sheet 802. Further, in the state shown in FIG. 10(b), the nip pressure between the single-piece substrate 61e and the adhesive sheet 802 is increased by the elastic force of the elastic member 505a.

According to this configuration, the same effects as the above-described configuration example 2-1 can be obtained by compression molding.

It is to be understood that the above-described embodiments and examples of the invention are intended to be modified, modified, added, and combined as appropriate within the scope of the present invention.

61‧‧‧Substrate

63‧‧‧Upper and lower connecting electrodes

65‧‧‧ resin layer

67‧‧‧Preparation hole

68‧‧‧ holes

651‧‧‧ surface of resin layer

652‧‧‧Residual resin layer

Claims (3)

A method for manufacturing an electronic component package, wherein a groove or a hole reaching the electrode pad is formed on a surface of a sealing resin that seals an electronic component and an electrode pad that are disposed on a substrate, and is characterized in that: a step of forming a groove or a hole on the surface of the sealing resin, forming a preliminary groove or a preliminary hole that does not reach the electrode pad by molding of the mold; and (b) by causing The second step of exposing the electrode pad to the processing of the depth of the preliminary trench or the preliminary hole formed in the first step is increased. The method of manufacturing an electronic component package according to claim 1, wherein the first step comprises the steps of: using a mold and another mold, the other mold having a chamber and being disposed thereon a protruding pin having a height lower than a depth of the groove or the hole at the bottom of the chamber, a step of abutting the mold holding the substrate from the back side of the substrate and fastening the mold, and The step of filling the chamber with a resin material. The method of manufacturing an electronic component package according to claim 2, wherein in the first step, the protruding pin is disposed on a top surface of the head of the ejection pin which can protrude from a bottom surface of the chamber The preliminary trench or preliminary hole is formed.