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TWI561574B - - Google Patents

Info

Publication number
TWI561574B
TWI561574B TW104102031A TW104102031A TWI561574B TW I561574 B TWI561574 B TW I561574B TW 104102031 A TW104102031 A TW 104102031A TW 104102031 A TW104102031 A TW 104102031A TW I561574 B TWI561574 B TW I561574B
Authority
TW
Taiwan
Application number
TW104102031A
Other languages
Chinese (zh)
Other versions
TW201533144A (en
Inventor
Tomoya Egawa
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of TW201533144A publication Critical patent/TW201533144A/en
Application granted granted Critical
Publication of TWI561574B publication Critical patent/TWI561574B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW104102031A 2014-01-23 2015-01-22 Sealing composition TW201533144A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014010770 2014-01-23

Publications (2)

Publication Number Publication Date
TW201533144A TW201533144A (en) 2015-09-01
TWI561574B true TWI561574B (en) 2016-12-11

Family

ID=53681329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104102031A TW201533144A (en) 2014-01-23 2015-01-22 Sealing composition

Country Status (5)

Country Link
JP (1) JP5914778B2 (en)
KR (1) KR101641480B1 (en)
CN (1) CN105557068B (en)
TW (1) TW201533144A (en)
WO (1) WO2015111525A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5926458B2 (en) * 2013-05-28 2016-05-25 株式会社ダイセル Curable composition for optical semiconductor encapsulation
KR20220098297A (en) * 2014-05-20 2022-07-11 세키스이가가쿠 고교가부시키가이샤 Sealing agent for organic electroluminescence display element
KR102624114B1 (en) * 2015-11-30 2024-01-12 주식회사 다이셀 Sealing composition
JP6022725B1 (en) * 2016-03-31 2016-11-09 Ｌｕｍｉｏｔｅｃ株式会社 Organic EL panel and manufacturing method thereof
KR101922296B1 (en) * 2016-06-23 2018-11-26 삼성에스디아이 주식회사 Solid state epoxy resin composition for encapsulating semicomductor device, encapsulant and semiconductor device comprising the same
JP6329330B1 (en) 2016-09-07 2018-05-23 リンテック株式会社 Sealing sheet and sealing body
CN109642134B (en) 2016-09-07 2021-07-06 琳得科株式会社 Adhesive composition, sealing sheet and sealing body
US11377518B2 (en) 2016-09-30 2022-07-05 Lg Chem, Ltd. Adhesive composition
WO2018106091A1 (en) 2016-12-09 2018-06-14 주식회사 엘지화학 Sealant composition
TWI687448B (en) 2016-12-09 2020-03-11 南韓商Ｌｇ化學股份有限公司 Encapsulating composition
US11171309B2 (en) 2016-12-09 2021-11-09 Lg Chem, Ltd. Encapsulating composition
WO2018106085A1 (en) 2016-12-09 2018-06-14 주식회사 엘지화학 Sealant composition
KR102468900B1 (en) 2017-05-31 2022-11-18 린텍 가부시키가이샤 Sheet-like adhesives, gas barrier laminates, and encapsulants
JP6665136B2 (en) * 2017-07-28 2020-03-13 株式会社ダイセル Monomer mixture and curable composition containing the same
JP6538774B2 (en) 2017-07-28 2019-07-03 株式会社ダイセル Monomer mixture and curable composition containing the same
TWI688142B (en) 2017-09-01 2020-03-11 南韓商Ｌｇ化學股份有限公司 Organic electronic device and method for preparing the same
KR102716967B1 (en) 2018-01-31 2024-10-11 니폰 제온 가부시키가이샤 Resin films and organic electroluminescent devices
US11970606B2 (en) 2018-01-31 2024-04-30 Zeon Corporation Resin composition, resin film and organic electroluminescent device
JP6547110B1 (en) * 2018-05-08 2019-07-24 ナトコ株式会社 Active energy ray curable ink composition
WO2020196669A1 (en) * 2019-03-27 2020-10-01 デンカ株式会社 Composition
JP7440498B2 (en) * 2019-04-23 2024-02-28 デンカ株式会社 Composition
KR20220038275A (en) * 2019-07-17 2022-03-28 세키스이가가쿠 고교가부시키가이샤 Encapsulant for organic EL display elements
CN116249722A (en) * 2021-03-31 2023-06-09 电化株式会社 Composition, cured body and organic EL display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW500791B (en) * 1999-08-12 2002-09-01 Mitsui Chemicals Inc Photo-curable resin composition for sealing material and sealing method
US20090026934A1 (en) * 2006-01-24 2009-01-29 Jun Fujita Adhesive encapsulating composition film and organic electroluminescence device
CN102822731A (en) * 2010-12-13 2012-12-12 Dic株式会社 Cationic curing liquid crystal sealant and liquid crystal display element
JP2013170223A (en) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd Curable resin composition for vapor deposition, resin protection film, and organic optical device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4384509B2 (en) 2003-01-09 2009-12-16 積水化学工業株式会社 Method for sealing organic electroluminescent element and organic electroluminescent element
JP5457078B2 (en) * 2009-06-05 2014-04-02 株式会社ダイセル Cationic polymerizable resin composition and cured product thereof
JP5651421B2 (en) * 2010-10-07 2015-01-14 三井化学株式会社 Sealing composition and sealing sheet using the same
JP2013157204A (en) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd Sealant for organic electroluminescent display element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW500791B (en) * 1999-08-12 2002-09-01 Mitsui Chemicals Inc Photo-curable resin composition for sealing material and sealing method
US20090026934A1 (en) * 2006-01-24 2009-01-29 Jun Fujita Adhesive encapsulating composition film and organic electroluminescence device
CN102822731A (en) * 2010-12-13 2012-12-12 Dic株式会社 Cationic curing liquid crystal sealant and liquid crystal display element
JP2013170223A (en) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd Curable resin composition for vapor deposition, resin protection film, and organic optical device

Also Published As

Publication number Publication date
WO2015111525A1 (en) 2015-07-30
CN105557068A (en) 2016-05-04
CN105557068B (en) 2017-06-09
TW201533144A (en) 2015-09-01
JPWO2015111525A1 (en) 2017-03-23
JP5914778B2 (en) 2016-05-11
KR101641480B1 (en) 2016-07-20
KR20160011228A (en) 2016-01-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees