TWI562185B - Multi charged particle beam writing method, and multi charged particle beam writing apparatus - Google Patents
Multi charged particle beam writing method, and multi charged particle beam writing apparatusInfo
- Publication number
- TWI562185B TWI562185B TW104116483A TW104116483A TWI562185B TW I562185 B TWI562185 B TW I562185B TW 104116483 A TW104116483 A TW 104116483A TW 104116483 A TW104116483 A TW 104116483A TW I562185 B TWI562185 B TW I562185B
- Authority
- TW
- Taiwan
- Prior art keywords
- charged particle
- particle beam
- beam writing
- multi charged
- writing method
- Prior art date
Links
- 239000002245 particle Substances 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1472—Deflecting along given lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/06—Electron sources; Electron guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/302—Controlling tubes by external information, e.g. programme control
- H01J37/3023—Programme control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/10—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using electron beam; Record carriers therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30472—Controlling the beam
- H01J2237/30483—Scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
- H01J2237/31761—Patterning strategy
- H01J2237/31762—Computer and memory organisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
- H01J2237/31761—Patterning strategy
- H01J2237/31766—Continuous moving of wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Electron Beam Exposure (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Plasma & Fusion (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014114526A JP6353278B2 (ja) | 2014-06-03 | 2014-06-03 | マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201611073A TW201611073A (zh) | 2016-03-16 |
| TWI562185B true TWI562185B (en) | 2016-12-11 |
Family
ID=54702602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104116483A TWI562185B (en) | 2014-06-03 | 2015-05-22 | Multi charged particle beam writing method, and multi charged particle beam writing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9275824B2 (zh) |
| JP (1) | JP6353278B2 (zh) |
| KR (1) | KR101724266B1 (zh) |
| TW (1) | TWI562185B (zh) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6353278B2 (ja) * | 2014-06-03 | 2018-07-04 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置 |
| JP6383228B2 (ja) * | 2014-09-19 | 2018-08-29 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビームのビーム位置測定方法及びマルチ荷電粒子ビーム描画装置 |
| JP6627632B2 (ja) * | 2016-02-08 | 2020-01-08 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法 |
| US9852876B2 (en) | 2016-02-08 | 2017-12-26 | Nuflare Technology, Inc. | Multi charged particle beam writing apparatus and multi charged particle beam writing method |
| JP6557160B2 (ja) * | 2016-02-23 | 2019-08-07 | 株式会社ニューフレアテクノロジー | 診断方法、荷電粒子ビーム描画装置、及びプログラム |
| JP6861508B2 (ja) * | 2016-12-08 | 2021-04-21 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム露光方法及びマルチ荷電粒子ビーム露光装置 |
| JP6720861B2 (ja) | 2016-12-28 | 2020-07-08 | 株式会社ニューフレアテクノロジー | マルチビーム用アパーチャセット及びマルチ荷電粒子ビーム描画装置 |
| JP2019114748A (ja) * | 2017-12-26 | 2019-07-11 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置 |
| JP6847886B2 (ja) | 2018-03-20 | 2021-03-24 | 株式会社東芝 | 荷電粒子ビーム偏向デバイス |
| JP7316127B2 (ja) * | 2019-07-10 | 2023-07-27 | 株式会社ニューフレアテクノロジー | マルチビーム描画方法及びマルチビーム描画装置 |
| TWI774157B (zh) * | 2019-12-27 | 2022-08-11 | 日商紐富來科技股份有限公司 | 帶電粒子束檢查裝置以及帶電粒子束檢查方法 |
| JP7458817B2 (ja) * | 2020-02-18 | 2024-04-01 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法 |
| JP7421364B2 (ja) * | 2020-02-18 | 2024-01-24 | 株式会社ニューフレアテクノロジー | マルチビーム描画方法及びマルチビーム描画装置 |
| JP7604355B2 (ja) * | 2021-11-22 | 2024-12-23 | 株式会社ニューフレアテクノロジー | ブランキングアパーチャアレイシステム及び荷電粒子ビーム描画装置 |
| WO2024154182A1 (ja) * | 2023-01-16 | 2024-07-25 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画装置 |
| KR102810015B1 (ko) * | 2023-01-16 | 2025-05-21 | 가부시키가이샤 뉴플레어 테크놀로지 | 멀티 하전 입자 빔 묘화 장치 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130157198A1 (en) * | 2011-12-19 | 2013-06-20 | Nuflare Technology, Inc. | Multi charged particle beam writing apparatus and multi charged particle beam writing method |
| TW201435513A (zh) * | 2012-11-02 | 2014-09-16 | 紐富來科技股份有限公司 | 多荷電粒子束描繪方法及多荷電粒子束描繪裝置 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2751717B2 (ja) * | 1991-03-13 | 1998-05-18 | 富士通株式会社 | 荷電粒子ビーム露光方法及び荷電粒子ビーム露光装置 |
| KR950002578B1 (ko) | 1991-03-13 | 1995-03-23 | 후지쓰 가부시끼가이샤 | 전자빔 노광방법 |
| US5546319A (en) * | 1994-01-28 | 1996-08-13 | Fujitsu Limited | Method of and system for charged particle beam exposure |
| US5528048A (en) | 1994-03-15 | 1996-06-18 | Fujitsu Limited | Charged particle beam exposure system and method |
| US5747814A (en) * | 1996-12-06 | 1998-05-05 | International Business Machines Corporation | Method for centering a lens in a charged-particle system |
| JP2005116577A (ja) * | 2003-10-03 | 2005-04-28 | Jeol Ltd | 荷電粒子ビーム描画装置 |
| JP4528308B2 (ja) * | 2004-12-28 | 2010-08-18 | パイオニア株式会社 | ビーム記録方法及び装置 |
| JP4801996B2 (ja) * | 2006-01-05 | 2011-10-26 | 株式会社ニューフレアテクノロジー | 試料移動機構及び荷電粒子ビーム描画装置 |
| TWI432908B (zh) * | 2006-03-10 | 2014-04-01 | 瑪波微影Ip公司 | 微影系統及投射方法 |
| NL2001369C2 (nl) | 2007-03-29 | 2010-06-14 | Ims Nanofabrication Ag | Werkwijze voor maskerloze deeltjesbundelbelichting. |
| JP5087318B2 (ja) * | 2007-05-30 | 2012-12-05 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
| US8384048B2 (en) * | 2007-06-25 | 2013-02-26 | Multibeam Corporation | Charged particle beam deflection method with separate stage tracking and stage positional error signals |
| JP5095364B2 (ja) * | 2007-11-26 | 2012-12-12 | 株式会社ニューフレアテクノロジー | トラッキング制御方法および電子ビーム描画システム |
| JP5243898B2 (ja) * | 2008-09-19 | 2013-07-24 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置および荷電粒子ビーム描画方法 |
| EP2187427B1 (en) | 2008-11-17 | 2011-10-05 | IMS Nanofabrication AG | Method for maskless particle-beam exposure |
| JP5498105B2 (ja) * | 2009-09-15 | 2014-05-21 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画方法及び荷電粒子ビーム描画装置 |
| JP2011091171A (ja) * | 2009-10-21 | 2011-05-06 | Nuflare Technology Inc | 荷電粒子ビーム描画方法および荷電粒子ビーム描画装置システム |
| JP5607413B2 (ja) * | 2010-04-20 | 2014-10-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
| JP5693981B2 (ja) * | 2011-01-20 | 2015-04-01 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
| JP5688308B2 (ja) * | 2011-02-18 | 2015-03-25 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
| TWI477925B (zh) * | 2011-10-04 | 2015-03-21 | 紐富來科技股份有限公司 | Multi - beam charged particle beam mapping device and multi - beam charged particle beam rendering method |
| JP6653125B2 (ja) | 2014-05-23 | 2020-02-26 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置 |
| JP6353278B2 (ja) * | 2014-06-03 | 2018-07-04 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置 |
-
2014
- 2014-06-03 JP JP2014114526A patent/JP6353278B2/ja active Active
-
2015
- 2015-05-22 TW TW104116483A patent/TWI562185B/zh active
- 2015-05-26 US US14/721,363 patent/US9275824B2/en active Active
- 2015-06-02 KR KR1020150078148A patent/KR101724266B1/ko active Active
-
2016
- 2016-01-20 US US15/002,121 patent/US9805907B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130157198A1 (en) * | 2011-12-19 | 2013-06-20 | Nuflare Technology, Inc. | Multi charged particle beam writing apparatus and multi charged particle beam writing method |
| TW201435513A (zh) * | 2012-11-02 | 2014-09-16 | 紐富來科技股份有限公司 | 多荷電粒子束描繪方法及多荷電粒子束描繪裝置 |
| TW201604661A (zh) * | 2012-11-02 | 2016-02-01 | 紐富來科技股份有限公司 | 多荷電粒子束描繪方法及多荷電粒子束描繪裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101724266B1 (ko) | 2017-04-07 |
| US20150348741A1 (en) | 2015-12-03 |
| JP2015228471A (ja) | 2015-12-17 |
| JP6353278B2 (ja) | 2018-07-04 |
| TW201611073A (zh) | 2016-03-16 |
| US9805907B2 (en) | 2017-10-31 |
| KR20150139463A (ko) | 2015-12-11 |
| US9275824B2 (en) | 2016-03-01 |
| US20160155604A1 (en) | 2016-06-02 |
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