TWI574806B - Disassembly method of laminated ceramic substrate - Google Patents

Disassembly method of laminated ceramic substrate Download PDF

Info

Publication number: TWI574806B
Authority: TW; Taiwan
Prior art keywords: ceramic substrate; laminated; metal film; substrate; scribe line
Prior art date: 2012-09-26

Application number

TW102112657A

Other languages

English (en)

Chinese (zh)

Other versions

TW201412481A (zh

Inventor

武田真和

村上健二

田村健太

Original Assignee

三星鑽石工業股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-09-26

Filing date

2013-04-10

Publication date

2017-03-21

2013-04-10 Application filed by 三星鑽石工業股份有限公司 filed Critical 三星鑽石工業股份有限公司

2014-04-01 Publication of TW201412481A publication Critical patent/TW201412481A/zh

2017-03-21 Application granted granted Critical

2017-03-21 Publication of TWI574806B publication Critical patent/TWI574806B/zh

Classifications

- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- H10W70/05—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Mining & Mineral Resources (AREA)
Mechanical Engineering (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Ceramic Products (AREA)
Dicing (AREA)

TW102112657A 2012-09-26 2013-04-10 Disassembly method of laminated ceramic substrate TWI574806B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2012212192A JP6019999B2 (ja)	2012-09-26	2012-09-26	積層セラミックス基板の分断方法

Publications (2)

Publication Number	Publication Date
TW201412481A TW201412481A (zh)	2014-04-01
TWI574806B true TWI574806B (zh)	2017-03-21

Family

ID=50318493

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW102112657A TWI574806B (zh)	2012-09-26	2013-04-10	Disassembly method of laminated ceramic substrate

Country Status (4)

Country	Link
JP (1)	JP6019999B2 (ja)
KR (1)	KR101779053B1 (ja)
CN (1)	CN103681294B (ja)
TW (1)	TWI574806B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20170008743A (ko) *	2014-05-14	2017-01-24	아사히 가라스 가부시키가이샤	복합체, 적층체 및 전자 디바이스, 그리고 그들의 제조 방법
JP6481465B2 (ja) *	2014-08-21	2019-03-13	三星ダイヤモンド工業株式会社	複合基板のブレイク方法
JP6547556B2 (ja) *	2015-09-29	2019-07-24	三星ダイヤモンド工業株式会社	脆性基板の分断方法
EP3703106A4 (en) *	2017-10-27	2021-08-25	Mitsuboshi Diamond Industrial Co., Ltd.	METHOD OF SEGMENTING A SUBSTRATE WITH METAL FILM
KR102579235B1 (ko) *	2017-10-27	2023-09-14	미쓰보시 다이야몬도 고교 가부시키가이샤	메탈막 부착 기판의 분단 방법
TWI820177B (zh) *	2018-09-26	2023-11-01	日商三星鑽石工業股份有限公司	附有金屬膜之基板的分割方法
JP2023179261A (ja) *	2022-06-07	2023-12-19	株式会社デンソー	半導体装置の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS60231427A (ja) *	1983-12-21	1985-11-18	Nippon Sheet Glass Co Ltd	板ガラスの切断法
JPS6369728A (ja) *	1986-09-12	1988-03-29	Tomonori Murase	合わせガラス板の切断方法
JP3461449B2 (ja) *	1998-10-13	2003-10-27	シャープ株式会社	半導体素子の製造方法
CN1980777A (zh) *	2004-07-16	2007-06-13	三星钻石工业股份有限公司	刀轮及其制造方法、手动划线工具及划线装置
CN1330596C (zh) *	2002-04-01	2007-08-08	三星钻石工业股份有限公司	脆性材料基板的分断方法以及采用该方法的分断装置
TW200930532A (en) *	2008-01-15	2009-07-16	Mitsuboshi Diamond Ind Co Ltd	Cutting method for layer laminated body and the cutting blade used in the method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6418605A (en) *	1987-07-15	1989-01-23	Matsushita Electric Works Ltd	Dividing method for ceramic wiring base
CN100410196C (zh) *	2001-11-08	2008-08-13	夏普株式会社	切割玻璃基体的方法和装置、液晶板以及制造液晶板的装置
JP2009166169A (ja) *	2008-01-15	2009-07-30	Mitsuboshi Diamond Industrial Co Ltd	カッター装置
JP4918064B2 (ja) *	2008-05-23	2012-04-18	三星ダイヤモンド工業株式会社	積層体の切断方法
JP2009252971A (ja) *	2008-04-04	2009-10-29	Dowa Metaltech Kk	金属セラミックス接合基板及びその製造方法及び金属セラミックス接合体
JP2012009767A (ja) *	2009-11-27	2012-01-12	Kyocera Corp	多数個取り配線基板およびその製造方法、ならびに配線基板およびその製造方法

2012
- 2012-09-26 JP JP2012212192A patent/JP6019999B2/ja active Active
2013
- 2013-04-10 TW TW102112657A patent/TWI574806B/zh active
- 2013-06-13 CN CN201310241360.6A patent/CN103681294B/zh active Active
- 2013-07-29 KR KR1020130089236A patent/KR101779053B1/ko active Active

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS60231427A (ja) *	1983-12-21	1985-11-18	Nippon Sheet Glass Co Ltd	板ガラスの切断法
JPS6369728A (ja) *	1986-09-12	1988-03-29	Tomonori Murase	合わせガラス板の切断方法
JP3461449B2 (ja) *	1998-10-13	2003-10-27	シャープ株式会社	半導体素子の製造方法
CN1330596C (zh) *	2002-04-01	2007-08-08	三星钻石工业股份有限公司	脆性材料基板的分断方法以及采用该方法的分断装置
CN1980777A (zh) *	2004-07-16	2007-06-13	三星钻石工业股份有限公司	刀轮及其制造方法、手动划线工具及划线装置
TW200930532A (en) *	2008-01-15	2009-07-16	Mitsuboshi Diamond Ind Co Ltd	Cutting method for layer laminated body and the cutting blade used in the method

Also Published As

Publication number	Publication date
CN103681294B (zh)	2017-05-24
KR20140040623A (ko)	2014-04-03
KR101779053B1 (ko)	2017-09-18
CN103681294A (zh)	2014-03-26
JP6019999B2 (ja)	2016-11-02
JP2014065633A (ja)	2014-04-17
TW201412481A (zh)	2014-04-01

Publication	Publication Date	Title
TWI574806B (zh)	2017-03-21	Disassembly method of laminated ceramic substrate
KR101998653B1 (ko)	2019-07-10	적층 세라믹 기판의 분단 방법
KR102557292B1 (ko)	2023-07-18	메탈막 부착 기판의 분단 방법
CN120895469A (zh)	2025-11-04	附金属膜的衬底的分断方法
TWI696228B (zh)	2020-06-11	基板之分斷方法及分斷裝置
TWI586234B (zh)	2017-06-01	Disassembly Method and Scribing Device of Laminated Ceramic Substrate
TW201505805A (zh)	2015-02-16	層積陶瓷基板之分斷方法
CN105304562A (zh)	2016-02-03	贴合基板的分断方法及分断装置
JP6191109B2 (ja)	2017-09-06	積層セラミックス基板の分断方法
TWI583522B (zh)	2017-05-21	Disassembly method of laminated ceramic substrate
TW201604158A (zh)	2016-02-01	貼合基板之分斷方法及分斷刀
JP6191108B2 (ja)	2017-09-06	積層セラミックス基板の分断方法
JP6040705B2 (ja)	2016-12-07	積層セラミックス基板の分断方法
CN106079115B (zh)	2020-08-25	贴合基板的分割方法及分割装置
JP6005571B2 (ja)	2016-10-12	金属膜積層セラミックス基板溝加工用ツール
JP6316395B2 (ja)	2018-04-25	積層セラミックス基板のスクライブ装置
JP7385908B2 (ja)	2023-11-24	貼り合わせ基板の分断方法および応力基板の分断方法
TW201505806A (zh)	2015-02-16	積層陶瓷基板之分斷方法
JP2016113309A (ja)	2016-06-23	複合基板のスクライブ方法及びスクライブ装置
JP2016112898A (ja)	2016-06-23	基板の分断装置