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TWI563600B - Package structure and fabrication method thereof - Google Patents

Package structure and fabrication method thereof

Info

Publication number
TWI563600B
TWI563600B TW104119563A TW104119563A TWI563600B TW I563600 B TWI563600 B TW I563600B TW 104119563 A TW104119563 A TW 104119563A TW 104119563 A TW104119563 A TW 104119563A TW I563600 B TWI563600 B TW I563600B
Authority
TW
Taiwan
Prior art keywords
package structure
fabrication method
fabrication
package
Prior art date
Application number
TW104119563A
Other languages
Chinese (zh)
Other versions
TW201701399A (en
Inventor
yang yi Lin
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW104119563A priority Critical patent/TWI563600B/en
Application granted granted Critical
Publication of TWI563600B publication Critical patent/TWI563600B/en
Publication of TW201701399A publication Critical patent/TW201701399A/en

Links

Classifications

    • H10W72/012—
TW104119563A 2015-06-17 2015-06-17 Package structure and fabrication method thereof TWI563600B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104119563A TWI563600B (en) 2015-06-17 2015-06-17 Package structure and fabrication method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104119563A TWI563600B (en) 2015-06-17 2015-06-17 Package structure and fabrication method thereof

Publications (2)

Publication Number Publication Date
TWI563600B true TWI563600B (en) 2016-12-21
TW201701399A TW201701399A (en) 2017-01-01

Family

ID=58227498

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104119563A TWI563600B (en) 2015-06-17 2015-06-17 Package structure and fabrication method thereof

Country Status (1)

Country Link
TW (1) TWI563600B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080054459A1 (en) * 2001-03-05 2008-03-06 Megica Corporation Low fabrication cost, fine pitch and high reliability solder bump
US20090174070A1 (en) * 2003-07-02 2009-07-09 Shriram Ramanathan Three-dimensional stacked substrate arrangements
US20120028411A1 (en) * 2010-07-30 2012-02-02 Taiwan Semiconductor Manufacturing Company, Ltd. Embedded Wafer-Level Bonding Approaches

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080054459A1 (en) * 2001-03-05 2008-03-06 Megica Corporation Low fabrication cost, fine pitch and high reliability solder bump
US20090174070A1 (en) * 2003-07-02 2009-07-09 Shriram Ramanathan Three-dimensional stacked substrate arrangements
US20120028411A1 (en) * 2010-07-30 2012-02-02 Taiwan Semiconductor Manufacturing Company, Ltd. Embedded Wafer-Level Bonding Approaches

Also Published As

Publication number Publication date
TW201701399A (en) 2017-01-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees