TWI572859B - Device of detecting appearance of electronic components and detecting method thereof - Google Patents
Device of detecting appearance of electronic components and detecting method thereof Download PDFInfo
- Publication number
- TWI572859B TWI572859B TW104123838A TW104123838A TWI572859B TW I572859 B TWI572859 B TW I572859B TW 104123838 A TW104123838 A TW 104123838A TW 104123838 A TW104123838 A TW 104123838A TW I572859 B TWI572859 B TW I572859B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- electronic components
- image capturing
- rotating disk
- disposed
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 35
- 238000001514 detection method Methods 0.000 claims description 59
- 230000007246 mechanism Effects 0.000 claims description 40
- 238000007664 blowing Methods 0.000 claims description 31
- 230000032258 transport Effects 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 10
- 230000007723 transport mechanism Effects 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 4
- 230000003139 buffering effect Effects 0.000 claims description 3
- 230000002950 deficient Effects 0.000 claims description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000001960 triggered effect Effects 0.000 description 4
- 238000004590 computer program Methods 0.000 description 3
- 238000013102 re-test Methods 0.000 description 3
- 206010036790 Productive cough Diseases 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 210000003802 sputum Anatomy 0.000 description 2
- 208000024794 sputum Diseases 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
本發明係有關於檢測裝置及檢測方法,尤其是電子元件外觀檢測裝置及電子元件外觀檢測方法。 The present invention relates to a detecting device and a detecting method, and more particularly to an electronic component appearance detecting device and an electronic component appearance detecting method.
現有的電子元件外觀檢測裝置係分別於複數個取像模組旁設置對應的複數感測器,當一電子元件被輸送至該複數感測器之一的一感測區時,該感測器可觸發一感測訊號。接著,該電子元件外觀檢測裝置的一控制器可依據該感測訊號來驅動對應被觸發的該感測器的該取像模組來擷取該電子元件的一元件影像,並對所擷取的該元件影像進行分析,以判斷該電子元件外觀是否有瑕疵。 The existing electronic component appearance detecting device respectively sets corresponding multi-sensors beside a plurality of image capturing modules, and when an electronic component is sent to a sensing region of one of the plurality of sensors, the sensor A sensing signal can be triggered. Then, a controller of the electronic component appearance detecting device can drive the image capturing module corresponding to the triggered sensor to capture a component image of the electronic component according to the sensing signal, and capture the component image of the electronic component. The component image is analyzed to determine if the electronic component is flawed in appearance.
然而,由於該電子元件係不斷移動,且現有的電子元件外觀檢測裝置並未考慮該感測器進行感測的一感測時間及該控制器進行判斷並驅動取像模組的一取像時間之間的一時間差。因此,現有的電子元件外觀檢測裝置常發生於拍攝時電子元件未完整落於取像範圍中(即該取像模組未拍攝到完整的該電子元件)的狀況。更進一步地,該控制器依據不完整的該元件影像所產生的檢測結果將具有較低的精確度。 However, since the electronic component is constantly moving, the existing electronic component appearance detecting device does not consider a sensing time that the sensor performs sensing and the controller determines and drives an imaging time of the image capturing module. A time difference between. Therefore, the existing electronic component appearance detecting device often occurs when the electronic component is not completely in the image capturing range at the time of shooting (that is, the image capturing module does not capture the complete electronic component). Further, the controller will have lower accuracy based on the detection result of the incomplete image of the component.
是以,習知電子元件外觀檢測裝置存在上述缺失,而無法準確地擷取完整元件影像,而亟待更有效的方案提出。 Therefore, the conventional electronic component appearance detecting device has the above-mentioned missing, and it is impossible to accurately capture the complete component image, and a more effective solution is proposed.
本發明之主要目的,係在於提供一種用於檢測微尺寸電子元件並可即時觸發影像擷取的電子元件外觀檢測裝置及電子元件外觀檢測方法。 The main object of the present invention is to provide an electronic component appearance detecting device and an electronic component appearance detecting method for detecting micro-sized electronic components and instantly triggering image capturing.
本發明提供一種電子元件外觀檢測裝置,包括一基座、一輸送機構、一感測器、複數個取像模組及電性連接該感測器及該複數取像模組的一控制器。該輸送機構包括設置於該基座的一馬達及用以輸送一電子元件的一旋轉盤。該感測器於偵測該電子元件通過時發出一觸發訊號。該複數取像模組分別配置於鄰近該旋轉盤的複數取像位置,並對該電子元件進行影像擷取。該控制器包括一時間取得模組、一計時模組、該擷取控制模組及一檢測模組。該時間取得模組於收到該觸發訊號時取得輸送該電子元件至各該取像位置分別所需的複數時間區間。該計時模組於計時各該時間區間經過時,分別發出對應的一影像擷取訊號。該擷取控制模組依據該複數影像擷取訊號分別驅動該複數取像模組擷取複數元件影像。該檢測模組依據該複數元件影像進行一瑕疵檢測處理,並產生一檢測結果。 The invention provides an electronic component appearance detecting device, which comprises a base, a conveying mechanism, a sensor, a plurality of image capturing modules, and a controller electrically connected to the sensor and the plurality of image capturing modules. The transport mechanism includes a motor disposed on the base and a rotating disk for transporting an electronic component. The sensor emits a trigger signal when detecting the passage of the electronic component. The plurality of image capturing modules are respectively disposed at a plurality of image capturing positions adjacent to the rotating disk, and image capturing the electronic components. The controller includes a time acquisition module, a timing module, the capture control module and a detection module. The time acquisition module obtains a plurality of time intervals required to transport the electronic component to each of the image capturing positions when the trigger signal is received. The timing module sends a corresponding image capturing signal when each time interval of the timing is passed. The capture control module drives the plurality of image capture modules to capture the plurality of component images according to the plurality of image capture signals. The detection module performs a detection process according to the image of the plurality of components, and generates a detection result.
本發明另外提供一種電子元件外觀檢測方法,運用於包括一輸送機構、一感測器、複數個取像模組及一控制器的一電子元件外觀檢測裝置,包括下列步驟:a)該感測器於偵測該輸送機構所輸送的一電子元件通過時發出一觸發訊號;b)該控制器於收到該觸發訊號時取得輸送該電子元件至對應該複數取像模組的複數取像位置分別所需的複數時間區間;c)於計時各該時間區間經過時,分別驅動對應的各該取像模組對該電子元件進行影像擷取並產生複數元件影像;及d)依據該複數元件影像進行一瑕疵檢測處理,並產生用以表示該電子元件的外觀是否有瑕疵的一檢測結果。 The invention further provides an electronic component appearance detecting method, which is applied to an electronic component appearance detecting device including a conveying mechanism, a sensor, a plurality of image capturing modules and a controller, comprising the following steps: a) the sensing Transmitting a trigger signal when detecting an electronic component transmitted by the transport mechanism; b) receiving, by the controller, the electronic component to the plurality of image capturing positions corresponding to the plurality of image capturing modules when receiving the trigger signal a plurality of time intervals respectively required; c) driving each of the corresponding image capturing modules to perform image capturing on the electronic component and generating a plurality of component images; and d) according to the plurality of components The image is subjected to a detection process and produces a detection result indicating whether or not the appearance of the electronic component is flawed.
本發明經由計算電子元件的輸送時間並即時主動觸發影像擷取,可使電子元件完整落於取像範圍內,而可取得較佳檢測影像,進而提升檢測結果的精確度。 By calculating the transit time of the electronic component and actively triggering the image capture, the electronic component can be completely within the imaging range, and the better detection image can be obtained, thereby improving the accuracy of the detection result.
1‧‧‧電子元件外觀檢測裝置 1‧‧‧Electronic component appearance detecting device
100‧‧‧基座 100‧‧‧Base
200‧‧‧輸送機構 200‧‧‧Transportation agency
210‧‧‧感測器 210‧‧‧ Sensor
220‧‧‧旋轉盤 220‧‧‧ rotating disk
230‧‧‧馬達 230‧‧‧ motor
231‧‧‧驅動軸 231‧‧‧ drive shaft
232‧‧‧角度編碼器 232‧‧‧Angle encoder
240‧‧‧靜電刷 240‧‧‧ electrostatic brush
300‧‧‧供料機構 300‧‧‧Feeding agency
310‧‧‧震動盤 310‧‧‧Vibration plate
311‧‧‧整列軌道 311‧‧‧ Entire track
320‧‧‧儲料桶 320‧‧‧ storage bucket
321‧‧‧供料道 321‧‧‧ Feeding channel
330‧‧‧下料軌道 330‧‧‧Unloading track
400‧‧‧取像模組 400‧‧‧Image capture module
410‧‧‧攝影鏡頭 410‧‧‧Photographic lens
420‧‧‧反射鏡 420‧‧‧Mirror
430‧‧‧直立滑軌 430‧‧‧Upright rails
500‧‧‧分料機構 500‧‧‧Distribution agency
510‧‧‧集料盒 510‧‧‧ aggregate box
511‧‧‧活動緩衝擋板 511‧‧‧Activity buffer baffle
520‧‧‧吹嘴 520‧‧‧Blowing mouth
521‧‧‧電磁閥 521‧‧‧ solenoid valve
522‧‧‧樞轉軸 522‧‧‧ pivot shaft
600‧‧‧控制器 600‧‧‧ controller
601‧‧‧時間取得模組 601‧‧‧Time acquisition module
602‧‧‧計時模組 602‧‧‧Time Module
603‧‧‧擷取控制模組 603‧‧‧ capture control module
604‧‧‧檢測模組 604‧‧‧Test module
605‧‧‧位置偵測模組 605‧‧‧Location Detection Module
606‧‧‧分類模組 606‧‧‧Classification module
700‧‧‧記憶體 700‧‧‧ memory
701‧‧‧電腦程式 701‧‧‧ computer program
S100-S112‧‧‧檢測步驟 S100-S112‧‧‧Test steps
S200-S210‧‧‧供料步驟 S200-S210‧‧‧Feeding steps
S1040-S1046‧‧‧時間區間取得步驟 S1040-S1046‧‧‧ time interval acquisition steps
S300-S304‧‧‧顯示及分類步驟 S300-S304‧‧‧Display and classification steps
圖1係本發明第一具體實施例之電子元件外觀檢測裝置之第一立體示意圖。 1 is a first perspective view of an electronic component appearance detecting device according to a first embodiment of the present invention.
圖2係本發明第一具體實施例之電子元件外觀檢測裝置之第二立體示意圖。 2 is a second perspective view of the electronic component appearance detecting device according to the first embodiment of the present invention.
圖3係本發明第一具體實施例之電子元件外觀檢測裝置之第三立體示意圖。 Fig. 3 is a third perspective view showing the electronic component appearance detecting device of the first embodiment of the present invention.
圖4係本發明第一具體實施例之電子元件外觀檢測裝置之第四立體示意圖。 Fig. 4 is a fourth perspective view showing the electronic component appearance detecting device of the first embodiment of the present invention.
圖5係本發明第一具體實施例之電子元件外觀檢測裝置之俯視圖。 Fig. 5 is a plan view showing an electronic component appearance detecting device according to a first embodiment of the present invention.
圖6係本發明第一具體實施例之輸送機構及供料機構之示意圖。 Figure 6 is a schematic view of a conveying mechanism and a feeding mechanism of a first embodiment of the present invention.
圖7係本發明第一具體實施例之分料機構第一立體示意圖。 Figure 7 is a first perspective view of the dispensing mechanism of the first embodiment of the present invention.
圖8係本發明第一具體實施例之分料機構之第二立體示意圖。 Figure 8 is a second perspective view of the dispensing mechanism of the first embodiment of the present invention.
圖9係本發明第一具體實施例之控制器架構圖。 Figure 9 is a block diagram of a controller of a first embodiment of the present invention.
圖10係本發明第一具體實施例之電子元件外觀檢測方法之流程圖。 FIG. 10 is a flow chart showing a method for detecting an appearance of an electronic component according to a first embodiment of the present invention.
圖11係本發明第二具體實施例之電子元件外觀檢測方法之部分流程圖。 Figure 11 is a partial flow chart showing a method of detecting an appearance of an electronic component according to a second embodiment of the present invention.
圖12係本發明第三具體實施例之電子元件外觀檢測方法之部分流程圖。 Figure 12 is a partial flow chart showing a method of detecting an appearance of an electronic component according to a third embodiment of the present invention.
圖13係本發明第四具體實施例之電子元件外觀檢測方法之部分流程圖。 Figure 13 is a partial flow chart showing the method for detecting the appearance of an electronic component according to a fourth embodiment of the present invention.
茲就本發明之一較佳實施例,配合圖式,詳細說明如後。 DETAILED DESCRIPTION OF THE INVENTION A preferred embodiment of the present invention will be described in detail with reference to the drawings.
首請參閱圖1-5,圖1係本發明第一具體實施例之電子元件外觀檢測裝置之第一立體示意圖,圖2係本發明第一具體實施例之電子元件外觀檢測裝置之第二立體示意圖,圖3係本發明第一具體實施例之電子元件外觀檢測裝置之第三立體示意圖,圖4係本發明第一具體實施例之電子元件外觀檢測裝置之第四立體示意圖,圖5係本發明第一具體實施例之電子元件外觀檢測裝置之俯視圖。 Referring to FIG. 1-5, FIG. 1 is a first perspective view of an electronic component appearance detecting device according to a first embodiment of the present invention, and FIG. 2 is a second perspective view of the electronic component appearance detecting device according to the first embodiment of the present invention. 3 is a third perspective view of an electronic component appearance detecting device according to a first embodiment of the present invention, and FIG. 4 is a fourth perspective view of the electronic component appearance detecting device according to the first embodiment of the present invention. FIG. A plan view of an electronic component appearance detecting device according to a first embodiment of the present invention.
如圖所示,本實施例的電子元件外觀檢測裝置1(以下簡稱檢測裝置1)主要包括有一基座100、一輸送機構200、一感測器210、複數個取像模組400及一控制器(如圖9所示之控制器600)。本實施例中不限定基座100之形式。 As shown in the figure, the electronic component appearance detecting device 1 (hereinafter referred to as the detecting device 1) of the present embodiment mainly includes a base 100, a conveying mechanism 200, a sensor 210, a plurality of image capturing modules 400, and a control unit. (Controller 600 as shown in Figure 9). The form of the susceptor 100 is not limited in this embodiment.
請同時參閱圖6,為本發明第一具體實施例之輸送機構及供料機構之示意圖。該輸送機構200設置在該基座100上,並主要包括有一旋轉盤220及一馬達230。 Please refer to FIG. 6 at the same time, which is a schematic diagram of a conveying mechanism and a feeding mechanism according to a first embodiment of the present invention. The conveying mechanism 200 is disposed on the base 100 and mainly includes a rotating disc 220 and a motor 230.
該馬達230設置於該基座100上,且該馬達230的一驅動軸231較佳為直立配置。較佳地,該馬達230係直驅式馬達(Direct Drive Motor,DD motor)。 The motor 230 is disposed on the base 100, and a drive shaft 231 of the motor 230 is preferably in an upright configuration. Preferably, the motor 230 is a direct drive motor (DD motor).
該旋轉盤220用以輸送複數電子元件(為方便說明,以下將以輸送一個該電子元件為例來進行說明)。較佳地,該旋轉盤220係用以輸送大量微尺寸的該電子元件,並可為玻璃製的圓環狀透明盤,但不以此限定。該旋轉盤220 呈水平配置而並動力連接該馬達230。該旋轉盤220的圓心配置於該馬達230的該驅動軸231的延伸線上,藉此該旋轉盤220能被該馬達230驅動而水平自轉。 The rotating disk 220 is used to transport a plurality of electronic components (for convenience of explanation, the following will be described by taking one electronic component as an example). Preferably, the rotating disk 220 is used to transport a large number of micro-sized electronic components, and may be a circular transparent disk made of glass, but is not limited thereto. The rotating disk 220 The motor 230 is configured to be horizontally connected and powered. The center of the rotary disk 220 is disposed on an extension line of the drive shaft 231 of the motor 230, whereby the rotary disk 220 can be driven by the motor 230 to rotate horizontally.
請同時參閱圖1-5,該感測器210設置在該基座100上,並對應該旋轉盤220配置。該感測器210可感測該旋轉盤22所輸送的該電子元件是否通過一感測區,並於偵測到該電子元件通過該感測區時觸發一觸發訊號。較佳地,該感測器210係遮斷式光學感測器,並可產生自該旋轉盤220上方貫穿的光束。該感測器210可沿著該旋轉盤220的旋轉方向與一下料軌道330的末端相鄰配置。較佳地,該感測器210係排列在該下料軌道330的末端之後。 Referring to FIG. 1-5 at the same time, the sensor 210 is disposed on the base 100 and disposed on the rotating disk 220. The sensor 210 can sense whether the electronic component conveyed by the rotating disk 22 passes through a sensing area, and triggers a trigger signal when detecting that the electronic component passes through the sensing area. Preferably, the sensor 210 is an occlusion optical sensor and can generate a light beam that passes through the rotating disk 220. The sensor 210 can be disposed adjacent to the end of the lower rail 330 along the direction of rotation of the rotating disk 220. Preferably, the sensor 210 is arranged behind the end of the blanking rail 330.
藉此,該旋轉盤220旋轉時可先接收該下料軌道330投下的該電子元件,以旋轉方式輸送該電子元件,並使該電子元件通過該感測器210。並且,該電子元件於通過該感測區時時,可遮斷該感測器210所產生的光束,而可使該感測器210觸發該觸發訊號。 Thereby, the rotating disk 220 can receive the electronic component dropped by the blanking rail 330 first, rotate the electronic component, and pass the electronic component through the sensor 210. Moreover, when the electronic component passes through the sensing region, the light beam generated by the sensor 210 can be blocked, and the sensor 210 can be triggered by the sensor 210.
該複數取像模組400分別設置於該基座100上的不同位置,用以分別對該電子元件的不同視角(如上視角、下視角、前視角、後視角、左視角或右視角)進行影像擷取。該複數取像模組400分別環繞該旋轉盤220配置。較佳地,各該取像模組400係分別依據不同的取像角度而沿不同的角度鄰近該旋轉盤220配置,以分別擷取該電子元件的不同視角的一元件影像。各該取像模組400主要包括用以進行光電轉換以產生該元件影像的一感光元件(圖未標示)及用以匯聚光線的一攝影鏡頭410。各該取像模組400可分別包括一直立滑軌430。各該直立滑軌430係直立配置,並縱向平行於該旋轉盤220的正向。並且,各該直立滑軌430上可滑動地設置該攝影鏡頭410。 The plurality of image capturing modules 400 are respectively disposed at different positions on the susceptor 100 for respectively imaging different viewing angles (such as a viewing angle, a lower viewing angle, a front viewing angle, a rear viewing angle, a left viewing angle, or a right viewing angle) of the electronic component. Capture. The plurality of image capturing modules 400 are disposed around the rotating disk 220, respectively. Preferably, each of the image capturing modules 400 is disposed adjacent to the rotating disk 220 at different angles according to different image capturing angles to respectively capture a component image of different viewing angles of the electronic component. Each of the image capturing modules 400 mainly includes a photosensitive element (not shown) for photoelectrically converting the image of the component and a photographic lens 410 for collecting light. Each of the image capturing modules 400 can include an upright slide rail 430. Each of the upright slide rails 430 is upright and longitudinally parallel to the forward direction of the rotary disk 220. Further, the photographic lens 410 is slidably disposed on each of the upright slide rails 430.
較佳地,該攝影鏡頭410係直接朝向該旋轉盤220配置,以直接對該電子元件進行影像擷取,但不以此限定。於本發明之另一實施例中,該取像模組400亦可視需求而經由一反射鏡420進行取像。舉例來說,該攝影鏡頭410係 朝向該反射鏡420配置,且該反射鏡420對應該旋轉盤220配置,藉以反射該旋轉盤220上承載的該電子元件的另一視角的光線至該攝影鏡頭410。藉此,該取像裝置400不須大幅變更設配置位置即可經由該反射鏡來420來間接擷取該電子元件的不同視角的影像(如該電子元件的後視角(即由該旋轉盤220內側朝外測觀看該電子元件的視角)的影像)。 Preferably, the photographic lens 410 is directly disposed toward the rotating disk 220 to directly capture the electronic component, but is not limited thereto. In another embodiment of the present invention, the image capturing module 400 can also perform image capturing via a mirror 420 as needed. For example, the photographic lens 410 is The reflector 420 is disposed toward the mirror 420, and the mirror 420 is disposed corresponding to the rotating disk 220, thereby reflecting light of another viewing angle of the electronic component carried on the rotating disk 220 to the photographic lens 410. Therefore, the image capturing device 400 can indirectly capture images of different viewing angles of the electronic component via the mirror 420 without changing the setting position (eg, the rear viewing angle of the electronic component (ie, by the rotating disk 220). The image of the viewing angle of the electronic component is viewed from the inside.
值得一提的是,用戶可於該旋轉盤220上預先為該複數取像模組400分別定義一取像位置,其中各該取像位置分別位於各該取像模組400的一拍攝範圍內。當該電子元件經過任一該取像位置時,所對應的該取像模組400可擷取最佳的特定視角的該元件影像(如包括完整電子元件的該元件影像,或是外觀最清晰的該元件影像)。較佳地,各該取像位置係分別依據各該取像模組400的配置位置及等效焦長、用戶欲取得的該電子元件的視角範圍及環境照明來決定,但不以此限定。 It is worth mentioning that the user can define an image capturing position for the plurality of image capturing modules 400 in advance on the rotating disk 220, wherein each of the image capturing positions is located in a shooting range of each of the image capturing modules 400. . When the electronic component passes through any of the image capturing positions, the corresponding image capturing module 400 can capture the image of the component with the best specific viewing angle (such as the component image including the complete electronic component, or the appearance is the clearest Image of the component). Preferably, each of the image capturing positions is determined according to the arrangement position of the image capturing module 400 and the equivalent focal length, the viewing angle range of the electronic component to be obtained by the user, and the ambient illumination, but is not limited thereto.
續請同時參閱圖1-5及圖9,圖9係本發明第一具體實施例之控制器架構圖。如圖9所示,該控制器600電性連接該感測器210及該複數取像模組400,並且主要包括一時間取得模組601、一計時模組602、一擷取控制模組603及一檢測模組604。 Continuing to refer to FIG. 1-5 and FIG. 9, FIG. 9 is a structural diagram of a controller according to a first embodiment of the present invention. As shown in FIG. 9 , the controller 600 is electrically connected to the sensor 210 and the plurality of imaging modules 400 , and mainly includes a time acquisition module 601 , a timing module 602 , and a capture control module 603 . And a detection module 604.
該時間取得模組601可於收到該觸發訊號時,取得將該電子元件自一當前位置(即該感測區)輸送至該複數取像位置分別所需的複數時間區間。 The time acquisition module 601 can obtain a plurality of time intervals required to respectively transport the electronic component from a current position (ie, the sensing region) to the plurality of image capturing positions when the trigger signal is received.
以三組該取像模組400(分別為對應第一取像位置的第一取像模組、對應第二取像位置的第二取像模組及對應第三取像位置的第三取像模組)為例,該時間取得模組601收到該觸發訊號時,可先取得該當前位置、該第一取像位置、該第二取像位置、該第三取像位置及該旋轉盤220的一旋轉速度。接著依據該當前位置、該第一取像位置及該旋轉速度計算出一第一時間區間(如1秒),依據該當前位置、該第二取像位置及該旋轉速度計算出一第二時間區間 (如1.5秒),並依據該當前位置、該第三取像位置及該旋轉速度計算出一第三時間區間(如3秒)。 Three sets of the image capturing module 400 (the first image capturing module corresponding to the first image capturing position, the second image capturing module corresponding to the second image capturing position, and the third image capturing position corresponding to the third image capturing position respectively) For example, when the module 601 receives the trigger signal, the time acquisition module 601 may first obtain the current position, the first image capturing position, the second image capturing position, the third image capturing position, and the rotation. A rotational speed of the disk 220. And calculating a first time interval (for example, 1 second) according to the current position, the first image capturing position, and the rotating speed, and calculating a second time according to the current position, the second image capturing position, and the rotating speed. Interval (eg, 1.5 seconds), and a third time interval (eg, 3 seconds) is calculated according to the current position, the third image capturing position, and the rotation speed.
雖於前述例子中,該複數時間區間係經由即時計算所取得,但不應以此限定。於本發明之另一實施例中,該檢測裝置1更包括電性連接該控制器600的一記憶體700。該控制器600係預先計算並儲存該複數時間區間於該記憶體700中,並於收到該觸發訊號時直接自該記憶體700讀取該複數時間區間。 Although in the foregoing examples, the complex time interval is obtained by instant calculation, it should not be limited thereto. In another embodiment of the present invention, the detecting device 1 further includes a memory 700 electrically connected to the controller 600. The controller 600 pre-calculates and stores the complex time interval in the memory 700, and reads the complex time interval directly from the memory 700 upon receiving the trigger signal.
該計時模組602連接該時間取得模組601,於接受觸發後分別計時該複數時間區間是否經過,並於每計時該複數時間區間之一經過時,發出對應的一影像擷取訊號。 The timekeeping module 602 is connected to the time acquisition module 601. After receiving the trigger, each time interval is counted, and a corresponding image capture signal is sent every time one of the plurality of time intervals elapses.
舉例來說,該計時模組602於計時該第一時間區間(如1秒)經過時,可發出對應該第一取像模組的一第一影像擷取訊號;於計時該第二時間區間(如1.5秒)經過時,可發出對應該第二取像模組的一第二影像擷取訊號;並於計時該第三時間區間(如3秒)經過時,可發出對應該第三取像模組的一第三影像擷取訊號。 For example, the timing module 602 may send a first image capturing signal corresponding to the first image capturing module when the first time interval (eg, 1 second) elapses; (for example, 1.5 seconds), a second image capturing signal corresponding to the second image capturing module may be emitted; and when the third time interval (for example, 3 seconds) elapses, the corresponding third drawing may be issued. A third image capture signal like the module.
該擷取控制模組603連接該計時模組602,用以依據所收到的該複數影像擷取訊號分別驅動該複數取像模組400來擷取該電子元件的不同視角的複數元件影像。 The capture control module 603 is coupled to the chronograph module 602 for driving the plurality of image capture modules 400 to capture the plurality of component images of different viewing angles of the electronic component according to the received plurality of image capture signals.
舉例來說,該擷取控制模組603於收到該第一影像擷取訊號時,可驅動該第一取像模組進行影像擷取,以擷取該電子元件的第一視角(如上視角)的該元件影像;於收到該第二影像擷取訊號時,可驅動該第二取像模組進行影像擷取,以擷取該電子元件的第二視角(如下視角)的該元件影像;並於收到該第三影像擷取訊號時,可驅動該第三取像模組進行影像擷取,以擷取該電子元件的第三視角(如前視角)的該元件影像。 For example, when the first image capturing signal is received, the capturing control module 603 can drive the first image capturing module to perform image capturing to capture the first viewing angle of the electronic component (such as the viewing angle The component image of the component; when receiving the second image capturing signal, driving the second image capturing module to perform image capturing to capture the component image of the second viewing angle of the electronic component (such as the following viewing angle) And receiving the third image capturing module to drive the third image capturing module to perform image capturing to capture the component image of the third viewing angle (such as the front viewing angle) of the electronic component.
該檢測模組604連接該擷取控制模組603,用以依據所擷取的該複數元件影像對該電子元件進行一瑕疵檢測處理,並產生用以表示該電子元件的外觀是否有瑕疵的一檢測結果(如有瑕疵、無瑕疵或需重測三種結果之一,或第一種類瑕疵、第二種類瑕疵、無瑕疵或需重測四種結果之一)。 The detection module 604 is connected to the capture control module 603 for performing a detection process on the electronic component according to the captured image of the plurality of components, and generating a one for indicating whether the appearance of the electronic component is flawed. Test results (one of the three results, including sputum, no sputum, or retesting, or one of the four types of 第一, second 瑕疵, 瑕疵 or retest).
較佳地,該檢測裝置1可進一步包括電性連接該控制器600的一輸出裝置(圖中未示),例如一顯示器、一喇叭或一印表機等。該檢測模組604可經由該輸出裝置輸出該檢測結果(如將該檢測結果以影像方式顯示於該顯示器、該檢測結果以語音方式以該喇叭輸出或將該檢測結果以圖文方式以該印表機列出)。 Preferably, the detecting device 1 can further include an output device (not shown) electrically connected to the controller 600, such as a display, a speaker or a printer. The detection module 604 can output the detection result via the output device (if the detection result is displayed on the display in an image manner, the detection result is outputted by the speaker in a voice manner or the detection result is in a graphic manner. The list is listed).
較佳地,該記憶體700可進一步預先儲存複數無瑕疵元件影像。該瑕疵檢測處理係一影像處理(如灰階化/半色調化處理、特徵像素分析處理、頻率分析處理、差異分析處理、其他影像處理或上述之任意組合)。具體而言,該瑕疵檢測處理是將該複數無瑕疵元件影像與所擷取的該複數元件影像逐一進行比對,以分別判斷該電子元件的各視角的外觀是否存在瑕疵。 Preferably, the memory 700 can further store a plurality of innocent component images in advance. The flaw detection processing is an image processing (such as grayscale/halftone processing, feature pixel analysis processing, frequency analysis processing, difference analysis processing, other image processing, or any combination thereof). Specifically, the flaw detection process compares the plurality of flawless component images with the captured plurality of component images one by one to determine whether the appearance of each view of the electronic component is flawed.
本發明經由計算電子元件的輸送時間並即時主動觸發影像擷取,可確保在取像時電子元件完整落於取像範圍內,而可取得較佳檢測影像,進而提升檢測結果的精確度。並且,由於本發明係經由計時來主動觸發影像擷取,而非經由感測器被動觸發影像擷取,可有效避免因感測器的感測時間及控制器判斷並驅動取像模組的取像時間之間的一時間差所造成的取像延遲,而可取得更佳的元件影像。 By calculating the transit time of the electronic component and actively triggering the image capture, the invention can ensure that the electronic component completely falls within the image capturing range during image capturing, and can obtain a better detection image, thereby improving the accuracy of the detection result. Moreover, since the present invention actively triggers image capture through timing, instead of passively triggering image capture via the sensor, the sensing time of the sensor and the controller can be effectively judged and driven to take the image capturing module. A better component image can be obtained by taking an image delay caused by a time difference between times.
復請參閱圖9,於本發明之另一實施例中,該輸送機構200更包括電性連接該馬達230及該控制器600的一角度編碼器232。該角度編碼器232內建有圓形角度座標,並可取得該旋轉盤220(或該馬達230)的角度位置(如角度值)。該控制器600更包括連接該時間取得模組601的一位置偵測模組605。該位置偵測 模組605經由該角度編碼器232取得該馬達230當前所在的角度值,並取得分別對應該複數取像模組400的複數角度值。並且,該時間取得模組601係將該馬達當前所在的角度值作為該當前位置,並將分別對應該複數取像模組400的該複數角度值分別做為該複數取像位置。較佳地,各該取像模組400的該取像位置係依據該角度編碼器232之角度座標預先儲存於該記憶體700中。並且,該旋轉盤220的該旋轉速度亦可同樣預先儲存於該記憶體700中。 Referring to FIG. 9 , in another embodiment of the present invention, the transport mechanism 200 further includes an angle encoder 232 electrically connected to the motor 230 and the controller 600 . The angle encoder 232 has a circular angle coordinate built therein, and can obtain an angular position (such as an angle value) of the rotating disk 220 (or the motor 230). The controller 600 further includes a position detection module 605 connected to the time acquisition module 601. Position detection The module 605 obtains the current angle value of the motor 230 via the angle encoder 232, and obtains a plurality of angle values corresponding to the plurality of image capturing modules 400. Moreover, the time acquisition module 601 sets the current angle value of the motor as the current position, and respectively determines the complex angle values corresponding to the plurality of image capturing modules 400 as the complex image capturing position. Preferably, the image capturing position of each of the image capturing modules 400 is pre-stored in the memory 700 according to the angular coordinates of the angle encoder 232. Further, the rotational speed of the rotating disk 220 can also be stored in the memory 700 in advance.
具體而言,當該電子元件通過該感測區時,該感測器210觸發該觸發訊號,該位置偵測模組605收到該觸發訊號時,自該角度編碼器232取得該馬達230當時所在的角度值,並藉此定義此角度值(即該當前位置)為該電子元件的一行經路徑的原點。接著,該時間取得模組601可依據前述原點、該旋轉速度及該複數取像模組400的複數角度值來精準地推算該電子元件到達各該取像位置之時間點,以便於該些時間點到達時分別驅動對應的各該取像模組400擷取影像。 Specifically, when the electronic component passes the sensing area, the sensor 210 triggers the trigger signal. When the position detecting module 605 receives the trigger signal, the motor 230 is obtained from the angle encoder 232. The angle value at which it is located, and thereby defining the angle value (ie, the current position) as the origin of a line of the electronic component. Then, the time acquisition module 601 can accurately estimate the time point at which the electronic component reaches each of the image capturing positions according to the origin, the rotation speed, and the complex angle value of the complex image capturing module 400, so as to facilitate the When the time point arrives, the corresponding image capturing module 400 is driven to capture images.
舉例來說,該位置偵測模組605收到該觸發訊號時可取得該馬達230當時所在的角度值(以10度為例)並作為該當前位置,並取得該第一取像位置(以20度為例)、該第二取像位置的(以30度為例)及該第三取像位置(以40度為例)。接著,該時間取得模組601可依據該當前位置、該旋轉速度(以5度/秒為例)及該複數角度值計算出該電子元件到達該第一取像位置需2秒,到達該第二取像位置需4秒,到達該第三取像位置需6秒。並且,該時間取得模組601可於2秒後發出該第一影像擷取訊號,於4秒後發出第二影像擷取訊號,並於6秒後發出第三影像擷取訊號。 For example, when the position detection module 605 receives the trigger signal, the angle value (in the case of 10 degrees) at which the motor 230 is located can be obtained and used as the current position, and the first image capturing position is obtained. 20 degrees is taken as an example), the second image capturing position (for example, 30 degrees) and the third image capturing position (for example, 40 degrees). Then, the time acquisition module 601 can calculate, according to the current position, the rotation speed (for example, 5 degrees/second) and the complex angle value, that the electronic component reaches the first image capturing position for 2 seconds, and reaches the first The second image taking position takes 4 seconds, and it takes 6 seconds to reach the third image capturing position. Moreover, the time acquisition module 601 can send the first image capture signal after 2 seconds, issue a second image capture signal after 4 seconds, and issue a third image capture signal after 6 seconds.
本發明藉由角度編碼器可對旋轉盤的旋轉方向進行精確定位,並僅須單一感測器來定位電子元件的行經路徑的原點,即可精確推斷電子元件到達各取像位置以及其他機構的精確時間。由於定位快速且精確,故本發明可以更快速度取像,並且取像品質更佳,而可確保檢測的準確率。 The invention can precisely position the rotating direction of the rotating disk by the angle encoder, and only needs a single sensor to locate the origin of the path of the electronic component, so that the electronic component can be accurately inferred to each image capturing position and other mechanisms. The precise time. Since the positioning is fast and accurate, the present invention can take images at a faster speed, and the image quality is better, and the accuracy of the detection can be ensured.
復請參閱圖1-6。於本發明之另一實施例中,該檢測裝置1更包括設置在該基座100上的一供料機構300。該供料機構300主要包括一震動盤310及一儲料桶320。 Please refer to Figure 1-6. In another embodiment of the invention, the detecting device 1 further includes a feeding mechanism 300 disposed on the base 100. The feeding mechanism 300 mainly includes a vibration plate 310 and a storage barrel 320.
該儲料桶320用以容納待檢測的該電子元件。具體而言,該儲料桶320經由一供料道321送出該儲料桶320內的該電子元件。該供料道321朝向該震動盤310內配置而可將該電子元件投入該震動盤310內。 The storage bin 320 is configured to receive the electronic component to be detected. Specifically, the storage bin 320 sends the electronic component in the storage bin 320 via a supply channel 321 . The supply channel 321 is disposed in the vibration disk 310 to put the electronic component into the vibration disk 310.
該震動盤310用以經由震動排列該電子元件。具體而言,該震動盤310內形成有一整列軌道311。該整列軌道311延伸呈單圈環形。當複數個該電子元件被投入該震動盤310內時,將落入該整列軌道311之中,並將因該震動盤310的震動而一列排列於該整列軌道311之中。更進一步地,該整列軌道311延伸出與其相連接的一下料軌道330,完成整列的該電子元件將被送入該下料軌道330。較佳地,該下料軌道330的末端延伸至該旋轉盤220上方並與該感測器210相鄰。並且,該下料軌道330沿著該旋轉盤220的旋轉方向之切線方向配置。當該旋轉盤220旋轉時,該電子元件被從該下料軌道330的末端一一投下至該旋轉盤220上,以使該電子元件隨該旋轉盤220旋轉而被沿圓環形的該行經路徑輸送。 The vibrating plate 310 is used to arrange the electronic components via vibration. Specifically, an entire column of tracks 311 is formed in the vibrating plate 310. The entire column of tracks 311 extends in a single ring shape. When a plurality of the electronic components are put into the vibrating plate 310, they will fall into the entire column of tracks 311, and will be arranged in a row in the entire column of tracks 311 due to the vibration of the vibrating plate 310. Further, the entire column of tracks 311 extends out of the blank track 330 to which it is connected, and the electronic components that complete the column are to be fed into the blank track 330. Preferably, the end of the blanking rail 330 extends above the rotating disk 220 and is adjacent to the sensor 210. Further, the blank rail 330 is disposed along a tangential direction of the rotation direction of the rotary disk 220. When the rotating disk 220 rotates, the electronic components are dropped one by one from the end of the blanking rail 330 onto the rotating disk 220, so that the electronic component is rotated along the circular ring as the rotating disk 220 rotates. Path transport.
較佳地,該震動盤310及該儲料桶320皆設置於基座100,但不以此限定。於本發明之另一實施例中,該儲料桶320係附設在該震動盤310上方,且該供料道321朝向該震動盤310內配置。 Preferably, the vibrating plate 310 and the storage bin 320 are all disposed on the base 100, but are not limited thereto. In another embodiment of the present invention, the storage tub 320 is attached to the vibrating tray 310, and the feeding lane 321 is disposed toward the vibrating disc 310.
本發明經由控制供料道的出料速度可有效控制電子元件的下料速度。並且,本發明令電子元件在震動盤內之整列軌道僅經過單圈路徑,可有效縮短電子元件被震動的時間,進而避免電子元件因震動而損壞。 The invention can effectively control the feeding speed of the electronic component by controlling the discharging speed of the feeding channel. Moreover, the present invention allows the entire track of the electronic component in the vibrating plate to pass through only a single-turn path, thereby effectively shortening the time during which the electronic component is vibrated, thereby preventing the electronic component from being damaged by vibration.
於本發明之另一實施例中,該震動盤310與該基座100間設置有一緩衝器(圖中未示)。該緩衝器可減少該震動盤310震動時造成該基座100搖晃,以避免因該旋轉盤220上的該電子元件抖動而影響取像精確度。 In another embodiment of the present invention, a buffer (not shown) is disposed between the vibrating plate 310 and the base 100. The buffer can reduce the shaking of the base 100 when the vibration disk 310 vibrates to avoid the image capturing accuracy caused by the shaking of the electronic component on the rotating disk 220.
於本發明之另一實施例中,該供料機構300更包括一去靜電風扇(圖中未示)。該去靜電風扇之出風方向係朝向該震動盤310配置,對該震動盤310中的該電子元件進行一去靜電處理,以去取該電子元件所帶電荷。具體而言,該電子元件多為環氧樹脂(Eploxy)封裝,因此容易帶有負電荷,該去靜電風扇可去除該震動盤310內的該電子元件所帶的負電荷。 In another embodiment of the present invention, the feeding mechanism 300 further includes a destaticizing fan (not shown). The wind direction of the destaticizing fan is disposed toward the vibrating disk 310, and the electronic component in the vibrating disk 310 is subjected to a destaticizing process to remove the charge of the electronic component. Specifically, the electronic component is mostly an epoxy resin (Eploxy) package, and thus is easily negatively charged, and the destaticizing fan can remove the negative charge carried by the electronic component in the vibration disk 310.
於本發明之另一實施例中,該輸送機構200更包括一靜電刷240。該靜電刷240設置在該基座100並接觸該旋轉盤220。藉此,當旋轉盤220旋轉時能夠與靜電刷240相互摩擦而使旋轉盤220上產生與該電子元件所帶電荷電性相反的電荷(如正電荷,容後詳述)。 In another embodiment of the invention, the transport mechanism 200 further includes an electrostatic brush 240. The electrostatic brush 240 is disposed on the base 100 and contacts the rotating disk 220. Thereby, when the rotary disk 220 rotates, it can rub against the electrostatic brush 240 to generate a charge (such as a positive charge) on the rotary disk 220 opposite to that of the electronic component.
具體而言,當不帶電荷的該電子元件(即已經過該去靜電處理的該電子元件)被輸送到該下料軌道330的末端時,會因與該下料軌道330摩擦而帶有少許電荷(如負電荷)。當該電子元件被從該下料軌道330的末端投下至該旋轉盤220上時,帶有電荷(如負電荷)的該電子元件將吸附固定於帶有電性相反電荷(如正電荷)的該旋轉盤220,如此一來,該電子元件較不易因上方的該震動盤310的震動或該旋轉盤220的轉動而改變在該旋轉盤220上的位置。 Specifically, when the uncharged electronic component (ie, the electronic component that has undergone the destatic processing) is transported to the end of the blanking rail 330, it may be slightly rubbed by friction with the blanking rail 330. A charge (such as a negative charge). When the electronic component is dropped from the end of the blank rail 330 onto the rotating disk 220, the electronic component with a charge (such as a negative charge) is adsorbed and fixed to an electrically opposite charge (such as a positive charge). The rotating disk 220 is such that the electronic component is less likely to change the position on the rotating disk 220 due to the vibration of the vibrating disk 310 above or the rotation of the rotating disk 220.
續請同時參閱圖1-5及7-8,圖7係本發明第一具體實施例之分料機構第一立體示意圖,圖8係本發明第一具體實施例之分料機構之第二立體示意圖。如圖所示,該檢測裝置1可進一步包括一分料機構500。 Continuing to refer to FIGS. 1-5 and 7-8, FIG. 7 is a first perspective view of a dispensing mechanism according to a first embodiment of the present invention, and FIG. 8 is a second perspective view of the dispensing mechanism of the first embodiment of the present invention. schematic diagram. As shown, the detection device 1 can further include a dispensing mechanism 500.
該分料機構500包括設置在該基座100上的複數集料盒510以及對應各集料盒510的複數吹嘴520。各該吹嘴520係分別朝向對應的該集料盒510配置。本發明中,該分料機構500可區分複數類別,例如有瑕疵、無瑕疵、需重測等,並且各類別分別對應設置有一個該吹嘴520及一個該集料盒510。該旋轉盤220介於該複數吹嘴520與對應的該複數集料盒510之間。各該吹嘴520分別連接一正壓氣源且各該吹嘴520上分別設置有電性連接該控制器600的一電磁閥521。 The dispensing mechanism 500 includes a plurality of collecting boxes 510 disposed on the base 100 and a plurality of blowing nozzles 520 corresponding to the respective collecting boxes 510. Each of the mouthpieces 520 is disposed toward the corresponding collection box 510. In the present invention, the dispensing mechanism 500 can distinguish between plural categories, such as flaws, flaws, retests, etc., and each of the categories is provided with one of the mouthpieces 520 and one of the collection boxes 510. The rotating disk 220 is interposed between the plurality of blowing nozzles 520 and the corresponding plurality of collecting boxes 510. Each of the blowing nozzles 520 is connected to a positive pressure air source, and each of the blowing nozzles 520 is respectively provided with a solenoid valve 521 electrically connected to the controller 600.
更進一步地,該控制器600更包括連接該檢測模組604的一分類模組606。該分類模組606於偵測該電子元件被輸送到達該分料機構500時,可依據該檢測結果控制對應的該電磁閥521,以使對應的該吹嘴520吹氣,而將該電子元件吹入對應的該集料盒510中。 Further, the controller 600 further includes a classification module 606 connected to the detection module 604. When the detecting module 606 detects that the electronic component is transported to the dispensing mechanism 500, the corresponding electromagnetic valve 521 can be controlled according to the detection result, so that the corresponding blowing nozzle 520 is blown, and the electronic component is driven. It is blown into the corresponding collection box 510.
較佳地,各該吹嘴520的一吹氣位置(如經由該角度編碼器232取得的對應各該吹嘴520的角度值)可先被預存於該記憶體700中。該分類模組606除依據該檢測結果決定需驅動的該吹嘴520外,可進一步依據該電子元件的該當前位置、該旋轉盤220的該旋轉速度及該吹氣位置計算一吹嘴時間區間。並於計時該吹嘴時間區間經過時,主動且即時地驅動該吹嘴520吹氣(此處主動驅動該吹嘴520的方式係與前述主動驅動該取像模組400的方式相似,於此不再贅述)。 Preferably, a blowing position of each of the blowing nozzles 520 (such as an angle value corresponding to each of the blowing nozzles 520 obtained through the angle encoder 232) may be pre-stored in the memory 700. The classification module 606 can further calculate a mouthpiece time interval according to the current position of the electronic component, the rotation speed of the rotating disk 220, and the blowing position, in addition to determining the blowing nozzle 520 to be driven according to the detection result. . And actively and immediately driving the blowing nozzle 520 to blow when timing the mouthpiece time interval (the manner of actively driving the mouthpiece 520 here is similar to the manner of actively driving the image capturing module 400, No longer).
本發明經由計算電子元件的輸送時間並即時主動驅動吹嘴吹氣,可使電子元件準確落於對應的集料盒中,而可有效避免分類錯誤。並且,由於本發明係經由計時來主動驅動吹嘴吹氣,而非經由感測器被動驅動吹嘴吹氣,可有效避免因感測器的感測時間及控制器判斷並驅動吹嘴的驅動時間之間的時間差所造成的吹氣延遲,而可使電子元件更準確地落於對應的集料盒中。 By calculating the conveying time of the electronic component and actively driving the blowing nozzle to blow the air, the electronic component can be accurately placed in the corresponding collecting box, and the classification error can be effectively avoided. Moreover, since the present invention actively drives the mouthpiece blowing through the timing, instead of passively driving the mouthpiece blowing through the sensor, the sensing time of the sensor and the controller can be effectively judged and driven by the controller. The blow delay caused by the time difference between the times allows the electronic components to fall more accurately into the corresponding collection box.
較佳地,各該集料盒510內分別設有一活動緩衝擋板511。各該吹嘴520分別朝向對應的該集料盒510內的該活動緩衝擋板511配置。當該吹嘴520將該旋轉盤220上的該電子元件吹入對應的該集料盒510時,該電子元件先撞擊該活動緩衝擋板511並減速,隨後落入該集料盒510底部。該活動緩衝擋板511可為但不限於一軟板或樞設在該集料盒510內的硬板。 Preferably, each of the collection boxes 510 is provided with a movable buffer baffle 511. Each of the blowing nozzles 520 is disposed toward the corresponding movable buffer baffle 511 in the corresponding collecting box 510. When the mouthpiece 520 blows the electronic component on the rotating disk 220 into the corresponding collecting box 510, the electronic component first hits the movable buffering baffle 511 and decelerates, and then falls into the bottom of the collecting box 510. The movable buffer baffle 511 can be, but not limited to, a soft board or a hard board pivoted within the collection box 510.
本發明經由配置活動緩衝擋板於集料盒中,可有效避免電子元件因高速撞擊集料盒內壁而損壞,進而提升檢測後電子元件的良率。 By arranging the active buffer baffle in the collecting box, the invention can effectively prevent the electronic component from being damaged by the high-speed impact on the inner wall of the collecting box, thereby improving the yield of the electronic component after the detecting.
請參閱圖8,本發明的該檢測裝置1更包括一種替換結構,可有效地且快速地進行元件汰換或維護。 Referring to FIG. 8, the detecting device 1 of the present invention further includes an alternative structure for efficiently and quickly performing component replacement or maintenance.
具體而言,各該吹嘴520係分別藉由一樞轉軸522可樞轉地連接該基座100。各該樞轉軸522與該旋轉盤220係相互平行配置。藉此各該吹嘴520可直接向上翻轉而自該旋轉盤220上退開,以方便進行汰換或維護。 Specifically, each of the mouthpieces 520 is pivotally coupled to the base 100 by a pivot shaft 522, respectively. Each of the pivot shafts 522 and the rotating disk 220 are disposed in parallel with each other. Thereby, each of the blowing nozzles 520 can be directly turned upside down and retracted from the rotating disk 220 to facilitate replacement or maintenance.
另,由於該電子元件的尺寸微小,易於輸送過程中磨損該旋轉盤220。受損的該旋轉盤220將難以穩定輸送該電子元件,並可能影響定位精確度,而須進行更換(即該旋轉盤220係屬於耗材)。 In addition, since the size of the electronic component is small, it is easy to wear the rotating disk 220 during conveyance. The damaged rotating disk 220 will be difficult to stably transport the electronic component and may affect the positioning accuracy and must be replaced (i.e., the rotating disk 220 is a consumable).
為解決上述該旋轉盤220的更換問題,本發明的該檢測裝置1除上述各該吹嘴520可向上翻轉退讓外,各該取像模組400的該鏡頭310亦可沿該直立滑軌430向上(翻轉)退讓。本發明的該檢測裝置1於該複數吹嘴520及該複數取像模組400退讓後,可有效騰出方便更換該旋轉盤220的一維護空間。並且,於前述退讓過程中,並不會造成該旋轉盤220(或替換後的該旋轉盤220)於旋轉方向上的位移。因此於更換完該旋轉盤220後,該複數取像模組400及該複數吹嘴520可直接向下(翻轉)歸位,且不需再重新對於該旋轉盤220的旋轉方向校正定位,而可有效減少維護耗時。 In order to solve the problem of the replacement of the rotating disk 220, the detecting device 1 of the present invention can be flipped and retracted in the above-mentioned respective blowing nozzles 520. The lens 310 of each of the image capturing modules 400 can also be along the vertical sliding rail 430. Up (flip) back. After the plurality of mouthpieces 520 and the plurality of image capturing modules 400 are retracted, the detecting device 1 of the present invention can effectively vacate a maintenance space for conveniently replacing the rotating disk 220. Moreover, during the aforementioned retracting process, the displacement of the rotating disk 220 (or the replaced rotating disk 220) in the rotational direction is not caused. Therefore, after the rotating disk 220 is replaced, the plurality of image capturing modules 400 and the plurality of blowing nozzles 520 can be directly turned down (flip), and the positioning direction of the rotating disk 220 is not required to be re-corrected. It can effectively reduce maintenance and time.
值得一提的是,該時間取得模組601、該計時模組602、該擷取控制模組603、該檢測模組604、該位置偵測模組605及該分類模組606可經由硬體模組方式實現(如電子電路或已燒錄數位電路的積體電路),亦可經由軟體模組方式實現(如韌體(fireware)、程式(program)或應用程式介面(Application Programming Interface,API)),但不以此為限。當前述模組係經由軟體模組方式實現時,前述各模組間的連接係指程式間的鏈結(link)。 It is worth mentioning that the time acquisition module 601, the timing module 602, the capture control module 603, the detection module 604, the position detection module 605 and the classification module 606 can be via hardware. Module mode implementation (such as electronic circuit or integrated circuit of programmed digital circuit) can also be implemented via software module (such as firmware, program or application programming interface (API). )), but not limited to this. When the aforementioned modules are implemented via a software module, the connection between the above modules refers to a link between programs.
當該時間取得模組601、該計時模組602、該擷取控制模組603、該檢測模組604、該位置偵測模組605及該分類模組606係經由軟體模組方式實現時,該記憶體700可儲存一電腦程式701,該電腦程式記錄有用於實現前述各該模 組的程式碼或機械碼(machine code)。該控制器600執行該電腦程式701的程式碼或機械碼後,可實現前述各該模組601-606的功能。 When the time acquisition module 601, the timing module 602, the capture control module 603, the detection module 604, the position detection module 605, and the classification module 606 are implemented via a software module, The memory 700 can store a computer program 701, which is recorded for implementing the foregoing modes. The set of code or machine code. After the controller 600 executes the code or mechanical code of the computer program 701, the functions of the modules 601-606 can be implemented.
續請參閱圖10,為本發明第一具體實施例之電子元件外觀檢測方法之流程圖。本發明各實施例的電子元件外觀檢測方法(以下簡稱該檢測方法)主要皆運用於圖1-9所示的該檢測裝置1。 Continuing to refer to FIG. 10, it is a flowchart of a method for detecting an appearance of an electronic component according to a first embodiment of the present invention. The electronic component appearance detecting method (hereinafter referred to as the detecting method) of each embodiment of the present invention is mainly applied to the detecting device 1 shown in FIGS. 1-9.
步驟S100:該感測器210偵測該輸送機構200所輸送的該電子元件是否通過該感測器210的該感測區。該輸送機構200較佳係經由該旋轉盤220輸送該電子元件,但亦可經由一輸送帶來輸送該電子元件,並且該檢測裝置1的各元件係圍繞該輸送帶配置,不加以限定。 Step S100: The sensor 210 detects whether the electronic component conveyed by the transport mechanism 200 passes through the sensing area of the sensor 210. The transport mechanism 200 preferably transports the electronic component via the rotating disk 220, but the electronic component can also be transported via a transport belt, and the components of the detecting device 1 are disposed around the conveyor belt and are not limited.
較佳地,該感測器210係遮斷式光學感測器,並可依據所產生的光束是否被遮斷來偵測該電子元件是否通過該感測區。若偵測該電子元件通過,則執行該步驟S102。否則,重複執行該步驟S100以持續偵測。 Preferably, the sensor 210 is an occlusion optical sensor and can detect whether the electronic component passes through the sensing area according to whether the generated light beam is blocked. If it is detected that the electronic component passes, the step S102 is performed. Otherwise, the step S100 is repeatedly executed to continuously detect.
步驟S102:該感測器210發出該觸發訊號至該控制器600。 Step S102: The sensor 210 sends the trigger signal to the controller 600.
步驟S104:該控制器600收到該觸發訊號時,分別取得輸送該電子元件至對應該複數取像模組400的該複數取像位置所需的該複數時間區間。 Step S104: When receiving the trigger signal, the controller 600 respectively obtains the complex time interval required to transport the electronic component to the complex image capturing position corresponding to the plurality of image capturing modules 400.
較佳地,該控制器600可進一步具有一連料偵測功能。具體而言,當該控制器600判斷多個該觸發訊號的接收時間過於密集(如僅間隔0.1秒)時,可直接判定當前通過的多個該電子元件有連料的情況發生(即多個該電子元件的間隔過小)。 Preferably, the controller 600 can further have a feed detection function. Specifically, when the controller 600 determines that the receiving time of the plurality of trigger signals is too dense (eg, only 0.1 second interval), it may directly determine that a plurality of the electronic components currently passing through have a connection (ie, multiple The spacing of the electronic components is too small).
接著,對當前通過的多個該電子元件進行定位,但不計時該複數時間區間,而是直接將多個該電子元件的該檢測結果皆設定為「需重測」,並令該分料機構500將多個該電子元件分類至對應的該集料盒510內。藉此,可有效避免多個該電子元件因連料而被誤判為有瑕疵,進而有效提升檢測正確率。 Then, the plurality of electronic components that are currently passing are positioned, but the plurality of time intervals are not counted, and the detection results of the plurality of electronic components are directly set to “re-retest”, and the dispensing mechanism is configured 500 sorts a plurality of the electronic components into the corresponding collection box 510. Thereby, it is possible to effectively prevent a plurality of the electronic components from being misjudged as defective due to the splicing, thereby effectively improving the detection accuracy.
並且,當連料的多個該電子元件通過各該取像模組400的該取像位置時,該控制器600可不驅動各該取像模組400進行影像擷取(換句話說,該控制器可不執行步驟S106-S112,而直接結束該檢測方法),以避免擷取到無用的該元件影像。 Moreover, when a plurality of the electronic components connected to each other pass the image capturing position of each of the image capturing modules 400, the controller 600 may not drive each of the image capturing modules 400 to perform image capturing (in other words, the control) The device may not perform steps S106-S112 and directly terminate the detection method) to avoid capturing the useless image of the component.
步驟S106:該控制器600計時任一該複數時間區間是否經過。若任一該複數時間區間經過,則執行步驟S108。否則,重複執行該步驟S106以持續計時。 Step S106: The controller 600 counts whether any of the plural time intervals has elapsed. If any of the complex time intervals has elapsed, step S108 is performed. Otherwise, step S106 is repeatedly executed to continue timing.
步驟S108:該控制器600驅動對應的該取像模組400來擷取該電子元件的特定視角的該元件影像,其中被驅動的該取像模組400係對應於該步驟S106中被判定已經經過的該時間區間。 Step S108: The controller 600 drives the corresponding image capturing module 400 to capture the component image of the specific viewing angle of the electronic component, wherein the image capturing module 400 that is driven corresponds to the determined in step S106. The time interval passed.
步驟S110:該控制器600判斷該複數時間區間是否皆已經過。換句話說,該控制器600係判斷是否該複數取像模組400(分別對應該複數時間區間,並分別用於拍攝該電子元件的不同視角)皆已完成對該電子元件的影像擷取動作。若判斷該複數時間區間皆已經過,則執行步驟S112。否則,重複執行該步驟S106以持續計時,直到該複數取像模組400皆完成對該電子元件的影像擷取動作為止。 Step S110: The controller 600 determines whether the plural time intervals have passed. In other words, the controller 600 determines whether the plurality of image capturing modules 400 (respectively for a plurality of time intervals and respectively for capturing different angles of view of the electronic component) have completed image capturing operations on the electronic component. . If it is determined that the complex time interval has passed, step S112 is performed. Otherwise, the step S106 is repeatedly performed to continue counting until the plurality of image capturing modules 400 complete the image capturing operation of the electronic component.
步驟S112:該控制器600依據所取得的該複數元件影像對該電子元件進行該瑕疵檢測處理,並產生用以表示該電子元件的外觀是否有瑕疵的該檢測結果。 Step S112: The controller 600 performs the flaw detection processing on the electronic component according to the acquired image of the plurality of components, and generates the detection result indicating whether the appearance of the electronic component is flawed.
續請參閱圖11,為本發明第二具體實施例之電子元件外觀檢測方法之部分流程圖。本實施例的檢測方法與第一實施例差異在於,本實施例的檢測方法於該步驟S100前更包括下列步驟: FIG. 11 is a partial flowchart of a method for detecting an appearance of an electronic component according to a second embodiment of the present invention. The difference between the detection method of this embodiment and the first embodiment is that the detection method of the embodiment further includes the following steps before the step S100:
步驟S200:該供料機構300將該電子元件自該儲料桶320輸送至該震動盤310。 Step S200: The feeding mechanism 300 transports the electronic component from the storage tub 320 to the vibration disk 310.
步驟S202:該供料機構300對該電子元件進行該去靜電處理。較佳地,該供料機構300係經由該去靜電風扇來進行該去靜電處理。 Step S202: The feeding mechanism 300 performs the destatic processing on the electronic component. Preferably, the feeding mechanism 300 performs the destaticizing treatment via the destaticizing fan.
步驟S204:該供料機構300震動該震動盤310以排列該電子元件,並將排列後的該電子元件輸送至該震動盤310延伸出的該下料軌道330。 Step S204: The feeding mechanism 300 vibrates the vibration disk 310 to arrange the electronic components, and delivers the arranged electronic components to the blanking rail 330 extended by the vibration disk 310.
步驟S206:該供料機構300使該電子元件帶有電荷。較佳地,該供料機構300經由使該電子元件摩擦該下料軌道330來使該電子元件帶有負電荷。 Step S206: The feeding mechanism 300 charges the electronic component. Preferably, the feeding mechanism 300 causes the electronic component to be negatively charged by rubbing the electronic component against the blanking track 330.
步驟S208:該輸送機構200使該旋轉盤帶有與該電子元件所帶電荷電性相反的電荷。較佳地,該輸送機構200係使該旋轉盤220摩擦該靜電刷240,以使該旋轉盤帶有與該電子元件攜帶電荷電性相反的電荷。 Step S208: The transport mechanism 200 causes the rotating disk to carry an electric charge opposite to that of the electronic component. Preferably, the transport mechanism 200 causes the rotating disc 220 to rub against the electrostatic brush 240 such that the rotating disc carries a charge that is electrically opposite to that of the electronic component.
步驟S210:該供料機構300經由該下料軌道330輸送該電子元件至該旋轉盤220。由於此時該電子元件與該旋轉盤220帶有彼此電性相反的電荷,該電子元件將吸附固定於該旋轉盤220。接著執行該步驟S100。 Step S210: The feeding mechanism 300 transports the electronic component to the rotating disk 220 via the blanking rail 330. Since the electronic component and the rotating disk 220 have electric charges opposite to each other at this time, the electronic component is adsorbed and fixed to the rotating disk 220. This step S100 is then performed.
續請參閱圖12,為本發明第三具體實施例之電子元件外觀檢測方法之部分流程圖。於本實施例中,該輸送機構200係經由該旋轉盤220輸送該電子元件。本實施例的檢測方法與第一實施例差異在於,本實施例的檢測方法的該步驟S104更包括下列步驟: Continuing to refer to FIG. 12, a partial flow chart of a method for detecting an appearance of an electronic component according to a third embodiment of the present invention is shown. In the present embodiment, the transport mechanism 200 transports the electronic component via the rotating disk 220. The difference between the detection method of this embodiment and the first embodiment is that the step S104 of the detection method of the embodiment further includes the following steps:
步驟S1040:該控制器600取得該電子元件於該旋轉盤220上的該當前位置。較佳地,該控制器600係經由該角度編碼器232取得驅動該旋轉盤220水平旋轉的該馬達230當前的角度值,並作為該當前位置。 Step S1040: The controller 600 obtains the current position of the electronic component on the rotating disk 220. Preferably, the controller 600 obtains the current angle value of the motor 230 that drives the rotating disk 220 to rotate horizontally via the angle encoder 232 as the current position.
步驟S1042:該控制器600取得該複數取像位置。較佳地,該控制器600係將分別對應該複數取像模組的複數角度值做為該複數取像位置。 Step S1042: The controller 600 obtains the complex image capturing position. Preferably, the controller 600 uses the complex angle value corresponding to the plurality of image capturing modules as the complex image capturing position.
步驟S1044:該控制器600取得該旋轉盤220的該旋轉速度。 Step S1044: The controller 600 acquires the rotational speed of the rotating disk 220.
步驟S1046:該控制器600依據所取得的該當前位置、該旋轉速度及該複數取像位置計算該複數時間區間。接著執行該步驟S106。 Step S1046: The controller 600 calculates the complex time interval according to the obtained current position, the rotation speed, and the complex image capturing position. This step S106 is then performed.
續請參閱圖13,為本發明第四具體實施例之電子元件外觀檢測方法之部分流程圖。本實施例的檢測方法與第一實施例差異在於,本實施例的檢測方法於該步驟S112之後更包括下列步驟: FIG. 13 is a partial flow chart of a method for detecting an appearance of an electronic component according to a fourth embodiment of the present invention. The detection method of this embodiment differs from the first embodiment in that the detection method of this embodiment further includes the following steps after the step S112:
步驟S300:該控制器600輸出該檢測結果。例如,將該檢測結果以影像方式顯示於該顯示器,或經由網路上傳至一遠端伺服器。 Step S300: The controller 600 outputs the detection result. For example, the detection result is displayed on the display in an image manner or uploaded to a remote server via a network.
步驟S302:該控制器600偵測該電子元件是否到達該分料機構500。較佳地,該控制器600係依據該檢測結果自該複數吹氣位置中選擇對應的該吹氣位置,並主動(如經由該角度編碼器232及計時該吹嘴時間區間是否經過)或被動(如經由設置於該分料機構旁的另一感測器觸發)偵測該電子元件是否到達該吹氣位置。若該控制器600偵測該電子元件到達該分料機構500,則執行該步驟S304。否則,重複執行該步驟S302以持續偵測。 Step S302: The controller 600 detects whether the electronic component reaches the dispensing mechanism 500. Preferably, the controller 600 selects the corresponding air blowing position from the plurality of air blowing positions according to the detection result, and actively (such as passing the angle encoder 232 and timing the mouth time interval) or passive (If triggered by another sensor disposed beside the dispensing mechanism) to detect whether the electronic component reaches the blowing position. If the controller 600 detects that the electronic component reaches the dispensing mechanism 500, then step S304 is performed. Otherwise, the step S302 is repeatedly executed to continuously detect.
步驟S304:該控制器600依據該檢測結果控制對應的該複數吹嘴520之一吹氣,以將該電子元件吹入對應的該集料盒510。 Step S304: The controller 600 controls one of the corresponding plurality of blowing nozzles 520 to blow according to the detection result to blow the electronic component into the corresponding collection box 510.
以上所述僅為本發明之較佳具體實例,非用以侷限本發明之專利範圍,故舉凡運用本發明內容所為之等效變化,均同理皆包含於本發明之範圍內,合予陳明。 The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent changes to the scope of the present invention are included in the scope of the present invention. Bright.
S100-S112‧‧‧檢測步驟 S100-S112‧‧‧Test steps
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104123838A TWI572859B (en) | 2015-07-23 | 2015-07-23 | Device of detecting appearance of electronic components and detecting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104123838A TWI572859B (en) | 2015-07-23 | 2015-07-23 | Device of detecting appearance of electronic components and detecting method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201704738A TW201704738A (en) | 2017-02-01 |
| TWI572859B true TWI572859B (en) | 2017-03-01 |
Family
ID=58609296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104123838A TWI572859B (en) | 2015-07-23 | 2015-07-23 | Device of detecting appearance of electronic components and detecting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI572859B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10267750B2 (en) * | 2017-02-09 | 2019-04-23 | Glasstech, Inc. | System and associated method for online detection of small defects on/in a glass sheet |
| TWI635463B (en) * | 2017-03-28 | 2018-09-11 | 良瑞科技股份有限公司 | Method for detecting appearance of articles with continuous image capturing function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833717B1 (en) * | 2004-02-12 | 2004-12-21 | Applied Materials, Inc. | Electron beam test system with integrated substrate transfer module |
| TWM261685U (en) * | 2004-06-15 | 2005-04-11 | Hirose Tech Co Ltd | Defect-detecting equipment of glass substrate disposed with polarizer thereon |
| TW200732651A (en) * | 2006-02-27 | 2007-09-01 | Yi-Zhen Zhuang | Surface defect inspection machine of glass substrate and examination method thereof |
| TW201425914A (en) * | 2012-12-24 | 2014-07-01 | Delta Electronics Inc | Examination apparatus |
| TW201502498A (en) * | 2013-03-19 | 2015-01-16 | Hennecke Systems Gmbh | Inspection system |
-
2015
- 2015-07-23 TW TW104123838A patent/TWI572859B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833717B1 (en) * | 2004-02-12 | 2004-12-21 | Applied Materials, Inc. | Electron beam test system with integrated substrate transfer module |
| TWM261685U (en) * | 2004-06-15 | 2005-04-11 | Hirose Tech Co Ltd | Defect-detecting equipment of glass substrate disposed with polarizer thereon |
| TW200732651A (en) * | 2006-02-27 | 2007-09-01 | Yi-Zhen Zhuang | Surface defect inspection machine of glass substrate and examination method thereof |
| TW201425914A (en) * | 2012-12-24 | 2014-07-01 | Delta Electronics Inc | Examination apparatus |
| TW201502498A (en) * | 2013-03-19 | 2015-01-16 | Hennecke Systems Gmbh | Inspection system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201704738A (en) | 2017-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106370666A (en) | Electronic component appearance detection device and detection method thereof | |
| US20140168661A1 (en) | High-speed, 3-d method and system for optically measuring a geometric dimension of manufactured parts | |
| JP7009217B2 (en) | Tablet printing device and tablet manufacturing method | |
| JP6260132B2 (en) | Speed detector for parts feeder and parts feeder | |
| JP7186265B2 (en) | Tablet printing device and tablet manufacturing method | |
| JP2020517110A (en) | Component receiving device having optical sensor | |
| JP6685776B2 (en) | Imaging system, measuring system, production system, imaging method, program, recording medium and measuring method | |
| US20140063509A1 (en) | High-speed method and system for optically measuring a geometric dimension of manufactured parts | |
| JP3954083B2 (en) | Appearance inspection method and apparatus | |
| CN204789382U (en) | Electronic component appearance inspection device | |
| TWI572859B (en) | Device of detecting appearance of electronic components and detecting method thereof | |
| CN104634264A (en) | Appearance inspection device | |
| CN104338685A (en) | Feeder | |
| JP5210998B2 (en) | Silicon wafer inspection equipment | |
| TW593973B (en) | Exterior inspection apparatus for workpieces and exterior inspection method | |
| CN105049700A (en) | Image processing device for feeder and feeder | |
| CN205110148U (en) | Distribution module | |
| JP5159237B2 (en) | Equipment for inspecting glass containers | |
| KR101358112B1 (en) | Vision inspection apparatus for inspecting plural sections of object | |
| TWM517819U (en) | Dispensing module | |
| JP2012021834A (en) | Defect inspection device, defect inspection system, and defect inspection method | |
| JPH06100147A (en) | Part arranging device | |
| KR20180120802A (en) | Method for measuring behavior of moving body and behavior measuring device | |
| JP2014182026A (en) | Article inspection apparatus | |
| CN210694144U (en) | Camera installation device and material detection equipment |