TWI574015B - Inspection probe member - Google Patents

Description

Probe component for detection

The present invention relates to a detecting probe component, and more particularly to a detecting probe component configured to contact a terminal of a semiconductor device at a plurality of contact points while preventing deposition of foreign matter.

In general, when detecting the electrical characteristics of a semiconductor device, a stable electrical connection should be formed between the semiconductor device and the test device. In general, a test socket is used to connect the semiconductor device to the test equipment.

The function of such a test socket is to connect the terminals of the semiconductor device to the pads of the test device for bidirectional transmission of electrical signals between the semiconductor device and the test device. For this purpose, a spring-loaded thimble can be included as a contact device in such a test socket. Such spring-loaded thimbles contain internal springs to smoothly connect the semiconductor device to the test equipment and reduce mechanical shock during the joining operation. Therefore, spring-loaded thimbles are used in most test sockets.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a conventional spring type thimble of the prior art.

The external contact terminal 2 is provided on the semiconductor device 1 to be inspected, and the test substrate 8 including the substrate pad 9 is placed at a position facing the semiconductor device 1. The spring type thimble is positioned between the semiconductor device 1 and the test substrate 8 for electrical connection The semiconductor device 1 and the test substrate 8. In Figure 1, the test socket body is not illustrated. As shown in FIG. 1, the spring type thimble includes an upper plunger 5 and a lower plunger 6 on both ends of the body 4, and the spring 7 is positioned inside the body 4. Therefore, the spring 7 applies an elastic force to the upper plunger 5 and the lower plunger 6 in a direction in which the upper plunger 5 and the lower plunger 6 move away from each other. Therefore, the upper plunger 5 can contact the external contact terminal 2 of the semiconductor device 1, and the lower plunger 6 can contact the substrate pad 9 of the test substrate 8. Next, the external contact terminal 2 and the substrate pad 9 can be electrically connected to each other. That is, if the end of the upper plunger 5 contacts the external contact terminal 2 of the semiconductor device 1, and the end of the lower plunger 6 contacts the substrate pad 9 of the test substrate 8, the external contact terminal 2 and the substrate pad 9 are in contact with each other. Electrical connection.

Another spring type ejector of the prior art is disclosed in Korean Patent Application Laid-Open Publication No. 10-2011-0127010. In particular, referring to Figures 2 and 3, the disclosed spring-loaded ejector can be positioned between the semiconductor device and the test substrate for testing the semiconductor device. The spring type thimble includes: a first plunger 20 having an empty passage formed through both ends of the first plunger 20; and a second plunger 30 formed of a conductive material and inserted into the empty passage of the first plunger 20 So that the end of the second plunger 30 can selectively protrude through the contact outlet provided on the end of the empty passage; and the elastic member 40 positioned between the first plunger 20 and the second plunger 30 Applying an elastic force to the first plunger 20 and the second plunger 30 in a direction in which the first plunger 20 and the second plunger 30 move away from each other, wherein the other end of the second plunger 30 is connectable to the test substrate The substrate pad and the end of the second plunger 30 may be exposed through a contact outlet provided on an end of the empty passage of the first plunger 20 and connectable to an external contact terminal of the semiconductor device.

However, such spring type thimbles of the prior art have the following problems. First, the spring type thimble illustrated in Fig. 1 has a concave portion in its central portion, and thus foreign matter collected on the terminals of the semiconductor device can settle on the concave portion. In this case, the conductivity of the spring type thimble can be gradually reduced.

In addition, the spring type ejector illustrated in FIG. 2 has a single mountain shape, and thus it may be difficult to break foreign matter deposited on the terminals by using a spring type thimble, thereby resulting in poor electrical conductivity.

The present invention has been made to solve the above problems. In particular, it is an object of the present invention to provide a probe component for detection that is configured to prevent deposition of foreign matter and to improve electrical conductivity.

Additional aspects will be set forth in part in the description which follows, and in part will be apparent from the description.

In order to achieve the above object, the present invention provides a detecting probe member that is at least partially inserted into a container body and configured to be in contact with a terminal of a semiconductor device at an upper end thereof, the detecting The probe component comprises: a first probe card comprising a first probe portion and a first coupling portion, the first probe portion being in the shape of a mountain, the first tip being provided on the upper end of the first probe portion for use In contact with a terminal of the semiconductor device, the first coupling portion extends downward from the first probe portion and is inserted into the container body and coupled to the container body; and a second probe card, a second probe portion and a second coupling portion, the second probe portion has a mountain shape, and a second tip is provided on an upper end of the second probe portion for contacting the terminal of the semiconductor device, The second coupling portion extends downward from the second probe portion and is inserted into the container body and coupled to the container The body, wherein the first probe card and the second probe card are coupled to each other in a state in which the first probe portion and the second probe portion are interlaced with each other to form a unit.

In an embodiment, the first probe portion and the second probe portion may form a plurality of concave shapes and convex shapes in combination.

In an embodiment, the first probe portion may include: a first first inclined surface extending downward from the first tip toward a side of the first probe portion; and a first a second inclined surface extending obliquely downward from the first tip toward the other side of the first probe portion, wherein the first first inclined surface may be longer than the first second inclined surface.

In an embodiment, the second probe portion may include: a second first inclined surface extending downward from the second tip toward a side of the second probe portion; and a second a second inclined surface extending downward from the second tip toward the other side of the second probe portion, wherein the second first inclined surface may be longer than the second second inclined surface.

In an embodiment, the first first inclined surface and the second first inclined surface may intersect each other in an X-shaped configuration.

In an embodiment, each of the first probe portion and the second probe portion may have a single mountain shape.

In order to achieve the above object, the present invention provides a detecting probe member that is at least partially inserted into a container body and configured to be in contact with a terminal of a semiconductor device at an upper end thereof, the detecting The probe component comprises: a first probe card comprising a first probe portion and a first coupling portion, the first probe portion being in the shape of a mountain, the first tip being provided on the upper end of the first probe portion for use In contact with a terminal of the semiconductor device, the first coupling portion is from the first probe portion Extending downwardly and inserted into the container body and coupled to the container body; and the second probe card includes a second probe portion and a second coupling portion, the second probe portion being in the shape of a mountain, Two tips are provided on an upper end of the second probe portion for contact with the terminal of the semiconductor device, the second coupling portion extending downward from the second probe portion and inserted into the In the container body and coupled to the container body, wherein each of the first probe card and the second probe card has a single mountain shape, and the first probe card The second probe card is coupled to each other to form a unitary body in such a manner that the first probe card and the second probe card form a plurality of mountain shapes when viewed from the side.

In an embodiment, the first tip and the second tip may be separated from each other, and the terminal of the semiconductor device may be inserted between the first tip and the second tip and contact the a first tip and the second tip.

In an embodiment, the first tip and the second tip can be positioned at the same height.

In an embodiment, the first probe card and the second probe card may have the same shape and may be symmetrically disposed from each other.

In the detecting probe member of the present invention, the first probe card and the second probe card are coupled to each other in such a manner that the first probe portion and the second probe portion cross each other To form a whole. Therefore, the probe member for detection can prevent foreign matter from being deposited and improve conductivity.

1‧‧‧Semiconductor device

2‧‧‧External contact terminals

4‧‧‧Ontology

5‧‧‧Upper plunger

6‧‧‧Lower plunger

7‧‧‧ Spring

8‧‧‧Test substrate

9‧‧‧Substrate liner

20‧‧‧First plunger

30‧‧‧Second plunger

40‧‧‧Flexible components

100‧‧‧Spring thimble

110‧‧‧Detection probe parts

120‧‧‧first probe board

121‧‧‧First probe section

121a‧‧‧first tip

121b‧‧‧ first first inclined surface

121c‧‧‧ first second inclined surface

121d‧‧‧First lateral surface

122‧‧‧First coupling part

122a‧‧‧first coupling upper part

122b‧‧‧First groove part

122c‧‧‧first coupling the lower part

123‧‧‧First locking claw part

130‧‧‧Second probe board

131‧‧‧Second probe section

131a‧‧‧second tip

131b‧‧‧Second first inclined surface

131c‧‧‧Second second inclined surface

131d‧‧‧Second lateral surface

132‧‧‧Second coupling part

132a‧‧‧Second coupling upper part

132b‧‧‧second groove part

132c‧‧‧Second coupling lower part

133‧‧‧Second locking claw part

140‧‧‧ container body

150‧‧‧Flexible components

160‧‧‧Lower probe member

170‧‧‧Semiconductor device

171‧‧‧terminal

These and/or other aspects will become more apparent from the following description of the embodiments taken in conjunction with the accompanying drawings.

1 is a schematic view illustrating a prior art spring type thimble.

2 is an exploded perspective view illustrating a prior art spring type thimble.

3 is a cross-sectional view illustrating the spring loaded ejector depicted in FIG. 2.

4 is a perspective view illustrating a spring type thimble including a probe component for detection according to an embodiment of the present invention.

Figure 5 is an assembled view of the spring loaded ejector depicted in Figure 4.

6 and 7 are views illustrating the operation of the spring type ejector depicted in Fig. 4.

The detecting probe component 110 of the present invention is used to detect the semiconductor device 170. At least a part of the detecting probe member 110 is inserted into the container body 140 and supported by the spring 150, and the upper end of the detecting probe member 110 contacts the terminal 171 of the semiconductor device 170.

The detecting probe component 110 is characterized by comprising a plurality of probe cards that are attached to each other by the probe portion and the coupling portion to form a unitary body. In particular, each of the probe cards includes a probe portion and a coupling portion, and the probe cards are integrally attached to each other. The probe card has a substantially thin plate shape.

Each of the probe cards will now be described in detail.

First, the first probe card 120 includes a first probe portion 121 and a first coupling portion 122, wherein the first tip 121a is provided on the upper end of the first probe portion 121 for contact with the terminal 171 of the semiconductor device 170. And the first coupling portion 122 extends downward from the first probe portion 121 and then is inserted into the container body 140 and coupled to the container body 140.

The first probe portion 121 has a thin plate shape, and the upper portion of the first probe portion 121 has a single mountain shape. The first probe portion 121 includes a first tip end 121a, a first first inclined surface 121b, a first second inclined surface 121c, and a first lateral surface 121d.

The first first inclined surface 121b extends downward from the first tip end 121a toward the side of the first probe portion 121, and the first second inclined surface 121c is inclined downward from the first tip end 121a toward the first probe portion The other side of 121 extends. The first first inclined surface 121b is longer than the first second inclined surface 121c.

The first lateral surface 121d refers to a portion that extends vertically downward from the first first inclined surface 121b and the first second inclined surface 121c. As described above, since the first first inclined surface 121b and the first second inclined surface 121c are connected to the first lateral surface 121d, the foreign matter collected on the terminal 171 of the semiconductor device 170 can be along the first The first inclined surface 121b and the first second inclined surface 121c move downward. That is, the foreign matter may not settle on the first first inclined surface 121b and the first second inclined surface 121c, but may fall along the first lateral surface 121d.

The first coupling portion 122 extends downward from the first probe portion 121 and includes: a first coupling upper portion 122a having a width equal to a width of a lower end of the first probe portion 121; a first groove portion 122b, The width is smaller than the width of the first coupling upper portion 122a; and the first coupling lower portion 122c has a width greater than the width of the first groove portion 122b. The elastic member (spring) 150 is fitted around the first coupling lower portion 122c and inserted into the first groove portion 122b and hooked on the first groove portion 122b.

The first locking claw portion 123 is provided to the first probe portion 121 and the first coupling Between the portions 122, and the first locking claw portion 123 has a width greater than the inner diameter of the container body 140. Due to the first locking claw portion 123, the first probe portion 121 is not insertable into the container body 140.

The second probe card 130 includes a second probe portion 131 and a second coupling portion 132, wherein the second probe portion 131 has a mountain shape, and the second tip 131a is provided on the upper end of the second probe portion 131 for use. In contact with the terminal 171 of the semiconductor device 170, the second coupling portion 132 extends downward from the second probe portion 131 and is then inserted into the container body 140 and coupled to the container body 140.

The second probe portion 131 has a thin plate shape, and the upper portion of the second probe portion 131 has a single mountain shape. The second probe portion 131 includes a second tip end 131a, a second first inclined surface 131b, a second second inclined surface 131c, and a second lateral surface 131d.

The second first inclined surface 131b extends downward from the second tip end 131a toward the side of the second probe portion 131, and the second second inclined surface 131c is inclined downward from the second tip end 131a toward the second probe. The other side of the portion 131 extends. The second first inclined surface 131b is longer than the second second inclined surface 131c.

The second lateral surface 131d refers to a portion that extends vertically downward from the second first inclined surface 131b and the second second inclined surface 131c. As described above, since the second first inclined surface 131b and the second second inclined surface 131c are connected to the second lateral surface 131d, the foreign matter collected on the terminal 171 of the semiconductor device 170 may be along the second The first inclined surface 131b and the second second inclined surface 131c move downward. That is, the foreign matter may not be deposited on the second first inclined surface 131b and the second second inclined surface 131c, but may fall along the second lateral surface 131d.

The second coupling portion 132 extends downward from the second probe portion 131 and includes The second coupling upper portion 132a has a width equal to the width of the lower end of the second probe portion 131; the second groove portion 132b has a width smaller than the width of the second coupling upper portion 132a; and the second coupling The lower portion 132c has a width greater than the width of the second groove portion 132b. The elastic member (spring) 150 is inserted into the second groove portion 132b and hooked on the second groove portion 132b while being fitted around the second coupling lower portion 132c.

The second locking claw portion 133 is provided between the second probe portion 131 and the second coupling portion 132, and the second locking claw portion 133 has a width larger than the inner diameter of the container body 140. Due to the second locking claw portion 133, the second probe portion 131 is not insertable into the container body 140.

The first probe card 120 and the second probe card 130 are coupled to each other in such a manner that the first probe portion 121 and the second probe portion 131 cross each other to form a unitary body. In detail, when viewed from the front side, the first first inclined surface 121b and the second first inclined surface 131b cross each other in an X-shaped configuration, and the first tip 121a and the second tip 131a are separated from each other, so that the semiconductor device The terminal 171 of the 170 is insertable between the first tip end 121a and the second tip end 131a and contacts the first tip end 121a and the second tip end 131a.

The first probe card 120 and the second probe card 130 have the same shape and are symmetrically disposed to each other. The first probe card 120 and the second probe card 130 are coupled to each other to form a unitary body in such a manner that the first probe card 120 and the second probe card 130 form a plurality of mountain shapes when viewed from the side. In addition, the first tip end 121a and the second tip end 131a are positioned at the same height. As described above, since the first tip 121a and the second tip 131a are positioned at the same height, the first tip 121a and the second tip 131a can simultaneously contact the terminal 171 of the semiconductor device 170.

Preferably, the first probe card 120 and the second probe card 130 can be the same Material formation. However, it is possible to form the first probe card 120 and the second probe card 130 using different materials. For example, the first probe portion 121 may be made of a high hardness material containing a nickel alloy, and the second probe portion 131 may be made of a material containing a high conductivity such as gold or silver or the like. As described above, the first probe card 120 and the second probe card 130 can comprise different materials. In this case, if a foreign substance such as an oxide layer exists on the terminal 171 of the semiconductor device 170, the first probe portion 121 may break the oxide layer, and the second probe portion 131 may provide high conductivity. In this case, the first probe card 120 can also conduct current.

According to the present invention, the spring type ejector pin 100 including the detecting probe member 110 can be configured as follows. The spring type ejector pin 100 includes: a detecting probe member 110; a container body 140; an elastic member 150 disposed in the container body 140 and elastically biasing the detecting probe member 110 in an upward direction; and at least partially passing through the container body The lower opening of 140 is exposed and lower probe member 160 supported by resilient member 150. The spring type ejector pin 100 is inserted into a housing (not shown) through which an opening is formed vertically.

The detecting probe component 110 of the present invention can provide the following operational effects.

First, if the terminal 171 of the semiconductor device 170 moves downward as shown in FIG. 6 and the contact detecting probe member 110 is as shown in FIG. 7, the terminal 171 of the semiconductor device 170 and the detecting probe member 110 are many. An effective contact is formed between the probe portions.

In detail, when the terminal 171 of the semiconductor device 170 contacts the first tip end 121a and the second tip end 131a which cross each other, the oxide layer formed on the terminal 171 of the semiconductor device 170 can be effectively removed. In this state, the terminal 171 of the semiconductor device 170 can be inserted between the first tip end 121a and the second tip end 131a. that is, The oxide layer formed on the terminal 171 of the semiconductor device 170 can be effectively removed while the terminal 171 of the semiconductor device 170 contacts a plurality of contact points.

The foreign matter separated from the terminal 171 of the semiconductor device 170 is movable away from the first tip end 121a and the second tip end 131a along the inclined surface. That is, the foreign matter may not fall on the detecting probe member 110 but may fall, and therefore, even if the detecting procedure is repeated for a long time, the conductivity reduction due to the deposition of the foreign matter does not occur.

In addition, the detecting probe component 110 of the present invention has a relatively small contact area as compared with the prior art probe having the same inner diameter. Therefore, the pressing pressure per unit area can be increased, and thus the foreign matter collected on the terminal 171 of the semiconductor device 170 can be effectively removed.

If the probe card that is in contact with the terminal 171 of the semiconductor device 170 is formed of a different material, the main function of a tip of the probe card may be to remove foreign matter from the terminal 171, and the main function of the other tip of the probe card may be It is in contact with the terminal 171 to ensure high conductivity. In this way, a better effect can be obtained. For example, if all of the probes are formed of the same material, that is, all of the probes are formed of a material having high hardness, the conductivity of the probe may be low, and thus the configuration may not be in terms of electrical conductivity. Preferably. In another example, if all of the probes are formed of a material that is highly conductive, the probes can be prone to wear in the event of frequent contact with the terminals. However, according to the present invention, a probe card formed of a material having high hardness and a probe card formed of a material having low hardness and high conductivity are alternately arranged and complementable.

The probe component 110 for detection can be fabricated in accordance with an embodiment of the present invention, for example, as described below. First, a conductive layer is formed on a substrate, and a dry film is disposed on the conductive layer. Next, a predetermined groove is formed in the dry film using a photoresist, and the groove is filled with a plating material to form the first probe card 120. Thereafter, another dry film is disposed on the dry film, and A groove having a desired shape is formed in another dry film. Next, a groove having a desired shape is filled with a plating material to form a second probe card 130. Thereafter, the dry film was removed, and the detecting probe member manufactured as described above was separated from the substrate.

It is understood that the embodiments described herein are to be considered in a descriptive sense only and not for the purpose of limitation. Descriptions of features or aspects within the various embodiments are generally considered to be applicable to other similar features or aspects in other embodiments.

While the probe component for detection has been described in accordance with various embodiments of the present invention, the invention is not limited thereto, and various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

100‧‧‧Spring thimble

110‧‧‧Detection probe parts

120‧‧‧first probe board

121‧‧‧First probe section

121a‧‧‧first tip

121b‧‧‧ first first inclined surface

121d‧‧‧First lateral surface

122‧‧‧First coupling part

122a‧‧‧first coupling upper part

122b‧‧‧First groove part

122c‧‧‧first coupling the lower part

123‧‧‧First locking claw part

130‧‧‧Second probe board

131‧‧‧Second probe section

131a‧‧‧second tip

131b‧‧‧Second first inclined surface

131c‧‧‧Second second inclined surface

131d‧‧‧Second lateral surface

132‧‧‧Second coupling part

132a‧‧‧Second coupling upper part

132b‧‧‧second groove part

132c‧‧‧Second coupling lower part

133‧‧‧Second locking claw part

140‧‧‧ container body

150‧‧‧Flexible components

160‧‧‧Lower probe member

Claims (10)

A detecting probe member at least partially inserted into a container body and configured to be in contact with a terminal of a semiconductor device at an upper end thereof, the detecting probe member comprising: a needle plate including a first probe portion and a first coupling portion, the first probe portion being in a mountain shape, a first tip being provided on an upper end of the first probe portion for use with the semiconductor device Terminal contact, the first coupling portion extends downward from the first probe portion and is inserted into the container body and coupled to the container body; and the second probe card includes a second probe a needle portion and a second coupling portion, the second probe portion has a mountain shape, and a second tip is provided on an upper end of the second probe portion for contacting the terminal of the semiconductor device, a second coupling portion extending downward from the second probe portion and inserted into the container body and coupled to the container body, wherein the first probe card and the second probe card Taking the first probe portion and the second probe Portion staggered from each other to form an integrally coupled to each other. The detecting probe member according to claim 1, wherein the first probe portion and the second probe portion are combined to form a plurality of concave shapes and convex shapes. The detecting probe component of claim 1, wherein the first probe portion comprises: a first first inclined surface that is inclined downward from the first tip toward the first probe a side extension of the portion; and a first second inclined surface extending obliquely downward from the first tip toward the other side of the first probe portion, wherein the first first inclined surface is The first second inclined surface is long. The detecting probe member of claim 3, wherein the second probe portion comprises: a second first inclined surface that is inclined downward from the second tip toward the second probe a side extension of the portion; and a second second inclined surface extending downwardly from the second tip toward the other side of the second probe portion, wherein the second first inclined surface is The second second inclined surface is long. The detecting probe member according to claim 4, wherein the first first inclined surface and the second first inclined surface intersect each other in an X-shaped configuration. The detecting probe member according to claim 1, wherein each of the first probe portion and the second probe portion has a single mountain shape. A detecting probe member at least partially inserted into a container body and configured to be in contact with a terminal of a semiconductor device at an upper end thereof, the detecting probe member comprising: a needle plate including a first probe portion and a first coupling portion, the first probe portion being in a mountain shape, a first tip being provided on an upper end of the first probe portion for use with the semiconductor device Terminal contact, the first coupling portion extends downward from the first probe portion and is inserted into the container body and coupled to the container body; and the second probe card includes a second probe a needle portion and a second coupling portion, the second probe portion has a mountain shape, and a second tip is provided on an upper end of the second probe portion for contacting the terminal of the semiconductor device, a second coupling portion extending downward from the second probe portion and inserted into the container body and coupled to the container body, wherein the first probe card and the second probe card Each of them has a single mountain shape, The first probe card and the second probe card are coupled to each other to form a whole in a manner that the first probe card and the second probe card form a plurality of mountain shapes when viewed from the side . The detecting probe member according to claim 7, wherein the first tip and the second tip are separated from each other, and the terminal of the semiconductor device is inserted into the first tip and the Between the second tips and contacting the first tip and the second tip. The detecting probe component of claim 7, wherein the first tip and the second tip are positioned at the same height. The detecting probe member according to claim 7, wherein the first probe card and the second probe card have the same shape and are symmetrically disposed to each other.