TWI566187B - Fingerprint identification unit - Google Patents
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- TWI566187B TWI566187B TW104136395A TW104136395A TWI566187B TW I566187 B TWI566187 B TW I566187B TW 104136395 A TW104136395 A TW 104136395A TW 104136395 A TW104136395 A TW 104136395A TW I566187 B TWI566187 B TW I566187B
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- 238000005253 cladding Methods 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 12
- 239000010408 film Substances 0.000 claims description 10
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 10
- 239000004973 liquid crystal related substance Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims 33
- 239000011247 coating layer Substances 0.000 claims 2
- 230000000873 masking effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001010 compromised effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
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Description
一種指紋辨識單元,尤指一種將指紋辨識單元直接整合形成於觸控面板、彩色濾光片 (Color Filter, CF)、薄膜電晶體(Thin-Film Transistor, TFT)、液晶模組(Liquid Crystal Module,LCM)其中任一上,進而提升指紋辨識精度的指紋辨識單元。A fingerprint identification unit, in particular, a fingerprint recognition unit directly integrated on a touch panel, a color filter (CF), a thin film transistor (Thin-Film Transistor, TFT), and a liquid crystal module (Liquid Crystal Module) , LCM), on any one of them, to improve the fingerprint identification accuracy of the fingerprint identification unit.
隨著多媒體技術之蓬勃發展,行動電話、個人數位助理(Personal Digital Assistant,PDA)、數位相機、個人筆記型電腦或平板或穿戴式裝置等越來越多之智慧型便攜式電子裝置已經成為了人們生活中必備之工具。然而,這些便攜式電子裝置具有很強之個人化的特點。因此一旦這些便攜式電子裝置遭到盜用或是遺失,其內部存儲之資訊,例如電話簿、相片、資料等等都有可能被別人利用,而造成不必要之損失。With the rapid development of multimedia technology, more and more smart portable electronic devices such as mobile phones, personal digital assistants (PDAs), digital cameras, personal notebook computers or tablets or wearable devices have become people. A must-have tool in life. However, these portable electronic devices are highly personal. Therefore, once these portable electronic devices are stolen or lost, the information stored therein, such as phone books, photos, materials, etc., may be used by others, causing unnecessary losses.
因此,這類產品需要搭配一定之身份認證及許可權管理,以確保使用者的隱私安全。而當前所採用之身份認證的主要方法係有密碼保護,使用者需先輸入正確的密碼至便攜式電子裝置,才能夠進入便攜式電子裝置的操控頁面。然而,密碼保護之安全性較低,原因在於密碼較容易被洩漏或遭到破解。而且假使當使用者忘記密碼時,也很麻煩。因此,即有採用指紋辨識之身份認證的便攜式電子裝置問市。由於每個人之指紋都是不同的,因此指紋具有唯一性之特點,使得採用指紋辨識之身份認證的安全性提高很多。並且,利用使用指紋辨識之身份認證的方法也相對方便,令使用者省去了記憶及輸入密碼之繁瑣。Therefore, such products need to be matched with certain identity authentication and permission management to ensure the privacy of users. The main method of identity authentication currently used is password protection, and the user needs to input the correct password to the portable electronic device before entering the control page of the portable electronic device. However, password protection is less secure because passwords are more likely to be compromised or compromised. And if the user forgets the password, it is also very troublesome. Therefore, there is a portable electronic device that uses fingerprint identification for identity authentication. Since each person's fingerprints are different, the unique characteristics of the fingerprints make the security of identity authentication using fingerprint recognition much improved. Moreover, the method of using identity authentication using fingerprint identification is relatively convenient, so that the user can save the cumbersome memory and password entry.
而現行指紋辨識系統廣泛應用於手持式裝置或行動裝置上,最為常見的指紋辨識裝置係獨立設計於例如筆記型電腦鍵盤之固定一側或手持式行動裝置之背側或一端底側的固定位置,並無法有效整合於手持行動裝置觸控螢幕上進而縮減手持式行動裝置之體積,並且習知指紋辨識晶片封裝模組主要包括基板、晶片以及模封體。晶片設置於基板上且與基板電性連接,而模封體覆蓋於基板的表面以及晶片上。The current fingerprint identification system is widely used in handheld devices or mobile devices. The most common fingerprint identification devices are independently designed, for example, on a fixed side of a notebook computer keyboard or a fixed position on the back side or the bottom side of a hand-held mobile device. It cannot be effectively integrated on the touch screen of the handheld mobile device to reduce the volume of the handheld mobile device, and the conventional fingerprint identification chip package module mainly includes a substrate, a wafer and a mold body. The wafer is disposed on the substrate and electrically connected to the substrate, and the mold body covers the surface of the substrate and the wafer.
而習知技術主要必須先將各感應電路及金屬走線或晶片設置於一矽晶圓所製成之基板上,整合製成一指紋辨識單元後再與觸控面板或其他裝置結合使用,習知技術所提供之指紋辨識單元整體厚度亦較厚也容易因厚度影響指紋辨識之精度以及因厚度之考量無法與較薄之裝置整合為一體。In the prior art, the sensing circuit and the metal trace or the chip must be disposed on a substrate made of a single wafer, integrated into a fingerprint identification unit, and then combined with a touch panel or other device. The overall thickness of the fingerprint identification unit provided by the known technology is also thick, and it is easy to integrate the thinner device due to the thickness affecting the accuracy of the fingerprint identification and the thickness consideration.
再者,一般來說當手指接觸晶片的感測區時,由於晶片外面覆蓋有多層膜,使得晶片封裝模組整體厚度較高,而晶片封裝模組靈敏度較低。Furthermore, when the finger touches the sensing region of the wafer, the wafer package is covered with a multilayer film, so that the overall thickness of the chip package module is high, and the chip package module has low sensitivity.
此外,習知滑移式指紋辨識系統具有方向性,且辨識時間過久且必須獨立設置則無論是結構整合或使用便利性皆非常不佳。In addition, the conventional slip fingerprint identification system has directionality, and the recognition time is too long and must be set independently, which is very poor in structural integration or ease of use.
爰此,為有效解決上述之問題,本發明之主要目的,係提供一種將指指紋辨識單元直接整合形成於觸控面板、彩色濾光片 (Color Filter, CF)、薄膜電晶體(Thin-Film Transistor, TFT)、液晶模組(Liquid Crystal Module,LCM)其中任一上並成為一體的指紋辨識單元。Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a fingerprint recognition unit directly integrated on a touch panel, a color filter (CF), a thin film transistor (Thin-Film). A fingerprint identification unit integrated into any one of a Transistor (TFT) and a Liquid Crystal Module (LCM).
為達上述目的本發明係提供一種指紋辨識單元,係形成於一基部上;In order to achieve the above object, the present invention provides a fingerprint identification unit formed on a base;
所述基部具有一上側及一下側,所述指指紋辨識單元選擇設置於該上、下側其中任一。 The base has an upper side and a lower side, and the fingerprint identification unit is selected to be disposed on any of the upper and lower sides.
所述指紋辨識單元,係具有:一第一披覆層、一第一指紋辨識電極層、一第二披覆層、一第二指紋辨識電極層、一導線層、一第三披覆層;The fingerprint identification unit has a first cladding layer, a first fingerprint identification electrode layer, a second cladding layer, a second fingerprint identification electrode layer, a wire layer, and a third cladding layer;
所述第一披覆層設於前述第一、二平面其中任一;所述第一指紋辨識電極層設於該第一披覆層相反該基部之一側,該第一指紋辨識電極層具有複數第一指紋辨識電極;所述第二披覆層覆蓋前述第一指紋辨識電極層;該第二指紋辨識電極層設於該第二披覆層相反該第一指紋辨識電極層之一側,該第二指紋辨識電極層具有複數第二指紋辨識電極;該導線層具有複數金屬導線,並該等金屬導線係選擇與前述第一、二指紋辨識電極層電性連接;該第三披覆層覆蓋前述第二指紋辨識電極層及部分導線層。The first cladding layer is disposed on any one of the first and second planes; the first fingerprint recognition electrode layer is disposed on a side of the first cladding layer opposite to the base portion, and the first fingerprint identification electrode layer has a plurality of first fingerprint recognition electrodes; the second cladding layer covers the first fingerprint recognition electrode layer; the second fingerprint recognition electrode layer is disposed on a side of the second cladding layer opposite to the first fingerprint identification electrode layer, The second fingerprint identifying electrode layer has a plurality of second fingerprint identifying electrodes; the wire layer has a plurality of metal wires, and the metal wires are electrically connected to the first and second fingerprint identifying electrode layers; the third covering layer Covering the second fingerprint identification electrode layer and a part of the wire layer.
透過本發明係直接將指紋辨識單元整合設置製造於觸控面板、彩色濾光片 (Color Filter, CF)、薄膜電晶體(Thin-Film Transistor, TFT)、液晶模組(Liquid Crystal Module,LCM)其中任一上,不僅可增加顯示裝置整體設計之彈性,並可令指紋辨識單元因厚度減少進而提升該指紋辨識精度者。Through the invention, the fingerprint identification unit is directly integrated and manufactured on a touch panel, a color filter (CF), a thin film (Thin-Film Transistor, TFT), and a liquid crystal module (LCM). In any of the above, not only the elasticity of the overall design of the display device can be increased, but also the fingerprint identification unit can be improved in thickness due to the thickness reduction.
1‧‧‧指紋辨識單元1‧‧‧Fingerprint identification unit
11‧‧‧第一披覆層11‧‧‧First coating
12‧‧‧第一指紋辨識電極層12‧‧‧First fingerprint identification electrode layer
121‧‧‧第一指紋辨識電極121‧‧‧First fingerprint identification electrode
13‧‧‧第二披覆層13‧‧‧Second coating
14‧‧‧第二指紋辨識電極層14‧‧‧Second fingerprint identification electrode layer
141‧‧‧第二指紋辨識電極141‧‧‧Second fingerprint recognition electrode
15‧‧‧導線層15‧‧‧Wire layer
151‧‧‧金屬導線151‧‧‧Metal wire
16‧‧‧第三披覆層16‧‧‧ Third coating
2‧‧‧基部2‧‧‧ base
21‧‧‧上側21‧‧‧ upper side
22‧‧‧下側22‧‧‧ Lower side
23‧‧‧玻璃基板23‧‧‧ glass substrate
231‧‧‧第一表面231‧‧‧ first surface
2311‧‧‧觸控區2311‧‧‧ touch area
2312‧‧‧非觸控區2312‧‧‧ Non-touch area
232‧‧‧第二表面232‧‧‧ second surface
24‧‧‧觸控電極層24‧‧‧Touch electrode layer
241‧‧‧第一觸控電極241‧‧‧First touch electrode
242‧‧‧第二觸控電極242‧‧‧Second touch electrode
243‧‧‧金屬走線243‧‧‧Metal routing
25‧‧‧第一絕緣層25‧‧‧First insulation
26‧‧‧第二絕緣層26‧‧‧Second insulation
27‧‧‧第一觸控電極層27‧‧‧First touch electrode layer
28‧‧‧第二觸控電極層28‧‧‧Second touch electrode layer
29‧‧‧金屬走線層29‧‧‧metal trace layer
3‧‧‧遮蔽層3‧‧‧shading layer
第1圖係為本發明之指紋辨識單元之第一實施例之立體分解圖;1 is an exploded perspective view of a first embodiment of a fingerprint recognition unit of the present invention;
第1A圖係為本發明之指紋辨識單元之第一實施例之立體局部放大圖;1A is a perspective partial enlarged view of the first embodiment of the fingerprint identification unit of the present invention;
第1B圖係為本發明之指紋辨識單元之第一實施例之立體局部放大圖;1B is a perspective partial enlarged view of the first embodiment of the fingerprint identification unit of the present invention;
第2圖係為本發明之指紋辨識單元之第一實施例之組合剖視圖;Figure 2 is a cross-sectional view showing the combination of the first embodiment of the fingerprint recognition unit of the present invention;
第3圖係為本發明之指紋辨識單元之第二實施例之組合圖剖視圖;Figure 3 is a sectional view showing a combination of the second embodiment of the fingerprint recognition unit of the present invention;
第4圖係為本發明之指紋辨識單元之第一、二指紋辨識電極示意圖;Figure 4 is a schematic diagram of the first and second fingerprint recognition electrodes of the fingerprint identification unit of the present invention;
第5圖係為本發明之指紋辨識單元之第一、二指紋辨識電極示意圖。Figure 5 is a schematic diagram of the first and second fingerprint recognition electrodes of the fingerprint identification unit of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1、1A、1B、2圖,係為本發明之指紋辨識單元之第一實施例之立體分解及局部放大圖及組合剖視圖,如圖所示,本發明指紋辨識單元1,係形成於一基部2上,所述基部2係為彩色濾光片 (Color Filter,CF)、薄膜電晶體(Thin-Film Transistor, TFT)、液晶模組(Liquid Crystal Module,LCM)、觸控面板其中任一。1 , 1A, 1B, and 2 are a perspective exploded view, a partially enlarged view, and a combined cross-sectional view of a first embodiment of the fingerprint recognition unit of the present invention. As shown in the figure, the fingerprint identification unit 1 of the present invention is formed. On the base 2, the base 2 is a color filter (CF), a thin film transistor (TFT), a liquid crystal module (LCM), and a touch panel. Either.
該基部2具有一上側21及一下側22,本實施例基部2係以觸控面板作為說明實施例,但並不引以為限,所述指紋辨識單元1係選擇設於前述上、下側21、22其中任一,所述觸控面板(基部2)係包含:一玻璃基板23、一觸控電極層24、一第一絕緣層25、一第二絕緣層26、一遮蔽層3;The base portion 2 has an upper side 21 and a lower side 22, and the base portion 2 of the embodiment is a touch panel as an illustrative embodiment, but is not limited thereto, and the fingerprint identification unit 1 is selectively disposed on the upper and lower sides. 21, 22, the touch panel (base 2) comprises: a glass substrate 23, a touch electrode layer 24, a first insulating layer 25, a second insulating layer 26, a shielding layer 3;
所述玻璃基板23具有一第一表面231及一第二表面232並於所述第一表面231定義一觸控區2311及一非觸控區2312,所述非觸控區2312相鄰該觸控區2311,該遮蔽層3選擇設於前述第一、二表面231、232的非觸控區2312其中任一,所述觸控電極層24設於該玻璃基板23之第一表面231之觸控區2311;該觸控電極層24具有複數第一觸控電極241及複數第二觸控電極242及複數金屬走線243,所述第一、二觸控電極241、242係選擇與該等金屬走線243電性連接;所述第一絕緣層25覆蓋前述第一、二觸控電極241、242交接處;所述第二絕緣層26覆蓋前述觸控電極層24及該第一絕緣層25。The glass substrate 23 has a first surface 231 and a second surface 232 and defines a touch area 2311 and a non-touch area 2312 on the first surface 231. The non-touch area 2312 is adjacent to the touch. In the control area 2311, the shielding layer 3 is selected from any of the non-touch areas 2312 of the first and second surfaces 231 and 232, and the touch electrode layer 24 is disposed on the first surface 231 of the glass substrate 23. The control electrode area 2311; the touch electrode layer 24 has a plurality of first touch electrodes 241 and a plurality of second touch electrodes 242 and a plurality of metal traces 243, and the first and second touch electrodes 241 and 242 are selected and The metal traces 243 are electrically connected to each other; the first insulating layer 25 covers the intersection of the first and second touch electrodes 241 and 242; the second insulating layer 26 covers the touch electrode layer 24 and the first insulating layer. 25.
所述指紋辨識單元1,係具有:一第一披覆層11、一第一指紋辨識電極層12、一第二披覆層13、一第二指紋辨識電極層14、一導線層15、一第三披覆層16;The fingerprint identification unit 1 has a first cladding layer 11, a first fingerprint identification electrode layer 12, a second cladding layer 13, a second fingerprint identification electrode layer 14, a wire layer 15, and a Third cladding layer 16;
所述第一披覆層11設於前述觸控面板(基部2)之上、下側21、22其中任一;所述第一指紋辨識電極層12設於該第一披覆層11相反該觸控面板(基部2)之一側,該第一指紋辨識電極層12具有複數第一指紋辨識電極121;所述第二披覆層13覆蓋前述第一指紋辨識電極層12;所述第二指紋辨識電極層14設於該第二披覆層13相反該第一指紋辨識電極層12之一側,該第二指紋辨識電極層14具有複數第二指紋辨識電極141;所述導線層15具有複數金屬導線151,並該等金屬導線151係選擇與前述第一、二指紋辨識電極層12、14電性連接;所述第三披覆層16覆蓋前述第二指紋辨識電極層14及部分導線層15。The first cladding layer 11 is disposed on the touch panel (base portion 2) and on the lower side 21, 22; the first fingerprint recognition electrode layer 12 is disposed on the first cladding layer 11 instead. One side of the touch panel (base 2), the first fingerprint recognition electrode layer 12 has a plurality of first fingerprint recognition electrodes 121; the second cladding layer 13 covers the first fingerprint identification electrode layer 12; The fingerprint identification electrode layer 14 is disposed on one side of the second cladding layer 13 opposite to the first fingerprint recognition electrode layer 12, and the second fingerprint recognition electrode layer 14 has a plurality of second fingerprint recognition electrodes 141; the wire layer 15 has a plurality of metal wires 151, and the metal wires 151 are selectively electrically connected to the first and second fingerprint electrode layers 12 and 14; the third cladding layer 16 covers the second fingerprint electrode layer 14 and a portion of the wires Layer 15.
本發明主要係改善傳統習知指紋辨識單元僅能獨立製造於矽晶圓上後再與觸控面板或其他裝置整合一體進行指紋辨識功能之缺失。The invention mainly improves the conventional fingerprint identification unit which can be independently manufactured on the silicon wafer and then integrated with the touch panel or other devices to perform the fingerprint identification function.
請參閱第3圖,係為本發明之指紋辨識單元之第二實施例之組合圖剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於本實施例之所述觸控面板(基部2),係包含:一玻璃基板23、一第一觸控電極層27、一第一絕緣層25、一第二觸控電極層28、一第二絕緣層26、一金屬走線層29、一遮蔽層3;Referring to FIG. 3, it is a sectional view of a combination of the second embodiment of the fingerprint identification unit of the present invention. As shown in the figure, the structural features of the embodiment are the same as those of the first embodiment, and therefore will not be The first embodiment differs from the first embodiment in that the touch panel (base 2) of the embodiment includes a glass substrate 23, a first touch electrode layer 27, and a first An insulating layer 25, a second touch electrode layer 28, a second insulating layer 26, a metal trace layer 29, a shielding layer 3;
所述玻璃基板23具有一第一表面231及一第二表面232並於所述第一表面231定義一觸控區2311及一非觸控區2312,所述非觸控區2312相鄰該觸控區2311,該遮蔽層3選擇設於前述第一、二表面231、232的非觸控區2312其中任一;所述第一觸控電極層27設於該玻璃基板23之第二表面232,該第一觸控電極層27具有複數第一觸控電極271;所述第一絕緣層25覆蓋前述第一觸控電極層27;所述第二觸控電極層28設於該第一絕緣層25相反該第一觸控電極層27的一側,該第二觸控電極層28具有複數第二觸控電極281;所述第二絕緣層26覆蓋前述第二觸控電極層28;所述金屬走線層29係選擇與前述第一、二觸控電極層27、28電性連接。The glass substrate 23 has a first surface 231 and a second surface 232 and defines a touch area 2311 and a non-touch area 2312 on the first surface 231. The non-touch area 2312 is adjacent to the touch. In the control area 2311, the shielding layer 3 is selected from any one of the non-touch areas 2312 of the first and second surfaces 231 and 232; the first touch electrode layer 27 is disposed on the second surface 232 of the glass substrate 23. The first touch electrode layer 27 has a plurality of first touch electrodes 271; the first insulating layer 25 covers the first touch electrode layer 27; the second touch electrode layer 28 is disposed on the first insulating layer The layer 25 is opposite to one side of the first touch electrode layer 27, the second touch electrode layer 28 has a plurality of second touch electrodes 281; the second insulating layer 26 covers the second touch electrode layer 28; The metal trace layer 29 is selectively electrically connected to the first and second touch electrode layers 27 and 28 .
本發明之第一、二實施例中所述第一、二、三披覆層11、13、16係為二氧化矽薄膜,並由該二氧化矽薄膜提升整體各層沈積時之附著性;並該等第一、二指紋辨識電極12、14係可呈圓形、方形、三角形、梯形其中任一幾何圖形。In the first and second embodiments of the present invention, the first, second, and third cladding layers 11, 13, 16 are ruthenium dioxide films, and the adhesion of the entire layers is improved by the ruthenium dioxide film; The first and second fingerprint identifying electrodes 12, 14 can be any geometric shape of a circle, a square, a triangle, and a trapezoid.
請參閱第4圖,係為本發明之指紋辨識單元之第一、二指紋辨識電極示意圖,如圖所示該等第一指紋辨識電極12相互連結,該等第二指紋辨識電極14相互連結,並該等第一、二指紋辨識電極之面積係為20um 2~50 um 2;該等第一指紋辨識電極12沿(參閱第1圖之該基部2)縱向延伸,該等第一指紋辨識電極12之間間距12a為10um~40um,該等第一指紋辨識電極12之間間距最佳值為38 um;該等第二指紋辨識電極14沿(參閱第1圖之該基部2)橫向延伸,該等第二指紋辨識電極14之間間距14a為10um~40um,該等第二指紋辨識電極之間間距最佳值為38 um;及該等第一、二指紋辨識電極12、14係為透明電極。 Please refer to FIG. 4 , which is a schematic diagram of the first and second fingerprint recognition electrodes of the fingerprint identification unit of the present invention. As shown, the first fingerprint recognition electrodes 12 are connected to each other, and the second fingerprint recognition electrodes 14 are connected to each other. And the first and second fingerprint recognition electrodes have an area of 20 um 2 to 50 um 2 ; the first fingerprint recognition electrodes 12 extend longitudinally (refer to the base 2 of FIG. 1 ), and the first fingerprint recognition electrodes The spacing 12a between 12 is 10um~40um, and the optimal spacing between the first fingerprint identifying electrodes 12 is 38um; the second fingerprint identifying electrodes 14 extend laterally along the base 2 (see the base 2 of FIG. 1). The spacing 14a between the second fingerprint recognition electrodes 14 is 10 um to 40 um, and the optimal spacing between the second fingerprint recognition electrodes is 38 um; and the first and second fingerprint recognition electrodes 12 and 14 are transparent. electrode.
請參閱第5圖,係為本發明之指紋辨識單元之第一、二指紋辨識電極另一示意圖,如圖所示,該等第一指紋辨識電極12之橫向寬度係為10 um~30um,該等第二指紋辨識電極縱向寬度係為10 um~30um,該等第一指紋辨識電極12與該等第二指紋辨識電極14相互對應設置之處橫12b向寬度係為10 um。Please refer to FIG. 5 , which is another schematic diagram of the first and second fingerprint recognition electrodes of the fingerprint identification unit of the present invention. As shown in the figure, the lateral width of the first fingerprint recognition electrodes 12 is 10 um~30 um. The second fingerprint identification electrode has a longitudinal width of 10 um~30 um, and the first fingerprint recognition electrode 12 and the second fingerprint recognition electrode 14 are disposed corresponding to each other at a width of 12 um to a width of 10 um.
本發明之指紋辨識單元1主要係透過直接製造整合於欲設置之觸控面板或其他顯示裝置之元件上,以薄型化該指紋辨識單元之整體厚度,並省去以矽基板做為基底材料使用,進而提升該電容感應量提升整體指紋辨識之精度。The fingerprint identification unit 1 of the present invention mainly thins the overall thickness of the fingerprint recognition unit by directly manufacturing components integrated on the touch panel or other display device to be disposed, and omits the use of the germanium substrate as a base material. In turn, the capacitance sensing amount is improved to improve the accuracy of the overall fingerprint identification.
本發明之指紋辨識單元1主要係先於該觸控面板(基部2)欲設置該指紋辨識單元1之處或平面上,以沈積鍍膜之方式先沈積一層二氧化矽薄膜形成該第一披覆層11作為增加附著率使用的基底層,其後再沈積一層可作為指紋辨識感應電極使用之材料的薄膜於該第一披覆層11上,並再透過黃光蝕刻之方式將該等第一指紋辨識電極121完整布置於該第一披覆層11上並形成部分與該等第一指紋辨識電極121電性連接之複數金屬導線151,其後再沈積一層二氧化矽薄膜覆蓋前述已成形的該等第一指紋辨識電極121上,形成一作為絕緣使用的第二披覆層13,並再於該第二披覆層13上沈積一層可作為指紋辨識感應電極使用之材料的薄膜於該第二披覆層13上,並再透過黃光蝕刻之方式將該等第二指紋辨識電極141完整布置於該第二披覆層13上,並形成部分與該等第二指紋辨識電極141電性連接之複數金屬導線151,最後再沈積一層二氧化矽薄膜覆蓋前述已成形的該等第二指紋辨識電極141及該等金屬導線151上作為封裝絕緣使用的第第三披覆層16。The fingerprint identification unit 1 of the present invention is mainly formed by depositing a layer of ruthenium dioxide film on the surface or the plane of the touch panel (the base 2) to form the first identification layer. The layer 11 is used as a base layer for increasing the adhesion rate, and then a film which can be used as a material for the fingerprint identification sensing electrode is deposited on the first cladding layer 11 and then firstly etched by yellow etching. The fingerprint identification electrode 121 is completely disposed on the first cladding layer 11 and forms a plurality of metal wires 151 electrically connected to the first fingerprint recognition electrodes 121, and then a layer of ruthenium dioxide film is deposited to cover the formed shape. Forming a second cladding layer 13 as an insulating layer on the first fingerprint identifying electrode 121, and depositing a film on the second cladding layer 13 as a material for use as a fingerprint sensing electrode. The second fingerprinting electrodes 141 are completely disposed on the second cladding layer 13 by a yellow light etching, and a portion and the second fingerprint recognition electrodes 141 are formed. Such second fingerprint electrode 151 connected to a plurality of metal wires, and finally depositing a layer of silicon dioxide covering the film 141 has been formed in the first and the third cladding layer 16 is used as the insulating package 151 such metal wire.
透過本發明之指紋辨識單元1係可將指紋辨識單元1設置於任何想設置之處,並無須再透過以矽晶圓作為底材不僅大幅節省製造成本,更可薄型化該指紋辨識單元1,以及縮減該等感應電極之間間距,藉此提升該指紋辨識之精度。Through the fingerprint recognition unit 1 of the present invention, the fingerprint recognition unit 1 can be disposed at any place where it is desired to be installed, and it is not necessary to further reduce the manufacturing cost by using the silicon wafer as a substrate, and the fingerprint identification unit 1 can be thinned. And reducing the spacing between the sensing electrodes, thereby improving the accuracy of the fingerprint identification.
1‧‧‧指紋辨識單元 1‧‧‧Fingerprint identification unit
11‧‧‧第一披覆層 11‧‧‧First coating
12‧‧‧第一指紋辨識電極層 12‧‧‧First fingerprint identification electrode layer
121‧‧‧第一指紋辨識電極 121‧‧‧First fingerprint identification electrode
13‧‧‧第二披覆層 13‧‧‧Second coating
14‧‧‧第二指紋辨識電極層 14‧‧‧Second fingerprint identification electrode layer
141‧‧‧第二指紋辨識電極 141‧‧‧Second fingerprint recognition electrode
15‧‧‧導線層 15‧‧‧Wire layer
151‧‧‧金屬導線 151‧‧‧Metal wire
16‧‧‧第三披覆層 16‧‧‧ Third coating
2‧‧‧基部 2‧‧‧ base
21‧‧‧上側 21‧‧‧ upper side
22‧‧‧下側 22‧‧‧ Lower side
23‧‧‧玻璃基板 23‧‧‧ glass substrate
231‧‧‧第一表面 231‧‧‧ first surface
2311‧‧‧觸控區 2311‧‧‧ touch area
2312‧‧‧非觸控區 2312‧‧‧ Non-touch area
232‧‧‧第二表面 232‧‧‧ second surface
24‧‧‧觸控電極層 24‧‧‧Touch electrode layer
241‧‧‧第一觸控電極 241‧‧‧First touch electrode
242‧‧‧第二觸控電極 242‧‧‧Second touch electrode
243‧‧‧金屬走線 243‧‧‧Metal routing
25‧‧‧第一絕緣層 25‧‧‧First insulation
26‧‧‧第二絕緣層 26‧‧‧Second insulation
3‧‧‧遮蔽層 3‧‧‧shading layer
Claims (9)
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| TW104136395A TWI566187B (en) | 2015-11-04 | 2015-11-04 | Fingerprint identification unit |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201229852A (en) * | 2010-10-18 | 2012-07-16 | Qualcomm Mems Technologies Inc | Controller architecture for combination touch, handwriting and fingerprint sensor |
| TWM498326U (en) * | 2014-10-03 | 2015-04-01 | Superc Touch Corp | Display device capable of both fingerprint identification and touch detection |
| TWM508720U (en) * | 2015-06-18 | 2015-09-11 | Tpk Touch Solutions Inc | Touch panel |
| US20150268754A1 (en) * | 2014-03-19 | 2015-09-24 | Bidirectional Display Inc. | Image sensor panel and method for capturing graphical information using same |
| TW201539234A (en) * | 2014-04-10 | 2015-10-16 | Kuo-Ching Chiang | Security method for an electronic device |
| TWM517371U (en) * | 2015-11-04 | 2016-02-11 | 關鍵應用科技股份有限公司 | Fingerprint identification unit |
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| TW201229852A (en) * | 2010-10-18 | 2012-07-16 | Qualcomm Mems Technologies Inc | Controller architecture for combination touch, handwriting and fingerprint sensor |
| US20150268754A1 (en) * | 2014-03-19 | 2015-09-24 | Bidirectional Display Inc. | Image sensor panel and method for capturing graphical information using same |
| TW201539234A (en) * | 2014-04-10 | 2015-10-16 | Kuo-Ching Chiang | Security method for an electronic device |
| TWM498326U (en) * | 2014-10-03 | 2015-04-01 | Superc Touch Corp | Display device capable of both fingerprint identification and touch detection |
| TWM508720U (en) * | 2015-06-18 | 2015-09-11 | Tpk Touch Solutions Inc | Touch panel |
| TWM517371U (en) * | 2015-11-04 | 2016-02-11 | 關鍵應用科技股份有限公司 | Fingerprint identification unit |
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