[go: up one dir, main page]

TWI561889B - - Google Patents

Info

Publication number
TWI561889B
TWI561889B TW104136662A TW104136662A TWI561889B TW I561889 B TWI561889 B TW I561889B TW 104136662 A TW104136662 A TW 104136662A TW 104136662 A TW104136662 A TW 104136662A TW I561889 B TWI561889 B TW I561889B
Authority
TW
Taiwan
Application number
TW104136662A
Other languages
Chinese (zh)
Other versions
TW201629583A (en
Inventor
Hisashi Ichimura
Yoshihito Nakazawa
Masayuki Saito
Takuya Kaizu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW201629583A publication Critical patent/TW201629583A/en
Application granted granted Critical
Publication of TWI561889B publication Critical patent/TWI561889B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW104136662A 2014-11-14 2015-11-06 Substrate assembling apparatus and substrate assembling method using the same TW201629583A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014232028A JP5810207B1 (en) 2014-11-14 2014-11-14 Board assembly apparatus and board assembly method using the same

Publications (2)

Publication Number Publication Date
TW201629583A TW201629583A (en) 2016-08-16
TWI561889B true TWI561889B (en) 2016-12-11

Family

ID=54550463

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104136662A TW201629583A (en) 2014-11-14 2015-11-06 Substrate assembling apparatus and substrate assembling method using the same

Country Status (4)

Country Link
JP (1) JP5810207B1 (en)
KR (4) KR101680744B1 (en)
CN (2) CN105607307B (en)
TW (1) TW201629583A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106066555B (en) * 2016-06-30 2020-07-03 京东方科技集团股份有限公司 Box equipment
WO2019092787A1 (en) * 2017-11-07 2019-05-16 堺ディスプレイプロダクト株式会社 Substrate bonding device, substrate bonding method, and method for manufacturing display device
JP2018089521A (en) * 2018-03-22 2018-06-14 株式会社 Ｍｔｇ Beauty equipment
CN108398814B (en) * 2018-03-22 2021-09-24 京东方科技集团股份有限公司 Processing device for display equipment
JP6733966B2 (en) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 Board assembly apparatus and board assembly method
CN110794488A (en) * 2019-11-26 2020-02-14 爱发科豪威光电薄膜科技(深圳)有限公司 Substrate loading and unloading equipment and optical coating equipment
JP7290375B2 (en) * 2020-04-14 2023-06-13 Ａｉメカテック株式会社 Substrate assembly equipment
JP7128534B2 (en) * 2020-05-26 2022-08-31 Ａｉメカテック株式会社 Board assembly device and board assembly method
CN115424973A (en) * 2022-08-01 2022-12-02 武汉华星光电半导体显示技术有限公司 Turnover device and substrate turnover method
KR20250106091A (en) * 2024-01-02 2025-07-09 한화세미텍 주식회사 Method for producing multiple PCB by reflecting the similarity of common components

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004070274A (en) * 2002-06-11 2004-03-04 Fujitsu Ltd Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
CN201808268U (en) * 2010-03-15 2011-04-27 株式会社日立工业设备技术 Laminating machine
TW201341161A (en) * 2012-04-11 2013-10-16 Hitachi High Tech Corp Substrate laminating apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3363308B2 (en) * 1996-04-18 2003-01-08 株式会社日立製作所 Substrate assembling method and liquid crystal display cell manufacturing method
JP3022879B1 (en) * 1999-03-08 2000-03-21 鹿児島日本電気株式会社 Substrate bonding equipment for LCD panel manufacturing
US6502324B2 (en) * 2000-12-12 2003-01-07 International Business Machines Corporation Method of alignment between sheet materials, method of alignment, substrate assembling method and aligning apparatus
JP3577546B2 (en) * 2001-02-08 2004-10-13 株式会社 日立インダストリイズ Substrate assembling method and assembling apparatus
JP2003098533A (en) * 2001-09-26 2003-04-03 Shibaura Mechatronics Corp Apparatus and method for bonding substrates
US7416010B2 (en) * 2002-03-08 2008-08-26 Lg Display Co., Ltd. Bonding apparatus and system for fabricating liquid crystal display device
TW594297B (en) * 2002-07-19 2004-06-21 Hitachi Ind Co Ltd Substrate assembling device
JP3694691B2 (en) * 2003-01-29 2005-09-14 株式会社 日立インダストリイズ Large substrate assembly apparatus and assembly method
JP4078487B2 (en) * 2005-05-25 2008-04-23 株式会社日立プラントテクノロジー Substrate assembly apparatus and method
KR20070100563A (en) * 2006-04-07 2007-10-11 주식회사 에이디피엔지니어링 Board Bonder and Board Bonding Method
JP4379435B2 (en) * 2006-05-17 2009-12-09 株式会社日立プラントテクノロジー Board assembly apparatus and board assembly method using the same
KR100770409B1 (en) 2007-04-05 2007-10-25 세호로보트산업 주식회사 How to attach flexible materials
TWI520262B (en) * 2008-04-02 2016-02-01 Ａｐ系統股份有限公司 Substrate assembling apparatus
KR101110429B1 (en) * 2009-04-08 2012-03-30 시바우라 메카트로닉스 가부시키가이샤 Substrate bonding apparatus and substrate bonding method
JP2012124444A (en) * 2010-12-06 2012-06-28 Shinko Engineering Kk Substrate bonding method
JP5759348B2 (en) * 2011-11-30 2015-08-05 株式会社Ｓｃｒｅｅｎホールディングス Pattern forming apparatus and pattern forming method
JP5968456B2 (en) 2012-10-31 2016-08-10 中外炉工業株式会社 Substrate holding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004070274A (en) * 2002-06-11 2004-03-04 Fujitsu Ltd Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
CN201808268U (en) * 2010-03-15 2011-04-27 株式会社日立工业设备技术 Laminating machine
TW201341161A (en) * 2012-04-11 2013-10-16 Hitachi High Tech Corp Substrate laminating apparatus

Also Published As

Publication number Publication date
CN105607307B (en) 2019-04-09
CN105607307A (en) 2016-05-25
JP5810207B1 (en) 2015-11-11
KR101680744B1 (en) 2016-11-29
CN110082935B (en) 2022-03-11
KR102636535B1 (en) 2024-02-15
KR102305145B1 (en) 2021-09-28
TW201629583A (en) 2016-08-16
KR102454458B1 (en) 2022-10-14
KR20210118782A (en) 2021-10-01
KR20160138363A (en) 2016-12-05
KR20220142980A (en) 2022-10-24
JP2016095420A (en) 2016-05-26
KR20160058047A (en) 2016-05-24
CN110082935A (en) 2019-08-02

Similar Documents

Publication Publication Date Title
BR112016017664A2 (en)
BR112016018555A2 (en)
BR112016017283A2 (en)
BR112016016308A2 (en)
BR112016018238A2 (en)
BR112016018633A2 (en)
BR112016017207A2 (en)
BR112016015311A2 (en)
BR112016016451A2 (en)
BR112016018185A2 (en)
BR112016016558A2 (en)
BR112016016372A2 (en)
BR112016016467A2 (en)
BR112016015256A2 (en)
BR112016015642A2 (en)
BR112016009523A2 (en)
BR112016018510A2 (en)
BR112016017960A2 (en)
BR112015033030A2 (en)
BR112016018632A2 (en)
BR112016000228A2 (en)
BR112016017927A2 (en)
BR112016015542A2 (en)
TWI561889B (en)
BR112016003522A2 (en)