TWI576958B - Wafer holding device - Google Patents

Description

Wafer holding device

The present invention relates to a holding device, and more particularly to a wafer holding device for holding a semiconductor wafer in a process.

In semiconductor manufacturing, the wafer is typically held by the two clamping arms of the clamping device to transport the wafer between different processing regions. Since the clamping device cannot be accurately aligned with the wafer due to the relative position error or other factors between the clamping device and the transfer mechanism of the processing area, the two clamping arms of the clamping device cannot be quickly and Precisely holding the wafer, even the two clamping arms can cause damage to the wafer during the process of clamping the wafer.

Therefore, the main object of the present invention is to provide a wafer holding device capable of simultaneously guiding the position of the wafer while moving and holding the wafers close to each other, thereby enabling rapid and accurate positioning. And firmly hold the wafer.

Thus, the wafer holding device of the present invention is adapted to hold a wafer, the wafer holding device comprising two clamping mechanisms, and a driving mechanism.

The two clamping mechanisms are spaced apart from each other, and each of the clamping mechanisms includes a clamping arm, and a clamping assembly disposed on the clamping arm, the clamping arm includes a connecting portion at an opposite end and a clamping portion, the clamping assembly is rotatably pivotally connected to the clamping portion The arm protrudes from the inside of the clamping arm, and the two clamping mechanisms are respectively moved in opposite directions to be close to each other, so that the clamping portion of the two clamping mechanisms and the clamping assembly jointly hold the wafer An outer peripheral edge, the driving mechanism is connected to the connecting portion of each of the clamping arms, the driving mechanism is configured to drive the two clamping mechanisms closer to each other to clamp the wafer, and drive the two clamping mechanisms away from each other to release The wafer.

The clamping assembly includes a pivoting rod pivotally connected to the clamping arm, and a clamping member disposed at an end of the pivoting rod for clamping the wafer, the clamping assembly being relative to the clamping member Holding the arm between an initial position and a clamping position, the clamping member being adjacent to the clamping portion and not holding the wafer in the initial position, the clamping member being in the clamping position Keep away from the clamping portion and clamp the wafer.

The pivoting rod includes a pivoting portion pivotally connected to the clamping arm, and a force applying arm and a resistance arm respectively located on opposite sides of the pivoting portion, the clamping member is disposed at the end of the force applying arm, the clamp The holding arm extends in an up and down direction, the clamping assembly is spaced above the clamping portion, the clamping arm includes an inner side surface, the force applying arm protrudes from the inner side surface, and the top side and the inner side surface of the force applying arm At an angle, the angle is a right angle or an acute angle.

Each of the clamping mechanisms further includes a stop assembly disposed on the clamp arm, the stop assembly for blocking the resistance arm to position the clamp assembly in the initial position.

The stop assembly is a screw that is screwed to the clamp arm.

The blocking assembly includes a mounting block connected to the clamping arm, and an adjusting screw. The mounting block is formed with a through screw hole extending in a direction parallel to the up and down direction, and the adjusting screw is screwed to the The screw hole includes a screw head protruding from the top end of the mounting block, and a pushing end protruding from the bottom end of the mounting block and abutting against the top side of the resistance arm.

The clamping member includes a clamping wheel rotatably pivotally coupled to the force applying arm, the clamping wheel includes a clamping circumferential surface for clamping the outer circumference of the wafer, and two clips respectively a circumferentially extending annularly extending surface extending outwardly and rearwardly opposite the circumferential end, the clamping circumferential surface and the two annular limiting surfaces together define a clamping groove for a portion of the wafer to be stretched, The two annular limiting surfaces respectively serve to block the two surfaces of the wafer on the front and rear opposite sides.

The clamping wheel further includes two annular guiding inclined surfaces respectively connected to the outer circumferences of the two annular limiting surfaces, and the two annular guiding inclined surfaces are inclined outwardly from the outer circumferential edges of the two annular limiting surfaces and away from each other. And, each of the annular guiding slopes is contacted by the outer circumference of the wafer and guided to the clamping groove.

The wafer holding device further includes a stopper for blocking the surface of the rear side of the wafer from being adjacent to the top end.

Each of the clamping mechanisms further includes a resilient biasing member disposed between the clamping arm and the pivoting lever, the resilient biasing member biasing the clamping assembly toward the initial position to cause the clamp The holder clamps the wafer.

The elastic biasing element is a metal elastic piece fixedly connected to the clamping arm and the force applying arm, and the elastic biasing element comprises a fixed connection a first piece on the inner side of the clamping arm, and a second piece connected to one end of the first piece and fixedly connected to the top side of the force applying arm.

Each of the clamping mechanisms further includes a resilient biasing member disposed between the clamping arm and the clamping assembly, the resilient biasing member biasing the clamping assembly to clamp the wafer .

The utility model has the advantages that: by the clamping portion of each clamping mechanism and the design of the clamping assembly, when the two clamping mechanisms are moved from the open position to the clamping position, the clamping portions and clips of the two clamping mechanisms The assembly holds the wafer quickly, accurately, and firmly to prevent wafer damage during wafer clamping. Furthermore, it is also possible to prevent the wafer holding device from causing the wafer to sway or fall during the movement of the wafer.

1‧‧‧ wafer

10‧‧‧ Center

11‧‧‧ outer periphery

111‧‧‧ lower half circumference

112‧‧‧ upper half circumference

12‧‧‧ surface

200‧‧‧ wafer holder

2‧‧‧ bracket

21‧‧‧ bottom

3‧‧‧Clamping mechanism

31‧‧‧Clamping arm

310‧‧‧Body

311‧‧‧Connecting Department

312‧‧‧Clamping Department

313‧‧‧ Arm face

314‧‧‧ inside

315‧‧‧ bearing surface

316‧‧‧ curved clamping surface

317‧‧‧ screw holes

32‧‧‧Clamping assembly

33‧‧‧ pivot rod

331‧‧‧ rods

332‧‧‧ pivotal

333‧‧‧ force arm

334‧‧‧Resistance arm

34‧‧‧Clamping parts

341‧‧‧ pivot

342‧‧‧ clamping wheel

343‧‧‧Clamping the circumference

344‧‧‧ annular limit surface

345‧‧‧clamping slot

346‧‧‧Circular guide bevel

347‧‧‧ guiding slot

35‧‧‧stop assembly

351‧‧‧Installation block

352‧‧‧Adjustment screw

353‧‧‧ screw holes

354‧‧‧ screw head

355‧‧‧Pushing end

36‧‧‧Elastic biasing element

361‧‧‧ first piece

362‧‧‧Second body

4‧‧‧ drive mechanism

41‧‧‧Cylinder components

5‧‧‧stops

51‧‧‧stop convex

6‧‧‧Carriage

A‧‧‧ angle

D1‧‧‧First moving direction

D2‧‧‧second moving direction

R1‧‧‧first direction of rotation

R2‧‧‧second direction of rotation

Z‧‧‧Up and down direction

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a perspective view of the first embodiment of the wafer holding device of the present invention, illustrating the bracket, the clamping mechanism, and the driving Figure 2 is a front view of the first embodiment of the wafer holding device of the present invention mated with the wafer, illustrating the two clamping mechanisms in the open position, and the clamping assembly 3 is a partial enlarged view of FIG. 2, illustrating a detailed structure of the clamping assembly; FIG. 4 is a cross-sectional view taken along line II of FIG. 3, illustrating a detailed structure of the clamping wheel; 5 is a front view of the first embodiment of the wafer clamping device of the present invention mated with the wafer, illustrating that the two clamping mechanisms are moved to the clamping position, and the clamping assembly is rotated to the clamping position; FIG. 6 is a view A partial enlarged view of 5, illustrating that the clamping circumferential surface of the clamping wheel holds the upper half circumference of the wafer; FIG. 7 is a cross-sectional view taken along line II-II of FIG. 5, illustrating the clamping of the two clamping wheels The circumferential surface holds the upper half of the wafer; FIG. 8 is a partial enlarged view of FIG. 7 , illustrating that the clamping circumferential surface of the clamping wheel holds the upper half of the wafer, and the two annular limiting surfaces respectively stop FIG. 9 is a partial enlarged view of the second embodiment of the wafer clamping device of the present invention, illustrating that the adjusting screw of the stopping assembly is screwed to the screw hole of the mounting block and can push the pivoting rod FIG. 10 is a partial enlarged view of a third embodiment of the wafer clamping device of the present invention, illustrating that the first body and the second body of the elastic biasing member are fixedly coupled to the inner side of the clamping arm, respectively; FIG. 11 is a partial enlarged view of a third embodiment of the wafer clamping device of the present invention, illustrating the clamping assembly rotation To the clamping position, the elastic biasing member biases the biasing arm of the pivoting lever such that the clamping circumferential surface of the clamping wheel is in tight contact with the upper half circumference of the wafer; and FIG. 12 is the wafer clamping of the present invention. A partially enlarged view of the fourth embodiment of the apparatus, illustrating that the first body and the second body of the resilient biasing member are fixedly coupled to the inner side of the clamping arm and the biasing arm of the pivoting lever, respectively.

1 and 2 are a first embodiment of a wafer clamping device according to the present invention. The wafer clamping device 200 is exemplified by a wet process applied to a semiconductor wafer. The wafer clamping device 200 is illustrated. Suitable for holding a wafer 1, the wafer clamping device 200 can move the wafer 1 to place the wafer 1 in a container (not shown), or remove the wafer 1 from the container, the container For example, a chemical tank or a washing tank.

The wafer clamping device 200 includes a bracket 2, two clamping mechanisms 3, and a driving mechanism 4. The two clamping mechanisms 3 are spaced apart from each other, and each clamping mechanism 3 includes a clamping arm 31 and a clamping assembly 32 disposed on the clamping arm 31. The clamping arm 31 includes a connecting portion 311 and a clamping portion 312 at opposite ends. The clamping assembly 32 is rotatably pivotally coupled to the clamping arm 31 and protrudes inside the clamping arm 31. The two clamping mechanisms 3 can be moved closer to each other by an open position as shown in FIG. 2, and when the two clamping mechanisms 3 are moved to a clamping position as shown in FIG. 5, the two clamping mechanisms 3 are moved. The clamping portion 312 and the clamping assembly 32 collectively sandwich the wafer 1. Thereby, the two clamping mechanisms 3 can clamp the wafer 1 quickly, accurately and stably, so as to prevent the wafer 1 from being damaged during the clamping of the wafer 1 by the two clamping mechanisms 3. Moreover, it is also possible to prevent the wafer clamping device 200 from causing the wafer 1 to sway or fall during the movement of the wafer 1.

The driving mechanism 4 is disposed on the bracket 2 and connected to the connecting portion 311 of each clamping arm 31. The driving mechanism 4 is used to drive the two clamping mechanisms 3 to move closer to each other from the open position and to the clamping position to clamp the wafer. 1, and the two clamping mechanisms 3 are driven away from each other by the clamping position and moved to the open position to release the wafer 1. Thereby, the two clamping mechanisms 3 can be conveniently and quickly carried out The wafer 1 is picked up and placed.

The specific configuration of the wafer clamping device 200 and its actuation mode will be described in detail below. Referring to FIG. 1 , FIG. 2 and FIG. 3 , in the embodiment, the clamping arm 31 of each clamping mechanism 3 includes an arm body. 310. The arm body 310 has an elongated shape and a length extending direction thereof extends in a vertical direction Z. The connecting portion 311 protrudes from the top end of the arm body 310. The arm body 310 of the clamping arm 31 includes an arm surface 313 and an inner side surface 314 connected to the inner side of the arm surface 313 and perpendicular to the arm surface 313. The clamping portion 312 protrudes from the inner side surface 314 of the arm body 310 and is adjacent to the bottom end of the arm body 310. The clamping portion 312 has a bearing surface 315 and a side connected to the bearing surface 315 and the bearing surface 315. A vertical curved clamping surface 316.

The clamping assembly 32 of each clamping mechanism 3 is spaced above the clamping portion 312. The clamping assembly 32 includes a pivoting rod 33 and a clamping member 34. The pivoting rod 33 is pivotally connected to the arm surface 313 of the clamping arm 31, and the clamping member 34 is disposed at the end of the pivoting rod 33 for clamping the wafer 1. The clamping assembly 32 is rotatable relative to the clamping arm 31 between an initial position as shown in FIG. 2 and a clamping position as shown in FIG. 5, when the clamping assembly 32 is in the initial position, The clamping member 34 is adjacent to the clamping portion 312 and does not clamp the wafer 1; when the clamping assembly 32 is in the clamping position, the clamping member 34 is away from the clamping portion 312 and holds the wafer 1.

Specifically, the pivoting lever 33 of the clamping assembly 32 is a lever structure, and the pivoting lever 33 includes a lever member 331 and a pivoting portion 332. The pivoting portion 332 of the embodiment is a rivet, and the rod member 331 is pivotally connected to the arm surface 313 of the clamping arm 31 through the pivoting portion 332. The rod 331 has a pivotal portion A force applying arm 333 on the opposite side of the 332 and a resisting arm 334 projecting from the inner side 314 of the arm body 310.

Referring to FIG. 2, FIG. 3 and FIG. 4, the clamping member 34 is disposed at the end of the urging arm 333. The clamping member 34 includes a pivot pin 341 and a clamping wheel 342. The pivot pin 341 is a rivet, and the clamping wheel 342 is pivotally connected to the urging arm 333 through the pivot pin 341 so that the clamping wheel 342 can rotate relative to the urging arm 333. The clamping wheel 342 is made of, for example, a Teflon (PTFE) material, the clamping wheel 342 includes a clamping circumferential surface 343, and the two are respectively extended radially outward by the front and rear opposite ends of the clamping circumferential surface 343. And the circumferential annular limiting surface 344, the clamping circumferential surface 343 and the two annular limiting surfaces 344 together define a clamping groove 345. The clamping circumferential surface 343 of the clamping wheel 342 is used to sandwich the outer periphery 11 of the wafer 1. The two annular limiting faces 344 are parallel to each other and the spacing between the two is greater than the thickness of the wafer 1 such that a portion of the wafer 1 can penetrate into the clamping groove 345. The two annular limiting surfaces 344 are respectively used to block the two surfaces 12 on the front and rear opposite sides of the wafer 1 (only the front surface 12 is shown in FIG. 2), thereby preventing the wafer 1 from being clamped by the clamping wheel 342. Shake back and forth during the process.

In order to allow a portion of the wafer 1 to be surely penetrated into the clamping groove 345 of the clamping wheel 342, the clamping wheel 342 of the embodiment further includes two annular guides respectively connected to the outer circumferences of the two annular limiting surfaces 344. Leading surface 346. The two annular guiding inclined surfaces 346 are obliquely extended outwardly from the outer circumferential edges of the two annular limiting surfaces 344 and away from each other. The two annular guiding inclined surfaces 346 jointly define a communication between the clamping groove 345 and the external environment. The guiding groove 347, the width of the guiding groove 347 is gradually reduced from the outer direction toward the clamping groove 345. Each annular guiding bevel 346 can be contacted by the outer periphery 11 of the wafer 1 and can be externally The peripheral edge 11 is guided into the clamping groove 345.

Referring to FIG. 2 and FIG. 3 , each clamping mechanism 3 further includes a stopping assembly 35 disposed on the arm body 310 of the clamping arm 31 for blocking the top side of the resistance arm 334 of the pivoting lever 33. The clamping assembly 32 is positioned in the initial position. In the present embodiment, the arm surface 313 of the arm body 310 is formed with a screw hole 317 (shown in FIG. 1). The stopper assembly 35 is a screw that is screwed to the screw hole 317 and protrudes from the arm surface 313. When the clamping assembly 32 is positioned at the initial position, the top side of the urging arm 333 of the pivoting lever 33 and the inner side 314 of the clamping arm 31 are at an angle A, and the angle A may be a right angle or an acute angle. The angle A is an example of an acute angle.

Referring to FIG. 1 and FIG. 2, the driving mechanism 4 includes two cylinder assemblies 41 disposed on the bracket 2, and the connecting portion 311 of each clamping arm 31 is locked to the corresponding cylinder assembly 41 by, for example, screw locking. Therefore, the two cylinder assemblies 41 can drive the two clamping mechanisms 3 to move in parallel between the open position and the clamping position. In addition, in order to ensure that the two clamping mechanisms 3 do not tilt the wafer 1 while holding the wafer 1 and the clamping wheel 342 can align with the outer periphery 11 of the wafer 1, the wafer clamping device 200 further includes a bracket. 2 is a stopper 5 for blocking the wafer 1. The stopper 5 is fixed to the bracket 2 by, for example, a screw locking method and protrudes from a bottom end 21 of the bracket 2, and the stopper 5 includes a stopper convex portion 51 adjacent to the bottom end, and the stopper convex portion 51 is blocked. The height is slightly higher than the height of the clamping wheel 342 of the two clamping assemblies 32. The blocking protrusion 51 is used to block the rear side surface 12 of the wafer 1 from being adjacent to the top end, thereby preventing the wafer 1 from being adjacent to the top end. The tilt is generated such that the two clamping wheels 342 can be accurately aligned with the outer periphery 11 of the wafer 1 and sandwich the outer periphery 11 of the wafer 1.

2, 3 and 4, when the wafer 1 is placed in the container, the lower half of the outer peripheral edge 11 of the wafer 1 is fixed to a carrier 6 so that the wafer 1 is vertical. Positioned in the container. When the wafer clamping device 200 is moved downward from the top of the container to a pick-and-place position in the container (as shown in FIG. 2), the blocking protrusion 51 of the stopper 5 abuts against the rear surface of the wafer 1. 12 is near the top. At the same time, a center 10 of the wafer 1 is positioned between the clamping portion 312 of the two clamping mechanisms 3 and the clamping wheel 342, that is, the clamping portion 312 is aligned under the outer periphery 11 of the wafer 1. The semicircular portion 111 and the clamping wheel 342 are aligned with an upper half circumferential portion 112 of the outer peripheral edge 11. By the abutment convex portion 51 of the stopper 5 abutting against the rear side surface 12 of the wafer 1, the upper half circumferential portion 112 of the wafer 1 can be prevented from tilting to ensure that the guiding grooves 347 of the two clamping wheels 342 can be Accurately aligned with the upper half circumferential portion 112.

In addition, since the lever member 331 of the pivoting lever 33 is pivotally connected to the arm body 310 of the clamping arm 31 through the pivoting portion 332, the clamping wheel 342 is pivotally connected to the biasing arm 333 of the lever member 331 through the pivot pin 341. The end, therefore, the clamping assembly 32 causes the resistance arm 334 to be tilted up due to the downward pressure exerted by the clamping member 34 on the force applying arm 333. Thereby, the top side of the resistance arm 334 abuts against the stop assembly 35 such that the clamp assembly 32 is constantly positioned in the initial position.

Referring to FIG. 5, FIG. 6, FIG. 7, and FIG. 8, the two cylinder assemblies 41 of the driving mechanism 4 respectively drive the two clamping mechanisms 3 closer to each other, so that the two clamping mechanisms 3 are respectively along a first moving direction D1 and one. The second moving direction D2 moves in parallel. During the approach of the clamping arms 31 of the two clamping mechanisms 3, the bearing surfaces 315 of the two clamping portions 312 are moved to the rear side surface 12 of the wafer 1, and the curved clamping surfaces of the two clamping portions 312 316 is directed to wafer 1 The lower half portion 111 is close to each other, and at the same time, the guiding grooves 347 of the two clamping wheels 342 are respectively approached toward the upper half circumferential portion 112 of the wafer 1. Since the stopper 5 prevents the design of the upper half circumferential portion 112 of the wafer 1 from being inclined, the upper half circumferential portion 112 of the wafer 1 can be ensured during the approach of the two clamping wheels 342 toward the upper half circumferential portion 112, respectively. A portion is respectively inserted into the guiding grooves 347 of the two clamping wheels 342.

Furthermore, if the positions of the clamping grooves 345 of the respective clamping wheels 342 are accurately aligned with the upper half circumferential portion 112 of the wafer 1, the two clamping wheels 342 are respectively approaching the upper half circumferential portion 112, The semi-circumferential portion 112 can directly penetrate into the clamping groove 345 via the guiding groove 347, so that the clamping circumferential surface 343 of the clamping wheel 342 directly abuts against the upper half circumferential portion 112, and the two annular limiting surfaces 344 The two surfaces 12 of the wafer 1 are respectively blocked. If the position of the clamping groove 345 of each of the clamping wheels 342 is inaccurate with the position of the upper half circumferential portion 112 of the wafer 1 and cannot be accurately aligned, but one of the annular guiding inclined surfaces 346 is aligned with the upper half circumferential portion 112, During the approach of the two clamping wheels 342 toward the upper half circumferential portion 112, respectively, the annular guiding slope 346 of the clamping wheel 342 first touches the upper half circumferential portion 112, and the annular guiding inclined surface 346 is applied to the upper half circumferential portion 112. The component force causes the wafer 1 to slightly oscillate and direct the position of the wafer 1 to guide the upper half circumferential portion 112 of the wafer 1 into the clamping groove 345. Thereby, the clamping circumferential surface 343 of the clamping wheel 342 is abutted on the upper half circumferential portion 112, and the two annular limiting surfaces 344 are respectively blocked on the two surfaces 12 of the wafer 1.

When the clamping circumferential surface 343 of the two clamping wheels 342 abuts against the upper half circumferential portion 112, the two clamping wheels 342 are blocked by the upper half circumferential portion 112. . Therefore, during the process in which the two clamping arms 31 continue to approach each other in the first moving direction D1 and the second moving direction D2, respectively, the clamping circumferential surface 343 of the two clamping wheels 342 rolls upward along the upper half circumferential portion 112. At the same time, the two rods 331 rotate around the pivoting portion 332 in a first rotation direction R1 and a second rotation direction R2 opposite to the first rotation direction R1. It should be noted that by the contact of the clamping circumferential surface 343 of the clamping wheel 342 with the upper half circumferential portion 112 in a rolling contact manner, the friction between the two can be reduced, so that the clamping circumferential surface of the clamping wheel 342 The 343 can smoothly roll along the upper half circumference portion 112. Furthermore, since the angle A (shown in FIG. 3) is an acute angle when each of the clamping assemblies 32 is at the initial position, the clamping circumferential surface 343 of the clamping wheel 342 abuts against the upper half circumferential portion 112 and During the process in which the clamping arms 31 continue to approach each other in the first moving direction D1 and the second moving direction D2, respectively, it can be ensured that the clamping circumferential surface 343 of the two clamping wheels 342 rolls upward along the upper half circumferential portion 112 instead of Rolling down causes the two clamping wheels 342 to reach the upper half circumferential portion 112 to prevent the wafer 1 from swaying upward.

When the two cylinder assemblies 41 respectively drive the two clamping mechanisms 3 to the clamping position shown in FIG. 5, the bearing surfaces 315 of the two clamping portions 312 abut against the rear side surface 12 of the wafer 1, the curved clamping surface. 316 is sandwiched between the lower half portion 111 of the wafer 1. At the same time, the two clamping assemblies 32 are respectively rotated to the clamping position, the clamping circumferential surface 343 of the clamping wheel 342 abuts and is clamped on the upper half circumferential portion 112, and the two annular limiting surfaces 344 are respectively blocked by the crystal The two surfaces 12 of the circle 1. The arcuate clamping surface 316 of the two clamping portions 312 is clamped to the lower half circumferential portion 111 of the wafer 1 , and the clamping circumferential surface 343 of the two clamping wheels 342 is clamped to the upper half circumferential portion 112 , whereby Making the two clamping mechanisms 3 securely and firmly clamped Hold wafer 1. When the two clamping mechanisms 3 hold the wafer 1, the wafer clamping device 200 can move the wafer 1 upward to move it away from the container.

Referring to FIG. 2 and FIG. 5, when the wafer clamping device 200 is to place another wafer 1 in the container, the wafer clamping device 200 can be moved downward from the top of the container to the position of the material in the container to make the crystal The lower half circumferential portion 111 of the circle 1 is fixed to the carrier 6 as shown in FIG. Then, the two clamping mechanisms 3 are respectively driven away from each other by the two cylinder assemblies 41, so that the two clamping mechanisms 3 are moved in parallel in the first moving direction D1 and the second moving direction D2, respectively. When the two clamping mechanisms 3 are moved to the open position, the clamping portion 312 and the clamping wheel 342 of the two clamping mechanisms 3 are separated from the wafer 1, respectively, and the operation of placing the wafer 1 in the container is completed.

Referring to Figure 9, there is shown a second embodiment of the wafer holding apparatus of the present invention, the overall structure and operation of which is substantially the same as that of the first embodiment, except for the structure of each of the stopper assemblies 35. Since the two stopper assemblies 35 have the same structure, the present embodiment will be described only with one of the stopper assemblies 35 shown in FIG.

The stopper assembly 35 of the present embodiment includes a mounting block 351 coupled to the clamp arm 31, and an adjustment screw 352. The mounting block 351 is locked to the arm surface 313 of the arm body 310 by, for example, screw locking. The mounting block 351 is formed with a through screw hole 353 extending in a direction parallel to the up and down direction Z. The adjusting screw 352 is screwed to the screw hole 353. The adjusting screw 352 includes a screw head 354 protruding from the top end of the mounting block 351, and an pushing end 355 opposite to the screw head 354 and protruding from the bottom end of the mounting block 351. The end 355 abuts against the top side of the resistance arm 334.

The user can move the adjusting screw 352 downward relative to the mounting block 351 by, for example, rotating the screw 354 of the adjusting screw 352 in a clockwise direction. During the downward movement of the adjusting screw 352, the resisting arm 334 of the pushing rod member 331 is pushed downward by the pushing end 355, and the rod member 331 is caused to rotate in the first rotating direction R1, whereby the biasing arm 333 can be narrowed. The angle A between the top side and the inner side 314. Conversely, when the screw 354 of the adjusting screw 352 is rotated, for example, in the counterclockwise direction, the adjusting screw 352 moves upward relative to the mounting block 351. The lever member 331 is rotated in the second rotation direction R2 by the downward pressure exerted by the clamping member 34 on the urging arm 333, so that the resistance arm 334 is upturned and abuts against the pushing end 355 of the adjusting screw 352. Thereby, the angle A sandwiched between the top side and the inner side 314 of the urging arm 333 can be increased.

By adjusting the screw 352 of the stopping assembly 35, the design of the blocking rod member 331 can be adjusted, and the clamping assembly 32 positioned at the initial position can be adjusted in angle to the top side and the inner side of the force applying arm 333. The angle A sandwiched between 314 is adjusted to the desired size. Thereby, the wafer clamping device 200 can be applied to the case of clamping the wafers 1 of different sizes to increase the flexibility in use.

Referring to FIG. 10 and FIG. 11 , a third embodiment of the wafer clamping device of the present invention is generally the same as the first embodiment, except that each clamping mechanism 3 further includes a clamping member. The resilient biasing element 36 between the arm 31 and the pivot rod 33. This embodiment is illustrated with only one of the resilient biasing members 36 shown in FIG.

The elastic biasing element 36 of the embodiment is connected to the clamping arm The metal spring piece of the urging arm 333 of the pivoting lever 33 has a V-shaped shape and includes a first body 361 and a second body 362 connected to one end of the first body 361. The first piece 361 is locked to the inner side surface 314 of the clamping arm 31 by, for example, screw locking, and the second piece 362 is locked to the top side of the force applying arm 333 by, for example, screw locking.

The elastic biasing member 36 is configured to bias the pivoting lever 33 of the clamping assembly 32 toward the initial position, whereby the top side of the resisting arm 334 abuts against the blocking assembly 35, so that the clamping assembly 32 is positioned. In the initial position. When the clamping assembly 32 is rotated from the initial position in the first rotational direction R1 to the clamping position, the second piece 362 of the elastic biasing member 36 is bent and deformed relative to the first piece 361 and accumulates the return elastic force. Therefore, the clamping circumferential surface 343 of the clamping wheel 342 is tightly contacted with the upper half circumferential portion 112 of the wafer 1 so that the clamping circumferential surface 343 of the two clamping wheels 342 can clamp the upper half circumferential portion 112 for further The grounding increases the stability of the wafer 1.

Referring to FIG. 12, a fourth embodiment of the wafer clamping device of the present invention is generally the same as the third embodiment, except that each clamping mechanism 3 omits the blocking assembly 35 shown in FIG. .

The clamping assembly 32 can be positioned by the connection relationship between the first body 361 and the second body 362 of the elastic biasing member 36 and the clamping arm 31 and the biasing arm 333 of the pivoting lever 33, respectively. The initial position shown in Figure 12.

In summary, the wafer clamping device 200 of each embodiment moves the two clamping mechanisms 3 from the open position to the clamp by the clamping portion 312 of each clamping mechanism 3 and the design of the clamping assembly 32. When holding the position, the two clamping mechanisms 3 The clamping portion 312 and the clamping assembly 32 can hold the wafer 1 quickly, accurately and stably to prevent damage to the wafer 1 during the clamping of the wafer 1. Furthermore, it is also possible to prevent the wafer holding device 200 from causing the wafer 1 to sway or fall during the movement of the wafer 1, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

1‧‧‧ wafer

10‧‧‧ Center

11‧‧‧ outer periphery

111‧‧‧ lower half circumference

112‧‧‧ upper half circumference

12‧‧‧ surface

200‧‧‧ wafer holder

2‧‧‧ bracket

21‧‧‧ bottom

3‧‧‧Clamping mechanism

31‧‧‧Clamping arm

310‧‧‧Body

311‧‧‧Connecting Department

312‧‧‧Clamping Department

314‧‧‧ inside

315‧‧‧ bearing surface

316‧‧‧ curved clamping surface

32‧‧‧Clamping assembly

33‧‧‧ pivot rod

34‧‧‧Clamping parts

342‧‧‧ clamping wheel

35‧‧‧stop assembly

4‧‧‧ drive mechanism

41‧‧‧Cylinder components

5‧‧‧stops

51‧‧‧stop convex

6‧‧‧Carriage

Z‧‧‧Up and down direction

Claims (11)

A wafer clamping device is adapted to hold a wafer, the wafer clamping device comprises: two clamping mechanisms spaced apart from each other, each clamping mechanism comprises a clamping arm, and a clamping arm is disposed on the clamping a clamping assembly for holding the arm, the clamping arm includes a connecting portion at an opposite end and a clamping portion, the clamping assembly is rotatably pivotally connected to the clamping arm and protrudes inside the clamping arm The two clamping mechanisms are respectively movable in opposite directions to be close to each other, such that the clamping portion of the two clamping mechanisms and the clamping assembly jointly hold an outer circumference of the wafer, and a driving mechanism, and each The connecting portion of the clamping arm is connected, the driving mechanism is configured to drive the two clamping mechanisms closer to each other to clamp the wafer, and drive the two clamping mechanisms away from each other to release the wafer; The utility model comprises a pivoting rod pivoted to the clamping arm, and a clamping member disposed at the end of the pivoting rod for clamping the wafer, the clamping assembly being movable relative to the clamping arm An initial position, and a rotation between the clamping positions, wherein the clamping member is adjacent to the clamping portion and No holding the wafer, when the clamping position, the clamping member away from the clamping portion and the clamping of the wafer. The wafer clamping device of claim 1, wherein the pivoting bar comprises a pivoting portion pivotally connected to the clamping arm, and a force applying arm and a resistance force respectively located on opposite sides of the pivoting portion An arm, the clamping member is disposed at an end of the urging arm, the clamping arm extends in an up and down direction, the clamping assembly is spaced above the clamping portion, the clamping arm includes an inner side, and the urging arm is convex The inner side surface is disposed and an angle is formed between the top side of the force applying arm and the inner side surface, and the angle is a right angle or an acute angle. The wafer clamping device of claim 2, wherein each of the clamping mechanisms further comprises a stop assembly disposed on the clamp arm, the stop assembly for blocking the resistance arm to cause the clamping The assembly is positioned at the initial position. The wafer holding device of claim 3, wherein the blocking component is a screw that is screwed to the clamping arm. The wafer clamping device of claim 3, wherein the blocking component comprises a mounting block connected to the clamping arm, and an adjusting screw, the mounting block is formed with a through screw hole, the screw hole The extending direction is parallel to the up and down direction, and the adjusting screw is screwed to the screw hole, and comprises a screw protruding from the top end of the mounting block, and a protruding end protruding from the bottom end of the mounting block and abutting against the top side of the resisting arm Push the end. The wafer clamping device of claim 2, wherein the clamping member comprises a clamping wheel rotatably pivotally coupled to the force applying arm, the clamping wheel comprising a holder for clamping the wafer a clamping circumferential surface of the outer circumference, and two annular limiting surfaces extending radially outward from the front and rear opposite ends of the clamping circumference, the clamping circumferential surface and the two annular limiting surfaces are defined together A clamping groove for a portion of the wafer is formed, and the two annular limiting surfaces respectively serve to block two surfaces of the wafer on the front and rear opposite sides. The wafer clamping device of claim 6, wherein the clamping wheel further comprises two annular guiding slopes respectively connected to outer circumferences of the two annular limiting surfaces, wherein the two annular guiding inclined surfaces are The outer peripheral edge of the limiting surface extends outwardly and obliquely away from each other, and each of the annular guiding inclined surfaces The outer periphery of the wafer is contacted and guided to the clamping slot. The wafer holding device of claim 7, further comprising a stopper for blocking the surface of the rear side of the wafer from being adjacent to the top end. The wafer clamping device of claim 2 or 3, wherein each of the clamping mechanisms further comprises a resilient biasing member disposed between the clamping arm and the pivoting lever, the resilient biasing member The clamping member is biased toward the initial position to bias the holder to clamp the wafer. The wafer clamping device of claim 9, wherein the elastic biasing member is a metal dome fixedly coupled to the clamping arm and the biasing arm, the resilient biasing member comprising a fixed connection a first body of the inner side of the clamping arm, and a second body coupled to one end of the first body and fixedly coupled to the top side of the force applying arm. The wafer clamping device of claim 1, wherein each of the clamping mechanisms further comprises a resilient biasing member disposed between the clamping arm and the clamping assembly, the resilient biasing member for The clamping assembly is biased to clamp the wafer.