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TWI562269B - Wafer transfer device and wafer transfer method with calitration function - Google Patents

Wafer transfer device and wafer transfer method with calitration function

Info

Publication number
TWI562269B
TWI562269B TW103102230A TW103102230A TWI562269B TW I562269 B TWI562269 B TW I562269B TW 103102230 A TW103102230 A TW 103102230A TW 103102230 A TW103102230 A TW 103102230A TW I562269 B TWI562269 B TW I562269B
Authority
TW
Taiwan
Prior art keywords
wafer transfer
calitration
function
transfer device
transfer method
Prior art date
Application number
TW103102230A
Other languages
Chinese (zh)
Other versions
TW201530684A (en
Inventor
Yi Chieh Wang
Jhan Fong Lin
Shing Long Lee
Chung Han Lin
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW103102230A priority Critical patent/TWI562269B/en
Publication of TW201530684A publication Critical patent/TW201530684A/en
Application granted granted Critical
Publication of TWI562269B publication Critical patent/TWI562269B/en

Links

TW103102230A 2014-01-22 2014-01-22 Wafer transfer device and wafer transfer method with calitration function TWI562269B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103102230A TWI562269B (en) 2014-01-22 2014-01-22 Wafer transfer device and wafer transfer method with calitration function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103102230A TWI562269B (en) 2014-01-22 2014-01-22 Wafer transfer device and wafer transfer method with calitration function

Publications (2)

Publication Number Publication Date
TW201530684A TW201530684A (en) 2015-08-01
TWI562269B true TWI562269B (en) 2016-12-11

Family

ID=54342832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103102230A TWI562269B (en) 2014-01-22 2014-01-22 Wafer transfer device and wafer transfer method with calitration function

Country Status (1)

Country Link
TW (1) TWI562269B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI731281B (en) * 2018-09-20 2021-06-21 大陸商杭州眾硅電子科技有限公司 Grinding loading and unloading component module containing movable loading and unloading module and wafer transmission method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI648813B (en) * 2017-11-09 2019-01-21 台灣積體電路製造股份有限公司 Process chamber, semiconductor manufacturing apparatus and calibration method thereof
JP7433180B2 (en) * 2020-09-23 2024-02-19 東京エレクトロン株式会社 Teaching method for transport device and robot arm

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW528709B (en) * 2002-08-01 2003-04-21 Nanya Technology Corp Wafer carrying device with blade position detection
TW200929421A (en) * 2007-12-20 2009-07-01 King Yuan Electronics Co Ltd Wafer transfer apparatus
US20120325105A1 (en) * 2011-06-22 2012-12-27 Inotera Memories, Inc. Bidirectional wafer carrying pod and wafer transfer system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW528709B (en) * 2002-08-01 2003-04-21 Nanya Technology Corp Wafer carrying device with blade position detection
TW200929421A (en) * 2007-12-20 2009-07-01 King Yuan Electronics Co Ltd Wafer transfer apparatus
US20120325105A1 (en) * 2011-06-22 2012-12-27 Inotera Memories, Inc. Bidirectional wafer carrying pod and wafer transfer system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI731281B (en) * 2018-09-20 2021-06-21 大陸商杭州眾硅電子科技有限公司 Grinding loading and unloading component module containing movable loading and unloading module and wafer transmission method thereof

Also Published As

Publication number Publication date
TW201530684A (en) 2015-08-01

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