TWI562854B - Device for manufacturing mold core - Google Patents

Device for manufacturing mold core

Info

Publication number: TWI562854B
Authority: TW; Taiwan
Prior art keywords: mold core; manufacturing mold; manufacturing; core; mold
Prior art date: 2012-10-30

Application number

TW101140207A

Other languages

English (en)

Other versions

TW201416165A (zh

Inventor

Po Chou Chen

Original Assignee

Hon Hai Prec Ind Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-10-30

Filing date

2012-10-30

Publication date

2016-12-21

2012-10-30 Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd

2012-10-30 Priority to TW101140207A priority Critical patent/TWI562854B/zh

2013-06-05 Priority to US13/910,126 priority patent/US9149887B2/en

2014-05-01 Publication of TW201416165A publication Critical patent/TW201416165A/zh

2016-12-21 Application granted granted Critical

2016-12-21 Publication of TWI562854B publication Critical patent/TWI562854B/zh

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C13/00—Moulding machines for making moulds or cores of particular shapes
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material

Landscapes

Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Plasma & Fusion (AREA)
Laser Beam Processing (AREA)
Moulds For Moulding Plastics Or The Like (AREA)

TW101140207A 2012-10-30 2012-10-30 Device for manufacturing mold core TWI562854B (en)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
TW101140207A TWI562854B (en)	2012-10-30	2012-10-30	Device for manufacturing mold core
US13/910,126 US9149887B2 (en)	2012-10-30	2013-06-05	Laser processing apparatus

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW101140207A TWI562854B (en)	2012-10-30	2012-10-30	Device for manufacturing mold core

Publications (2)

Publication Number	Publication Date
TW201416165A TW201416165A (zh)	2014-05-01
TWI562854B true TWI562854B (en)	2016-12-21

Family

ID=50546043

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW101140207A TWI562854B (en)	2012-10-30	2012-10-30	Device for manufacturing mold core

Country Status (2)

Country	Link
US (1)	US9149887B2 (zh)
TW (1)	TWI562854B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20240155375A (ko) *	2015-10-30	2024-10-28	쇠라 테크널러지스 인코포레이티드	적층식 제조 시스템 및 방법
JP6575350B2 (ja) *	2015-12-24	2019-09-18	ブラザー工業株式会社	レーザ加工装置
CN206747778U (zh) *	2016-03-26	2017-12-15	广州创乐激光设备有限公司	激光打标机
CN107765609A (zh) *	2017-12-05	2018-03-06	吉林壁虎工程机械制造有限公司	一种激光发射器、激光接收器以及激光整平机
CN108406126B (zh) *	2018-04-23	2023-10-03	广州新可激光设备有限公司	一种单层抽拉换料激光打标机
CN109332847A (zh) *	2018-12-13	2019-02-15	郑州云海信息技术有限公司	一种热风台固定装置
US12162074B2 (en)	2020-11-25	2024-12-10	Lawrence Livermore National Security, Llc	System and method for large-area pulsed laser melting of metallic powder in a laser powder bed fusion application
TWI749961B (zh)	2020-12-22	2021-12-11	雷應科技股份有限公司	刀具檢測器
CN113059272A (zh) *	2021-03-31	2021-07-02	芜湖造船厂有限公司	拉伸试样激光标距打点装置及激光标距打点方法
CN113714624A (zh) *	2021-08-29	2021-11-30	南京晨光集团有限责任公司	一种用于电连接器激光标刻的对焦装置
CN118455755B (zh) *	2024-07-09	2024-10-25	山东锐图激光科技有限公司	一种激光打标机

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH10111706A (ja) *	1996-10-08	1998-04-28	Tokyo Seimitsu Co Ltd	数値制御工作機械の自動測定装置
US5961861A (en) *	1996-01-15	1999-10-05	The University Of Tennessee Research Corporation	Apparatus for laser alloying induced improvement of surfaces
JP2002221446A (ja) *	2001-01-29	2002-08-09	Fuji Photo Film Co Ltd	光センサの調整方法
KR20050117882A (ko) *	2004-06-11	2005-12-15	삼성전자주식회사	캐리어 플레이트의 반도체 칩 패키지 탑재 불량 감지 장치
TW200909113A (en) *	2007-02-26	2009-03-01	Disco Corp	Laser beam radiating apparatus, and laser beam machine
TW201008689A (en) *	2008-06-03	2010-03-01	M Solv Ltd	Method and apparatus for controlling the size of a laser beam focal spot

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2104999B1 (zh) *	1970-09-15	1973-08-10	Peugeot & Renault
GB0026902D0 (en) *	2000-11-03	2000-12-20	Foseco Int	Machinable body and casting process
US6596961B2 (en) *	2001-09-12	2003-07-22	Fraunhofer Usa, Inc.	Method and apparatus for monitoring and adjusting a laser welding process
TWI352001B (en) *	2005-11-18	2011-11-11	Hon Hai Prec Ind Co Ltd	Laser machining system and process for laser machi

2012
- 2012-10-30 TW TW101140207A patent/TWI562854B/zh not_active IP Right Cessation
2013
- 2013-06-05 US US13/910,126 patent/US9149887B2/en not_active Expired - Fee Related

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5961861A (en) *	1996-01-15	1999-10-05	The University Of Tennessee Research Corporation	Apparatus for laser alloying induced improvement of surfaces
JPH10111706A (ja) *	1996-10-08	1998-04-28	Tokyo Seimitsu Co Ltd	数値制御工作機械の自動測定装置
JP2002221446A (ja) *	2001-01-29	2002-08-09	Fuji Photo Film Co Ltd	光センサの調整方法
KR20050117882A (ko) *	2004-06-11	2005-12-15	삼성전자주식회사	캐리어 플레이트의 반도체 칩 패키지 탑재 불량 감지 장치
TW200909113A (en) *	2007-02-26	2009-03-01	Disco Corp	Laser beam radiating apparatus, and laser beam machine
TW201008689A (en) *	2008-06-03	2010-03-01	M Solv Ltd	Method and apparatus for controlling the size of a laser beam focal spot

Also Published As

Publication number	Publication date
US20140116998A1 (en)	2014-05-01
TW201416165A (zh)	2014-05-01
US9149887B2 (en)	2015-10-06

Publication	Publication Date	Title
GB2502655B (en)	2015-11-04	Press moulding method
TWI562854B (en)	2016-12-21	Device for manufacturing mold core
ZA201407760B (en)	2015-12-23	A core tray
SG11201504875UA (en)	2015-07-30	Method for manufacturing magnetoresistance effect element
HRP20190275T1 (hr)	2019-04-05	Kalup za sir
PL2697009T3 (pl)	2017-07-31	Forma odlewnicza
EP2891639A4 (en)	2016-04-27	DEVICE FOR MANUFACTURING CEMENT
GB2501752B (en)	2015-01-28	Coil forming device
EP2837440A4 (en)	2016-01-27	MOLD TYPE DEVICE FOR FORGING PURPOSES
GB201214336D0 (en)	2012-09-26	Mould tool
GB201219704D0 (en)	2012-12-12	A process for manufacturing a fixing device
EP2732947A4 (en)	2015-09-09	FORM CLOSURE DEVICE
SG11201400227YA (en)	2014-06-27	Mold and method for manufacturing mold
PL2857166T3 (pl)	2020-11-02	Forma
SG11201400407YA (en)	2014-05-29	Mold
GB2505862B (en)	2015-02-18	Mould
GB2500876B8 (en)	2016-02-17	A moulding method
GB2517891B (en)	2020-05-20	Manufacturing process
EP2902835A4 (en)	2016-05-18	METHOD FOR MANUFACTURING MIRROR DEVICE
TWM432519U (en)	2012-07-01	Mold
TWM432518U (en)	2012-07-01	Mold
GB201203684D0 (en)	2012-04-18	Mould
GB201214439D0 (en)	2012-09-26	Methods for manufacturing photonic devices
TWM433250U (en)	2012-07-11	Punching mold
GB201222327D0 (en)	2013-01-23	Manufacturing method

Legal Events

Date	Code	Title	Description
2018-09-21	MM4A	Annulment or lapse of patent due to non-payment of fees