TWI563580B - - Google Patents

Info

Publication number: TWI563580B
Authority: TW; Taiwan

Application number

TW103119855A

Other languages

Chinese (zh)

Other versions

TW201511150A (en

Inventor

Michitaka Mikami

Bin Liu

Hiroyuki Amano

takuya Hamamoto

Yoshiyuki Imaizumi

Yuka Nagae

Tsutomu Yamashita

Original Assignee

Tanaka Electronics Ind

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-06-13

Filing date

2014-06-09

Publication date

2016-12-21

2014-06-09 Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind

2015-03-16 Publication of TW201511150A publication Critical patent/TW201511150A/en

2016-12-21 Application granted granted Critical

2016-12-21 Publication of TWI563580B publication Critical patent/TWI563580B/zh

Classifications

- H10W72/015—
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
- H10W72/07533—
- H10W72/50—
- H10W72/522—
- H10W72/534—
- H10W74/00—

TW103119855A 2013-06-13 2014-06-09 Structure of plated copper wire for ultrasonic welding TW201511150A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2013124903A JP5546670B1 (en)	2013-06-13	2013-06-13	Structure of coated copper wire for ultrasonic bonding

Publications (2)

Publication Number	Publication Date
TW201511150A TW201511150A (en)	2015-03-16
TWI563580B true TWI563580B (en)	2016-12-21

Family

ID=51409577

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW103119855A TW201511150A (en)	2013-06-13	2014-06-09	Structure of plated copper wire for ultrasonic welding

Country Status (4)

Country	Link
JP (1)	JP5546670B1 (en)
CN (1)	CN104241237B (en)
SG (1)	SG10201403091UA (en)
TW (1)	TW201511150A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
SG11201608819VA (en)	2014-04-21	2016-12-29	Nippon Steel & Sumikin Mat Co	Bonding wire for semiconductor device
DE112015007265B4 (en) *	2015-05-26	2025-06-05	Nippon Micrometal Corporation	Bonding wire for semiconductor device
WO2016189752A1 (en) *	2015-05-26	2016-12-01	日鉄住金マイクロメタル株式会社	Bonding wire for semiconductor device
CN112038312B (en) *	2015-05-26	2024-08-30	日铁新材料股份有限公司	Bonding wire for semiconductor devices
CN106489199B (en)	2015-06-15	2019-09-03	日铁新材料股份有限公司	Bonding wire for semiconductor device
JP5893230B1 (en)	2015-07-23	2016-03-23	日鉄住金マイクロメタル株式会社	Bonding wires for semiconductor devices
SG10201705029XA (en) *	2015-08-12	2017-07-28	Nippon Micrometal Corp	Bonding wire for semiconductor device
JP6410692B2 (en) *	2015-08-28	2018-10-24	田中電子工業株式会社	Copper alloy bonding wire
WO2017221434A1 (en) *	2016-06-20	2017-12-28	日鉄住金マイクロメタル株式会社	Bonding wire for semiconductor device
CN116875840B (en) *	2023-09-05	2023-11-21	汕头市骏码凯撒有限公司	High-power blister copper wire resistant to high temperature, oxidation and thermal fatigue and method for manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH06151497A (en) *	1992-11-10	1994-05-31	Tanaka Denshi Kogyo Kk	Wire for bonding semiconductor element and its manufacture
JP2009088132A (en) *	2007-09-28	2009-04-23	Tanaka Electronics Ind Co Ltd	Bonding wire
US20120104613A1 (en) *	2007-07-24	2012-05-03	Nippon Micrometal Corporation	Bonding wire for semiconductor device
WO2013018238A1 (en) *	2011-08-01	2013-02-07	タツタ電線株式会社	Ball bonding wire

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0750720B2 (en) *	1989-11-08	1995-05-31	株式会社東芝	Bonding wire and semiconductor device having the same
JPH06283565A (en) *	1993-03-29	1994-10-07	Nippon Steel Corp	High frequency bonding wire
JPH09246310A (en) *	1996-03-04	1997-09-19	Hitachi Ltd	Semiconductor device
KR100280084B1 (en) *	1998-12-29	2001-03-02	마이클 디. 오브라이언	Wire for semiconductor device
TW200414453A (en) *	2002-03-26	2004-08-01	Sumitomo Electric Wintec Inc	Bonding wire and IC device using the bonding wire
JP2005129603A (en) *	2003-10-22	2005-05-19	Mitsumi Electric Co Ltd	Semiconductor integrated circuit device
JP5381816B2 (en) *	2010-03-03	2014-01-08	三菱電機株式会社	Wire bonding method

2013
- 2013-06-13 JP JP2013124903A patent/JP5546670B1/en not_active Expired - Fee Related
2014
- 2014-06-09 TW TW103119855A patent/TW201511150A/en not_active IP Right Cessation
- 2014-06-10 SG SG10201403091UA patent/SG10201403091UA/en unknown
- 2014-06-13 CN CN201410265987.XA patent/CN104241237B/en not_active Expired - Fee Related

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH06151497A (en) *	1992-11-10	1994-05-31	Tanaka Denshi Kogyo Kk	Wire for bonding semiconductor element and its manufacture
US20120104613A1 (en) *	2007-07-24	2012-05-03	Nippon Micrometal Corporation	Bonding wire for semiconductor device
JP2009088132A (en) *	2007-09-28	2009-04-23	Tanaka Electronics Ind Co Ltd	Bonding wire
WO2013018238A1 (en) *	2011-08-01	2013-02-07	タツタ電線株式会社	Ball bonding wire

Also Published As

Publication number	Publication date
JP5546670B1 (en)	2014-07-09
CN104241237B (en)	2017-04-12
CN104241237A (en)	2014-12-24
SG10201403091UA (en)	2015-01-29
TW201511150A (en)	2015-03-16
JP2015002213A (en)	2015-01-05

Publication	Publication Date	Title
AP2016009275A0 (en)	2016-06-30
BR112015007533A2 (en)	2017-08-22
BR112016000699A2 (en)	2017-07-25
BR102016010778A2 (en)	2017-08-08
BR112014017733A2 (en)	2017-06-20
BR112014018502A2 (en)	2017-06-20
BR112014017739A2 (en)	2017-06-20
BR112014019326A2 (en)	2017-06-20
BR112014018516A2 (en)	2017-06-20
BR112014018480A2 (en)	2017-06-20
BR112014020341A2 (en)	2017-06-20
BR112014017855A2 (en)	2017-06-20
BR112014017765A2 (en)	2017-06-20
BR112014017669A2 (en)	2017-06-20
BR112014021878A2 (en)	2017-06-20
BR112014018468A2 (en)	2017-06-20
BR112014017901A2 (en)	2017-06-20
BR112014018207A2 (en)	2017-06-20
BR112015015948A2 (en)	2017-08-15
BR112014017722A2 (en)	2017-06-20
BR112014017653A2 (en)	2017-06-20
BR112014018578A2 (en)	2017-06-20
BR112014018483A2 (en)	2017-06-20
BR112014017794A2 (en)	2017-06-20
BR112015015312A2 (en)	2017-08-15

Legal Events

Date	Code	Title	Description
2020-09-21	MM4A	Annulment or lapse of patent due to non-payment of fees