TWI568575B - Ultra-thin are heat - Google Patents
Ultra-thin are heat Download PDFInfo
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- TWI568575B TWI568575B TW104117544A TW104117544A TWI568575B TW I568575 B TWI568575 B TW I568575B TW 104117544 A TW104117544 A TW 104117544A TW 104117544 A TW104117544 A TW 104117544A TW I568575 B TWI568575 B TW I568575B
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- epoxy resin
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- 239000002184 metal Substances 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 55
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 230000008859 change Effects 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 description 28
- 238000004519 manufacturing process Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000012782 phase change material Substances 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Description
一種供對應至少一發熱電子元件設置的超薄均熱片。 An ultra-thin heat spreader for providing at least one heat-generating electronic component.
隨著科技的進步，電子產品逐漸朝著輕、薄、短、小的方向發展，但小型化的電子元件在高速率運轉下產生的高度熱流，往往減損電子產品的壽命，因此市面出現不少各式各樣的散熱裝置。 With the advancement of technology, electronic products are gradually moving toward light, thin, short and small, but the high heat flow generated by miniaturized electronic components at high speed often detracts from the life of electronic products, so there are many in the market. A wide range of heat sinks.
由於銅具有較高的熱傳導係數且成本合理，因此傳統的散熱材料多以銅為主體；隨後，也有許多結構是在內部添加相變化材料，使得散熱裝置可以運用相變化時的潛熱而更有效率地傳輸熱能，此種內含相變化材料的結構，外型大多以管狀為主，或管狀組合鰭片，以藉由鰭片擴大與周邊空氣進行熱交換的面積，但整體體積也勢必隨之變大。 Because copper has a high heat transfer coefficient and reasonable cost, traditional heat-dissipating materials are mostly made of copper. Subsequently, there are many structures in which phase-change materials are added internally, so that the heat sink can use the latent heat at the phase change and be more efficient. The transmission of thermal energy, the structure containing the phase change material, the shape is mostly tubular, or the tubular combination of fins, to expand the area of heat exchange with the surrounding air by fins, but the overall volume is bound to follow Become bigger.
由於常見的發熱元件如半導體元件或發光二極體等，多半具有平坦表面，為使散熱裝置與發熱元件良好貼合，目前，市面上也有均熱片的出現，不過都為全金屬銅且厚度偏厚，原因是銅的熔點約1084℃，要成形必須提供極度高溫的鑄造環境，即使要降低成形的溫度而採取例如擴散焊接技術時，操作溫度也需高達600~900℃，還需要輔以高壓，使得上下兩片半部件內部的銅擴散層能稍有熔融而擴散對接，藉以形成整片均熱片；因此，均熱片的上下兩片半部件，銅基板的部分需要有足夠厚度，才能承受高壓操作，此外，均熱片半部件中的銅擴散層也必需預留足夠厚度 才不會輕易被壓扁，能形成足夠的空間，容許其內部的相變化材料可在冷熱兩端來回通行及進行相變化。 Since common heating elements such as semiconductor elements or light-emitting diodes have a flat surface, in order to make the heat-dissipating device and the heating element fit well, at present, there are also uniform heat sheets on the market, but all are copper and thickness. It is thicker because the melting point of copper is about 1084 ° C. To form a casting environment that must provide extremely high temperature, even if the temperature of forming is to be reduced, for example, diffusion welding technology is required, the operating temperature needs to be as high as 600-900 ° C, and it needs to be supplemented. The high voltage is such that the copper diffusion layer inside the upper and lower halves can be slightly melted and diffused and docked to form a whole piece of heat equalizing sheet; therefore, the upper and lower halves of the soaking sheet and the portion of the copper substrate need to have sufficient thickness. In order to withstand high pressure operation, in addition, the copper diffusion layer in the half piece of the heat spreader must also be reserved for sufficient thickness. It will not be easily crushed, and it will form enough space to allow the internal phase change material to pass back and forth between the hot and cold ends and phase change.
上述均熱片製程，即使可以降低操作溫度，仍然必須達到攝氏數百度高溫，使得加工環境受限；且必須對上下半部件施加壓力，造成目前產品的上下半部件基板部分，每片基板的板厚至少需達200μm以上，無疑讓均熱片整體厚度無法降低、銅的用量無法減少、均熱片的重量也無法減輕，尤其大面積加壓時受力不易均勻，也因此限制均熱片面積。 The above-mentioned soaking sheet process, even if the operating temperature can be lowered, must reach a high temperature of several hundred degrees Celsius, which limits the processing environment; and pressure must be applied to the upper and lower halves to cause the upper and lower halves of the current product, the board of each substrate. The thickness needs to be at least 200μm or more, which undoubtedly makes the overall thickness of the heat spreader cannot be reduced, the amount of copper cannot be reduced, and the weight of the heat spreader cannot be alleviated. Especially when the pressure is large, the force is not uniform, and thus the area of the heat spreader is limited. .
為了解決現有技術問題，本案試圖提供一種超薄均熱片，將高分子聚合物透過簡單的製作方式形成於金屬基板上，再以極低溫熱壓的方式使其結合、融合，使得高分子聚合物次結構和金屬共同構成一個密封的空間；利用高分子聚合物具有加熱後固化、不易熔融、以及可與特定金屬接著性良好的特性。如此一來，不僅使均熱片的基板部分更薄、且用部分高分子次結構取代部分金屬使得整體重量益發變輕，基板變薄也使導熱效率從而提升，更使得大面積均熱片的生產成為可行，尤其是加工環境僅需例如攝氏兩百度以下的低溫，故可大幅降低製造成本。 In order to solve the problems of the prior art, the present invention attempts to provide an ultra-thin heat spread sheet, which is formed on a metal substrate by a simple manufacturing method, and then combined and fused at a very low temperature and hot pressure to polymerize the polymer. The material structure and the metal together form a sealed space; the high-molecular polymer has the characteristics of being post-heat-cured, not easily melted, and having good adhesion to a specific metal. In this way, not only the substrate portion of the heat spreader is made thinner, but also a part of the polymer substructure is substituted for a part of the metal, so that the overall weight is lighter, and the thinning of the substrate also improves the heat conduction efficiency, and the large-area heat spreader is further improved. Production becomes feasible, especially in the processing environment, which requires only a low temperature of, for example, two degrees Celsius or less, so that the manufacturing cost can be greatly reduced.
本發明之一目的在提供一種超薄均熱片，透過簡單的製作方式將高分子聚合物次結構形成於金屬基板上，由於高分子聚合物次結構不用高溫處理，因此可大幅降低加工成本及製作難度。 An object of the present invention is to provide an ultra-thin heat spread sheet, which is formed on a metal substrate by a simple manufacturing method, and the high-polymer polymer substructure does not require high temperature treatment, thereby greatly reducing processing cost and Difficult to make.
本發明另一目的在提供一種超薄均熱片，由於超薄均熱片整體不需施加高壓處理，因此基板厚度可更薄、也使得大面積均熱片的製造變得可行。 Another object of the present invention is to provide an ultra-thin heat spread sheet. Since the ultra-thin heat spread sheet does not need to be subjected to high-pressure treatment as a whole, the thickness of the substrate can be made thinner, and the manufacture of the large-area heat spread sheet becomes feasible.
本發明再一目的在提供一種超薄均熱片，藉由使用高分子聚合物次結構，可降低材料成本。 Still another object of the present invention is to provide an ultrathin heat spread sheet which can reduce material cost by using a polymer polymer substructure.
本發明又一目的在提供一種超薄均熱片，由於基板厚度薄，且中間的次結構材料為質輕的高分子聚合物，大幅降低整體均熱片結構的重量。 Still another object of the present invention is to provide an ultrathin heat spreader sheet which has a small thickness and an intermediate substructure material which is a lightweight polymer which greatly reduces the weight of the overall heat spreader structure.
為達上述目的，本發明提供一種超薄均熱片，包括兩片彼此平行且相向面具有粗糙面的上、下金屬基板、一組連接上述上、下金屬基板的流道結構、一設置於上述上金屬基板或上述下金屬基板的高分子聚合物次結構、一由上述流道結構和上述上、下金屬基板共同環繞出的封閉空間、及一填充在上述封閉空間中的相變化流體。 In order to achieve the above object, the present invention provides an ultra-thin heat spread sheet comprising two upper and lower metal substrates parallel to each other and having a rough surface facing each other, a set of flow path structures connecting the upper and lower metal substrates, and a a polymer secondary structure of the upper metal substrate or the lower metal substrate, a closed space surrounded by the flow path structure and the upper and lower metal substrates, and a phase change fluid filled in the closed space.
在上述超薄均熱片的特徵中，在於相連上述上、下金屬基板的上述流道結構是高分子聚合物次結構，上述高分子聚合物次結構可以選擇為環氧樹脂等高分子聚合物材料，也使得本案所揭露的一種超薄均熱片，不僅材料成本降低，又可降低製作均熱片的操作溫度而降低製造成本，且在非高壓製作條件下，金屬基板的厚度將可變薄，均熱片整體的面積也可變寬廣，達到更好散熱效果，並可大量生產，更能符合產量規模。 In the above ultra-thin heat spreader, the flow path structure connecting the upper and lower metal substrates is a polymer secondary structure, and the polymer secondary structure may be selected from a polymer such as an epoxy resin. The material also makes an ultra-thin heat spreader disclosed in the present invention not only reduce the material cost, but also reduce the operating temperature of the heat spread sheet to reduce the manufacturing cost, and the thickness of the metal substrate will be variable under non-high pressure production conditions. The overall area of the thin and even heat-sinks can also be varied to achieve better heat dissipation, and can be mass-produced to better meet the production scale.
1、1’‧‧‧上半部件 1, 1'‧‧‧ upper part
3、3’‧‧‧下半部件 3, 3'‧‧‧ lower half
11、11”‧‧‧上金屬基板 11, 11" ‧ ‧ upper metal substrate
13、13”‧‧‧下粗糙面 13, 13" ‧ ‧ rough surface
31、31’'‧‧‧下金屬基板 31, 31''‧‧‧ under the metal substrate
33、33”‧‧‧上粗糙面 33, 33" ‧ ‧ rough surface
5、5’‧‧‧流道結構 5, 5'‧‧‧ runner structure
51、51’、51”‧‧‧環氧樹脂凸部 51, 51', 51" ‧ ‧ epoxy resin convex
52”‧‧‧環氧樹脂熱壓連結部 52"‧‧‧Epoxy Resin Hot Pressing Joint
53’‧‧‧膠黏層 53'‧‧‧Adhesive layer
圖1為本發明超薄均熱片第一較佳實施例的上、下半部件內部結構正視圖；圖2為圖1實施例的上、下半部件的部分放大正視示意圖，說明各主要結構的分布；圖3為圖1實施例的部分結構側面剖視分解圖，說明上、下半部件內部高 分子聚合物次結構的上、下相對應情形；圖4為圖1實施例的側面剖視結合示意圖，說明上、下半部件內部高分子聚合物次結構經熱壓後連接，且與上下金屬基板共同環繞形成流道結構；圖5為本發明超薄均熱片第二較佳實施例的部分結構側面剖視結合示意圖，說明高分子聚合物次結構間，可經由一膠黏層連接，並與金屬基板共同形成流道結構；以及圖6為本發明超薄均熱片第三較佳實施例的側面剖視結合示意圖，說明上半部件亦可直接以金屬基板與下半部件的高分子聚合物次結構相對應結合的情形。 1 is a front elevational view showing the internal structure of the upper and lower halves of the first preferred embodiment of the ultrathin heat spreader of the present invention; FIG. 2 is a partially enlarged front elevational view showing the upper and lower halves of the embodiment of FIG. Figure 3 is a side cross-sectional exploded view of the partial structure of the embodiment of Figure 1, illustrating the interior of the upper and lower halves The upper and lower corresponding situations of the molecular polymer substructure; FIG. 4 is a side cross-sectional view of the embodiment of FIG. 1 , illustrating that the secondary polymer substructures of the upper and lower halves are connected by hot pressing, and the upper and lower metals The substrate is formed to form a flow channel structure together; FIG. 5 is a partial side cross-sectional view of the second preferred embodiment of the ultra-thin heat spreader of the present invention, illustrating that the polymer polymer sub-structures can be connected via an adhesive layer. And forming a flow path structure together with the metal substrate; and FIG. 6 is a side cross-sectional view of the third preferred embodiment of the ultra-thin heat spreader of the present invention, illustrating that the upper half member can also be directly higher than the metal substrate and the lower half member. The case where the molecular polymer secondary structure is correspondingly combined.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之較佳實施例的詳細說明中，將可清楚呈現；此外，在各實施例中，相同元件將以相似的標號表示。 The foregoing and other technical features, features and advantages of the present invention will be apparent from Said.
本發明超薄均熱片的第一較佳實施例請參考圖1和圖2所示，為便於說明理解，以下將本案用以組合超薄均熱片的兩部分，分別稱為上半部件1及下半部件3，並且將上半部件1以反向掀開的方式，繪示於下半部件3的上方。且上半部件1和下半部件3分別具有一片例如由模具沖壓出來、可供平貼於電子元件(圖未示)的上金屬基板11和下金屬基板31，且上述上金屬基板11和下金屬基板31彼此平行設置。 The first preferred embodiment of the ultrathin heat spread sheet of the present invention is shown in FIG. 1 and FIG. 2. For ease of explanation, the following two parts of the ultrathin heat spread sheet are respectively referred to as the upper part. 1 and the lower half 3, and the upper half 1 is shown in the opposite half of the lower half 3 in a reversely split manner. And the upper half member 1 and the lower half member 3 respectively have a piece of upper metal substrate 11 and a lower metal substrate 31 which are stamped out by a mold and are flattened to an electronic component (not shown), and the upper metal substrate 11 and the lower surface are respectively The metal substrates 31 are disposed in parallel to each other.
上述上金屬基板11的一側形成有供面向上述下半部件3的下粗糙面13，在上述下金屬基板31朝向上半部件1的一側同樣形成一上粗 糙面33，使得上述下粗糙面13與上述上粗糙面33彼此相向並相互對應。在本例中，上述下粗糙面13與上述上粗糙面33是由電化蝕刻形成電化蝕刻粗化面。當然，熟悉本技術者也可以利用機械摩擦或金屬粉末燒結等方式將金屬基板之表面粗化。 A lower rough surface 13 facing the lower half member 3 is formed on one side of the upper metal substrate 11, and a thick upper side is formed on the side of the lower metal substrate 31 facing the upper half member 1. The rough surface 33 is such that the lower rough surface 13 and the upper rough surface 33 face each other and correspond to each other. In this example, the lower rough surface 13 and the upper rough surface 33 are formed by electrochemical etching to form an etched roughened surface. Of course, those skilled in the art can also roughen the surface of the metal substrate by mechanical friction or sintering of metal powder.
且在上述下粗糙面13與上述上粗糙面33上分別利用曝光顯影分別形成例釋為環氧樹脂凸部51的高分子聚合物次結構。當然，熟悉本技術者也可以考慮將高分子聚合物次結構採取雷射雕刻、網版印刷或3D列印(3D printing，又稱增材製造(Additive Manufacturing))成形於金屬基板上，使得本案所揭露的超薄均熱片製造結構更具有彈性，且金屬基板粗糙化的過程，也可以在設置高分子聚合物次結構後進行，均無礙於本發明的實施。 Further, on the lower rough surface 13 and the upper rough surface 33, a polymer secondary structure exemplified as the epoxy resin convex portion 51 is formed by exposure development, respectively. Of course, those skilled in the art may also consider forming a polymer polymer substructure by laser engraving, screen printing or 3D printing (3D printing, also known as additive manufacturing) on a metal substrate. The disclosed ultrathin heat spread sheet manufacturing structure is more elastic, and the process of roughening the metal substrate can also be performed after the provision of the polymer polymer substructure, without hindering the implementation of the present invention.
接著請參考圖3和圖4所示，當上述上半部件1和下半部件3的上述的環氧樹脂凸部51對應結合時，由於本例中的上述環氧樹脂凸部51均為雙酚A型環氧樹脂(Bisphenol-A epoxy resin)，使得加熱結合的操作溫度只需約140℃~170℃，便可將上述上金屬基板11與上述下金屬基板31間的高分子聚合物次結構連接成為一組流道結構5，使得上述上金屬基板11和上述下金屬基板31間形成具有間隙的密閉空間；並在上述密閉空間填充一相變化材料(圖未示)，在本例中，該相變化材料例釋為水。由於本案的上金屬基板11和下金屬基板31厚度分別低於150μm，加計流道結構5的高度約100μm，使本案均熱片的整體厚度可小於500μm。當然，如熟悉本技術領域者所能輕易理解，由於銅箔厚度影響其機械強度，亦可考慮上下金屬基板其中一者選擇現有厚度約200μm，另一者則選擇例如100μm，既可降低均熱片整體厚度，亦可使均熱片整體保有相當結構強度。 Referring to FIG. 3 and FIG. 4, when the above-mentioned epoxy convex portions 51 of the upper half member 1 and the lower half member 3 are combined, the epoxy resin convex portions 51 in the present example are both double. Bisphenol-A epoxy resin, the operating temperature of the heat bonding is only about 140 ° C ~ 170 ° C, the polymer between the upper metal substrate 11 and the lower metal substrate 31 can be The structure is connected to form a plurality of flow path structures 5 such that a sealed space having a gap is formed between the upper metal substrate 11 and the lower metal substrate 31; and a phase change material (not shown) is filled in the sealed space, in this example The phase change material is exemplified as water. Since the thicknesses of the upper metal substrate 11 and the lower metal substrate 31 of the present case are respectively less than 150 μm, the height of the flow channel structure 5 is about 100 μm, so that the overall thickness of the heat spread sheet of the present invention can be less than 500 μm. Of course, as can be easily understood by those skilled in the art, since the thickness of the copper foil affects the mechanical strength, it is also considered that one of the upper and lower metal substrates is selected to have a thickness of about 200 μm, and the other is, for example, 100 μm, which can reduce the soaking. The overall thickness of the sheet can also maintain the structural strength of the heat spreader as a whole.
由於上半部件1和下半部件3只需經由低溫熱壓，便能形成超薄均熱片。相較過往的技術，本案的結構設計大幅降低均熱片的製作溫度，大幅降低製造成本，且易於量產，產品良率藉此提升；更因低溫熱壓的壓力較以往小，壓力不均勻問題從而降低，超薄均熱片的產品面積可以輕易提升至約800mm X 600mm，符合一般較大電路板尺寸，增大使用彈性；另方面，製作的過程不必經由高溫高壓操作，均熱片的金屬基板厚度可以變更薄，且流道結構主要包括高分子聚合物，使得整體重量變更輕。 Since the upper half member 1 and the lower half member 3 need only be subjected to low temperature hot pressing, an ultrathin heat spread sheet can be formed. Compared with the previous technology, the structural design of the case greatly reduces the production temperature of the heat spreader, greatly reduces the manufacturing cost, and is easy to mass-produce, thereby improving the yield of the product; more pressure due to low-temperature hot pressing is smaller than before, and the pressure is uneven. The problem is thus reduced, and the product area of the ultra-thin heat spread sheet can be easily increased to about 800 mm X 600 mm, which is in line with the generally larger circuit board size and increases the elasticity of use; on the other hand, the manufacturing process does not have to be operated by high temperature and high pressure, and the heat spread sheet is The thickness of the metal substrate can be changed to be thin, and the flow path structure mainly includes a high molecular polymer, so that the overall weight is changed lightly.
本案第二較佳實施例請參考圖5所示，與前一實施例不同在於，本例中，在上半部件1’中的環氧樹脂凸部為3D列印的例如雙酚A型環氧樹脂，下半部件3’中的高分子聚合物則另選擇環氧酚醛清漆樹脂(epoxy-novolak resin)，且當上述上半部件1’與下半部件3’的上述環氧樹脂凸部51’對應結合時，在上述環氧樹脂凸部51’間還額外增加有一膠黏層53’，而形成一組流道結構5’，以利相變化流體(圖未示)進行毛細作用。 The second preferred embodiment of the present invention is shown in FIG. 5, which is different from the previous embodiment in that, in this example, the epoxy resin convex portion in the upper half member 1' is 3D printed, for example, a bisphenol A type ring. Oxygen resin, the polymer in the lower half 3' is additionally selected from an epoxy-novolak resin, and the above-mentioned epoxy convex portion of the upper half member 1' and the lower half member 3' When the 51' is combined, an adhesive layer 53' is additionally added between the epoxy resin protrusions 51' to form a plurality of flow path structures 5' for capillary action of a phase change fluid (not shown).
當然，如熟悉本技術領域人士所能輕易理解，本發明的高分子聚合物次結構材質也可為聚脂樹脂、壓克力樹脂，位於兩片金屬基板上的高分子聚合物次結構並不一定要採用相同材質，甚至不一定要同時存在於上、下半部件中，如圖6本案第三較佳實施例所示，本例中上金屬基板11”的下粗糙面13”與下金屬基板31”的上粗糙面33”同以金屬粉末燒結造成粗化面，但上金屬基板11”的下方並無高分子聚合物次結構，因此在本例中以超音波加熱結合時，是以上述下金屬基板31”的網版印刷的環氧樹脂凸部51”直接對應抵接至上述上金屬基板11”的下粗糙面13”，使兩者相連形成一段環氧樹脂熱壓連結部52”。 Of course, as can be easily understood by those skilled in the art, the secondary polymer material of the present invention may also be a polyester resin or an acrylic resin, and the secondary structure of the polymer on the two metal substrates is not The same material must be used, even if it does not have to exist in the upper and lower halves at the same time. As shown in the third preferred embodiment of the present invention, the lower rough surface 13" and the lower metal of the upper metal substrate 11" in this example. The upper rough surface 33" of the substrate 31" is sintered with a metal powder to form a roughened surface, but there is no polymer secondary structure under the upper metal substrate 11". Therefore, in this example, when ultrasonic bonding is used, The screen printed epoxy resin protrusion 51" of the lower metal substrate 31" directly abuts against the lower rough surface 13" of the upper metal substrate 11", and the two are connected to form a section of the epoxy thermocompression bonding portion 52. ".
綜上所述，本案的結構利用高分子聚合物次結構的可塑性、高黏合性、以及固化物交聯密度高，且處理溫度不用太高的條件下，金屬基板的面積可依使用所需而做變化，在設計上也可以有非常高的變化。惟以上所述者，僅為本發明之較佳實施例而已，不能以此限定本發明實施之範圍，凡係依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾，皆應仍屬本發明專利涵蓋之範圍內。 In summary, the structure of the present invention utilizes the plasticity of the secondary structure of the polymer, high adhesion, and high crosslink density of the cured product, and the processing temperature is not too high, and the area of the metal substrate can be used as needed. Making changes can also have very high changes in design. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and the simple equivalent changes and modifications made by the scope of the present invention and the description of the invention are all It should remain within the scope of this invention.
1‧‧‧上半部件 1‧‧‧ upper part
3‧‧‧下半部件 3‧‧‧ lower half
11‧‧‧上金屬基板 11‧‧‧Upper metal substrate
13‧‧‧下粗糙面 13‧‧‧Under rough surface
31‧‧‧下金屬基板 31‧‧‧Under metal substrate
33‧‧‧上粗糙面 33‧‧‧Upper rough surface
51‧‧‧環氧樹脂凸部 51‧‧‧ epoxy resin convex
Claims (10)
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| TWI568575B true TWI568575B (en) | 2017-02-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200635992A (en) * | 2004-03-30 | 2006-10-16 | Gen Electric | Thermally conductive compositions and methods of making thereof |
| CN101351901A (en) * | 2006-04-03 | 2009-01-21 | 株式会社渊上微 | Heat pipe |
| TW201505852A (en) * | 2013-06-07 | 2015-02-16 | 信越化學工業股份有限公司 | Thermal conductive composite sheet and heat dissipation structure |
| TWM510541U (en) * | 2015-05-29 | 2015-10-11 | Winnotek Inc | Ultra thin heat spreader |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200635992A (en) * | 2004-03-30 | 2006-10-16 | Gen Electric | Thermally conductive compositions and methods of making thereof |
| CN101351901A (en) * | 2006-04-03 | 2009-01-21 | 株式会社渊上微 | Heat pipe |
| TW201505852A (en) * | 2013-06-07 | 2015-02-16 | 信越化學工業股份有限公司 | Thermal conductive composite sheet and heat dissipation structure |
| TWM510541U (en) * | 2015-05-29 | 2015-10-11 | Winnotek Inc | Ultra thin heat spreader |
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