TWI575620B - Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure - Google Patents

Description

Fingerprint identification chip package structure manufacturing method and manufacturing device

The present invention relates to a method and a device for fabricating a chip package structure, and more particularly to a method and a device for fabricating a chip identification chip package structure.

A common fingerprint identification chip package is generally composed of a line carrier, a fingerprint identification chip, and an encapsulant. The fingerprint identification chip is fixed on the line carrier with its back surface to expose the fingerprint identification surface. The fingerprint identification surface can be electrically connected to the line carrier through the wire. The encapsulant is disposed on the line carrier and covers portions of the wafer and wires. In detail, the encapsulant will have a windowed area to partially expose the fingerprinting surface. When the user's finger reaches the window opening area and touches the fingerprint identification surface, the fingerprint identification chip package can capture the user's fingerprint information.

In the existing process, when the encapsulant is formed on the circuit carrier to cover the portion of the wafer and the wires, the encapsulant is liable to be insufficiently bonded to the fingerprint identification surface due to the combination of the mold, or due to the combination of the mold. The fingerprint recognition wafer is forced to break. Therefore, the existing process has the problem of poor production yield.

The invention provides a method for manufacturing a fingerprint identification chip package structure and a manufacturing device thereof, which contribute to improving production yield.

The invention provides a method for fabricating a fingerprint identification chip package structure, which comprises the following steps. A line carrier having a plurality of wafer placement areas is provided. Fingerprint identification wafers are respectively disposed in the respective wafer setting regions. These fingerprint identification wafers are electrically connected to the line carrier. A spacer is disposed over the fingerprint recognition wafers, and the plurality of spaced protrusions of the spacer respectively abut the fingerprint recognition surfaces of the fingerprint recognition wafers. Forming the encapsulant between the spacer and the line carrier, so that the encapsulant partially covers the respective fingerprint recognition wafers, and partially exposes the fingerprint identification surface of each fingerprint recognition wafer. Remove the spacer. The encapsulant and the wiring carrier are cut between any two adjacent wafer setting regions to obtain a plurality of fingerprint identification chip package structures.

In an embodiment of the invention, the material of the spacer comprises a heat resistant material having elasticity. The spacer protrusions elastically abut the fingerprint recognition surfaces of the fingerprint recognition wafers respectively when the encapsulant is formed between the spacers and the line carrier.

In an embodiment of the invention, the method for fabricating the fingerprint identification chip package structure further includes the following steps. After the fingerprint identification wafers are electrically connected to the line carrier, the molds are secured to the line carriers and the fingerprint recognition wafers are placed in the mold. The spacer is placed in the mold, and the spacer is abutted against the mold through the body portion connecting the spaced projections. The encapsulant is injected between the body portion, the spacers, and the line carrier to partially encapsulate the fingerprint identification wafers.

In an embodiment of the invention, the method for fabricating the fingerprint identification chip package structure further includes the following steps. Prior to securing the mold to the line carrier, the spacers are released from the first spool and the spacers are transported over the fingerprint recognition wafers. The spacer protrusions of the spacer are respectively aligned with the fingerprint recognition surfaces of the fingerprint recognition wafers to abut the respective fingerprint protrusions against the fingerprint recognition surface of the corresponding fingerprint recognition wafer when the mold is fixed to the line carrier. After injecting the encapsulant, the mold is removed to separate the respective spaced protrusions of the spacer from the fingerprint identification surface of the corresponding fingerprint identification wafer. The spacer is recycled to the second reel.

In an embodiment of the invention, the method for fabricating the fingerprint identification chip package structure further includes the following steps. A plurality of external connection terminals are formed on the line carrier, wherein the external connection terminals and the fingerprint recognition wafers are respectively located on opposite sides of the line carrier.

The invention provides a manufacturing device for a fingerprint identification chip package structure, which comprises a mold, a conveying element and a glue injection unit. The transport element is configured to transport the spacer over the fingerprint recognition wafers located within the mold and to align the plurality of spaced projections of the spacer to the fingerprint recognition surfaces of the fingerprint recognition wafers, respectively. After the mold is fixed to the line carrier, and each of the spaced protrusions abuts the fingerprint identification surface of the corresponding fingerprint identification wafer, the encapsulation layer is injected between the spacer and the line carrier through the injection unit, so that the package colloid is partially packaged. Each fingerprint recognition chip is overlaid, and the fingerprint recognition surface of each fingerprint recognition wafer is partially exposed.

In an embodiment of the invention, the mold includes a template and a mold base. After the template and the mold base are respectively fixed on the two opposite sides of the line carrier, the mold base abuts the line carrier, and the spacer abuts the template.

In an embodiment of the invention, the conveying element comprises a first reel and a second reel disposed opposite each other. The first reel is used to release the spacer and the second reel is used to reclaim the spacer.

Based on the above, the manufacturing method and manufacturing apparatus of the fingerprint identification chip package structure of the present invention can elastically abut the fingerprint identification wafer through the spacer protrusion of the spacer when the encapsulation colloid is formed on the line carrier board to partially cover the fingerprint identification wafer. Fingerprint recognition surface. Since the spacer protrusion of the spacer can be surely attached to the fingerprint recognition surface, and there is no force applied, the package gel can be prevented from overflowing to the fingerprint recognition surface, and the cracking of the fingerprint recognition wafer can be avoided. , thereby increasing production yield.

The above described features and advantages of the invention will be apparent from the following description.

1A to 1H are partial cross-sectional views showing a manufacturing process of a fingerprint identification chip package structure according to an embodiment of the present invention. First, referring to FIG. 1A, a line carrier 110 is provided. The line carrier 110 can be a hard printed circuit board or a flexible printed circuit board and includes a first patterned wiring layer 111 and a second patterned wiring layer 112 with respect to the first patterned wiring layer 111. On the other hand, the line carrier 110 has a plurality of wafer setting regions 113. Next, the fingerprint recognition wafer 120 is taken out from the feeding end through the pick-and-place element 210 (for example, a vacuum suction head), and the fingerprint recognition wafer 120 is placed on the line carrier 110. In detail, each of the wafer setting areas 113 is provided with a fingerprint identification wafer 120, wherein the fingerprint identification wafers 120 and the first patterned circuit layer 111 are located on the same side of the line carrier 110, and the fingerprint identification chips 120 are transparent. The glue layer 123 on the back surface 122 is fixed in the corresponding wafer setting area 113.

Next, referring to FIG. 1B, one end of the wire 130 is bonded to the fingerprint identification surface 121 of any one of the fingerprint recognition wafers 120 through the wire cutter 220, and the other end of the wire 130 is bonded to the wafer setting area where the fingerprint identification chip 120 is located. The first patterned circuit layer 111 within 113. The first fingerprinting layer 111 in the corresponding wafer setting area 113 is wire bonded to each of the fingerprint identification wafers 120 such that the fingerprint identification wafers 120 are electrically connected to the line carrier 110. Next, as shown in FIG. 1C, the line carrier 110 and the fingerprint identification wafers 120 electrically connected to the line carrier 110 are transported to the next workstation through a transport element (not shown), wherein the transport element can be transported. Belt, conveyor belt and conveyor roller combination, jaws, robotic arm or other suitable.

The workstation station is provided with a mold 240 and a conveying member 250. The mold 240 includes a mold base 241 and a template 242, and the mold base 241 and the template 242 can be clamped or released. As shown in FIG. 1C, the die holder 241 is separated from the template 242, and the line carrier 110 and the fingerprint recognition wafers 120 electrically connected to the line carrier 110 are transported between the die holder 241 and the template 242 through the conveying member. . The second patterned wiring layer 112 faces the die holder 241, and the first patterned wiring layer 111 and the fingerprint recognition wafers 120 face the template 242. In the present embodiment, the transport element 250 includes a first reel 251 and a second reel 252 that are disposed opposite each other and are located on opposite sides of the mold 240, respectively. The first reel 251 can release the spacer 140 and move the spacer 140 between the fingerprint recognition wafer 120 and the template 242.

Referring to FIG. 1C and FIG. 1D simultaneously, the spacer 140 includes a body 141 and a plurality of spaced protrusions 142 of the connection body 141. After the line carrier 110 and the fingerprint recognition wafers 120 electrically connected to the line carrier 110 are transported over the fingerprint recognition wafer 120 through the transport member, the spacer 140 is brought into contact with the template 242 by the body 141, and The spacer protrusions 142 face the fingerprint recognition wafers 120, wherein the spacer protrusions 142 are respectively aligned with the fingerprint recognition surface 121 of the fingerprint recognition wafers 120. After the body 141 is overlaid on the cavity 243, the cavity 243 is evacuated to move the body 141 into the cavity 243 and affixed to the template 242 to define the inner wall surface 244 of the cavity 243. At this time, the body 141 and the spacer protrusions 142 are both located in the cavity 243, wherein the body 141 is conformed to the inner wall surface 244, and the spacer protrusions 142 are still aligned with the fingerprint recognition surface 121 of the fingerprint recognition wafer 120, respectively.

Next, referring to FIG. 1E, the die holder 241 is combined with the template 242 to be fixed to the line carrier 110. The die holder 241 and the template 242 are respectively located on opposite sides of the line carrier 110, wherein the template 241 abuts the side of the second carrier layer 112 in the line carrier 110, and the body 141 abuts the template 242. At this time, the fingerprint recognition wafers 120 are all located in the cavity 243, and the spacer protrusions 142 respectively abut the fingerprint recognition surface 1211 of the fingerprint recognition wafers 120. On the other hand, since the respective spacer protrusions 142 are staggered from the wires 130 on the fingerprint recognition surface 121 of the corresponding fingerprint recognition wafer 120, the wires 130 are not crushed by the spacer protrusions 142. In this embodiment, the material of the spacer 140 includes a heat-resistant material having elasticity, such as heat-resistant rubber, silicone rubber or polyimide, so that the spacer protrusions 142 can elastically abut the fingerprint recognition wafers 120, respectively. Fingerprint identification surface 121. After the mold 240 is fixed to the line carrier 110 and the spacers 142 abut the fingerprint identification surface 121 of the corresponding fingerprint recognition wafer 120, the encapsulation 150 is injected through the glue injection unit 260 to the spacer 140 and the line carrier. Between 110, the encapsulant 150 partially covers the respective fingerprint recognition wafers 120, and partially exposes the fingerprint identification surface 121 of each fingerprint recognition wafer 120. In other words, the encapsulant 150 impregnated between the spacer 140 and the line carrier 110 can define a plurality of window openings 151 through the spacer protrusions 142 to partially expose the fingerprint recognition surface 121 of each fingerprint recognition wafer 120. Since the spacer protrusions 142 can be surely attached to the fingerprint recognition surfaces 121 of the fingerprint recognition wafers 120, respectively, and there is no force applied, the package encapsulation 150 can be prevented from overflowing to the fingerprint recognition wafers 120. The fingerprint identification surface 121 also prevents the fingerprint recognition wafer 120 from being broken.

In terms of the process, the two molds 240 are usually arranged side by side, and the glue injection unit 260 is disposed between the two molds 240. The glue injection unit 260 is, for example, a rubber column (shown schematically), and the rubber column can be formed into a fluidity encapsulant 150 by heat extrusion. The flowable encapsulant 150 can be injected between the spacer 140 and the line carrier 110 through a flow path (not shown) on the side wall of each mold 240.

Next, the mold 240 is removed from the line carrier 110 (even if the mold base 241 is separated from the template 242) and the spacer 140 is removed, wherein the spacer 140 can be recycled to the second reel 252. Next, the line carrier 110, the fingerprint identification chips 120 electrically connected to the line carrier 110, and the encapsulant 150 partially covering the fingerprint identification wafers 120 are transported into an oven (not shown) to encapsulate the encapsulant 150. The baking process is performed such that the encapsulant 150 is completely cured and the moisture of the fingerprint recognition wafer 120 is removed. As shown in FIG. 1F, each of the window opening regions 151 of the encapsulant 150 partially exposes the fingerprint identification surface 121 of the corresponding fingerprint recognition wafer 120, and no encapsulant 150 remains in the fingerprint recognition surface 121 in the window opening regions 151. .

With continued reference to FIG. 1F, after the encapsulant 150 is fully cured, a plurality of external connection terminals 160 are formed on the second patterned wiring layer 112 of the line carrier 110. The external connection terminals 160 may be solder balls to form a ball grid array (BGA) on the line carrier 110, wherein the external connection terminals 160 and the fingerprint recognition wafers 110 are respectively located on opposite sides of the line carrier 110. However, the external connection terminals are not limited to solder balls, and in other embodiments, the external connection terminals may form a planar grid array (LGA) or a pin grid array (PGA) on the line carrier. Finally, referring to FIG. 1G and FIG. 1H, the encapsulant 150 and the line carrier 110 are cut between any two adjacent wafer setting regions 113 through a cutting unit 270 (eg, a cutting hob or a laser), and The principle of fingerprint identification wafer 120, wire 130 and external connection terminal 160 is not destroyed, thereby obtaining a plurality of fingerprint identification chip package structures 100 (one of which is schematically illustrated in FIG. 1H). In the above, the manufacturing apparatus for fabricating the fingerprint identification chip package structure 100 includes at least the mold 240, the conveying element 250, and the glue injection unit 260, and may further include the pick-and-place element 210, the wire cutter 220, the oven (not shown), and the cutting. Unit 270.

In summary, the method and manufacturing apparatus for the fingerprint identification chip package structure of the present invention can directly cover the fingerprint identification surface of the fingerprint identification wafer when the package encapsulation is formed on the circuit carrier board to partially cover the fingerprint identification wafer. Contact, but elastically abuts the fingerprint recognition surface through the spaced protrusions of the spacer. Since the spacer protrusion of the spacer can be surely attached to the fingerprint recognition surface, and there is no force applied, the package gel can be prevented from overflowing to the fingerprint recognition surface, and the cracking of the fingerprint recognition wafer can be avoided. , thereby increasing production yield.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧ Chip package structure

110‧‧‧Line carrier

111‧‧‧First patterned circuit layer

112‧‧‧Second patterned circuit layer

113‧‧‧ wafer setup area

120‧‧‧Fingerprint identification chip

121‧‧‧Fingerprint surface

122‧‧‧Back surface

123‧‧‧ glue layer

130‧‧‧Wire

140‧‧‧ spacers

141‧‧‧ Ontology

142‧‧‧ spaced projections

150‧‧‧Package colloid

151‧‧‧windowed area

160‧‧‧External connection terminal

210‧‧‧ pick and place components

220‧‧‧Threader

240‧‧‧Mold

241‧‧‧ mold base

242‧‧‧ Template

243‧‧‧ cavity

244‧‧‧ inner wall

250‧‧‧Transport components

251‧‧‧ first scroll

252‧‧‧second reel

260‧‧‧Glue injection unit

270‧‧‧Cutting unit

1A to 1H are partial cross-sectional views showing a manufacturing process of a fingerprint identification chip package structure according to an embodiment of the present invention.

110‧‧‧Line carrier

111‧‧‧First patterned circuit layer

112‧‧‧Second patterned circuit layer

113‧‧‧ wafer setup area

120‧‧‧Fingerprint identification chip

121‧‧‧Fingerprint surface

122‧‧‧Back surface

123‧‧‧ glue layer

130‧‧‧Wire

140‧‧‧ spacers

141‧‧‧ Ontology

142‧‧‧ spaced projections

150‧‧‧Package colloid

151‧‧‧windowed area

240‧‧‧Mold

241‧‧‧ mold base

242‧‧‧ Template

243‧‧‧ cavity

244‧‧‧ inner wall

250‧‧‧Transport components

251‧‧‧ first scroll

252‧‧‧second reel

260‧‧‧Glue injection unit

Claims (7)

A method for fabricating a fingerprint identification chip package structure includes: providing a circuit carrier board having a plurality of wafer setting areas; and respectively providing a fingerprint identification chip in each of the wafer setting areas; and electrically connecting the fingerprint identification chips to the a wiring board; a spacer is disposed above the fingerprint identification wafers, and the plurality of spaced protrusions of the spacer respectively abut the fingerprint identification surfaces of the fingerprint recognition wafers; forming an encapsulant on the spacers Between the circuit carriers, the encapsulant partially covers the fingerprint identification wafers, and partially exposes the fingerprint identification surface of each of the fingerprint recognition wafers; removes the spacers; and along any two adjacent ones The package body and the line carrier are cut between the wafer setting areas to obtain a plurality of fingerprint identification chip package structures. The method for fabricating a fingerprint identification chip package structure according to claim 1, wherein the material of the spacer comprises a heat-resistant material having elasticity, and when the encapsulant is formed between the spacer and the line carrier, The spacer protrusions respectively elastically abut the fingerprint recognition surfaces of the fingerprint recognition wafers. The method for fabricating a fingerprint identification chip package structure according to claim 1, further comprising: after electrically connecting the fingerprint identification chips to the line carrier, fixing a mold to the line carrier, and Having the fingerprint identification wafers in the mold; The spacer is disposed in the mold, and the spacer is abutted against the mold through a body portion connecting the spaced protrusions; and the encapsulant is injected into the body portion, the spaced protrusions, and the line Between the carriers, the encapsulant is partially coated with the fingerprint recognition wafer. The method for fabricating a fingerprint identification chip package structure according to claim 3, further comprising: releasing the spacer from a first reel and transporting the spacer before fixing the mold to the line carrier Up to the fingerprint recognition wafers; the spacer protrusions of the spacers are respectively aligned with the fingerprint recognition surfaces of the fingerprint recognition wafers to make the intervals when the mold is fixed to the line carrier The convex portion abuts the corresponding fingerprint recognition surface of the fingerprint recognition wafer; after the encapsulation is injected, the mold is removed, and the spacer protrusions of the spacer are separated from the fingerprint identification surface of the corresponding fingerprint recognition wafer; And recycling the spacer to a second reel. The method for fabricating a fingerprint identification chip package structure according to claim 1, further comprising: forming a plurality of external connection terminals on the circuit carrier, wherein the external connection terminals and the fingerprint identification wafers are respectively located Two opposite sides of the line carrier. A manufacturing apparatus for a fingerprint identification chip package structure, comprising: a mold; a conveying member for conveying a spacer to the fingerprint identification wafers located in the mold, and causing a plurality of spacing protrusions of the spacer Partially aligned with the The fingerprint recognition surface of the fingerprint identification chip, wherein the conveying element comprises a first reel and a second reel disposed opposite to each other, the first reel is for releasing the spacer, and the second reel is for recycling the interval And a glue injection unit, after the mold is fixed to the circuit carrier, and each of the spacers abuts the fingerprint identification surface of the corresponding fingerprint recognition wafer, and then an encapsulant is injected through the injection unit Between the spacer and the circuit carrier, the encapsulant partially covers each of the fingerprint recognition wafers, and partially exposes the fingerprint identification surface of each of the fingerprint recognition wafers. The apparatus for manufacturing a fingerprint identification chip package structure according to claim 6, wherein the mold comprises a mold base and a template, after the mold base and the template are respectively fixed on opposite sides of the line carrier, The mold base abuts the line carrier, and the spacer abuts the template.