TWI572259B - Apparatus for gripping semi-conductive board with vacuum - Google Patents

Description

Vacuum adsorption device for semiconductor substrate

The present invention relates to a vacuum adsorption device for a semiconductor substrate, and more particularly to a vacuum adsorption device for a semiconductor substrate capable of minimizing the replacement time of a block.

A fixing method for attaching and fixing a substrate for a semiconductor manufacturing substrate or a printed circuit board (PCB), which includes a screw, a magnet, a vacuum suction, and a magnet.

The method of fixing with a screw is the most commonly used method for fixing a block body for attaching a substrate for manufacturing a semiconductor or a printed circuit board (PCB), and using screws to move the front and rear sides of the block body. Two or more positions are fixed to prevent the vacuum block body from moving.

The method of using a magnet refers to a method of attaching a semiconductor substrate or a printed circuit board (PCB) to a fixed support by attaching a magnet to the lower side of the block. At this time, the adhesion can be adjusted by adjusting the magnetic strength of the magnet.

When using the vacuum adsorption method, on the support of the vacuum block The side is equipped with a vacuum plate, and a vacuum is formed between the surface of the vacuum plate and the lower side of the vacuum block to achieve a supporting effect. In this case, in order to be able to attach vacuum blocks of different sizes, it is necessary to provide a vacuum plate corresponding to a printed circuit board (PCB) size area.

Moreover, depending on the different printed circuit boards (PCBs), ie different printed circuit board (PCB) sizes and internal wafer layouts, it is also necessary to replace the use of the different vacuum blocks in order to be able to carry out the production smoothly. As described above, since the components need to be frequently replaced, in order to improve the production efficiency, the component replacement operation must be completed in a short time, so that it is possible to cause the installation error due to the user's mistakes and the complexity of the replacement operation in the process. The situation happened.

Advanced technical literature

Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-134992

Patent Document 2: Korean Laid-Open Patent Publication No. 10-2001-0009073

An object of the present invention is to solve the above problems, and to provide a vacuum adsorption apparatus for a semiconductor substrate which can minimize the replacement time of a block and has an extremely strong holding force.

The subject matter of the present invention is not limited to the problems mentioned in the above description, and other problems that are not mentioned can be clearly understood by the following description.

In order to achieve the object, a vacuum adsorption device suitable for the semiconductor substrate of the embodiment of the present invention includes: a support table; a vacuum block, Mounted on the support table, and equipped with a substrate attachment surface for supporting the substrate through the upper side; the stopper controls the pressure joint surface formed on the lower side of the vacuum block; the stopper controls the pressure passage to form Inside the vacuum block, in communication with the stopper control pressure engagement surface; and a stopper assembly by which the air pressure in the pressure passage is controlled to be selectively attached from the substrate Hold the face out or retract.

The stopper assembly includes: a slider located inside the vacuum block, moving upward when pressurized by air pressure in the pressure channel controlled by the stopper, or being disposed on the outer circumference The elastic member of the surface elastically supports downward movement; and a limiting protrusion fixed to the upper side of the slider for reciprocating up and down together with the slider to protrude from the substrate supporting surface or Retracted.

The vacuum adsorption device of the semiconductor substrate of the present invention further includes: a stopper drive hole formed in an upper side of the support table and communicating with the stopper control pressure engagement surface for injecting air.

The vacuum adsorption device of the semiconductor substrate of the present invention further includes: a substrate adsorption vacuum channel formed inside the vacuum block to generate an air pressure for vacuum adsorption of a lower side of the semiconductor substrate; and a bulk adsorption vacuum channel, A portion formed on the substrate outside the adsorption vacuum channel generates an air pressure for vacuum adsorption of the support table.

The upper side of the support platform includes: a substrate adsorption driving hole, Connecting to the central vertical passage to form a vacuum; and the vacuum block body adsorbing the drive hole to communicate with the lower side vertical passage to form a vacuum.

The substrate adsorption vacuum channel includes: an upper horizontal channel parallel to an upper side of the vacuum block, adjacent to a substrate holding surface including a plurality of substrate adsorption holes, and is adhered to the substrate adsorption holes; and a central vertical The passage communicates with the upper horizontal passage inside the vacuum block and vertically penetrates the lower side of the vacuum block. The block-adsorbing vacuum channel includes: a lower horizontal channel, the inside of the vacuum block is centered on the central vertical channel, and formed on both sides thereof along a length of a longer side of a lower side of the vacuum block, and The lower side of the vacuum block is parallel; and the lower vertical channel forms a branch at a plurality of positions of the lower horizontal channel and is formed to penetrate in a direction perpendicular to a lower side of the vacuum block.

For specific matters of other embodiments of the present invention, please refer to the disclosure of the specification and drawings.

A vacuum adsorption apparatus to which the semiconductor substrate of the present invention is applied has one or more effects as described below.

Since the process of incorporating the vacuum block into the support table is simple and fast, the vacuum block can be quickly replaced when using substrates of various sizes and internal wafer layouts, and the installation error due to the complexity of the replacement operation can be prevented.

The effects of the present invention are not limited to the effects mentioned in the above description, and the description in the scope of the invention patent will clearly understand Other effects mentioned.

100‧‧‧Support table

101‧‧‧Substrate adsorption drive hole

102‧‧‧Block adsorption drive hole

103‧‧‧Retainer drive hole

110‧‧‧Locating pin

200‧‧‧vacuum block

200a‧‧‧substrate attachment surface

201a‧‧‧Central Vertical Channel Interface

201b‧‧‧Lower vertical channel interface

201c‧‧‧Retainer control pressure joint

210‧‧‧Locating pin

220‧‧‧Upper horizontal channel

221‧‧‧Central vertical channel

230, 240‧‧‧ lower horizontal channel

230a, 240a‧‧ separate sealing parts

231,241‧‧‧lower vertical channel

250‧‧‧Retainer control pressure channel

300‧‧‧Retainer assembly

300a‧‧‧ air chamber

300b‧‧‧Seal parts

301‧‧‧Support board

311‧‧‧ annular flange

312‧‧‧The outer circumference is equipped with an O-ring

313‧‧‧Flexible parts

314‧‧‧Support ring

315‧‧‧ screws

320‧‧‧ Limit convex

321‧‧‧Hook end

330‧‧‧ Guide pin

Fig. 1 is a perspective view showing a vacuum suction apparatus of a semiconductor substrate according to an embodiment of the present invention.

Fig. 2 is a perspective view showing a support table of a vacuum adsorption apparatus for a semiconductor substrate according to an embodiment of the present invention.

Fig. 3 is a perspective view showing a vacuum block substrate holding surface of a vacuum adsorption apparatus for a semiconductor substrate according to an embodiment of the present invention.

Fig. 4 is a perspective view showing a lower side of a vacuum block of a vacuum adsorption apparatus for a semiconductor substrate according to an embodiment of the present invention.

Fig. 5 is a perspective view showing a cross section of the inside of a vacuum suction device of a semiconductor substrate according to an embodiment of the present invention.

Fig. 6 is a cross-sectional perspective view showing a stopper control passage of a vacuum suction device of a semiconductor substrate according to an embodiment of the present invention.

Fig. 7 is a cross-sectional view showing a stopper assembly of a vacuum adsorption apparatus for a semiconductor substrate according to an embodiment of the present invention.

Fig. 8 is a cross-sectional view showing the stopper assembly in Fig. 7 in a convex state.

In order to clearly understand the advantages and features of the present invention and the embodiments thereof, the following detailed description will be made in conjunction with the drawings and the embodiments described below. and The detailed description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. Therefore, the equivalent variations of the present invention are included in the scope of the present invention. To Chen Ming. Throughout the specification, the same reference symbols represent the same constituent elements.

The terms used in the present specification are only used to describe the present embodiment, and are not intended to limit the invention. Unless otherwise stated, the singular statements recited in this specification also include the plural meaning. Specification "comprises (comprises &)" and / or "comprising (comprising,)", further comprising mentioned constituent elements, steps, operation and / or at least one other constituent element or the presence of an additional element, The steps, actions, and/or components.

In the absence of a clear definition, all terms (including technical and scientific terms) that are used in the specification are intended to mean the ordinary meanings that can be understood by those skilled in the art. In addition, for the terminology used daily, which has been defined in the dictionary, no further detailed explanation will be made except for the case where a specific definition is explicitly made.

The vacuum adsorption apparatus to which the semiconductor substrate of the present invention is applied will be described in detail with reference to the drawings.

Fig. 1 is a perspective view showing a vacuum suction apparatus of a semiconductor substrate according to an embodiment of the present invention. Fig. 2 is a perspective view showing a support table of a vacuum adsorption apparatus for a semiconductor substrate according to an embodiment of the present invention. As shown in FIGS. 1 and 2, a vacuum adsorption device for a semiconductor substrate according to an embodiment of the present invention The utility model comprises a support platform (100), a vacuum block (200) and a stopper assembly (300).

A support table (100) is used to secure the vacuum block (200) from movement. In the drawings of the present embodiment, the support table (100) uses a shape in which a support leg (not shown) is formed on the lower side of the flat plate shape, but is provided with a flat surface capable of forming a stable surface contact with the lower side of the vacuum block (200). All shapes of the face can be applied.

The support table (100) includes: a substrate adsorption driving hole (101), a block adsorption driving hole (102), and a stopper driving hole (103), and further includes: determining the vacuum block (200) on the supporting table ( 100) The exact position of the locating pin (110). Since each structure related to this will be combined with a vacuum block (200) to be described later, a portion of the vacuum block (200) to be described later will be described in detail.

Fig. 3 is a perspective view showing a vacuum block substrate holding surface of a vacuum adsorption apparatus for a semiconductor substrate according to an embodiment of the present invention. Fig. 4 is a perspective view showing a lower side of a vacuum block of a vacuum adsorption apparatus for a semiconductor substrate according to an embodiment of the present invention.

As shown in FIGS. 3 and 4, the upper side surface of the vacuum block (200) has a flat substrate holding surface (200a) which is brought into surface contact with a semiconductor substrate (not shown) to be attached thereto. A plurality of adsorption holes (not shown) are formed in the substrate holding surface (200a). Each of the adsorption holes is in communication with an upper horizontal channel (220) to be described later.

a lower side of the vacuum block (200), and having a substrate adsorption driving hole (101), a block adsorption driving hole (102), and a stopper driving hole (103) respectively connected to the supporting table (100) The central vertical channel interface (201a), the lower vertical channel interface (201b), and the stopper control pressure interface (201c). In the present embodiment, as shown in FIGS. 5 and 6, the through holes of the central vertical passage (221), the lower vertical passages (231, 241), and the stopper control pressure joint surface (201c) are used. The lower side of the vacuum block (200) is arranged in a line, but as long as it can be respectively disposed with a central vertical channel (221) disposed on the inside of the vacuum block (200), a lower vertical channel (231, 241), and a stopper. The control pressure channel (250) is connected to the central vertical channel of the substrate adsorption drive hole (101), the block adsorption drive hole (102) and the stopper drive hole (103) and the vacuum block (200) connected thereto The interface (201a), the lower vertical channel interface (201b), and the position of the stopper control pressure interface (201c) are arranged in a variety of different configurations.

Further, the lower side of the vacuum block (200) includes a positioning hole (210). The positioning hole (210) is disposed in the lower side of the vacuum block (200) except at least 2 of the central vertical channel interface (201a), the lower vertical channel interface (201b), and the stopper control pressure joint surface (201c). Location.

The positioning hole (210) is for inserting a protruding positioning pin (110) formed on the upper side of the support table (100). So when the vacuum block (200) When coupled to the upper side of the support table (100) in a surface contact manner, the positioning pin (110) and the positioning hole (210) are combined with each other, so that the position of the vacuum block (200) on the support table (100) is accurately fixed. The at least two positioning holes (210) and the positioning pins (110) respectively formed by this can prevent the vacuum block (200) from rotating or moving in a state of being in surface contact with the support table (100).

Fig. 5 is a perspective view showing a cross section of the inside of a vacuum suction device of a semiconductor substrate according to an embodiment of the present invention.

As shown in Fig. 5, the inside of the vacuum block (200) forms a substrate adsorption vacuum channel (220, 221) and a vacuum block body adsorption vacuum channel (230, 240), respectively.

The substrate adsorption vacuum channel (221, 220) includes: an upper horizontal channel (220) parallel to the upper side of the vacuum block (200) and adjacent to the substrate holding surface (200a) including the plurality of substrate adsorption holes, and The central vertical channel (221) communicates with the upper horizontal channel (220) inside the vacuum block (200) and vertically penetrates the lower side of the vacuum block (200).

The horizontal passage (220) communicates with a plurality of substrate adsorption holes formed in a vertical direction of the substrate holding surface (200a) (the direction indicated by the arrow of the substrate holding surface 200a of each drawing) to provide adsorption thereto. force. That is, a portion of the outer peripheral surface side of the horizontal passage (220) is respectively communicated with the plurality of substrate adsorption holes, so that the plurality of substrate adsorption holes are Under the vacuum pressure formed inside the horizontal channel (220), an adsorption force required for the substrate is generated.

The central vertical channel (221) communicates with the upper horizontal channel (220) in a direction perpendicular to each other. That is, the central vertical passage (221) is formed along the upper and lower directions of the through vacuum block (200) such that the vacuum pressure formed inside the central vertical passage (221) communicates with the upper horizontal passage (220). At this time, at the lower end of the central vertical passage (221), a central vertical passage interface (201a) whose diameter is gradually enlarged is formed. The central vertical channel interface (201a) is of a gradually enlarged diameter structure for communication with the substrate adsorption drive hole (101) of the support table (100).

Both end portions in the longitudinal direction of the upper horizontal passage (220) may be sealed by a separate sealing member, or both ends of the upper horizontal passage (220) may be formed in a sealed structure inside the vacuum block (200). Thereby, the situation in which the vacuum pressure supplied from the central vertical passage (221) is externally leaked at both end portions of the upper horizontal passage (220) is prevented.

The vacuum block body adsorbs the vacuum channel (230, 231, 240, 241), including: a lower horizontal channel (230, 240), centered on the central vertical channel (221) inside the vacuum block (200), on both sides thereof Formed along the longer side of the vacuum block, parallel to the underside of the vacuum block (200). At this time, the lower horizontal channels (230, 240) on both sides are connected to each other through a separate intermediate tube (not shown) inside the vacuum block (200) to form the same vacuum pressure on both sides.

The vacuum block body adsorption vacuum channel (230, 231, 240, 241) includes: a lower vertical channel (231, 241) that branches at a plurality of locations on the lower horizontal channel (230, 240), along a vertical vacuum block ( 200) The direction of the lower side is formed through. And along the length direction of the lower horizontal channel (230, 240), a plurality of lower vertical channels (231, 241) are formed at a certain interval. At this time, on the lower side of the vacuum block (200), a lower vertical channel connecting interface (201b) having a gradually enlarged diameter is included. The lower vertical channel interface (201b) is of a gradually enlarged diameter structure to facilitate communication with the block suction drive hole (102) of the support table (100).

Both ends of the lower horizontal channel (230, 240) in the longitudinal direction may be sealed by separate sealing members (230a, 240a), or both ends of the lower horizontal channel (230, 240) may be vacuumed The inside of the block (200) forms a sealing structure, thereby preventing the vacuum pressure supplied from the lower horizontal passages (230, 240) from leaking at both ends thereof while remaining inside the lower vertical passages (231, 241).

Fig. 6 is a cross-sectional perspective view showing a stopper control passage of a vacuum adsorption device of a semiconductor substrate according to an embodiment of the present invention.

As shown in Fig. 6, a stopper control pressure joint surface (201c) is formed on the lower side of the vacuum block (200). At this time, a stopper control pressure passage (250) communicating with the stopper control pressure engagement surface (201c) is formed inside the vacuum block (200), and includes: a stopper assembly (300), by means of The limiter controls the control pressure in the pressure channel (250), selecting Optionally extending or retracting from the substrate attachment surface (200a).

The stopper control pressure passage (250) communicates with the stopper control pressure engagement surface (201c), and is not inside the vacuum block (200) with the upper horizontal passage (220) and the lower horizontal passage (230, 240). The way of mutual interference is connected to the limiter assembly (300). In the present embodiment, the stopper control pressure passage (250) is formed in a direction perpendicular to the upper horizontal passage (220) and the lower horizontal passage (230, 240) and faces the inner center of the vacuum block (200). In part, any path that communicates with the stopper assembly (300) described later may be employed.

Fig. 7 is a cross-sectional view showing a stopper assembly of a semiconductor substrate vacuum adsorption device according to an embodiment of the present invention. Fig. 8 is a cross-sectional view showing the stopper assembly in Fig. 7 in a convex state.

As shown in FIGS. 7 and 8, the stopper assembly (300) includes: a slider (310) that is engaged with a limiting protrusion (320) by a screw 315, thereby causing the slider ( 310) capable of sliding in the up-and-down direction from the substrate holding surface (200a) inside the vacuum block (200); an annular flange (311) is formed at the bottom of the slider (310) by an air chamber 300a The air pressure is compressed to move the slider (310) upward; and the limit projection (320) reciprocates together with the slider (310) to extend or retract from the substrate attachment surface (200a).

a limit protrusion (320) of the stopper assembly (300) in the pair of long sides and the short side of the substrate (200a) of the vacuum block (200), It is formed at a position convex from an intermediate portion of one short side. At this time, in a state where the semiconductor substrate (not shown) is in contact with the substrate holding surface (200a), after the length of the substrate holding surface (200a) is moved along a certain short side, the stopper is always Under the action of (300), during the process of attaching and fixing the limiting protrusion, only the intermediate portion of the short side is attached, so that the substrate can be prevented from rotating by means of the stopper assembly (300).

The slider (310) has a cylindrical shape with an annular flange (311) on one end surface thereof, and includes: an elastic member (313) whose one end is supported by the annular flange of the outer circumferential surface of the slider (310). The other end is supported by a support ring (314). Thereby, when the air pressure is supplied to the inside of the stopper control pressure passage (250), the slider is compressed by the action of the air pressure to compress the elastic member (313). At this time, since the slider (310) moves together with the limit projection (320), the hook end portion (321) of the limit projection (320) will protrude from the substrate holding surface (200a). At this time, in order to prevent leakage of the air pressure applied to the slider (310), an O-ring (312) is provided on the outer circumferential surface of the annular flange (311). The sealing member, which is designated as 300b, is for blocking the inside and the outside of the stopper control pressure passage (250), but is not limited to this structure, and may be convenient for the manufacture of the vacuum block (200). The sealing effect is formed directly by the side walls of the vacuum block (200) by omitting such a sealing member.

In addition, a portion of the limiting protrusion (320) can be cut along the longitudinal direction of the limiting protrusion (320) to be in the limiting protrusion (320). The length direction forms a guide groove (not shown) and includes a guide pin (330), a portion of which is inserted into the guide groove in a direction perpendicular to the limit protrusion (320). The guide pin (330) is used to maintain the up and down reciprocating motion of the limit protrusion (320) to maintain a straight line state. At this time, a support plate (301) for fixing the guide pin (330) may be provided, and the support plate (301) may cover a part of the outer surface of the vacuum block (200) at a right angle to keep the vacuum block (200) flat. shape.

As described above, the vacuum adsorption apparatus of the semiconductor substrate of the embodiment of the present invention is applied because the vacuum adsorption block (220, 220) and the vacuum block body adsorption vacuum passage (230, 240) are disposed inside the vacuum block (200). Therefore, the vacuum adsorption between the vacuum block (200) and the support table (100) can be completed only by the process of bonding the vacuum block (200) into the positioning pin (110) of the support table (100), and the vacuum block can be utilized. (200) The adsorption force of the substrate adsorption holes in the upper side firmly holds the substrate, and the vacuum block (200) can be quickly replaced when using substrates of various sizes and internal wafer layouts, and the complexity of the replacement operation can be prevented. The installation caused by the error.

The description is only for the preferred embodiment of the invention and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present invention are covered by the scope of the invention.

100‧‧‧Support table

200‧‧‧vacuum block

200a‧‧‧substrate attachment surface

230a‧‧ separate sealing parts

300‧‧‧Retainer assembly

Claims (5)

A vacuum adsorption device for a semiconductor substrate, comprising: a support table; a vacuum block mounted on the support table, and a substrate holding surface for supporting the substrate by the upper side; the stopper controlling the pressure joint surface formed on a lower side of the vacuum block; a stopper control pressure passage formed inside the vacuum block to communicate with the stopper control pressure engagement surface; and a stopper assembly by means of the stopper Controlling the air pressure in the pressure channel to selectively extend or retract from the substrate holding surface; wherein a vacuum block body is formed inside the vacuum block to absorb the vacuum channel, and is generated to perform the support table Vacuum pressure of air adsorption. The vacuum adsorption device of the semiconductor substrate according to claim 1, wherein the stopper assembly comprises: a slider located inside the vacuum block, and the air in the pressure channel controlled by the stopper The pressurization of the pressure moves upward, or moves downward when subjected to the elastic action of the elastic member disposed on the outer peripheral surface; and the limit projection is fixed to the upper side of the slider to be in contact with the slider It acts as a vertical up and down movement and extends or retracts from the substrate attachment surface. The vacuum adsorption device for a semiconductor substrate according to claim 2, further comprising: an upper side formed on the support table, communicating with the stopper control pressure joint surface, and a stopper drive for injecting air hole. The vacuum adsorption device of the semiconductor substrate of claim 1, further comprising: a substrate adsorption vacuum channel formed in the vacuum block to form a portion of the vacuum block body that adsorbs the vacuum channel, and is generated for the semiconductor substrate The lower side of the support table is subjected to vacuum adsorption air pressure; the upper side of the support table further includes: a substrate adsorption drive hole connected to the central vertical passage to form a vacuum; and the vacuum block body adsorbing the drive hole to communicate with the lower side A vertical channel is formed to form a vacuum. The vacuum adsorption device for a semiconductor substrate according to claim 4, wherein the substrate adsorption vacuum channel further comprises: an upper horizontal channel parallel to an upper side of the vacuum block and attached to a substrate including a plurality of substrate adsorption holes Holding the surface adjacent to each other and communicating with the respective substrate adsorption holes; and a central vertical passage communicating with the upper horizontal channel inside the vacuum block and vertically penetrating toward the lower side of the vacuum block; The vacuum block body adsorbs the vacuum channel, further comprising: a lower horizontal channel, the inner portion of the vacuum block is centered on the central vertical channel, and the two sides thereof are formed along a longer side of the lower side of the vacuum block. Parallel to the lower side of the vacuum block; and a lower vertical channel forming a branch at a plurality of locations of the lower horizontal channel, formed through the direction perpendicular to the lower side of the vacuum block.