TWI566073B - Power-supply apparatus - Google Patents

Description

Power supply unit

The present invention relates to a power supply device, and more particularly to an internal structure of a power supply device.

1 is an internal structure of a typical power supply device. The main power circuit 100 is shown by a broken line in FIG. 1, and it can be seen that most of the main power devices (such as power semiconductor devices and magnetic components) are distributed and directly mounted on the main power circuit 100. The main board, and the main power device requires a special heat sink to dissipate heat. At present, for high-power applications, one of the conventional solutions for power supply devices is realized by series-parallel connection of a plurality of main power devices, such as paralleling a plurality of in-line power tubes, and serially arranging a plurality of magnetic components for expansion. Another solution is to expand a certain number of power supply units in parallel. Although this solution is flexible, it requires multiple sets of control lines. Both solutions face shortcomings such as low power density, low efficiency, and complex production.

As the power level of the device continues to increase and the size of the device shrinks, the output power and power density of the single power supply are required to increase. Traditional in-line main power devices and packages are not capable of achieving high power density requirements. Therefore, the relevant fields do not bother to find a solution, but the way that has not been applied for a long time has been developed. Therefore, how to solve the above problems is one of the current important research and development topics, and it has become the goal of improvement in the relevant fields.

An aspect of the present invention is to provide a power supply device to solve the problems of the prior art.

A power supply device provided by the present invention includes a main board, a power module unit and a control unit. The power module unit includes a printed circuit board and a power device. The power device is concentrated on the printed circuit board, and the printed circuit board is vertically inserted on the main board. The control unit is separately provided from the power module unit, and the control unit is used to control the power module unit.

In an embodiment, the number of power module units is a single one.

In an embodiment, the number of power module units is plural.

In an embodiment, the control unit performs centralized control of at least two of the plurality of power module units.

In an embodiment, the number of control units is multiple, and the number of the power module units is multiple, and each control unit performs centralized control on at least two of the plurality of power module units.

In one embodiment, the power device includes a power semiconductor device and a magnetic member.

In one embodiment, the magnetic components are transformers and inductors.

In one embodiment, the magnetic component is integrated on the printed circuit board, and the magnetic component is a planar magnetic component that uses the trace of the printed circuit board as a winding.

In one embodiment, the magnetic components are individually designed and mounted on a printed circuit board.

In an embodiment, the power supply device further includes a driver, a sampling chip, a buffer component, or a reverse current circuit, and the like, distributed on the printed circuit board.

In an embodiment, the power supply device further includes a driver, a sampling chip, a buffer component, or a reverse current circuit, and the like, and is distributed on the main board.

In an embodiment, the control unit is a control board, and the control board is vertically inserted on the main board.

In an embodiment, the control unit is a control circuit, and the control circuit is formed in an area of the main board.

In one embodiment, the control unit is a control board, the control board is disposed on the plurality of power module units, and the control board spans and is perpendicular to the plurality of power module units.

In another aspect, another power supply device provided by the present invention includes a main board, a plurality of power module units, and a plurality of control units. Each of the power module units includes a printed circuit board and a power device. The power devices are concentrated on the printed circuit board. The printed circuit board is vertically inserted on the main board, and the plurality of control units and the power module unit are separately disposed on the main board. Each control unit performs centralized control of at least two of the plurality of power module units.

In one embodiment, the power device includes a power semiconductor device and a magnetic member.

In one embodiment, the power semiconductor device is a chip device that is planarly attached to the printed circuit board.

In an embodiment, the magnetic component is a transformer or an inductor.

In one embodiment, the magnetic component is integrated on the printed circuit board, and the magnetic component is a planar magnetic component that uses the trace of the printed circuit board as a winding.

In one embodiment, the magnetic components are individually designed and mounted on the printed circuit board.

In an embodiment, the power supply device further includes a driver, a sampling chip, a buffer component, or a reverse current circuit, and the like, distributed on the printed circuit board.

In an embodiment, the power supply device further includes a driver, a sampling chip, a buffer component, or a reverse current circuit, and the like, and is distributed on the main board.

In an embodiment, the control unit is a control board, and the control board is vertically inserted on the main board.

In summary, the technical solution of the present invention has obvious advantages and beneficial effects compared with the prior art. Through the above technical solutions, considerable technological progress can be achieved, and the industrial use value is widely used. The invention proposes a concept of a main power modular design using centralized control, that is, a patch device and a flat magnetic technology are used to modularize a main power circuit in a power supply device to form a power module unit, the power module unit being vertically The power module is mounted in the power supply unit, and the control unit in the power unit controls the power module unit to output the required voltage. In the case of high power, the output power can be increased by parallel connection of multiple power module units, and the number of power module units connected in parallel can be changed to achieve different power level requirements, and multiple power module units share independent control. The unit is used for voltage regulation or regulation, thus greatly improving power density and design flexibility. The use of such modularity can also greatly shorten the product development cycle.

The above description will be described in detail in the following embodiments, and further explanation of the technical solutions of the present invention will be provided.

In order to make the description of the present invention more complete and complete, reference is made to the accompanying drawings and the accompanying drawings. On the other hand, well-known elements and steps are not described in the embodiments to avoid unnecessarily limiting the invention.

2 is a top plan view of a power supply device 200 in accordance with an embodiment of the present invention. As shown in FIG. 2, the power supply device 200 includes a main board 210, a power module unit 220, and a control unit 230. The power module unit 220 includes a main power device required by the power supply device 200, that is, the main power circuit 100 shown in FIG. 1 is modularized to form the power module unit 220 in the power supply device 200. The power module unit 220 is vertically inserted on the main board 210, and the control unit 230 controls the power module unit 220 to output the required power. With the power supply device of the above structure, replacing the original distributed main power circuit 100 (such as FIG. 1) with the power module unit 220 vertically inserted in the main board 210 can not only reduce the volume occupied by the main power circuit, but also improve the power density. Increase design flexibility and shorten product development cycles.

As shown in FIG. 2, the power module unit 220 includes a power device 222 and a printed circuit board 221. The power device 222 includes a magnetic member 223 (e.g., transformer T1 or inductor L) and a power semiconductor device 225 that is disposed as a main power device on the printed circuit board 221. Structurally, the control unit 230 and the power module unit 220 are separately disposed on the main board 210, and the power module unit 220 is vertically inserted on the main board 210. In use, the control unit 230 is used to control the power module unit 220, whereby the power supply device 200 can output the required power.

In a high-power application, the power outputted by the power supply device 200 can be increased by parallel connection of the plurality of power module units 220, and the number of power module units 220 connected in parallel can be changed to achieve different power level requirements, and then controlled. Unit 230 performs centralized control, which greatly increases power density and design flexibility. As shown in FIG. 2, the control unit 230 can be a control board. The control board is electrically connected to the power module unit 220. The control board and the power module unit 220 are vertically inserted on the main board 210, and the control board can be connected with the power module. The units 220 are arranged in parallel with each other, and the number of the power module units 220 is two, but the actual application is not limited thereto, and the two power module units 220 are vertically inserted on the main board 210 and the two power module units 220 share independent The control unit 230 performs voltage regulation or current regulation to output the required power. In other embodiments, the number of power module units 220 may also be a single one. The control unit 230 independently controls the power module unit 220, and those skilled in the art should select an elastic selection at that time.

In practical applications, those skilled in the art can select more power module units to be used in parallel according to the required power level, and the number of the control units 230 can also be multiple (as shown in FIG. 3). The main difference between the power supply device 200' in FIG. 3 and the power supply device 200 in FIG. 2 is that, in structure, the number of control units 230 in FIG. 3 is plural, and the number of power module units 220 is also multiplied and paralleled to each other to expand. . In use, each control unit 230 centrally controls at least two of the plurality of power module units 220.

In addition, the position of the control unit 230 is not limited to that shown in FIG. 3, and those skilled in the art can flexibly place the control unit 230 according to actual needs. For example, the control unit 230 can be respectively placed on both sides of the power module units.

In addition, the control unit 230 in FIGS. 2 and 3 is a control board, and the control board is vertically inserted on the main board. In a practical application, the control unit 230 can be a control circuit disposed in an area of the main board 210, that is, a device of the control circuit is disposed on the main board 210 and electrically connected to the power module unit 220; the control unit 230 can be perpendicular to the power. A control board of the module unit, the control board spanning the power module unit and electrically connected to the power module unit 220. Those skilled in the art can arbitrarily select the type and location of the control unit 230 according to actual needs.

In FIG. 2 and FIG. 3, the power supply device further includes sampling, drivers, and the like required by the power module unit 220. The devices are disposed on the printed circuit board 221, and further, there are some peripheral circuits in the power supply device, and the devices of the circuits are disposed on the motherboard. On the 210, for example, fuses, EMI filters, anti-reverse circuits, Hold-up capacitors, and auxiliary power supplies provide protection and auxiliary power supply for the power module unit. In another embodiment, devices such as samples, drivers, etc. may also be disposed on the motherboard 210, and devices of the peripheral circuitry may also be disposed on the printed circuit board 221. Those skilled in the art can flexibly select according to actual needs.

4 is a structural diagram of a power module unit applied to an embodiment of the present invention. The power module unit 220 includes a main power device and a printed circuit board 221. The main power devices, that is, the power semiconductor device 225 (eg, switches S1 - S6) and the magnetic components (eg, transformer T1, inductor L) are disposed on the printed circuit board 221. The printed circuit board 221 further includes input terminals a, b and output terminals c, d. The printed circuit board 221 is electrically connected to the main board 210 through the input terminals a, b and the output terminals c, d, and is mechanically fixed to the main board 210, but is not limited thereto. Thus, the printed circuit board 221 can also achieve the same function by an additional metal terminal or the like. Figure 4 shows only the two terminals a, b and c, d for transmitting the power signal, but in practice, there are other terminals for transmitting power signals or control signals, which will not be described in detail herein.

In one embodiment, the power semiconductor devices S1 - S6 can be patch devices that are affixed to the printed circuit board 221. In an embodiment, the printed circuit board 221 is further provided with an input capacitor Cin, an output capacitor Co, a current transformer CT, a driver 510, a snubber 520, and a sampling chip, a reverse current circuit (for example, an ORing circuit). ), or other circuits are placed on the motherboard. In another embodiment, the input capacitor Cin, the output capacitor Co, the current transformer CT, the driver 510, the snubber 520, and the like may be disposed on the main board 210, and the sampling chip and the anti-reverse current circuit (for example, an ORing circuit) ) or other circuits may also be disposed on the printed circuit board 221.

In one embodiment, the magnetic component is integrated on the printed circuit board 221, and the trace of the printed circuit board 221 is used as the winding of the transformer T1 and the inductor L to form a PCB winding plane transformer or inductor. As shown in FIG. 5, the magnetic components (for example, the transformer T and the inductor L) are all disposed on the printed circuit board 221 in a flat PCB winding structure, thereby reducing the volume of the device.

In another embodiment, the magnetic members can also be individually designed and mounted on the printed circuit board 221. As shown in FIG. 6, the inductor L is a conventional wound structure, and the transformer T1 is a flat magnetic structure in which a winding of another printed circuit board 740 is used as a winding, and the two are mounted on the printed circuit board 221. In other embodiments, transformer T1 and inductor L may be integrated on another printed circuit board that is then mounted to printed circuit board 221. However, the position of the magnetic member is not limited thereto, and any person skilled in the art can change the position of the magnetic member according to actual needs, thereby increasing design flexibility.

FIG. 7 is a schematic circuit diagram of an implementation of the power module unit 220 of FIG. Structurally, the main power circuit includes an input capacitor Cin, an output capacitor Co, a current transformer CT, power semiconductor devices S1 - S6, a magnetic member (eg, transformer T1, inductor L), a buffer assembly 520, and a driver 510. The control unit 230 is electrically connected to the two drivers 510 of the power module unit 220. The two drivers 510 are electrically connected to the power semiconductor switches S1–S4 on the primary side and the power semiconductor switches S5–S6 on the secondary side, respectively, and the input capacitor Cin and the current. The transformer CT is electrically connected to the power semiconductor switches S1 - S4 , the inductor L and the output capacitor Co are electrically connected to the secondary side of the transformer T1 , and the buffer component 520 is electrically connected to the transformer T1 . In use, the input terminals a, b of the main power circuit receive the input voltages Vin+, Vin-, the control unit 230 outputs a control signal according to the state of the main power circuit, and the driver 510 drives the opening and closing of the power semiconductor switches S1 - S6 according to the control signal. The output voltages Vo+, Vo- are output to the output terminals c, d.

Although the main power circuit of FIG. 7 is an isolated full-bridge circuit, this is not limited thereto. In practice, the main power circuit may also be an isolated half-bridge circuit or an isolated non-bridge circuit (eg, a flyback converter). , forward circuits, etc.) and non-isolated circuits (such as buck circuits, boost circuits, etc.), those skilled in the art should consider the need for flexible selection at that time.

In addition, the control unit 230 mentioned in FIG. 2 to FIG. 7 and the power module unit 220 are electrically exchanged directly or directly through the main board 210 to implement closed loop or open loop control. The specific implementation of the control unit 230 can be an analog control circuit or a digital control circuit. Those skilled in the art will flexibly select a specific embodiment of the control unit 230 as needed at the time.

It should be noted that the parallel connection of the plurality of power module units 220 mentioned in the above embodiments may refer to the input terminals (a, b end) of the plurality of power module units 220 being parallel and the output terminals of the plurality of power module units 220 ( c, d end) parallel, to achieve the effect of expansion. However, the practical application is not limited thereto, and the plurality of power module units 220 may be connected in series or in parallel through input terminals, and the output terminals may be connected in series or in parallel to achieve capacity expansion. Those skilled in the art should consider the need for flexible selection at the time.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.
100‧‧‧ main power circuit
200, 200'‧‧‧ power supply unit
210‧‧‧ motherboard
220‧‧‧Power Module Unit
230‧‧‧Control unit
221, 740‧‧‧ Printed circuit boards
222‧‧‧Power devices
223‧‧‧ Magnetic parts
225‧‧‧Power semiconductor devices
510‧‧‧ drive
520‧‧‧buffer components
Cin‧‧‧ input capacitor
Co‧‧‧ output capacitor
CT‧‧‧current transformer
S1–S6‧‧‧Power semiconductor switch
T1‧‧‧ transformer
L‧‧‧Inductors
Vin+, Vin-, Vo+, Vo-‧‧‧ voltage
a, b‧‧‧ input terminals
c, d‧‧‧ output terminal

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; FIG. 3 is a plan view of a power supply device according to another embodiment of the present invention; FIG. 4 is a structural view of a power module unit according to an embodiment of the present invention; 5 is a structural diagram of a power module unit according to another embodiment of the present invention; FIG. 6 is a structural diagram of a power module unit according to an embodiment of the present invention; FIG. 7 is mainly a main power circuit of the power module unit of FIG. Circuit diagram.

200‧‧‧Power supply unit

210‧‧‧ motherboard

220‧‧‧Power Module Unit

230‧‧‧Control unit

221‧‧‧Printed circuit board

222‧‧‧Power devices

223‧‧‧ Magnetic parts

225‧‧‧Power semiconductor devices

Claims (23)

A power supply device comprising: a main board; a power module unit formed by modularizing a main power circuit, comprising a printed circuit board and a power device, the power device being disposed on the printed circuit board, the power module unit being vertical Plugged into the motherboard; and a control unit disposed separately from the power module unit for controlling the power module unit. The power supply unit according to claim 1, wherein the number of the power module units is a single one. The power supply device according to claim 1, wherein the number of the power module units is plural. The power supply device of claim 3, wherein the control unit performs centralized control of at least two of the plurality of power module units. The power supply device of claim 1, wherein the number of the control units is plural, and the number of the power module units is plural, and each of the control units performs centralized control on at least two of the plurality of power module units. The power supply device of claim 1, the power device comprising a power semiconductor device and a magnetic member. The power supply device of claim 6, the magnetic component being a transformer or an inductor. The power supply device according to claim 6, wherein the magnetic member is integrally designed on the printed circuit board, and the magnetic member is a planar magnetic member having a winding of the printed circuit board as a winding. The power supply device of claim 6, wherein the magnetic member is separately designed and mounted on the printed circuit board. The power supply device of claim 1, further comprising: a driver, a sampling chip, a buffer component or a reverse current circuit, disposed on the printed circuit board. The power supply device of claim 1, further comprising: a driver, a sampling chip, a buffer component or a reverse current circuit disposed on the motherboard. The power supply device of claim 1, wherein the control unit is a control board that is vertically inserted on the main board. The power supply device of claim 1, wherein the control unit is a control circuit disposed in an area of the main board. The power supply device of claim 3, wherein the control unit is a control board, the control board is disposed on the plurality of power module units, and the The control board spans and is perpendicular to the plurality of power module units. A power supply device comprising: a main board; a plurality of power module units, each power module unit being formed by a main power circuit modular, comprising a printed circuit board and a power device, wherein the power device is disposed on the printed circuit board The plurality of power module units are vertically inserted on the main board; and a plurality of control units are disposed on the main board separately from the power module unit, wherein each of the control units is at least the plurality of power module units Both are centrally controlled. The power supply device of claim 15, the power device comprising a power semiconductor device and a magnetic component. The power supply device of claim 16, wherein the power semiconductor device is a chip device that is flat on the printed circuit board. The power supply device of claim 16, wherein the magnetic component is a transformer or an inductor. The power supply device according to claim 16, wherein the magnetic member is integrally designed on the printed circuit board, and the magnetic member is a planar magnetic member having a winding of the printed circuit board as a winding. The power supply device of claim 16, wherein the magnetic member is separate It is then mounted on the printed circuit board after design. The power supply device of claim 15, further comprising: a driver, a sampling chip, a buffer component or a reverse current circuit disposed on the printed circuit board. The power supply device of claim 15, further comprising: a driver, a sampling chip, a buffer component or a reverse current circuit disposed on the motherboard. The power supply device of claim 15, wherein the control unit is a control board that is vertically inserted on the main board.