TWI568339B - Electronic device - Google Patents
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- TWI568339B TWI568339B TW104121731A TW104121731A TWI568339B TW I568339 B TWI568339 B TW I568339B TW 104121731 A TW104121731 A TW 104121731A TW 104121731 A TW104121731 A TW 104121731A TW I568339 B TWI568339 B TW I568339B
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Description
本發明係關於一種電子裝置,特別是一種免設置風扇背板的電子裝置。 The present invention relates to an electronic device, and more particularly to an electronic device free of a fan back plate.
隨著電子裝置逐漸朝向「輕、薄、短、小」之設計概念發展,其內部之電子元件體積亦趨於微型化。惟,於電子元件體積趨於微型化的同時,其單位面積的密集度隨之提高,故相關電子元件所產生之熱量亦隨之增加。由於過高的溫度將嚴重影響電子裝置運作的穩定性與效率,並造成電子元件的壽命縮短,是以,散熱裝置已成為電子裝置不可或缺的配備。 As electronic devices gradually move toward the design concept of "light, thin, short, and small", the size of electronic components inside them tends to be miniaturized. However, as the volume of electronic components tends to be miniaturized, the density per unit area increases, so the amount of heat generated by the related electronic components also increases. Because the excessive temperature will seriously affect the stability and efficiency of the operation of the electronic device, and the life of the electronic component is shortened, the heat sink has become an indispensable device for the electronic device.
以伺服器為例,一般來說伺服器的散熱需求較高,故一般會在伺服器內部設有由多個風扇組成的風扇陣列來提升伺服器的散熱能力。風扇陣列在機構上一般是透過風扇架組裝於伺服器的殼體,而在電路上一般是透過電路板形式的風扇背板轉接於伺服器內之主機板,進而提升風扇陣列與伺服器的組裝效率。 Taking a server as an example, in general, the heat dissipation requirement of the server is high. Therefore, a fan array composed of a plurality of fans is generally provided inside the server to improve the heat dissipation capability of the server. The fan array is generally assembled to the server casing through the fan frame, and the fan back plate in the form of a circuit board is generally transferred to the motherboard in the server, thereby enhancing the fan array and the server. Assembly efficiency.
風扇背板的設置雖然可以提升風扇陣列與主機板間之組裝效率,但由於風扇背板的成本高,使得伺服器之成本難以壓低,進而恐降低伺服器的市場競爭力。 Although the fan backplane can improve the assembly efficiency between the fan array and the motherboard, the cost of the fan backplane is high, which makes it difficult to reduce the cost of the server, which may reduce the market competitiveness of the server.
此外,風扇背板的設置會額外佔據伺服器的容置空間而造成空間上之浪費,進而使得伺服器的體積難以進一步縮小。 In addition, the setting of the fan backboard additionally occupies the storage space of the server, which causes a waste of space, which makes it difficult to further reduce the size of the server.
因此,如何兼顧風扇陣列之組裝效率以及組裝成本與改善伺服器容置空間上的浪費,將是研發人員應解決的問題之一。 Therefore, how to balance the assembly efficiency of the fan array and the assembly cost and the waste of the server accommodation space will be one of the problems that the R&D personnel should solve.
本發明在於提供一種電子裝置,藉以兼顧風扇陣列之組裝效率以及組裝成本與改善伺服器容置空間上的浪費。 The present invention provides an electronic device that combines the assembly efficiency and assembly cost of the fan array with the improvement of waste in the server housing space.
本發明所揭露的電子裝置,包含一機殼、一主機板及一風扇模組。主機板設置於機殼。風扇模組設置於機殼。風扇模組包含一框架、複數個轉接器及一傳輸組件。框架包含一底座及二側板。底座具有一頂面及一底面。二側板連接於底座之相對兩側並令底座之頂面與二側板共同形成至少一氣流道。二側板之一具有一理線口,底座之底面具有一理線槽及複數個理線結構。理線槽之其中一端連通理線口。這些理線結構鄰近於理線槽。這些轉接器裝設於框架之底座。轉接器包含一第一電連接埠以及一第二電連接埠。第一電連接埠與第二電連接埠之插接方向正交。第一電連接埠貼合於底座之底面上。第二電連接埠插設底座並凸出於底座之頂面而位於氣流道內。傳輸組件包含有複數個第三電連接埠、一第四電連接埠、一第五電連接埠及一線材。線材銜接這些第三電連接埠與第四電連接埠,以及銜接這些第三電連接埠與第五電連接埠。這些第三電連接埠分別可分離地插設於這些第一電連接埠。第四電連接埠與第五電連接埠位於線材遠離這些第三電連接埠之一端。傳輸組件透過理線結構與理線槽之導引自理線口穿出框架,以使第四電連接埠與第五電連接埠位於框架外部且可分離地插設於主機板上。這些風扇單元各具有一第六電連接埠。風扇單元位於氣流道,且第六電連接埠可分離地插設於第二電連接埠,令風扇單元透過傳輸組件以電性連接於主機板。 The electronic device disclosed in the present invention comprises a casing, a motherboard and a fan module. The motherboard is placed in the chassis. The fan module is disposed in the casing. The fan module includes a frame, a plurality of adapters, and a transmission component. The frame includes a base and two side panels. The base has a top surface and a bottom surface. The two side plates are connected to opposite sides of the base and the top surface of the base and the two side plates together form at least one air passage. One of the two side plates has a cable management port, and the bottom surface of the base has a cable management slot and a plurality of cable management structures. One end of the cable management slot is connected to the cable management port. These cable management structures are adjacent to the cable management slots. These adapters are mounted on the base of the frame. The adapter includes a first electrical port and a second electrical port. The first electrical connection port is orthogonal to the insertion direction of the second electrical connection port. The first electrical connector is attached to the bottom surface of the base. The second electrical connector is inserted into the base and protrudes from the top surface of the base and is located in the airflow path. The transmission component includes a plurality of third electrical connections, a fourth electrical connection, a fifth electrical connection, and a wire. The wire connects the third electrical connection port and the fourth electrical connection port, and connects the third electrical connection port and the fifth electrical connection port. The third electrical connections are respectively detachably inserted into the first electrical connections. The fourth electrical connection port and the fifth electrical connection port are located at one end of the wire away from the third electrical connection ports. The transmission component passes through the frame of the cable management structure and the guiding cable of the cable management slot, so that the fourth electrical connection port and the fifth electrical connection port are located outside the frame and are detachably inserted on the motherboard. Each of the fan units has a sixth electrical port. The fan unit is located in the airflow path, and the sixth electrical port is detachably inserted into the second electrical port, so that the fan unit is electrically connected to the motherboard through the transmission component.
根據上述實施例所揭露的電子裝置,由於風扇單元是透過轉接器與傳輸組件直接插接於主機板上,而非透過另一電路板銜接,故可壓低電子裝置之製造成本,以提升市場競爭力。 According to the electronic device disclosed in the above embodiments, since the fan unit is directly inserted into the motherboard through the adapter and the transmission component, rather than being connected through another circuit board, the manufacturing cost of the electronic device can be reduced to enhance the market. Competitiveness.
再者,因無需額外設置電路板,故可優化伺服器之容置空間的利用,以改善電路板會浪費伺服器的容置空間的問題。 Moreover, since there is no need to additionally set the circuit board, the utilization of the storage space of the server can be optimized to improve the problem that the circuit board wastes the storage space of the server.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.
10‧‧‧電子裝置 10‧‧‧Electronic devices
100‧‧‧機殼 100‧‧‧Chassis
200‧‧‧主機板 200‧‧‧ motherboard
210‧‧‧訊號插槽 210‧‧‧Signal slot
220‧‧‧電源供應插槽 220‧‧‧Power supply slot
300‧‧‧風扇模組 300‧‧‧Fan module
310‧‧‧框架 310‧‧‧Frame
311‧‧‧底座 311‧‧‧Base
311a‧‧‧頂面 311a‧‧‧ top
311b‧‧‧底面 311b‧‧‧ bottom
311c‧‧‧裝設孔 311c‧‧‧Installation hole
311d‧‧‧理線槽 311d‧‧‧ cable trough
311e‧‧‧理線結構 311e‧‧‧Management structure
312‧‧‧側板 312‧‧‧ side panels
312a‧‧‧理線口 312a‧‧ ‧ management line
313‧‧‧分隔板 313‧‧‧ partition board
320‧‧‧轉接器 320‧‧‧Adapter
321‧‧‧第一電連接埠 321‧‧‧First electrical connection埠
322‧‧‧第二電連接埠 322‧‧‧Second electrical connection埠
330‧‧‧傳輸組件 330‧‧‧Transport components
331‧‧‧第三電連接埠 331‧‧‧ Third electrical connection埠
332‧‧‧第四電連接埠 332‧‧‧4th electrical connection埠
333‧‧‧第五電連接埠 333‧‧‧Film connection埠
334‧‧‧線材 334‧‧‧Wire
340‧‧‧風扇單元 340‧‧‧Fan unit
341‧‧‧第六電連接埠 341‧‧‧6th electrical connection埠
342‧‧‧卡勾 342‧‧‧ card hook
C‧‧‧氣流道 C‧‧‧ air passage
第1圖為根據本發明第一實施例所述之電子裝置的立體示意圖。 1 is a perspective view of an electronic device according to a first embodiment of the present invention.
第2圖為第1圖之分解示意圖。 Fig. 2 is an exploded perspective view of Fig. 1.
第3圖至第7圖為第1圖之電子裝置的組裝示意圖。 3 to 7 are schematic views showing the assembly of the electronic device of Fig. 1.
請參閱第1圖至第2圖。第1圖為根據本發明第一實施例所述之電子裝置的立體示意圖。第2圖為第1圖之分解示意圖。 Please refer to Figures 1 to 2. 1 is a perspective view of an electronic device according to a first embodiment of the present invention. Fig. 2 is an exploded perspective view of Fig. 1.
本實施例之電子裝置10是以伺服器為例,但並不以此為限,在其他實施例中,電子裝置10亦可為桌上型電腦。電子裝置10包含一機殼100、一主機板200及一風扇模組300。 The electronic device 10 of the present embodiment is a server, but is not limited thereto. In other embodiments, the electronic device 10 may also be a desktop computer. The electronic device 10 includes a casing 100, a motherboard 200, and a fan module 300.
主機板200設置於機殼100內。主機板200上例如設有中央處理器、記憶體或擴充插槽。在本實施例中,主機板200上設有一訊號插槽210及一電源供應插槽220。 The motherboard 200 is disposed in the casing 100. The motherboard 200 is provided with, for example, a central processing unit, a memory or an expansion slot. In the embodiment, the motherboard 200 is provided with a signal slot 210 and a power supply slot 220.
風扇模組300設置於機殼100之中部。所謂機殼100之中部例 如係是指機殼100之長邊的中央區域。但並不以此為限,在其他實施例中,風扇模組300亦可設置於機殼100之前段或後段。 The fan module 300 is disposed in the middle of the casing 100. The case of the case 100 For example, it refers to the central area of the long side of the casing 100. However, the fan module 300 can also be disposed in the front or rear section of the casing 100 in other embodiments.
風扇模組300包含一框架310、複數個轉接器320、一傳輸組件330及複數個風扇單元340。 The fan module 300 includes a frame 310, a plurality of adapters 320, a transmission component 330, and a plurality of fan units 340.
框架310包含一底座311及二側板312。底座311具有相對的一頂面311a及一底面311b。二側板312連接於底座311之相對兩側並令底座311之頂面311a與二側板312共同形成至少一氣流道C。詳細來說,框架310更包含複數個分隔板313(如第3圖所示)。這些分隔板313間隔地排列並連接於底座311,且位於二側板312之間,以令底座311之頂面311a、二側板312及這些分隔板313共同形成多個氣流道C。 The frame 310 includes a base 311 and two side plates 312. The base 311 has a top surface 311a and a bottom surface 311b. The two side plates 312 are connected to opposite sides of the base 311 and the top surface 311a of the base 311 and the two side plates 312 together form at least one air passage C. In detail, the frame 310 further includes a plurality of partition plates 313 (as shown in FIG. 3). The partition plates 313 are spaced apart from each other and connected to the base 311 and located between the two side plates 312 such that the top surface 311a of the base 311, the two side plates 312, and the partition plates 313 together form a plurality of air passages C.
此外,底座311更具有複數個裝設孔311c,各裝設孔311c分別對應各氣流道C。並且二側板312之一具有一理線口312a。底座311之底面311b具有一理線槽311d及複數個理線結構311e。理線槽311d之其中一端連通理線口312a。這些理線結構311e鄰近於理線槽311d並間隔排列於理線槽311d之兩旁。 In addition, the base 311 further has a plurality of mounting holes 311c, and each of the mounting holes 311c corresponds to each air passage C. And one of the two side plates 312 has a management port 312a. The bottom surface 311b of the base 311 has a cable management slot 311d and a plurality of cable management structures 311e. One end of the cable management slot 311d is connected to the cable management port 312a. The cable management structures 311e are adjacent to the cable management slots 311d and are arranged at intervals on both sides of the cable management slots 311d.
轉接器320包含一第一電連接埠321以及一第二電連接埠322。第一電連接埠321與第二電連接埠322之插接方向正交。所謂之插接方向是指電連接埠之插槽的開口方向或是插頭供插設的方向。複數個轉接器320例如以卡合連接的方式裝設於框架310之底座311之裝設孔311c,使得第一電連接埠321平行貼合於底座311之底面311b上,第二電連接埠322插設底座311之裝設孔311c並凸出於底座311之頂面311a而位於氣流道C內。 The adapter 320 includes a first electrical port 321 and a second electrical port 322. The first electrical connection port 321 is orthogonal to the insertion direction of the second electrical connection port 322. The so-called plug-in direction refers to the opening direction of the slot of the electrical connection or the direction in which the plug is inserted. The plurality of adapters 320 are mounted on the mounting holes 311c of the base 311 of the frame 310 in a snap-fit manner, such that the first electrical connector 321 is parallelly attached to the bottom surface 311b of the base 311, and the second electrical connection is The mounting hole 311c of the base 311 is inserted into the hole 311c and protrudes from the top surface 311a of the base 311 to be located in the airflow path C.
此外,第一電連接埠321與第二電連接埠322皆為母頭。但並 不以此為限,在其他實施例中,也可以是第一電連接埠321為母頭,第二電連接埠322為公頭。 In addition, the first electrical connection 321 and the second electrical connection 322 are both female. But In the other embodiments, the first electrical connection 321 is a female and the second electrical connection 322 is a male.
傳輸組件330包含有複數個第三電連接埠331、一第四電連接埠332、一第五電連接埠333及一線材334。這些第三電連接埠331連接於線材334之一端,第四電連接埠332與第五電連接埠333連接於線材334遠離這些第三電連接埠331之一端。詳細來說,線材334內例如包含多個芯線(未繪示),部分芯線分別銜接這些第三電連接埠331與第四電連接埠332,以傳輸資料訊號(如風扇控制訊號)。另一部分芯線分別銜接這些第三電連接埠331與第五電連接埠333,以傳輸電源訊號。 The transmission component 330 includes a plurality of third electrical connections 331 , a fourth electrical connection 332 , a fifth electrical connection 333 , and a wire 334 . The third electrical connection port 331 is connected to one end of the wire 334, and the fourth electrical connection port 332 and the fifth electrical connection port 333 are connected to the wire 334 away from one end of the third electrical connection port 331. In detail, the wire 334 includes, for example, a plurality of core wires (not shown), and the partial core wires respectively connect the third electrical connection ports 331 and the fourth electrical connection ports 332 to transmit data signals (such as fan control signals). The other part of the core wire respectively connects the third electrical connection port 331 and the fifth electrical connection port 333 to transmit a power signal.
這些第三電連接埠331例如為插接埠,並分別可分離地插設於這些第一電連接埠321。第四電連接埠332為電源連接埠,且第五電連接埠333為風扇控制訊號連接埠。第四電連接埠332可分離地插接於主機板200上之電源供應插槽210。第五電連接埠333可分離地插接於主機板200上之訊號插槽220。 The third electrical ports 331 are, for example, plug connectors, and are separately detachably inserted into the first electrical ports 321 . The fourth electrical port 332 is a power port, and the fifth port 333 is a fan control signal port. The fourth electrical port 332 is detachably plugged into the power supply slot 210 on the motherboard 200. The fifth electrical port 333 is detachably inserted into the signal slot 220 on the motherboard 200.
此外,傳輸組件330可透過上述理線結構311e與理線槽311d之導引自理線口312a穿出框架310,以讓傳輸組件330之線材334整齊地位於底座311與機殼100之間。 In addition, the transmission component 330 can pass through the frame 310 through the guiding cable 311e and the guiding wire 312a of the cable management slot 311d, so that the wire 334 of the transmission component 330 is neatly located between the base 311 and the casing 100.
風扇單元340例如為軸流式風扇。每一風扇單元340具有一第六電連接埠341,且第六電連接埠341例如為插接埠。風扇單元340位於氣流道C,且第六電連接埠341可分離地插設於第二電連接埠322,令這些風扇單元340分別透過這些轉接器320與這些傳輸組件330以電性連接於主機板200。詳細來說,當風扇單元340插入框架310之氣流道C時,第六電連接埠341插入並電 性連接於第二電連接埠322。當風扇單元340自框架310之氣流道C拔出時,第六電連接埠341拔出並解除與第二電連接埠322的電性連接。 The fan unit 340 is, for example, an axial fan. Each fan unit 340 has a sixth electrical port 341, and the sixth electrical port 341 is, for example, a plug port. The fan unit 340 is located in the air channel C, and the sixth electrical port 341 is detachably inserted into the second electrical port 322, so that the fan unit 340 is electrically connected to the transmission components 330 through the adapters 320, respectively. Motherboard 200. In detail, when the fan unit 340 is inserted into the air flow path C of the frame 310, the sixth electrical connection port 341 is inserted and charged. It is connected to the second electrical port 322. When the fan unit 340 is pulled out from the air channel C of the frame 310, the sixth electrical port 341 is pulled out and the electrical connection with the second electrical port 322 is released.
此外,在本實施例中,風扇單元340以一卡勾342固设於该框架310,但並不以此為限,在其他實施例中,風扇單元340也可以用螺絲固設於框架310。 In addition, in the embodiment, the fan unit 340 is fixed to the frame 310 by a hook 342. However, in other embodiments, the fan unit 340 can also be fixed to the frame 310 by screws.
此外,上述之第三電連接埠331與第六電連接埠341為插接埠。第一電連接埠321、第二電連接埠322、第三電連接埠331、第四電連接埠332、第五電連接埠333、第六電連接埠341為插接埠。 In addition, the third electrical connection port 331 and the sixth electrical connection port 341 are plug-in ports. The first electrical connection 321 , the second electrical connection 322 , the third electrical connection 331, the fourth electrical connection 332 , the fifth electrical connection 333 , and the sixth electrical connection 341 are plug-in ports.
接著,繼續介紹電子裝置10之組裝步驟。請參閱第3圖至第7圖。第3圖至第7圖為第1圖之電子裝置的組裝示意圖。 Next, the assembly steps of the electronic device 10 will be continued. Please refer to Figures 3 to 7. 3 to 7 are schematic views showing the assembly of the electronic device of Fig. 1.
如第3圖所示,將轉接器320裝設於底座311之底面311b上的裝設孔311c,使得第一電連接埠321平行貼合於底座311之底面311b上,第二電連接埠322插設底座311之裝設孔311c並凸出於底座311之頂面311a而位於氣流道C內。 As shown in FIG. 3, the adapter 320 is mounted on the mounting hole 311c of the bottom surface 311b of the base 311, so that the first electrical connector 321 is parallelly attached to the bottom surface 311b of the base 311, and the second electrical connection is The mounting hole 311c of the base 311 is inserted into the hole 311c and protrudes from the top surface 311a of the base 311 to be located in the airflow path C.
接著,如第4圖所示,將傳輸組件330之這些第三電連接埠331分別插接並電性連接於這些第一電連接埠321。 Then, as shown in FIG. 4, the third electrical connections 331 of the transmission component 330 are respectively plugged and electrically connected to the first electrical connections 321 .
接著,如第5圖所示,將傳輸組件330之線材334固定於底座311之理線結構311e及理線槽311d並由理線口312a穿出。 Next, as shown in FIG. 5, the wire 334 of the transmission assembly 330 is fixed to the cable management structure 311e and the cable management slot 311d of the base 311 and is passed through the management cable opening 312a.
接著,如第6圖所示,將風扇單元340裝設於框架310之氣流道C內,並令風扇單元340之卡勾342勾扣於側板312或分隔板313,以及令風扇單元340之第六電連接埠341插設於第二電連接埠322。 Then, as shown in FIG. 6, the fan unit 340 is installed in the airflow path C of the frame 310, and the hook 342 of the fan unit 340 is hooked to the side plate 312 or the partition plate 313, and the fan unit 340 is The sixth electrical connection port 341 is inserted into the second electrical connection port 322.
接著,如第7圖所示,將風扇模組300之框架310裝設於機殼 100,並將第四電連接埠332與第五電連接埠333分別插設主機板200上之電源供應插槽210與訊號插槽220,以完成電子裝置10之組裝。 Next, as shown in FIG. 7, the frame 310 of the fan module 300 is mounted on the casing. 100, and the fourth electrical port 332 and the fifth electrical port 333 are respectively inserted into the power supply slot 210 and the signal slot 220 on the motherboard 200 to complete the assembly of the electronic device 10.
根據上述實施例所揭露的電子裝置,由於風扇單元是透過轉接器與傳輸組件直接插接於主機板上,而非透過另一電路板銜接,故可壓低電子裝置之製造成本,以提升市場競爭力。 According to the electronic device disclosed in the above embodiments, since the fan unit is directly inserted into the motherboard through the adapter and the transmission component, rather than being connected through another circuit board, the manufacturing cost of the electronic device can be reduced to enhance the market. Competitiveness.
再者,因無需額外設置電路板,故可優化伺服器之容置空間的利用,以改善電路板會浪費伺服器的容置空間的問題。 Moreover, since there is no need to additionally set the circuit board, the utilization of the storage space of the server can be optimized to improve the problem that the circuit board wastes the storage space of the server.
此外,透過上述框架、轉接器與傳輸組件之配置,使用者可快速地將風扇單元裝至定位,進而提升電子裝置的組裝效率。如此一來,透過上述之設計將可兼顧電子裝置之組裝效率以及組裝成本。 In addition, through the configuration of the frame, the adapter and the transmission component, the user can quickly mount the fan unit to the positioning, thereby improving the assembly efficiency of the electronic device. In this way, the above-mentioned design can balance the assembly efficiency and assembly cost of the electronic device.
雖然本發明的實施例揭露如上所述,然並非用以限定本發明,任何熟習相關技藝者,在不脫離本發明的精神和範圍內,舉凡依本發明申請範圍所述的形狀、構造、特徵及數量當可做些許的變更,因此本發明的專利保護範圍須視本說明書所附的申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.
300‧‧‧風扇模組 300‧‧‧Fan module
310‧‧‧框架 310‧‧‧Frame
311‧‧‧底座 311‧‧‧Base
311a‧‧‧頂面 311a‧‧‧ top
311b‧‧‧底面 311b‧‧‧ bottom
311c‧‧‧裝設孔 311c‧‧‧Installation hole
311d‧‧‧理線槽 311d‧‧‧ cable trough
311e‧‧‧理線結構 311e‧‧‧Management structure
312‧‧‧側板 312‧‧‧ side panels
312a‧‧‧理線口 312a‧‧ ‧ management line
320‧‧‧轉接器 320‧‧‧Adapter
321‧‧‧第一電連接埠 321‧‧‧First electrical connection埠
322‧‧‧第二電連接埠 322‧‧‧Second electrical connection埠
330‧‧‧傳輸組件 330‧‧‧Transport components
331‧‧‧第三電連接埠 331‧‧‧ Third electrical connection埠
332‧‧‧第四電連接埠 332‧‧‧4th electrical connection埠
333‧‧‧第五電連接埠 333‧‧‧Film connection埠
334‧‧‧線材 334‧‧‧Wire
340‧‧‧風扇單元 340‧‧‧Fan unit
341‧‧‧第六電連接埠 341‧‧‧6th electrical connection埠
342‧‧‧卡勾 342‧‧‧ card hook
C‧‧‧氣流道 C‧‧‧ air passage
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104121731A TWI568339B (en) | 2015-07-03 | 2015-07-03 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104121731A TWI568339B (en) | 2015-07-03 | 2015-07-03 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201703614A TW201703614A (en) | 2017-01-16 |
| TWI568339B true TWI568339B (en) | 2017-01-21 |
Family
ID=58401174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104121731A TWI568339B (en) | 2015-07-03 | 2015-07-03 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI568339B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI839688B (en) * | 2022-01-21 | 2024-04-21 | 緯創資通股份有限公司 | Fan cage and fan module and electronic device including the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040256334A1 (en) * | 2003-06-23 | 2004-12-23 | Inventec Corporation | Fan rack |
| TWM474168U (en) * | 2013-11-07 | 2014-03-11 | Chenbro Micom Co Ltd | Seismic isolation fan allowing hot plug |
| TWI482003B (en) * | 2013-06-26 | 2015-04-21 | Inventec Corp | Electronic device |
-
2015
- 2015-07-03 TW TW104121731A patent/TWI568339B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040256334A1 (en) * | 2003-06-23 | 2004-12-23 | Inventec Corporation | Fan rack |
| TWI482003B (en) * | 2013-06-26 | 2015-04-21 | Inventec Corp | Electronic device |
| TWM474168U (en) * | 2013-11-07 | 2014-03-11 | Chenbro Micom Co Ltd | Seismic isolation fan allowing hot plug |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI839688B (en) * | 2022-01-21 | 2024-04-21 | 緯創資通股份有限公司 | Fan cage and fan module and electronic device including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201703614A (en) | 2017-01-16 |
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