[go: up one dir, main page]

TWI563891B - Method for manufacturing circuit board - Google Patents

Method for manufacturing circuit board

Info

Publication number
TWI563891B
TWI563891B TW103135514A TW103135514A TWI563891B TW I563891 B TWI563891 B TW I563891B TW 103135514 A TW103135514 A TW 103135514A TW 103135514 A TW103135514 A TW 103135514A TW I563891 B TWI563891 B TW I563891B
Authority
TW
Taiwan
Prior art keywords
circuit board
manufacturing circuit
manufacturing
board
circuit
Prior art date
Application number
TW103135514A
Other languages
English (en)
Other versions
TW201615071A (en
Inventor
Yin Ju Chen
Cheng Po Yu
Cheng Jui Chang
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW103135514A priority Critical patent/TWI563891B/zh
Publication of TW201615071A publication Critical patent/TW201615071A/zh
Application granted granted Critical
Publication of TWI563891B publication Critical patent/TWI563891B/zh

Links

TW103135514A 2014-10-14 2014-10-14 Method for manufacturing circuit board TWI563891B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103135514A TWI563891B (en) 2014-10-14 2014-10-14 Method for manufacturing circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103135514A TWI563891B (en) 2014-10-14 2014-10-14 Method for manufacturing circuit board

Publications (2)

Publication Number Publication Date
TW201615071A TW201615071A (en) 2016-04-16
TWI563891B true TWI563891B (en) 2016-12-21

Family

ID=56361343

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103135514A TWI563891B (en) 2014-10-14 2014-10-14 Method for manufacturing circuit board

Country Status (1)

Country Link
TW (1) TWI563891B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005302854A (ja) * 2004-04-08 2005-10-27 Fujikura Ltd 部品内蔵両面基板、部品内蔵両面配線板およびその製造方法
TW201134338A (en) * 2010-03-16 2011-10-01 Unitech Printed Circuit Board Corp Manufacturing method of multilayer circuit board with embedded electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005302854A (ja) * 2004-04-08 2005-10-27 Fujikura Ltd 部品内蔵両面基板、部品内蔵両面配線板およびその製造方法
TW201134338A (en) * 2010-03-16 2011-10-01 Unitech Printed Circuit Board Corp Manufacturing method of multilayer circuit board with embedded electronic component

Also Published As

Publication number Publication date
TW201615071A (en) 2016-04-16

Similar Documents

Publication Publication Date Title
IL253334B (en) electronic component
EP3217775A4 (en) Circuit board and method for manufacturing same
EP3183753A4 (en) Electronic circuit
PL3473783T3 (pl) Sposób wytwarzania desek podłogowych
SG11201606647PA (en) Circuit system
GB201503428D0 (en) Electronic apparatus
KR101882060B1 (ko) 집적 회로 제조 방법
TWI563725B (en) Electronic apparatus
GB201612112D0 (en) Electronic apparatus
GB201414589D0 (en) Ballast circuit
GB2531371B (en) Electronic apparatus
GB201808621D0 (en) Electronic apparatus
GB2530494B (en) An undervoltage-lockout circuit
GB201802802D0 (en) Electronic apparatus
EP2916629A4 (en) CIRCUIT BOARD
SG11201801073QA (en) Electronic apparatus
GB2531372B (en) Electronic apparatus
IL256835A (en) Methods of manufacturing printed circuit boards
TWI561958B (en) Integrated circuit
GB2525184B (en) Electronic Circuit
TWI562687B (en) Circuit board assembly
TWI563391B (en) Identification circuit
GB201410554D0 (en) Print circuit board
GB2537218B (en) Hybrid electronic circuit
GB2543101B (en) Lamination technique for producing electronic devices

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees