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TWI561328B - Swirl jet flow auxiliary manufacturing device - Google Patents

Swirl jet flow auxiliary manufacturing device

Info

Publication number
TWI561328B
TWI561328B TW103130451A TW103130451A TWI561328B TW I561328 B TWI561328 B TW I561328B TW 103130451 A TW103130451 A TW 103130451A TW 103130451 A TW103130451 A TW 103130451A TW I561328 B TWI561328 B TW I561328B
Authority
TW
Taiwan
Prior art keywords
manufacturing device
jet flow
flow auxiliary
swirl jet
auxiliary manufacturing
Prior art date
Application number
TW103130451A
Other languages
Chinese (zh)
Other versions
TW201609298A (en
Inventor
Chao Ching Ho
yan min Chen
Chia Lung Kuo
Jin Chen Hsu
Yuan Jen Chang
Original Assignee
Univ Nat Yunlin Sci & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Yunlin Sci & Tech filed Critical Univ Nat Yunlin Sci & Tech
Priority to TW103130451A priority Critical patent/TWI561328B/en
Publication of TW201609298A publication Critical patent/TW201609298A/en
Application granted granted Critical
Publication of TWI561328B publication Critical patent/TWI561328B/en

Links

TW103130451A 2014-09-03 2014-09-03 Swirl jet flow auxiliary manufacturing device TWI561328B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103130451A TWI561328B (en) 2014-09-03 2014-09-03 Swirl jet flow auxiliary manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103130451A TWI561328B (en) 2014-09-03 2014-09-03 Swirl jet flow auxiliary manufacturing device

Publications (2)

Publication Number Publication Date
TW201609298A TW201609298A (en) 2016-03-16
TWI561328B true TWI561328B (en) 2016-12-11

Family

ID=56084974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103130451A TWI561328B (en) 2014-09-03 2014-09-03 Swirl jet flow auxiliary manufacturing device

Country Status (1)

Country Link
TW (1) TWI561328B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727899B (en) * 2023-07-12 2024-01-30 大辽激光科技(宁波)有限公司 Device for laser deep small hole machining and laser rotary cutting machining dust removing method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873413A (en) * 1986-11-20 1989-10-10 Nec Corporation Method and apparatus for writing a line on a patterned substrate
US5229081A (en) * 1988-02-12 1993-07-20 Regal Joint Co., Ltd. Apparatus for semiconductor process including photo-excitation process
TW498008B (en) * 2000-08-22 2002-08-11 Nippon Electric Co Laser correction method and apparatus
US20040226927A1 (en) * 2003-05-16 2004-11-18 Hiroshi Morikazu Laser beam processing machine
WO2005118210A1 (en) * 2004-05-28 2005-12-15 Cambridge Display Technology Limited Apparatus and method using a gas vortex for extracting debris during laser ablation
CN1986138A (en) * 2005-12-22 2007-06-27 索尼株式会社 Laser beam machining apparatus, its machining method, and mechanism and method for collecting debris
TW200728011A (en) * 2005-09-07 2007-08-01 Disco Corp Laser beam processing machine
TW200734100A (en) * 2006-03-07 2007-09-16 Sony Corp Laser processing apparatus, laser processing head and the laser processing method
TW201021952A (en) * 2008-12-04 2010-06-16 Ind Tech Res Inst Laser processing apparatus and method therefor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873413A (en) * 1986-11-20 1989-10-10 Nec Corporation Method and apparatus for writing a line on a patterned substrate
US5229081A (en) * 1988-02-12 1993-07-20 Regal Joint Co., Ltd. Apparatus for semiconductor process including photo-excitation process
TW498008B (en) * 2000-08-22 2002-08-11 Nippon Electric Co Laser correction method and apparatus
US20040226927A1 (en) * 2003-05-16 2004-11-18 Hiroshi Morikazu Laser beam processing machine
WO2005118210A1 (en) * 2004-05-28 2005-12-15 Cambridge Display Technology Limited Apparatus and method using a gas vortex for extracting debris during laser ablation
TW200728011A (en) * 2005-09-07 2007-08-01 Disco Corp Laser beam processing machine
CN1986138A (en) * 2005-12-22 2007-06-27 索尼株式会社 Laser beam machining apparatus, its machining method, and mechanism and method for collecting debris
TW200734100A (en) * 2006-03-07 2007-09-16 Sony Corp Laser processing apparatus, laser processing head and the laser processing method
TW201021952A (en) * 2008-12-04 2010-06-16 Ind Tech Res Inst Laser processing apparatus and method therefor

Also Published As

Publication number Publication date
TW201609298A (en) 2016-03-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees