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TWI563125B - Composition and aqueous dispersion for protecting metal surface and method of protecting metal surface - Google Patents

Composition and aqueous dispersion for protecting metal surface and method of protecting metal surface

Info

Publication number
TWI563125B
TWI563125B TW104111104A TW104111104A TWI563125B TW I563125 B TWI563125 B TW I563125B TW 104111104 A TW104111104 A TW 104111104A TW 104111104 A TW104111104 A TW 104111104A TW I563125 B TWI563125 B TW I563125B
Authority
TW
Taiwan
Prior art keywords
metal surface
protecting metal
composition
aqueous dispersion
protecting
Prior art date
Application number
TW104111104A
Other languages
English (en)
Other versions
TW201538798A (zh
Inventor
chun lian Liu
Original Assignee
Suzhou Asanuo Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Asanuo Electronic Technology Co Ltd filed Critical Suzhou Asanuo Electronic Technology Co Ltd
Publication of TW201538798A publication Critical patent/TW201538798A/zh
Application granted granted Critical
Publication of TWI563125B publication Critical patent/TWI563125B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW104111104A 2014-04-09 2015-04-07 Composition and aqueous dispersion for protecting metal surface and method of protecting metal surface TWI563125B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410139435.4A CN103993301B (zh) 2014-04-09 2014-04-09 一种集成电路板金属表面保护剂

Publications (2)

Publication Number Publication Date
TW201538798A TW201538798A (zh) 2015-10-16
TWI563125B true TWI563125B (en) 2016-12-21

Family

ID=51307623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111104A TWI563125B (en) 2014-04-09 2015-04-07 Composition and aqueous dispersion for protecting metal surface and method of protecting metal surface

Country Status (2)

Country Link
CN (1) CN103993301B (zh)
TW (1) TWI563125B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104294296A (zh) * 2014-09-17 2015-01-21 明光市锐创电气有限公司 一种预绞丝生产使用清洗剂及其制作方法
CN104651861B (zh) * 2015-01-27 2017-05-31 南京航空航天大学 直缝埋弧焊管扩径后内壁清洗剂
CN104862680A (zh) * 2015-04-08 2015-08-26 安徽豪鼎金属制品有限公司 一种抗氧化金属表面处理剂
CN108611628A (zh) * 2016-12-09 2018-10-02 段钰 一种金属防腐蚀保护剂
CN107022762B (zh) * 2017-05-08 2019-07-30 广东光华科技股份有限公司 三胺基取代苯酚或三胺基取代苯硫酚的应用及微蚀处理液
CN107365989B (zh) * 2017-07-11 2019-08-09 东莞市富默克化工有限公司 一种金属表面处理方法及其制得的金属保护膜
CN108315789A (zh) * 2018-03-01 2018-07-24 深圳市盛元半导体有限公司 一种铜基镀锡耐高温保护剂
CN110079142A (zh) * 2019-05-23 2019-08-02 深圳市力达纳米科技有限公司 一种表面保护水溶性保护剂及方法、5g通信电子产品
CN110257072A (zh) * 2019-06-13 2019-09-20 常州时创能源科技有限公司 硅片单面制绒与边缘刻蚀用添加剂及其应用
CN110373055A (zh) * 2019-07-29 2019-10-25 深圳市力达纳米科技有限公司 一种表面保护的水溶性保护剂及制备方法、集成电路

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200944367A (en) * 2007-04-18 2009-11-01 Enthone Metallic surface enhancement
TW201247047A (en) * 2011-05-04 2012-11-16 Subtron Technology Co Ltd Circuit structure and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6524644B1 (en) * 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
FR2851258B1 (fr) * 2003-02-17 2007-03-30 Commissariat Energie Atomique Procede de revetement d'une surface, fabrication d'interconnexion en microelectronique utilisant ce procede, et circuits integres
FR2868085B1 (fr) * 2004-03-24 2006-07-14 Alchimer Sa Procede de revetement selectif d'une surface composite, fabrication d'interconnexions en microelectronique utilisant ce procede, et circuits integres
CN101575704B (zh) * 2009-06-12 2011-01-26 林原标 铜及铜合金表面处理剂
CN103602990B (zh) * 2013-11-18 2016-03-30 北京化工大学 一种铜及其合金的超分子缓蚀剂及其高速搅拌制备方法
CN103602992B (zh) * 2013-11-19 2015-11-18 北京化工大学 一种铜及其合金的超分子缓蚀剂及其超细研磨制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200944367A (en) * 2007-04-18 2009-11-01 Enthone Metallic surface enhancement
TW201247047A (en) * 2011-05-04 2012-11-16 Subtron Technology Co Ltd Circuit structure and manufacturing method thereof

Also Published As

Publication number Publication date
CN103993301A (zh) 2014-08-20
TW201538798A (zh) 2015-10-16
CN103993301B (zh) 2016-09-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees