TWI564114B - Subtle vortex polishing apparatus - Google Patents
Subtle vortex polishing apparatus Download PDFInfo
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- TWI564114B TWI564114B TW101147958A TW101147958A TWI564114B TW I564114 B TWI564114 B TW I564114B TW 101147958 A TW101147958 A TW 101147958A TW 101147958 A TW101147958 A TW 101147958A TW I564114 B TWI564114 B TW I564114B
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- polishing device
- composite fine
- container body
- power supply
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- 238000005498 polishing Methods 0.000 title claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 21
- 238000000227 grinding Methods 0.000 claims description 21
- 238000013019 agitation Methods 0.000 claims description 17
- 239000002131 composite material Substances 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 10
- 238000012545 processing Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005111 flow chemistry technique Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本發明是有關於一種複合精微渦流研拋裝置,尤指一種可使流體磨料產生渦流磨擦該待研拋工件,使待研拋工件一次性完成去毛刺、拋光以及倒角,以提升待研拋工件內外表面之研磨效果,進而可應用於微小、內孔、夾縫、弧面、複雜曲面...等加工困難之處,而達到易於操作、可同時加工單面或多面、提升加工速率、大幅度減輕勞動強度、降低加工成本以及提高生產率之功效者。 The invention relates to a composite fine vortex grinding and polishing device, in particular to a method for causing a fluid abrasive to generate eddy currents to rub the workpiece to be polished, and to perform deburring, polishing and chamfering of the workpiece to be polished in one time, so as to enhance the to-be-casting. The grinding effect of the inner and outer surfaces of the workpiece can be applied to machining difficulties such as small, inner hole, crevice, curved surface, complex curved surface, etc., and it is easy to operate, can process single or multi-sided at the same time, and increase the processing rate and large The effect of reducing labor intensity, reducing processing costs, and increasing productivity.
按,一般習用者如日本大森整等五人於2002年發明專利,曾探討無金屬黏合研磨石及電解修整研磨方法及其裝置,其係利用磨粒與保持磨粒之含碳非金屬材之結合部,以電解作用,達良好加工能率,而獲得良好加工之效果。 According to the general practitioners such as Japan’s Omori Rectifier, who invented the patent in 2002, they have explored the metal-free bonded grinding stone and the electrolytic dressing grinding method and apparatus thereof, which utilize the abrasive grains and the carbon-containing non-metal materials that maintain the abrasive grains. The bonding part, by electrolysis, achieves a good processing energy rate, and obtains a good processing effect.
然而上述之加工方法雖可藉由研磨石及電解修整研磨被加工件,而改善工件之表面粗糙度,惟針對微小、內孔、夾縫、弧面、複雜曲面...等外形等不易加工之被加工件表面研拋,其材料去除能力等進給效率與表面粗度技術有待加強。 However, the above-mentioned processing method can improve the surface roughness of the workpiece by grinding the stone and electrolytically grinding the workpiece, but it is difficult to process for a shape such as a minute, an inner hole, a slit, a curved surface, a complicated curved surface, and the like. The feed efficiency and surface roughness techniques of the workpiece surface are to be strengthened.
V.K.Gorana等人曾於2004年在International Journal of Machine Tool & Manufacture,Vol.44,pp.201-211國際期刊,探討以磨料流動加工之擠製壓力、磨料濃度與磨粒粒度對材料去 除量、表面粗糙度、切割力與作動磨粒密度之影響,這些加工參數包括:磨粒粒徑、磨料種類、濃度混合比、加工時間及工件材質,此研究加工方法係藉磨料經由壓力往復運動方式直接對被加工件,產生材料去除與表面粗糙度改善,惟針對精密傳動機構,諸如微小、內孔、夾縫、弧面、複雜曲面...等不易加工之被加工件表面研拋,對材料去除能力等進給效率與表面粗度改善有限。 V.K. Gorana et al., in the International Journal of Machine Tool & Manufacture, Vol. 44, pp. 201-211, in 2004, discussed the extrusion pressure, abrasive concentration and abrasive grain size of abrasive flow processing. In addition to the effects of volume, surface roughness, cutting force and operating abrasive density, these processing parameters include: abrasive particle size, abrasive type, concentration mixing ratio, processing time and workpiece material. This research method is based on the friction of the abrasive through the pressure The movement mode directly improves the material removal and surface roughness of the workpiece, but for the precision transmission mechanism, such as micro, inner hole, crevice, curved surface, complex curved surface, etc. Improvements in feed efficiency and surface roughness are limited for material removal capabilities.
另外V.K.Jain等人曾於2004年在International Journal of Machine Tool & Manufacture,Vol.44,pp.1019-1029國際期刊發表,研發並設計出結合磨粒與電磁流變精拋之加工方式,來探討不同磨料配置對表面粗糙度和材料移除量之影響。進而後續發展使用旋轉磁極帶動磁性磨料轉動,以探討磁極之形狀和轉動速度對表面粗糙度和材料移除量之影響,惟針對複雜外形之螺旋曲面等不易加工之表面材料去除能力與表面精度等技術改善有限。有鑑於此,本案之發明人特針對前述習用發明問題深入探討,並藉由多年從事相關產業之研發與製造經驗,積極尋求解決之道,經過長期努力之研究與發展,終於成功之開發出本發明「複合精微渦流研拋裝置」,藉以改善習用之種種問題。 In addition, VKJain et al. published in the International Journal of Machine Tool & Manufacture, Vol.44, pp.1019-1029 international journal in 2004, developed and designed a processing method combining abrasive particles and electromagnetic rheology polishing. The effect of different abrasive configurations on surface roughness and material removal. Furthermore, the subsequent development uses the rotating magnetic pole to drive the rotation of the magnetic abrasive to investigate the influence of the shape and rotational speed of the magnetic pole on the surface roughness and the amount of material removed, but the surface material removal ability and surface precision, etc., which are difficult to be processed, such as a spiral curved surface of a complicated shape. Technical improvements are limited. In view of this, the inventors of this case have intensively discussed the above-mentioned problems of conventional inventions, and actively pursued solutions through years of experience in R&D and manufacturing of related industries. After long-term efforts in research and development, they have finally succeeded in developing this book. Invented the "composite fine vortex grinding and polishing device" to improve the problems of the conventional use.
本發明之主要目之係在於,可於容置單元中設置待研拋工件及流體磨料,並以傳動單元帶動攪動單元,使流體磨料於容置單元中產生渦流磨擦該待研拋工件,使待研拋工件一次性完成去毛刺、拋光以及倒角,以提升待研拋工件內外表面之研磨效果,進而可應用於微小、內孔、夾縫、弧面、複雜曲面...等加工困難之處 ,而達到易於操作、可同時加工單面或多面、提升加工速率、大幅度減輕勞動強度、降低加工成本以及提高生產率之功效。 The main object of the present invention is to provide a workpiece to be polished and a fluid abrasive in the accommodating unit, and drive the agitation unit with the transmission unit to cause the fluid abrasive to generate eddy currents in the accommodating unit to rub the workpiece to be ground and blasted. The workpiece to be polished and polished is subjected to deburring, polishing and chamfering at one time to improve the grinding effect of the inner and outer surfaces of the workpiece to be polished, and thus can be applied to small, inner holes, crevices, curved surfaces, complicated curved surfaces, etc. At It is easy to operate, can process single or multi-face at the same time, increase processing speed, greatly reduce labor intensity, reduce processing cost and improve productivity.
為達上述之目之,本發明係一種複合精微渦流研拋裝置,其包含有:一容置單元;一活動設於容置單元中之攪動單元;以及一與攪動單元連接之傳動單元。 In order to achieve the above object, the present invention is a composite fine vortex grinding and polishing device comprising: a receiving unit; an agitating unit movable in the accommodating unit; and a transmission unit connected to the agitation unit.
於本發明之一實施例中,該容置單元係包含至少具有一容置區之容器本體、一設於容器本體底部之承載部、一活動結合於容器本體一端之上蓋、一設於上蓋頂面之置放區、及一設於上蓋頂面且封閉置放區之蓋板,而該傳動單元係設置於上蓋之置放區中,且該攪動單元係穿過上蓋與傳動單元連接。 In an embodiment of the present invention, the accommodating unit comprises a container body having at least one accommodating area, a bearing portion disposed at the bottom of the container body, a movable cover coupled to the upper end of the container body, and a top cover And a cover plate disposed on the top surface of the upper cover and closing the placement area, wherein the transmission unit is disposed in the placement area of the upper cover, and the agitation unit is connected to the transmission unit through the upper cover.
於本發明之一實施例中,該容器本體係呈一圓筒狀。 In one embodiment of the invention, the container system has a cylindrical shape.
於本發明之一實施例中,該容器本體之容置區中係注入有流體磨料。 In an embodiment of the invention, the container body is filled with a fluid abrasive in the accommodating area.
於本發明之一實施例中,該容器本體之承載部上係可設置待研拋工件。 In an embodiment of the invention, the workpiece on the container body can be provided with a workpiece to be polished.
於本發明之一實施例中,該攪動單元係包含有一與傳動單元連接之軸體、及多數設於軸體一端周緣之葉片。 In an embodiment of the invention, the agitation unit includes a shaft body coupled to the transmission unit, and a plurality of blades disposed on a periphery of one end of the shaft body.
於本發明之一實施例中,該傳動單元係包含有一與攪動單元連接之致動元件、一與致動元件連接之電源部、及一連接致動單元與電源部之開關。 In an embodiment of the invention, the transmission unit includes an actuating element coupled to the agitation unit, a power supply unit coupled to the actuating element, and a switch connecting the actuating unit and the power supply unit.
於本發明之一實施例中,該致動元件係為馬達。 In an embodiment of the invention, the actuating element is a motor.
於本發明之一實施例中,該電源部係為電池、充電電池或連接市電之插頭。 In an embodiment of the invention, the power supply unit is a battery, a rechargeable battery, or a plug connected to a commercial power supply.
於本發明之一實施例中,該傳動單元更進一步包含有一連接致動元件與開關之計時器、及一連接計時器與電源部之變頻器。 In an embodiment of the invention, the transmission unit further includes a timer for connecting the actuating element and the switch, and a frequency converter for connecting the timer and the power supply unit.
1‧‧‧容置單元 1‧‧‧ housing unit
11‧‧‧容器本體 11‧‧‧ container body
111‧‧‧容置區 111‧‧‧Receiving area
12‧‧‧承載部 12‧‧‧Loading Department
13‧‧‧上蓋 13‧‧‧Upper cover
14‧‧‧置放區 14‧‧‧Placement area
15‧‧‧蓋板 15‧‧‧ Cover
2‧‧‧攪動單元 2‧‧‧Agitating unit
21‧‧‧軸體 21‧‧‧Axis
22‧‧‧葉片 22‧‧‧ blades
3‧‧‧傳動單元 3‧‧‧Transmission unit
31‧‧‧致動元件 31‧‧‧Actuating element
32‧‧‧電源部 32‧‧‧Power Supply Department
33‧‧‧開關 33‧‧‧ switch
34‧‧‧計時器 34‧‧‧Timer
35‧‧‧變頻器 35‧‧‧Inverter
4‧‧‧待研拋工件 4‧‧‧Study to be thrown
5‧‧‧流體磨料 5‧‧‧ Fluid Abrasives
第1圖,係本發明第一實施例之立體外觀示意圖。 Fig. 1 is a perspective view showing the appearance of a first embodiment of the present invention.
第2圖,係本發明第一實施例之立體分解示意圖。 Fig. 2 is a perspective exploded view showing the first embodiment of the present invention.
第3圖,係本發明第一實施例之使用狀態示意圖。 Fig. 3 is a schematic view showing the state of use of the first embodiment of the present invention.
第4圖,係本發明第二實施例之立體分解示意圖。 Figure 4 is a perspective exploded view of a second embodiment of the present invention.
請參閱『第1、2及第3圖』所示,係分別為本發明第一實施例之立體外觀示意圖、本發明第一實施例之立體分解示意圖及本發明第一實施例之使用狀態示意圖。如圖所示:本發明係一種複合精微渦流研拋裝置,其至少包含有一容置單元1、一攪動單元2以及一傳動單元3所構成。 Please refer to the "1, 2, and 3" drawings, which are schematic perspective views of a first embodiment of the present invention, a perspective exploded view of the first embodiment of the present invention, and a schematic view of the use state of the first embodiment of the present invention. . As shown in the figure, the present invention is a composite fine vortex grinding and polishing device comprising at least one accommodating unit 1, an agitation unit 2 and a transmission unit 3.
上述所提之容置單元1係包含至少具有一容置區111之容器本體11、一設於容器本體11底部之承載部12、一活動結合於容器本體11一端之上蓋13、一設於上蓋13頂面之置放區14、及一設於上蓋13頂面且封閉置放區14之蓋板15,其中該容器本體11係呈一圓筒狀。 The accommodating unit 1 includes a container body 11 having at least one accommodating area 111, a carrying portion 12 disposed at the bottom of the container body 11, a cover 13 movably coupled to one end of the container body 11, and a cover 13 13 The top surface of the placement area 14, and a cover 15 disposed on the top surface of the upper cover 13 and closing the placement area 14, wherein the container body 11 has a cylindrical shape.
該攪動單元2係活動設於容置單元1中,其包含有一軸體21、及多數設於軸體21一端周緣之葉片22,而該攪動單元2係以軸體21係穿過上蓋13而活動設於容器本體11之容置區111中。 The agitation unit 2 is disposed in the accommodating unit 1 and includes a shaft body 21 and a plurality of blades 22 disposed at a periphery of one end of the shaft body 21, and the agitation unit 2 is passed through the upper cover 13 by the shaft body 21 The activity is disposed in the accommodating area 111 of the container body 11.
該傳動單元3係設置於上蓋13之置放區14中且與攪動單元2連接,而該傳動單元3係包含有一與攪動單元2所設軸體21連接之致動元件31、一與致動元件31連接之電源部32、及一連接致動單元31與電源部32之開關33,其中該致動元件31係為馬達,該電源部21係為電池、充電電池或連接市電之插 頭。 The transmission unit 3 is disposed in the placement area 14 of the upper cover 13 and connected to the agitation unit 2, and the transmission unit 3 includes an actuation element 31 coupled to the shaft body 21 provided by the agitation unit 2, and an actuation The power supply unit 32 to which the component 31 is connected, and a switch 33 that connects the actuation unit 31 and the power supply unit 32, wherein the actuation component 31 is a motor, and the power supply unit 21 is a battery, a rechargeable battery or a connection to the mains. head.
當本發明於運用時,係於容器本體11之承載部12上設置待研拋工件4,且將流體磨料5注入容器本體11之容置區111中,之後再開啟傳動單元3之開關33,使致動元件31由電源部32擷取運轉時所需之電力,進而讓致動元件31傳動攪動單元2之軸體21,藉以帶動各葉片22,讓各葉片22攪動流體磨料5產生渦流,使流體磨料5磨擦該待研拋工件4,此時,該待研拋工件4即可利用流體磨料5一次性完成去毛刺、拋光以及倒角,而可應用於微小、內孔、夾縫、弧面、複雜曲面...等加工困難之處,如此,便可提升待研拋工件4內外表面之研磨效果。 When the present invention is applied, the workpiece 4 to be polished is placed on the bearing portion 12 of the container body 11, and the fluid abrasive 5 is injected into the accommodating area 111 of the container body 11, and then the switch 33 of the transmission unit 3 is opened. The actuating element 31 is caused by the power supply unit 32 to extract the electric power required for the operation, and the actuating element 31 is driven to drive the shaft 21 of the agitation unit 2, thereby driving the blades 22 to cause the blades 22 to agitate the fluid abrasive 5 to generate eddy currents. The fluid abrasive 5 is caused to rub the workpiece 4 to be polished. At this time, the workpiece 4 to be polished can be deburred, polished and chamfered by the fluid abrasive 5, and can be applied to the micro, inner hole, the slit, the arc. Such as the surface, the complex surface, etc., the processing difficulties, so that the grinding effect of the inner and outer surfaces of the workpiece 4 to be polished can be improved.
請參閱『第4圖』所示,係本發明第二實施例之立體分解示意圖。如圖所示:本發明除上述第一實施例所提型態之外,更可為本第二實施例之型態,而其所不同之處係在於,該傳動單元3更進一步包含有一連接致動元件31與開關33之計時器34、及一連接計時器34與電源部32之變頻器35。 Please refer to FIG. 4, which is a perspective exploded view of a second embodiment of the present invention. As shown in the figure, the present invention can be in the form of the second embodiment in addition to the above-mentioned first embodiment, and the difference is that the transmission unit 3 further includes a connection. A timer 34 for actuating the element 31 and the switch 33, and a frequency converter 35 for connecting the timer 34 to the power supply unit 32.
其中該計時器34係可讓使用者詳細了解作動之時間,且可依所須設定相關之研拋運轉時間,而於設定時間之後進行自動關閉,另該變頻器35係可利用固定電壓改變功率,而可進行控制致動元件31之轉速;如此,即可讓本發明能更符合實際使用之所需。 The timer 34 allows the user to know the time of the operation in detail, and can set the relevant grinding and running time according to the setting, and automatically close after the set time, and the inverter 35 can change the power by using the fixed voltage. The rotational speed of the actuating element 31 can be controlled; thus, the present invention can be made more suitable for practical use.
綜上所述,本發明複合精微渦流研拋裝置可有效改善習用之種種缺點,可於容置單元中設置待研拋工件及流體磨料,並以傳動單元帶動攪動單元,使流體磨料於容置單元中產生渦流磨擦該待研拋工件,使待研拋工件一次性完成去毛刺、拋光以及倒角,以提升待研拋工件內外表面之研磨效果,進而可應用於微小、內孔、 夾縫、弧面、複雜曲面...等加工困難之處,而達到易於操作、可同時加工單面或多面、提升加工速率、大幅度減輕勞動強度、降低加工成本以及提高生產率之功效;進而使本發明之產生能更進步、更實用、更符合消費者使用之所須,確已符合發明專利申請之要件,爰依法提出專利申請。 In summary, the composite fine vortex flow polishing and polishing device of the invention can effectively improve various disadvantages of the conventional use, and can set the workpiece to be polished and the fluid abrasive in the accommodating unit, and drive the agitation unit with the transmission unit to make the fluid abrasive accommodate. The eddy current is generated in the unit to rub the workpiece to be polished, and the workpiece to be polished is subjected to deburring, polishing and chamfering at one time to improve the grinding effect of the inner and outer surfaces of the workpiece to be polished, and then can be applied to small and inner holes. Such as quilting, curved surface, complex curved surface, etc., it is easy to operate, can process single or multi-sided at the same time, increase processing speed, greatly reduce labor intensity, reduce processing cost and improve productivity; The invention can be more advanced, more practical, and more suitable for the use of the consumer, and has indeed met the requirements of the invention patent application, and filed a patent application according to law.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍;故,凡依本發明申請專利範圍及發明說明書內容所作之簡單之等效變化與修飾,皆應仍屬本發明專利涵蓋之範圍內。 However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; therefore, the simple equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the invention are modified. All should remain within the scope of the invention patent.
11‧‧‧容器本體 11‧‧‧ container body
111‧‧‧容置區 111‧‧‧Receiving area
12‧‧‧承載部 12‧‧‧Loading Department
13‧‧‧上蓋 13‧‧‧Upper cover
14‧‧‧置放區 14‧‧‧Placement area
15‧‧‧蓋板 15‧‧‧ Cover
2‧‧‧攪動單元 2‧‧‧Agitating unit
21‧‧‧軸體 21‧‧‧Axis
22‧‧‧葉片 22‧‧‧ blades
3‧‧‧傳動單元 3‧‧‧Transmission unit
31‧‧‧致動元件 31‧‧‧Actuating element
32‧‧‧電源部 32‧‧‧Power Supply Department
33‧‧‧開關 33‧‧‧ switch
4‧‧‧待研拋工件 4‧‧‧Study to be thrown
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101147958A TWI564114B (en) | 2012-12-17 | 2012-12-17 | Subtle vortex polishing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101147958A TWI564114B (en) | 2012-12-17 | 2012-12-17 | Subtle vortex polishing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201424932A TW201424932A (en) | 2014-07-01 |
| TWI564114B true TWI564114B (en) | 2017-01-01 |
Family
ID=51725123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101147958A TWI564114B (en) | 2012-12-17 | 2012-12-17 | Subtle vortex polishing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI564114B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI889142B (en) * | 2024-01-15 | 2025-07-01 | 豪昱電子有限公司 | Magnetic grinding and polishing machine |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114434312A (en) * | 2021-11-26 | 2022-05-06 | 新昌浙江工业大学科学技术研究院 | Bearing outer ring inner raceway force rheological polishing machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW416888B (en) * | 1998-11-23 | 2001-01-01 | Liau Lu Rung | Work piece burr removing device |
| JP2005262344A (en) * | 2004-03-16 | 2005-09-29 | Canon Inc | Ultra-precision polishing method and apparatus |
| TWM303083U (en) * | 2006-06-28 | 2006-12-21 | New Yu Ming Machinery Co | Dust-collecting apparatus of a grinder |
| TW200714351A (en) * | 2005-10-07 | 2007-04-16 | Duen-Gang Mou | A small portable stirred reaction device with high power input |
-
2012
- 2012-12-17 TW TW101147958A patent/TWI564114B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW416888B (en) * | 1998-11-23 | 2001-01-01 | Liau Lu Rung | Work piece burr removing device |
| JP2005262344A (en) * | 2004-03-16 | 2005-09-29 | Canon Inc | Ultra-precision polishing method and apparatus |
| TW200714351A (en) * | 2005-10-07 | 2007-04-16 | Duen-Gang Mou | A small portable stirred reaction device with high power input |
| TWM303083U (en) * | 2006-06-28 | 2006-12-21 | New Yu Ming Machinery Co | Dust-collecting apparatus of a grinder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI889142B (en) * | 2024-01-15 | 2025-07-01 | 豪昱電子有限公司 | Magnetic grinding and polishing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201424932A (en) | 2014-07-01 |
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