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TWI563590B - Position apparatus of wafer fabrication and method using the same - Google Patents

Position apparatus of wafer fabrication and method using the same

Info

Publication number
TWI563590B
TWI563590B TW104117811A TW104117811A TWI563590B TW I563590 B TWI563590 B TW I563590B TW 104117811 A TW104117811 A TW 104117811A TW 104117811 A TW104117811 A TW 104117811A TW I563590 B TWI563590 B TW I563590B
Authority
TW
Taiwan
Prior art keywords
same
wafer fabrication
position apparatus
fabrication
wafer
Prior art date
Application number
TW104117811A
Other languages
Chinese (zh)
Other versions
TW201643987A (en
Inventor
Hung Neng Lai
Chun Sung Chuang
Original Assignee
Gallant Micro Machining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gallant Micro Machining Co Ltd filed Critical Gallant Micro Machining Co Ltd
Priority to TW104117811A priority Critical patent/TWI563590B/en
Publication of TW201643987A publication Critical patent/TW201643987A/en
Application granted granted Critical
Publication of TWI563590B publication Critical patent/TWI563590B/en

Links

TW104117811A 2015-06-02 2015-06-02 Position apparatus of wafer fabrication and method using the same TWI563590B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104117811A TWI563590B (en) 2015-06-02 2015-06-02 Position apparatus of wafer fabrication and method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104117811A TWI563590B (en) 2015-06-02 2015-06-02 Position apparatus of wafer fabrication and method using the same

Publications (2)

Publication Number Publication Date
TW201643987A TW201643987A (en) 2016-12-16
TWI563590B true TWI563590B (en) 2016-12-21

Family

ID=58055993

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104117811A TWI563590B (en) 2015-06-02 2015-06-02 Position apparatus of wafer fabrication and method using the same

Country Status (1)

Country Link
TW (1) TWI563590B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780424B (en) * 2020-04-07 2022-10-11 均華精密工業股份有限公司 Improving accuracy and speed of bonding apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050005702A1 (en) * 2001-09-06 2005-01-13 Tokyo Electron Limited Transporting tool for object to be tested, and object-to-be-tested transporting system
US20060017897A1 (en) * 2003-04-18 2006-01-26 Canon Kabushiki Kaisha Exposure apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050005702A1 (en) * 2001-09-06 2005-01-13 Tokyo Electron Limited Transporting tool for object to be tested, and object-to-be-tested transporting system
US20060017897A1 (en) * 2003-04-18 2006-01-26 Canon Kabushiki Kaisha Exposure apparatus

Also Published As

Publication number Publication date
TW201643987A (en) 2016-12-16

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