TWI574082B - Production apparatus for optical member affixed body - Google Patents

Description

Optical component bonding body manufacturing device

The present invention relates to a manufacturing apparatus for an optical component bonding body.

The present invention claims priority based on Japanese Patent Application No. 2012-197453, filed on Sep. 7, 2012, in Japan, and Japanese Patent Application No. 2013-104148, filed on Jan. And quote its contents here.

Conventionally, in a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate attached to a liquid crystal panel (optical display member) is cut out from a long film to cut a layer having a size conforming to a display area of the liquid crystal panel. Thereafter, it is bonded to a liquid crystal panel (for example, refer to Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2003-255132.

In the conventional structure, in consideration of variations in the dimensions of the liquid crystal panel and the ply, and the lamination deviation (positional deviation) of the ply of the liquid crystal panel, a ply which is slightly larger than the display area is cut. Therefore, an unnecessary area (frame portion) is formed in the peripheral portion of the display region, which may hinder the miniaturization of the device.

An object of the present invention is to provide an apparatus for manufacturing an optical component bonding body which can reduce the frame portion around the display area and achieve the purpose of expanding the display area and miniaturizing the device.

In order to achieve the above object, an aspect of the present invention provides a manufacturing apparatus for an optical component bonding body, which is a manufacturing apparatus for bonding an optical component to an optical display component to form an optical component bonding body, comprising: a conveying section, a conveying strip An optical layer comprising the optical component and a separation layer detachably laminated on a side of the optical component, wherein the strip optical layer has a longer side or a shorter side than a display area of the optical display component The separation portion is configured to convey the separation layer constituting the optical layer from the conveyance portion, and cut the optical assembly longer than the length of the other side of the long side or the short side of the display region. Separating and forming a layer sheet, and supplying the separated layer sheet to a bonding position where the layer sheet is bonded to the optical display member; the bonding portion bonding the layer sheet supplied from the separating portion to the layer The optical display member and the cutting device are formed by splicing the remaining portion disposed outside the opposing portion of the display region with a layer corresponding to the display portion, and forming a corresponding portion corresponding to the display The optical component domain size.

In the above configuration, the "opposing portion with the display region" means a region which is larger than the display region and smaller than the outer shape of the optical display member, and is a region in which the functional portion such as the electronic component mounting portion is avoided. That is, the above structure includes a case where the remaining portion is cut by laser along the outer periphery of the optical display member.

Another aspect of the present invention provides a manufacturing apparatus for an optical component bonding body, which is a manufacturing apparatus for bonding an optical component to an optical display component to form an optical component bonding body, comprising: a conveying section that conveys a strip-shaped optical layer; a separation layer comprising the optical component and a surface separable on one side of the optical component, and the strip optical layer has a length longer than either one of a long side or a short side of a display area of the optical display part Width; a separation unit that transports the separation layer constituting the optical layer from the transport unit, and cuts the optical unit longer than the length of the other side of the long side or the short side of the display area to separate and form a layer And supplying the separated layer sheet to the bonding position where the layer sheet is bonded to the optical display member; the bonding portion bonding the layer sheet supplied from the separating portion to the optical display member; detecting The device detects the outer periphery of the bonding surface of the optical display member to which the layer is attached and the layer; The cutting device is formed by laminating the remaining portion disposed outside the corresponding portion of the bonding surface by a layer bonded to the optical display member to form an optical component having a size corresponding to the bonding surface; Here, the cutting device cuts the layer along the outer peripheral edge of the bonding surface of the optical display member and the layer detected by the detecting device.

Further, in the above configuration, "the bonding surface of the optical layer and the optical display member" means the surface of the optical layer facing the optical display member. Specifically, the term "outer peripheral edge of the bonding surface" means the outer peripheral edge of the substrate on the side where the optical layer is bonded to the optical display member.

Further, the "corresponding portion of the bonding surface" of the optical layer means an area in the optical layer which is larger than the display area of the optical display member opposed to the optical layer and smaller than the outer shape of the optical display member (the outline shape in the plan view). And in order to avoid the area of the functional part such as the electronic component mounting part of the optical display part. Similarly, "corresponding to the size of the bonding surface" means a size larger than the display area of the optical display member and smaller than the outer shape of the optical display member (the outline shape in the plan view).

According to the aspect of the invention, the frame portion around the display area can be reduced, and the display area can be enlarged and the size of the machine can be reduced.

1‧‧‧Film bonding system

5‧‧‧Roller conveyor

6‧‧‧Upstream conveyor

7‧‧‧ downstream conveyor

11‧‧‧First adsorption device

11a‧‧‧ Panel Holder

11b‧‧‧calibration camera

12‧‧‧The first dust collecting device

13‧‧‧First bonding device

15‧‧‧Reversal device

15c‧‧‧calibration camera

16‧‧‧Second dust collecting device

17‧‧‧Second fitting device

20‧‧‧Second adsorption device

22‧‧‧Transporting device

22a‧‧‧Roller Holder

22b‧‧‧Guide roller

22c‧‧‧cutting device

22d‧‧‧blade

22e‧‧‧Winding Department

23‧‧‧ pinch roller

23a‧‧‧Adhesive roller

24‧‧‧Free roller conveyor

26‧‧‧Sucking tray

31‧‧‧First cut-off device

32‧‧‧Second cutting device

40‧‧‧Control Department

41‧‧‧First detection device

42‧‧‧Second detection device

43‧‧‧Photographing device

43a‧‧‧Photographing surface

44‧‧‧Light source

H‧‧‧ Height

H1‧‧‧ Height

CA‧‧‧ inspection area

CL‧‧‧ transverse line

CP‧‧‧ checkpoint

ED‧‧‧ edge

EL‧‧‧ edge line

F1‧‧‧ first optical layer

F2‧‧‧Second optical layer

F11‧‧‧First optical component

F12‧‧‧Second optical component

F1a‧‧‧Optical component body

F2a‧‧‧Adhesive layer

F3a‧‧‧Separation layer

F4a‧‧‧Surface protection film

F5‧‧‧Fitting layer

F6‧‧‧ polarizer

F7‧‧‧ first film

F8‧‧‧second film

FX‧‧‧ optical layer

FXm‧‧‧ layer

F1X‧‧‧ optical components

F1m‧‧‧ first layer FZ optical layer

G‧‧‧Border Department

L1, L2‧‧‧ cutting line

P‧‧‧ LCD panel

P1‧‧‧ first substrate

P2‧‧‧second substrate

P3‧‧‧ liquid crystal layer

P4‧‧‧ display area

PA1‧‧‧First optical component fit

PA2‧‧‧Second optical component fit

PA3‧‧‧The third optical component fit

PA4‧‧‧Four optical component bonding body

P4‧‧‧ display area

R‧‧ track

R1‧‧‧ Roller

R2‧‧‧Separate layer roller

S‧‧‧stop

SA1‧‧‧ first fit surface

T‧‧‧ cut end

WCL‧‧‧ cut line

Θ‧‧‧ tilt angle

Maxmax‧‧‧maximum offset angle

Midmid‧‧‧average offset angle

Θmin‧‧‧minimum offset angle

Fig. 1 is a schematic view showing a manufacturing apparatus of an optical component bonding body according to an embodiment of the present invention.

Fig. 2 is a plan view of a liquid crystal panel.

Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2.

Figure 4 is a cross-sectional view of the optical layer.

Fig. 5 is a schematic view showing the operation of the cutting device.

Fig. 6A is a schematic view showing an example of a method of determining the bonding position with respect to the layer of the liquid crystal panel.

Fig. 6B is a schematic view showing an example of a method of determining the bonding position with respect to the layer of the liquid crystal panel.

Fig. 7 is a cross-sectional view showing the laser cut end of the layer laminated to the liquid crystal panel.

Figure 8 is a cross-sectional view showing the laser cut end of the ply individual.

Figure 9 is a plan view showing the detecting step of the edge of the bonding surface.

Figure 10 is a schematic view of the detecting device.

Fig. 11 is a schematic view showing a modification of the detecting device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but are not limited to the following embodiments of the present invention.

In addition, in the following drawings, the dimensions, ratios, and the like of the respective structural elements are appropriately changed for the sake of clarity of the drawings. In the following description and the drawings, the same or corresponding elements are designated by the same reference numerals, and the repeated description is omitted.

In the following description, the XYZ orthogonal coordinate system is set corresponding to the demand, and the positional relationship of each component is described with reference to the XYZ orthogonal coordinate system. In the present embodiment, the X direction is the transport direction of the liquid crystal panel of the optical display member, and the Y direction is the direction orthogonal to the X direction in the plane of the liquid crystal panel (the width direction of the liquid crystal panel), and the Z direction is the X direction and The direction in which the Y direction is orthogonal.

Hereinafter, a film bonding system 1 for manufacturing an optical component bonding body according to an embodiment of the present invention will be described with reference to the drawings.

Fig. 1 is a schematic structural view showing a film bonding system 1 of the present embodiment.

In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, an antireflection film, or a light diffusing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel.

As shown in Fig. 1, the film bonding system 1 of the present embodiment is provided as a process for manufacturing a production line of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by the control unit 40 of the electronic control unit.

Fig. 2 is a plan view of the liquid crystal panel P as viewed from the thickness direction of the liquid crystal layer P3 of the liquid crystal panel P. The liquid crystal panel P is provided with a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a small rectangular shape disposed opposite to the first substrate P1, and a liquid crystal layer P3 enclosing the first substrate P1 and the second substrate P2. between. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view. In the liquid crystal panel P, a region located inside the outer periphery of the liquid crystal layer P3 in plan view is the display region P4.

Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2. The first optical component cut from the elongated first optical layer F1 and the second optical layer F2 (refer to FIG. 1, hereinafter collectively referred to as optical layer FX) is appropriately bonded to the front/rear surface of the liquid crystal panel P. F11 and second optical component F12 (hereinafter, collectively referred to as optical component F1X). In the present embodiment, the first optical component F11 and the second optical component F12 as polarizing films are bonded to each other on the double-sided side of the backlight side and the display surface side of the liquid crystal panel P.

In addition, each of the remaining portions on the outer side of the facing portion of the display region P4 of the liquid crystal panel P is cut off from the first layer sheet F1m and the second layer sheet F2m (hereinafter, collectively referred to as the layer sheet FXm), which will be described later, respectively. The first optical component F11 and the second optical component F12 are formed.

Fig. 4 is a partial cross-sectional view of the optical layer FX bonded to the liquid crystal panel P. The optical layer FX has a film-like optical module body F1a, an adhesive layer F2a provided on one side of the optical module body F1a (upper side of FIG. 4), and a layer that can be separated and laminated on the optical component via the adhesive layer F2a. A separation layer F3a on the one side of the body F1a; and a surface protection film F4a laminated on the other side of the optical module body F1a (the lower side of FIG. 4). The optical unit body F1a has a function as a polarizing plate, and is disposed across the entire area of the display area P4 of the liquid crystal panel P and the peripheral area of the liquid crystal panel P. In addition, the hatching of each layer in Fig. 4 is omitted for convenience of the drawing.

The optical component body F1a is adhered to the surface of one side of the optical component body F1a. The layer F2a is adhered to the liquid crystal panel P via the adhesive layer F2a in a state of being separated from the separation layer sheet F3a. Hereinafter, a portion obtained by removing the separation layer sheet F3a from the optical layer FX is referred to as a bonding layer sheet F5.

The separation layer F3a protects the adhesive layer F2a and the optical module body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. The surface protective film F4a is separated from the optical module body F1a at a specific time point. Further, the optical layer FX may be a structure that does not include the surface protective film F4a, and the surface protective film F4a may be a structure that cannot be separated from the optical module body F1a.

The optical module body F1a has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on one side of the polarizing mirror F6, and a bonding agent or the like on the other side of the polarizing mirror F6. The second film F8. The first film F7 and the second film F8 protect the protective film such as the polarizer F6.

Further, the optical module body F1a may have a single layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the surface on one side of the optical module body F1a via the adhesive layer F2a.

Next, the film bonding system 1 of the present embodiment will be described in detail.

As shown in Fig. 1, the film bonding system 1 of the present embodiment is provided with a downstream side (+X direction side) in the transport direction of the liquid crystal panel P on the right side in the drawing, and a downstream direction of the liquid crystal panel P on the left side in the drawing. A drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state up to the side (the -X direction side).

The reel device 15 described later on the roller conveyor 5 is a boundary and is divided into an upstream conveyor. 6 and the downstream side conveyor 7. In the upstream conveyor 6, the liquid crystal panel P is conveyed along the short side of the display region P4. On the other hand, in the downstream conveyor 7, the liquid crystal panel P is conveyed along the long side of the display area P4. The layer FXm (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length is cut out from the strip-shaped optical layer FX with respect to the front/rear surface of the liquid crystal panel P.

Further, the upstream conveyor 6 is provided in a first adsorption device 11 to be described later, and includes a free roller conveyor 24 that is independent of the downstream side. On the other hand, the downstream conveyor 7 is attached to the second adsorption device 20, which will be described later, and includes a free roller conveyor 24 that is independent of the downstream side.

The film bonding system 1 of the present embodiment includes a first adsorption device 11, a first dust collecting device 12, a first bonding device 13, a first cutting device 31, a reversing device 15, and a second dust collecting device. The device 16, the second bonding device 17, the second cutting device 32, and the control unit 40.

The first adsorption device 11 adsorbs the liquid crystal panel P and transports it to the upstream conveyor 6, and performs calibration (determination of position) of the liquid crystal panel P. The first adsorption device 11 includes a panel holding portion 11a, a calibration camera 11b, and a rail R.

The panel holding portion 11a is movable in the vertical direction and the horizontal direction, and holds the liquid crystal panel P of the stopper S on the downstream side by the upstream conveyor 6, and aligns the liquid crystal panel P. The panel holding portion 11a sucks and holds the upper side surface of the liquid crystal panel P that is in contact with the stopper S by vacuum suction. The panel holding portion 11a moves on the rail R while the liquid crystal panel P is in the state of being sucked and held, and conveys the liquid crystal panel P. The panel holding portion 11a releases the suction holding when the conveyance is completed, and transmits the liquid crystal panel P to the free roller conveyor 24.

The calibration camera 11b captures a calibration mark or a front end shape of the liquid crystal panel P when the panel holding portion 11a is held in contact with the liquid crystal panel P of the stopper S. The photographic data of the calibration camera 11b is transmitted to the control unit 40, and the panel holding unit 11a is activated based on the photographic data, and the liquid crystal panel P is calibrated to the destination free roller conveyor 24. In other words, the liquid crystal panel P is opposed to the free roller conveyor 24 in the direction in which the conveyance direction is adjusted and the direction in which the conveyance direction is orthogonal, and The free roller conveyor 24 is conveyed in a state in which the amount of deviation in the direction of rotation of the vertical axis of the liquid crystal panel P is rotated.

Here, the liquid crystal panel P conveyed along the rail R by the panel holding portion 11a is attached to the nip roller 23 together with the layer FXm in a state of being adsorbed to the suction tray 26.

The first dust collecting device 12 is disposed on the upstream side of the liquid crystal panel P of the nip roller 23 at the bonding position of the first bonding device 13. The first dust collecting device 12 performs static elimination and dust collection to remove dust around the liquid crystal panel P before being guided to the bonding position, in particular, dust on the lower side of the liquid crystal panel P.

The first bonding apparatus 13 is provided on the downstream side of the panel conveyance of the first adsorption device 11. The first bonding apparatus 13 is bonded to the lower side surface of the liquid crystal panel P that is guided to the bonding position, and is bonded to the bonding layer sheet F5 (corresponding to the first layer sheet F1m) of a specific size.

The first bonding apparatus 13 includes a conveying device 22 and a nip roller 23 .

The transport device 22 winds up the optical layer FX from the roll drum R1 around which the optical layer FX is wound, and transports the optical layer FX in the longitudinal direction of the optical layer FX. The conveying device 22 conveys the bonding layer sheet F5 with the separation layer sheet F3a as a carrier. The conveying device 22 has a drum holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a blade 22d, and a winding portion 22e. Here, the roller holding portion 22a and the plurality of guide rollers 22b correspond to the conveying portion described in the patent application scope. The cutting device 22c and the blade 22d correspond to the separating portion described in the patent application.

The roller holding portion 22a holds the roll drum R1 around which the strip-shaped optical layer FX is wound, and winds up the optical layer FX in the longitudinal direction of the optical layer FX.

The plurality of guide rollers 22b guide the optical layer FX unwound from the roll drum R1 along a specific conveyance path to wind the optical layer FX.

The cutting device 22c applies a half cut to the optical layer FX on the transport path.

The blade 22d is such that the optical layer FX after the half cut is wound at an acute angle to make the laminated layer F5 is separated from the separation layer sheet F3a and the bonded layer sheet F5 is supplied to the bonding position.

The take-up portion 22e holds the separation ply roller R2 that winds up the separation layer sheet F3a that is passed through the blade 22d.

The roller holding portion 22a located at the beginning of the conveying device 22 and the winding portion 22e located at the end of the conveying device 22 are driven in synchronization with each other, for example. Thereby, the roller holding portion 22a winds up the optical layer FX in the conveyance direction of the optical layer FX, and the winding portion 22e winds up the separation layer sheet F3a which passes through the blade 22d. In the transport device 22, the upstream side in the transport direction of the optical layer FX (separation layer sheet F3a) is referred to as the layer transport upstream side, and the downstream side in the transport direction is referred to as the layer transport downstream side.

Each of the guide rollers 22b changes the direction in which the optical layer FX is conveyed along the transport path, and at least a part of the plurality of guide rollers 22b is movable to adjust the tension of the optical layer FX during transport.

Further, a tension roller (not shown) may be disposed between the roller holding portion 22a and the cutting device 22c. The tension roller absorbs the amount of winding of the optical layer FX conveyed by the roller holding portion 22a while the optical layer FX is cut by the cutting device 22c.

Fig. 5 is a schematic view showing the operation of the cutting device 22c of the present embodiment.

As shown in Fig. 5, when the optical device FX of a specific length is wound up, the cutting device 22c straddles the entire width in the width direction orthogonal to the longitudinal direction of the optical layer FX, and performs a part of the thickness direction of the optical layer FX. Cut off half cut. The cutting device 22c of this embodiment is provided with respect to the optical layer FX from the opposite side of the separation layer F3a toward the optical layer FX.

The cutting device 22c is half-cut, that is, the tension in the optical layer FX is conveyed, and the optical layer FX (separation layer sheet F3a) is not broken (the specific thickness separation layer sheet F3a remains), and the cutting is performed. The front and rear positions of the broken blade are cut until the position near the interface between the adhesive layer F2 and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.

In the optical layer FX after the half cut, the optical is cut according to the thickness direction of the optical layer FX The module body F1a and the surface protection film F4a form a cutting line L1 and a cutting line L2 which span the entire width in the width direction of the optical layer FX. The cutting line L1 and the cutting line L2 are formed in parallel in the longitudinal direction of the strip-shaped optical layer FX. For example, in the case of the bonding step of transporting the liquid crystal panel P of the same size, the plurality of cutting lines L1 and L2 are formed at equal intervals in the longitudinal direction of the optical layer FX. The optical layer FX divides a plurality of partitions in the longitudinal direction by a plurality of cutting lines L1 and L2. In the longitudinal direction of the optical layer FX, the partition portions sandwiched by the adjacent pair of cutting lines L1 and L2 are each one of the laminated sheets F5. The layer FXm is a layer of an optical layer FX larger than the display area P4 of the liquid crystal panel P.

Returning to Fig. 1, the blade 22d is disposed below the upstream conveyor 6, and is formed to extend at least the entire width of the optical layer FX in the width direction of the optical layer FX. The side of the separation layer sheet F3a of the optical layer FX after the half cutting is wound in a sliding contact with the blade edge 22d.

The blade 22d has a first surface that is disposed to face downward in a width direction of the optical layer FX (a width direction of the upstream conveyor 6), and a second surface that is above the first surface from the optical layer FX. The width direction is arranged at an acute angle with respect to the first surface; and the front end portion is located at the intersection of the first surface and the second surface.

In the first bonding apparatus 13, the blade 22d is wound around the first optical layer F1 at an acute angle before the edge of the blade 22d. When the first optical layer F1 is folded back at an acute angle due to the front end portion of the blade 22d, the layer sheet (the first layer sheet F1m) of the bonded layer sheet F5 is separated from the separation layer sheet F3a. The front end portion of the blade 22d is disposed on the downstream side of the panel conveyance close to the nip roller 23. The first layer sheet F1m separated from the separation layer sheet F3a by the blade edge 22d is superposed on the lower side surface of the liquid crystal panel P adsorbed to the first adsorption device 11, and guided to the pair of bonding rollers of the nip roller 23. Between 23a. The first layer F1m is a layer of the first optical layer F1 having a larger size than the display region P4 of the liquid crystal panel P.

On the other hand, the bonding layer sheet F5 separated from the separation layer sheet F3a by the blade edge 22d faces the winding portion 22e. The winding portion 22e winds up the bonding layer sheet F5 separated from the separation layer sheet F3a. Line recycling.

The nip roller 23 causes the conveying device 22 to bond the first layer sheet F1m separated from the first optical layer F1 to the lower side surface of the liquid crystal panel P conveyed by the upstream side conveyor 6. Here, the nip roller 23 corresponds to the bonding portion described in the patent application.

The nip roller 23 has a pair of bonding rolls 23a which are arranged in parallel with each other in the axial direction (the upper bonding roll 23a can move up and down). A predetermined gap is formed between the pair of bonding rolls 23a, and the gap is the bonding position of the first bonding apparatus 13.

The liquid crystal panel P and the first layer sheet F1m are superposed and introduced into the gap between the pair of bonding rolls 23a. The liquid crystal panel P and the first layer sheet F1m are pinched between the respective bonding drums 23a, and are sent to the downstream side of the panel conveyance of the upstream conveyor 6. In the present embodiment, the first layer sheet F1m can be bonded to the surface of the backlight side of the liquid crystal panel P by the nip roller 23 to form the first optical component bonding body PA1.

The first cutting device 31 is provided on the downstream side of the panel conveyance of the first bonding device 13 . The first cutting device 31 is cut from the first layer sheet F1m bonded to the liquid crystal panel P, and the remaining portion of the display region P4 disposed on the liquid crystal panel P facing the outside of the portion is cut to form a display corresponding to the liquid crystal panel P. An optical component of the size P4 (first optical component F11).

Here, the "opposing portion with the display region P4" refers to a region that is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region that avoids a functional portion such as an electronic component mounting portion. That is, the case where the remaining portion is cut by laser along the circumference of the liquid crystal panel P is included.

By the first cutting device 31, the remaining portion of the first layer sheet F1m is cut from the first optical unit bonding body PA1, and the first optical unit F11 is bonded to the surface of the backlight side of the liquid crystal panel P to form a second portion. The optical component is bonded to the body PA2. The remaining portion cut from the first layer sheet F1m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

The inverting device 15 is directed to the second side of the display surface side of the liquid crystal panel P toward the upper side The component bonding body PA2 performs forward/reverse inversion so that the backlight side of the liquid crystal panel P faces the upper side, and the second bonding apparatus 17 performs calibration of the liquid crystal panel P.

The inverting device 15 has the same calibration function as the panel holding portion 11a of the first adsorption device 11. The reversing device 15 is provided with the same calibration camera 15c as the calibration camera 11b of the first adsorption device 11.

The inverting device 15 determines the width direction and the direction of rotation of the second optical component bonding body PA2 of the second bonding device 17 based on the optical axis direction inspection data stored in the control unit 40 and the imaging data of the calibration camera 15c. s position. In this state, the second optical component bonding body PA2 is guided to the bonding position of the second bonding device 17.

Since the second adsorption device 20 has the same configuration as that of the first adsorption device 11, the same components are denoted by the same reference numerals and will be described. The second adsorption device 20 adsorbs the second optical component bonding body PA2 and conveys it to the downstream conveyor 7, and performs calibration (determination of position) of the second optical component bonding body PA2. The second adsorption device 20 includes a panel holding portion 11a, a calibration camera 11b, and a rail R.

The panel holding portion 11a is movable in the vertical direction and the horizontal direction, and holds the second optical component bonding body PA2 that is in contact with the downstream side stopper S by the downstream conveyor 7, and performs the second optical component bonding. Calibration of the fitted PA2. The panel holding portion 11a sucks and holds the upper surface of the second optical component bonding body PA2 that abuts against the stopper S by vacuum suction. The panel holding portion 11a moves on the rail R while the second optical unit bonding body PA2 is being sucked and held, and conveys the second optical unit bonding body PA2. When the conveyance is completed, the panel holding portion 11a releases the suction holding of the second optical unit bonding body PA2 and transfers the second optical unit bonding body PA2 to the free roller conveyor 24.

The calibration camera 11b captures a calibration mark or a front end shape of the second optical component bonding body PA2 while the panel holding portion 11a is held in contact with the second optical component bonding body PA2 of the stopper S. The photographic data of the calibration camera 11b is transmitted to the control unit 40, according to the photography. The data is moved by the panel holding portion 11a, and the free roller conveyor 24 of the destination is calibrated to the second optical component bonding body PA2. In other words, the second optical component bonding body PA2 is opposed to the free roller conveyor 24 in the direction in which the conveying direction is adjusted, the direction orthogonal to the conveying direction, and the amount of deviation in the direction of rotation about the vertical axis of the second optical component bonding body PA2. In the state, it is transported to the free roller conveyor 24.

The second dust collecting device 16 is provided on the upstream side in the conveying direction of the liquid crystal panel P of the nip roller 23 at the bonding position of the second bonding device 17. The second dust collecting device 16 performs static elimination and dust collection to remove dust around the second optical component bonding body PA2 before the bonding position, particularly the dust on the lower side of the second optical component bonding body PA2.

The second bonding apparatus 17 is provided on the downstream side of the panel conveyance of the second dust collecting device 16. The second bonding apparatus 17 is bonded to the lower side surface of the second optical component bonding body PA2 that is guided to the bonding position, and is bonded to the bonding layer sheet F5 (corresponding to the second layer sheet F2m) of a specific size. The second bonding apparatus 17 includes the same conveying device 22 and the nip roller 23 as the first bonding device 13 .

The second optical component bonding body PA2 and the second layer sheet F2m are superposed and introduced into the gap between one of the nip rollers 23 and the bonding roller 23a (the bonding position of the second bonding device 17). The second layer F2m is a layer of the second optical layer F2 that is larger than the display area P4 of the liquid crystal panel P.

The second optical component bonding body PA2 and the second layer sheet F2m are pinched between the bonding rollers 23a, and are sent to the downstream side of the panel conveyance of the downstream conveyor 7. In the present embodiment, the second layer sheet F2m can be bonded to the surface of the display surface side of the liquid crystal panel P by the nip roller 23 (the first optical component F11 to which the second optical component bonding body PA2 is bonded) The opposite side of the face) to form the third optical component bonding body PA3.

The second cutting device 32 is provided on the downstream side of the panel conveyance of the second bonding device 17. The second cutting device 32 cuts off the remaining portion of the display region P4 disposed on the liquid crystal panel P opposite to the second layer sheet F2m that is bonded to the liquid crystal panel P to form a display corresponding to the liquid crystal panel P. An optical component of the size P4 (second optical component F12).

By the second cutting device 32, the remaining portion of the second layer F2m is cut from the third optical component bonding body PA3, and the second optical component F12 is bonded to the surface of the display surface side of the liquid crystal panel P, and The first optical component F11 is bonded to the surface of the backlight side of the liquid crystal panel P to form a fourth optical component bonding body PA4 (optical component bonding body). The remaining portion cut from the second layer sheet F2m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

Here, the first cutting device 31 and the second cutting device 32 are, for example, a carbon dioxide (CO ₂ ) laser cutting machine. The first cutting device 31 and the second cutting device 32 cut the layer sheet FXm bonded to the liquid crystal panel P without interruption along the outer periphery of the display region P4.

A bonding inspection device omitted in the drawings is provided on the downstream side of the panel conveyance of the second bonding apparatus 17. The bonding inspection device inspects the workpiece to which the film is bonded (the liquid crystal panel P) by an inspection device omitted from the drawing. For example, the inspection of the inspection apparatus determines whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance range) or the like. When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

Further, in the present embodiment, the control unit 40 as an electronic control unit that integrally controls each part of the film bonding system 1 is included in a computer system. The computer system includes an arithmetic processing unit such as a CPU, and a memory unit such as a memory or a hard disk.

The control unit 40 of this embodiment includes an interface that can communicate with an external device of the computer system. An input device capable of inputting an input signal can be connected to the control unit 40. The above input device includes an input device such as a keyboard or a mouse, or a communication device that can input data from an external device of the computer system. The control unit 40 may include a display device such as a liquid crystal display that displays the operation state of each part of the film bonding system 1, and may be connected to the display device.

An operating system (OS) for controlling the computer system is installed in the memory unit of the control unit 40. In the memory unit of the control unit 40, the calculation processing unit controls each part of the film bonding system 1 to store a program for performing the process of accurately transferring the optical layer FX to each part of the film bonding system 1. package The various information including the program stored in the memory unit can be read by the arithmetic processing unit of the control unit 40. The control unit 40 may include a logic circuit such as an ASIC that performs various processes required for controlling the respective parts of the film bonding system 1.

The memory unit includes a semiconductor memory such as a random access memory (RAM (Random Access Memory)) or a read only memory (ROM (Read Only Memory)), or a hard disk, a CD-ROM reading device, or a disk type. The concept of an external storage device such as a memory medium. In terms of functionality, the memory unit is configured to store the first adsorption device 11, the first dust collection device 12, the first bonding device 13, the first cutting device 31, the inverting device 15, and the second. The storage area of the program software of the control sequence of the adsorption device 20, the second dust collecting device 16, the second bonding device 17, and the second cutting device 32; and other various memory regions.

Hereinafter, an example of a method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P will be described with reference to FIGS. 6A and 6B.

First, as shown in FIG. 6A, a plurality of checkpoints CP are set in the width direction of the optical layer FX, and the optical axis direction of the optical layer FX is detected at each of the checkpoints CP. The time point at which the optical axis is detected may be the time when the roll drum R1 is manufactured, or may be the period before the half of the optical layer FX is taken out from the roll drum R1. The data in the optical axis direction of the optical layer FX and the optical layer FX position (the position in the longitudinal direction and the width direction of the optical layer FX) are stored in association with each other in the memory portion omitted in the drawing.

The control unit 40 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each of the inspection points CP from the memory unit to detect the optical layer FX (the area defined by the transverse line CL) in which the layer FXm is cut out. The average optical axis direction.

For example, as shown in FIG. 6B, the angle (offset angle) between the optical axis direction and the edge line EL of the optical layer FX is detected at the checkpoint CP each time to the maximum angle (maximum offset angle) among the offset angles. As θmax, when the minimum angle (minimum offset angle) is θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Next, detecting relative light The average offset angle θmid direction of the edge line EL of the learning layer FX is taken as the average optical axis direction of the optical layer FX. Further, the offset angle is calculated, for example, by the edge line EL of the optical layer FX, the counterclockwise direction being a positive angle, and the clockwise direction being a negative angle.

Then, the average optical axis direction of the optical layer FX detected by the above method is at a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P, and the bonding position of the layer FXm with respect to the liquid crystal panel P is determined ( Relatively fitting position). For example, in the case where the optical axis direction of the optical component F1X is set to be 90° with respect to the long side or the short side of the display area P4 according to the design specification, the average optical axis direction of the optical layer FX is relative to the long side of the display area P4. Or the short side is 90°, and the layer FXm is attached to the liquid crystal panel P.

The first cutting device 31 and the second cutting device 32 detect the outer peripheral edge of the display region P4 of the liquid crystal panel P by a detecting mechanism such as a camera, and are cut and bonded to the liquid crystal panel P without interruption along the outer peripheral edge of the display region P4. Layer FXm. The outer periphery of the display region P4 is detected by photographing the end portion of the liquid crystal panel P, the position alignment mark provided on the liquid crystal panel P, or the outermost edge of the black matrix provided on the display region P4. On the outer side of the display region P4, a frame portion G (refer to FIG. 3) for providing a predetermined width such as a sealant for bonding the first substrate P1 and the second substrate P2 forming the liquid crystal panel P is provided, and the frame portion G is provided on the frame portion G. The slice FXm is cut (cut line: WCL) by the first cutting device 31 and the second cutting device 32 in the width. In the present embodiment, the first cutting device 31 and the second cutting device 32 perform laser cutting within the width of the frame portion G.

As shown in Fig. 8, when the resin optical layer FZ is separately subjected to laser cutting, the cut end t may be expanded or undulated by thermal deformation. Therefore, when the optical layer FZ after the laser cutting is bonded to the optical display member, it is easy to cause a problem of poor adhesion such as air mixing or deformation in the optical layer FZ.

On the other hand, as shown in Fig. 7, after the layer sheet FXm cut out from the optical layer FX is bonded to the liquid crystal panel P, the layer FXm is cut in this embodiment of the laser cutting layer sheet FXm. The end t is supported by the glass surface of the liquid crystal panel P. Therefore, the cut end t of the layer FXm is not easy Since it is formed in an expanded or wavy shape and is bonded to the liquid crystal panel P, it is less likely to cause a problem of poor bonding.

The vibration amplitude (tolerance) of the cutting line of the laser processing machine is smaller than the vibration amplitude (tolerance) of the cutting blade. Therefore, in the present embodiment, the width of the frame portion G can be made narrower than in the case where the optical layer FX is cut by the dicing blade, and the miniaturization and/or display area of the liquid crystal panel P (machine) can be achieved. The size of P4 is large. Therefore, it can be effectively applied to a high-performance mobile device that needs to enlarge the display screen under the limitation of the size of the casing, such as a smart phone or a tablet terminal in recent years.

Moreover, in the case where the layer in which the optical layer FX is integrated in the display region P4 of the liquid crystal panel P is cut and then bonded to the liquid crystal panel P, the dimensional tolerance of each of the layer and the liquid crystal panel P, and the relative The dimensional tolerances of the bonding positions are superimposed, and it is difficult to make the width of the frame portion G of the liquid crystal panel P narrow (it is difficult to enlarge the display area).

On the other hand, the layer FXm of the optical layer FX having a larger size than the display area P4 of the liquid crystal panel P is cut out from the optical layer FX, and the cut layer FXm is bonded to the liquid crystal panel P, according to the display area P4. In the case of cutting, it is only necessary to take into consideration the vibration tolerance of the cutting line, and it is possible to reduce the tolerance of the width of the frame portion G (±0.1 mm or less). This also makes it possible to narrow the width of the frame portion G of the liquid crystal panel P (which can enlarge the display area).

Further, since the layer FXm is cut by the laser of the non-profit blade, stress is not applied to the liquid crystal panel P at the time of cutting, so that cracks or cracks are less likely to occur at the edge of the substrate of the liquid crystal panel P, and the heat cycle and the like can be improved. Durability. Similarly, since the liquid crystal panel P is non-contact-processed, damage to the electronic component mounting portion P5 is also small.

As described above, according to the film bonding system 1 of the present embodiment, after the first layer F1m and the second layer F2m which are larger than the display region P4 are respectively attached to the liquid crystal panel P, the first layer F1m is used. And the remaining portions of the second layer sheets F2m are cut off, whereby the first optical component F11 and the second optical component F12 corresponding to the size of the display region P4 are formed on the surface of the liquid crystal panel P, respectively. Thereby, the accuracy of each of the first optical component F11 and the second optical component F12 is set in the display area P4. Preferably, the frame portion G outside the display area P4 can be reduced and the display area can be enlarged and the size of the machine can be reduced.

Further, the first layer F1m and the second layer F2m which are larger than the display region P4 are respectively attached to the liquid crystal panel P, even if the optical axis direction is the position of each of the first layer F1m and the second layer F2m. In the case of the change, the liquid crystal panel P can be calibrated and attached in accordance with the direction of the optical axis. Thereby, the accuracy of the optical axis directions of the first optical component F11 and the second optical component F12 of the liquid crystal panel P can be improved, and the color degree and contrast of the optical display device can be improved.

Further, each of the first cutting device 31 and the second cutting device 32 is used to cut the first layer F1m by laser, and the first cutting device 31 and the second cutting device 32 are used to cut the first layer sheet F1m and the second layer sheet F2m, respectively. When the second layer sheet F2m is applied, stress is not applied to the liquid crystal panel P, and cracking or cracking is less likely to occur, and the stability of the liquid crystal panel P can be obtained. Further, it is possible to prevent the occurrence of poor bonding as compared with the case where the first layer sheet F1m and the second layer sheet F2m before the bonding are separately cut by laser.

The examples of suitable embodiments of the present embodiment have been described above with reference to the attached drawings, and are of course not limited to the related examples of the present invention. Various shapes or combinations of the structural components shown in the above examples are merely examples, and various changes can be made according to design requirements and the like without departing from the gist of the invention.

Further, the size of the remaining portion of the layer FXm (the size of the portion protruding toward the outside of the liquid crystal panel P) can be appropriately set in accordance with the size of the liquid crystal panel P. For example, when the layer FXm is applied to a small-sized and small-sized liquid crystal panel P of 5 吋 to 10 ,, the interval between one side of the layer F1S and one side of the liquid crystal panel P at each side of the layer FXm. It can be set to a length ranging from 2 mm to 5 mm.

Hereinafter, a film bonding system according to a second embodiment of the present invention will be described with reference to Figs. 9 to 11 . In the present embodiment, the same components as those of the film bonding system 1 described in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In addition, in this embodiment, the system is attached The ply FXm of the liquid crystal panel P is joined, and the remaining portion outside the bonding surface of the ply FXm is cut to form the optical component F1X.

The film bonding system of the present embodiment is provided with a first detecting device 41 (refer to Fig. 10). The first detecting device 41 is provided on the downstream side of the panel conveyance of the first bonding device 13. The first detecting device 41 detects the edge of the bonding surface of the liquid crystal panel P and the first layer sheet F1m (hereinafter referred to as the first bonding surface).

For example, as shown in FIG. 9, the first detecting device 41 detects the edge ED (outer peripheral edge of the bonding surface) of the first bonding surface SA1 in the four inspection areas CA provided on the conveying path of the upstream conveyor 6. Each of the inspection regions CA is disposed at a position corresponding to the four corner portions of the first bonding surface SA1 having a rectangular outer shape. The edge ED is detected for each liquid crystal panel P conveyed on the production line. The edge ED data detected by the first detecting device 41 is stored in a memory portion not shown in the drawing.

In addition, the arrangement position of the inspection area CA is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side).

Fig. 10 is a schematic view of the first detecting device 41.

In Fig. 10, for the sake of convenience, the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded is the upper side, and the structure of the first detecting device 41 is shown as being vertically opposite.

As shown in Fig. 10, the first detecting device 41 includes an illumination light source 44 that illuminates the bright edge ED, and a photographing device 43 that is disposed closer to the end edge ED with respect to the normal direction of the first bonding surface SA1. In a state in which the inside of the first bonding surface SA1 is inclined, a screen on which the edge ED is imaged from the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded is attached.

The illumination light source 44 and the imaging device 43 are disposed in each of the four inspection areas CA (corresponding to the four corners of the first bonding surface SA1) shown in FIG.

The normal line of the first bonding surface SA1 is sandwiched by the normal line of the imaging surface 43a of the photographing device 43 The angle θ (hereinafter referred to as the inclination angle θ of the photographing device 43) can be set such that the deviation or the burr or the like when the panel is broken does not enter the photographing field of view of the photographing device 43. For example, in a case where the end surface of the second substrate P2 is shifted to the outside of the end surface of the first substrate P1, the inclination angle θ of the photographing device 43 can be set so as not to enter the end edge of the second substrate P2 into the photographing field of view of the photographing device 43.

The inclination angle θ of the photographing device 43 can be set in accordance with the distance H between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter referred to as the height H of the imaging device 43). For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 43 may be set to an angle of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 43 and the tilt angle θ of the photographing device 43 can be obtained from the amount of deviation. In the present embodiment, the height H of the photographing device 43 is set to 78 mm, and the tilt angle θ of the photographing device 43 is set to 10°.

The illumination light source 44 is fixed to the imaging device 43 and disposed in each of the inspection areas CA.

Further, the illumination light source 44 and the imaging device 43 may be arranged to be movable along the edge ED of the first bonding surface SA1. In this case, one set of the illumination light source 44 and the photographing device 43 may be provided. Further, by this, the illumination light source 44 and the imaging device 43 can move at a position where the edge ED of the first bonding surface SA1 can be easily photographed.

The illumination light source 44 is disposed on the opposite side to the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded. The illumination light source 44 is disposed in a state of being inclined toward the outer side of the first bonding surface SA1 with respect to the normal direction of the first bonding surface SA1. In the present embodiment, the optical axis of the illumination source 44 is parallel to the normal line of the imaging surface 43a of the imaging device 43.

In addition, the illumination light source 44 may be disposed on the side of the first optical component bonding body PA1 to which the first layer sheet F1m is bonded.

Further, the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 may also intersect each other with a slight inclination.

Further, as shown in Fig. 11, the imaging device 43 and the illumination light source 44 may be disposed at positions overlapping the edge ED along the normal direction of the first bonding surface SA1. The distance H1 between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43 (hereinafter referred to as the height H1 of the imaging device 43) can be set to a position where the edge ED of the first bonding surface SA1 can be easily detected. For example, the height H1 of the photographing device 43 may be set to a range of 50 mm or more and 150 mm or less.

The cutting position of the first layer sheet F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control unit 40 (refer to FIG. 1) acquires the edge ED data stored in the first bonding surface SA1 of the memory unit to determine the cutting position of the first layer F1m, so that the first optical component F11 does not protrude from the liquid crystal. The outer side of the panel P (outside of the first bonding surface SA1). The first cutting device 31 cuts the first layer sheet F1m at the cutting position determined by the control unit 40.

Returning to Fig. 1, the first cutting device 31 is provided on the downstream side of the panel conveyance of the first detecting device 41. The first cutting device 31 performs laser cutting along the edge ED to project a portion of the first layer F1m protruding from the first optical component bonding body PA1 toward the outside of the first bonding surface SA1 (the first layer F1m The remaining portion is cut to form an optical component (first optical component F11) corresponding to the size of the first bonding surface SA1. Here, the first cutting device 31 corresponds to the cutting device described in the patent application.

Here, "the size corresponding to the first bonding surface SA1" means a size larger than the display area of the liquid crystal panel P and smaller than the outer shape of the liquid crystal panel P (the outline shape in plan view).

By the first cutting device 31, the remaining portion of the first layer sheet F1m is cut from the first optical component bonding body PA1 to form a surface on which the first optical component F11 is bonded to the backlight side of the liquid crystal panel P. Two optical components are bonded to the body PA2. At this time, the corresponding portion (first optical unit F11) of the second optical unit bonding body PA2 and the first bonding surface SA1 is cut, and is separated from the remaining portion of the remaining first layer sheet F1m. The remaining portion after being cut from the first layer sheet F1m is peeled off from the liquid crystal panel P by a peeling device omitted in the drawing and recovered.

Here, the "corresponding portion of the first bonding surface SA1" means larger than the liquid crystal panel P The area is smaller than the outer shape of the liquid crystal panel P, and is an area that avoids functional parts such as an electronic component mounting portion. In this embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, at the three sides except the functional portion, the remaining portion is cut off by laser along the outer periphery of the liquid crystal panel P, which is equivalent to the function. On one side of the portion, the remaining portion is cut by laser from a position outside the outer periphery of the liquid crystal panel P toward the display region P4 side. For example, in the case where the corresponding portion of the first bonding surface SA1 is a bonding surface of the TFT substrate, in the side corresponding to the functional portion, in addition to the functional portion, from the periphery of the liquid crystal panel P toward the display region The P4 side is offset by a certain amount of position.

Further, the film bonding system is provided with a second detecting device 42 (refer to Fig. 10). The second detecting device 42 is provided on the downstream side of the panel conveyance of the second bonding device 17. The second detecting device 42 detects the edge of the bonding surface of the liquid crystal panel P and the second layer sheet F2m (hereinafter referred to as a second bonding surface). The edge data detected by the second detecting device 42 is stored in a memory portion not shown in the drawing.

The cutting position of the second layer F2m is adjusted according to the detection result of the edge of the second bonding surface. The control unit 40 (refer to FIG. 1) acquires the data of the edge of the second bonding surface stored in the memory unit to determine the cutting position of the second layer F2m, so that the second optical component F12 does not protrude from the liquid crystal panel P. Outside (outside of the second bonding surface). The second cutting device 32 cuts the second layer sheet F2m at the cutting position determined by the control unit 40.

The second cutting device 32 is provided on the downstream side of the panel conveyance of the second detecting device 42. The second cutting device 32 performs laser cutting along the edge of the second bonding surface to extend the second layer F2m from the third optical component bonding body PA3 toward the outside of the second bonding surface (second layer) The remaining portion of the sheet F2m is cut to form an optical component (second optical component F12) corresponding to the size of the second bonding surface.

Here, "the size corresponding to the second bonding surface" means a size larger than the display area P4 of the liquid crystal panel P and smaller than the outer shape of the liquid crystal panel P (the outline shape in plan view).

The remaining portion of the second ply F2m is cut from the third optical component bonding body PA3 by the second cutting device 32 to form a display surface for bonding the second optical component F12 to the liquid crystal panel P. On the side surface, the first optical component F11 is bonded to the fourth optical component bonding body PA4 (optical component bonding body) on the backlight side of the liquid crystal panel P. At this time, the corresponding portion (second optical component F12) of the fourth optical component bonding body PA4 and the second bonding surface is cut, and is separated from the remaining portion of the remaining frame-shaped second layer F2m. The remaining portion cut from the second layer sheet F2m is peeled off from the liquid crystal panel P by the peeling device omitted in the drawing and recovered.

Here, the "corresponding portion of the second bonding surface" refers to a region that is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region that avoids a functional portion such as an electronic component mounting portion. In the present embodiment, at the four side edges of the liquid crystal panel P having a rectangular outer shape in plan view, the remaining portion is cut by laser along the outer periphery of the liquid crystal panel P. For example, in the case where the corresponding portion of the second bonding surface is a bonding surface of a color filter (CF) substrate, since there is no portion corresponding to the functional portion, the four side edges of the liquid crystal panel P are The outer periphery of the liquid crystal panel P is cut.

In the present embodiment, the first cutting device 31 is along the outer periphery of the bonding surface (first bonding surface SA1) of the liquid crystal panel P and the first layer sheet F1m detected by the first detecting device 41. One layer of film F1m is cut. The second cutting device 32 cuts the second layer sheet F2m along the outer peripheral edge of the bonding surface (second bonding surface) of the liquid crystal panel P and the second layer sheet F2m detected by the second detecting device 42.

As described above, according to the film bonding system of the present embodiment, after the first layer F1m and the second layer F2m which are larger than the display region P4 are respectively attached to the liquid crystal panel P, the first layer is detected and bonded. The outer peripheral edge of the bonding surface of the liquid crystal panel P of the sheet F1m and the second layer sheet F2m and the first layer sheet F1m and the second layer sheet F2m are disposed on the first layer sheet F1m and the first layer which are respectively bonded to the liquid crystal panel P. The remaining portion outside the corresponding portion of the bonding surface of the two-layer sheet F2m is cut, whereby the first optical component F11 and the second optical component F12 corresponding to the size of the bonding surface can be formed on the surface of the liquid crystal panel P. Thereby, the accuracy of each of the first optical unit F11 and the second optical unit F12 is preferably set in the display area P4, and the frame portion G outside the display area P4 can be reduced, and the display area can be enlarged and the size of the machine can be reduced.

Further, in the film bonding system of the above-described embodiment, the outer peripheral edge of each of the bonding faces of the plurality of liquid crystal panels P is detected by the detecting means, and the layer laminated to each of the liquid crystal panels P can be set according to the outer periphery of the detection. The cut position. Thereby, regardless of the individual difference in the size of the liquid crystal panel P or the layer, the optical component of the desired size can be cut. Therefore, there is no difference in quality due to individual differences in the size of the liquid crystal panel P or the layer size, and the frame portion around the display area can be reduced, and the display area can be enlarged and the size of the machine can be reduced.

While the preferred embodiments of the present invention have been described in the foregoing description, it is understood that the description of the invention is not limited thereto. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Therefore, the invention should not be limited by the foregoing description, but by the scope of the patent application.

1‧‧‧Film bonding system

5‧‧‧Roller conveyor

6‧‧‧Upstream conveyor

7‧‧‧ downstream conveyor

11‧‧‧First adsorption device

11a‧‧‧ Panel Holder

11b‧‧‧calibration camera

12‧‧‧The first dust collecting device

13‧‧‧First bonding device

15‧‧‧Reversal device

15c‧‧‧calibration camera

16‧‧‧Second dust collecting device

17‧‧‧Second fitting device

20‧‧‧Second adsorption device

22‧‧‧Transporting device

22a‧‧‧Roller Holder

22b‧‧‧Guide roller

22c‧‧‧cutting device

22d‧‧‧blade

22e‧‧‧Winding Department

23‧‧‧ pinch roller

23a‧‧‧Adhesive roller

24‧‧‧Free roller conveyor

26‧‧‧Sucking tray

31‧‧‧First cut-off device

32‧‧‧Second cutting device

40‧‧‧Control Department

F1‧‧‧ first optical layer

F2‧‧‧Second optical layer

F3a‧‧‧Separation layer

P‧‧‧ LCD panel

PA1‧‧‧First optical component fit

PA2‧‧‧Second optical component fit

PA3‧‧‧The third optical component fit

PA4‧‧‧Four optical component bonding body

R‧‧ track

R1‧‧‧ Roller

R2‧‧‧Separate layer roller

S‧‧‧stop

Claims (2)

A manufacturing apparatus for an optical component bonding body, which is a manufacturing apparatus for bonding an optical component to an optical display component to form an optical component bonding body, comprising: a conveying section, which is a conveying optical layer containing the optical component and the separable laminated product a separation layer on a side of the optical component, wherein the optical layer has a width greater than a length of one of a long side or a short side of the display area of the optical display unit; and the separation unit is transported from the transport unit The separation layer constituting the optical layer is cut to be longer than the length of the other side of the long side or the short side of the display area to separate and form a layer, and the separated layer is supplied to The layer is bonded to the bonding position of the optical display member; the bonding portion is to bond the layer supplied from the separating portion to the optical display member; and the cutting device is attached to the optical The layer of the display member is laser-cut with respect to the remaining portion disposed outside the opposing portion of the display region to form an optical component having a size corresponding to the display region. A manufacturing apparatus for an optical component bonding body, which is a manufacturing apparatus for bonding an optical component to an optical display component to form an optical component bonding body, comprising: a conveying section, which is a conveying optical layer containing the optical component and the separable laminated product a separation layer on a side of the optical component, wherein the optical layer has a width greater than a length of one of a long side or a short side of the display area of the optical display unit; and the separation unit is transported from the transport unit The separation layer constituting the optical layer is cut to be longer than the length of the other side of the long side or the short side of the display area to separate and form a layer, and the separated layer is supplied to The layer is bonded to the bonding position of the optical display member; the bonding portion is used to bond the layer supplied from the separating portion to the optical display member; and the detecting device detects that the layer is bonded An outer periphery of the optical display member and the lamination of the ply; and The cutting device is formed by laminating the remaining portion disposed outside the corresponding portion of the bonding surface by a layer bonded to the optical display member to form an optical component having a size corresponding to the bonding surface; Here, the cutting device cuts the layer along the outer peripheral edge of the bonding surface of the optical display member and the layer detected by the detecting device.