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TWI561317B - Substrate cleaning apparatus and substrate processing apparatus - Google Patents

Substrate cleaning apparatus and substrate processing apparatus

Info

Publication number
TWI561317B
TWI561317B TW102129780A TW102129780A TWI561317B TW I561317 B TWI561317 B TW I561317B TW 102129780 A TW102129780 A TW 102129780A TW 102129780 A TW102129780 A TW 102129780A TW I561317 B TWI561317 B TW I561317B
Authority
TW
Taiwan
Prior art keywords
substrate
processing apparatus
substrate processing
cleaning apparatus
substrate cleaning
Prior art date
Application number
TW102129780A
Other languages
English (en)
Other versions
TW201416141A (zh
Inventor
Hideaki Tanaka
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW201416141A publication Critical patent/TW201416141A/zh
Application granted granted Critical
Publication of TWI561317B publication Critical patent/TWI561317B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • H10P72/0412—
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B15/00—Other brushes; Brushes with additional arrangements
    • A46B15/0002—Arrangements for enhancing monitoring or controlling the brushing process
    • A46B15/0004—Arrangements for enhancing monitoring or controlling the brushing process with a controlling means
    • A46B15/0012—Arrangements for enhancing monitoring or controlling the brushing process with a controlling means with a pressure controlling device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H10P52/00—
    • H10P70/00—
    • H10P70/60—
    • H10P72/0414—
    • H10P72/0428—
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B2200/00—Brushes characterized by their functions, uses or applications
    • A46B2200/30—Brushes for cleaning or polishing
TW102129780A 2012-08-20 2013-08-20 Substrate cleaning apparatus and substrate processing apparatus TWI561317B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012181670A JP5878441B2 (ja) 2012-08-20 2012-08-20 基板洗浄装置及び基板処理装置

Publications (2)

Publication Number Publication Date
TW201416141A TW201416141A (zh) 2014-05-01
TWI561317B true TWI561317B (en) 2016-12-11

Family

ID=50149948

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102129780A TWI561317B (en) 2012-08-20 2013-08-20 Substrate cleaning apparatus and substrate processing apparatus
TW105134529A TW201706045A (zh) 2012-08-20 2013-08-20 基板清洗裝置及基板處理裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105134529A TW201706045A (zh) 2012-08-20 2013-08-20 基板清洗裝置及基板處理裝置

Country Status (7)

Country Link
US (2) US9978617B2 (zh)
JP (1) JP5878441B2 (zh)
KR (2) KR101919652B1 (zh)
CN (1) CN104584197B (zh)
SG (2) SG10201610272PA (zh)
TW (2) TWI561317B (zh)
WO (1) WO2014030640A1 (zh)

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JP6262983B2 (ja) * 2012-10-25 2018-01-17 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP6279276B2 (ja) 2013-10-03 2018-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP2015220402A (ja) * 2014-05-20 2015-12-07 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
KR102281074B1 (ko) * 2014-10-07 2021-07-23 주식회사 케이씨텍 브러쉬 세정 장치
JP6328577B2 (ja) 2015-02-24 2018-05-23 株式会社荏原製作所 荷重測定装置および荷重測定方法
JP6646460B2 (ja) 2016-02-15 2020-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6767834B2 (ja) 2016-09-29 2020-10-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6941464B2 (ja) 2017-04-07 2021-09-29 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6758247B2 (ja) 2017-05-10 2020-09-23 株式会社荏原製作所 洗浄装置および基板処理装置、洗浄装置のメンテナンス方法、並びにプログラム
JP6823541B2 (ja) 2017-05-30 2021-02-03 株式会社荏原製作所 キャリブレーション方法およびキャリブレーションプログラム
TWI705519B (zh) * 2017-07-25 2020-09-21 日商Ｈｏｙａ股份有限公司 基板處理裝置、基板處理方法、光罩洗淨方法及光罩製造方法
CN107871697B (zh) * 2017-10-30 2020-04-14 安徽世林照明股份有限公司 一种led生产用外延片清洗装置及清洗工艺
JP7232615B2 (ja) * 2017-12-13 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
TWI834489B (zh) 2017-12-13 2024-03-01 日商東京威力科創股份有限公司 基板處理裝置
TWI645467B (zh) * 2017-12-20 2018-12-21 弘塑科技股份有限公司 晶圓清洗設備及控制晶圓清洗設備之毛刷組之方法
CN109950170B (zh) * 2017-12-20 2023-04-04 弘塑科技股份有限公司 晶圆清洗设备及控制晶圆清洗设备的毛刷组的方法
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN111318940B (zh) * 2018-08-28 2021-06-08 绍兴博弈机械设备研发有限公司 一种应用于文玩核桃的无序初步加工设备及方法
CN109540046B (zh) * 2018-12-29 2024-02-20 广东中鹏新能科技有限公司 全自动化窑炉辊棒检测装置
KR102644399B1 (ko) * 2019-06-05 2024-03-08 주식회사 케이씨텍 기판 처리 장치
CN110743833A (zh) * 2019-09-24 2020-02-04 徐州吉瑞合金铸造有限公司 一种合金铸造的清洁装置
KR102788872B1 (ko) * 2020-05-21 2025-03-31 삼성전자주식회사 틸팅 가능한 롤 브러쉬를 갖는 기판 세정 장치
JP7093390B2 (ja) * 2020-10-15 2022-06-29 株式会社荏原製作所 基板洗浄装置
JP7482768B2 (ja) 2020-12-16 2024-05-14 株式会社荏原製作所 洗浄部材用洗浄装置、洗浄部材の洗浄方法及び基板洗浄方法
CN112845205B (zh) * 2020-12-23 2022-01-11 河南科技大学第一附属医院 一种用于除颤仪电极板的抽吸式清洁盒
JP7653785B2 (ja) * 2020-12-28 2025-03-31 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP7588521B2 (ja) * 2021-02-15 2024-11-22 株式会社荏原製作所 基板洗浄装置、基板洗浄装置の異常判定方法、基板洗浄装置の異常判定プログラム
CN115831821B (zh) * 2022-12-12 2023-06-06 上海世禹精密设备股份有限公司 一种基板清洗干燥装置
JP2025171626A (ja) * 2024-05-10 2025-11-20 株式会社荏原製作所 基板洗浄方法、基板洗浄装置、基板洗浄プログラムおよび基板処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050602A (ja) * 2000-08-01 2002-02-15 Ebara Corp 基板洗浄装置
JP2002313767A (ja) * 2001-04-17 2002-10-25 Ebara Corp 基板処理装置
JP2008130820A (ja) * 2006-11-21 2008-06-05 Tokyo Seimitsu Co Ltd 洗浄装置

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JPS59193029A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd 洗浄方法およびその装置
JP3326642B2 (ja) * 1993-11-09 2002-09-24 ソニー株式会社 基板の研磨後処理方法およびこれに用いる研磨装置
JP3292367B2 (ja) 1994-05-12 2002-06-17 東京エレクトロン株式会社 洗浄装置及び洗浄方法
US5475889A (en) 1994-07-15 1995-12-19 Ontrak Systems, Inc. Automatically adjustable brush assembly for cleaning semiconductor wafers
JPH10242092A (ja) * 1997-02-25 1998-09-11 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US6116990A (en) * 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
JP2000164555A (ja) * 1998-11-30 2000-06-16 Ebara Corp 基板乾燥装置及び方法
JP4484298B2 (ja) * 1999-02-09 2010-06-16 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシング用の低プロファイル可調整ジンバルシステム
JP2001105298A (ja) 1999-10-04 2001-04-17 Speedfam Co Ltd 流体加圧式キャリアの内圧安定化装置
JP2001293445A (ja) 2000-04-14 2001-10-23 Sony Corp 洗浄装置と、半導体装置の製造方法及び液晶素子の製造方法
JP2002313765A (ja) * 2001-04-17 2002-10-25 Sony Corp ブラシ洗浄装置及びその制御方法
JP5323455B2 (ja) * 2008-11-26 2013-10-23 株式会社荏原製作所 基板処理装置のロール間隙調整方法
US8926760B2 (en) * 2009-02-20 2015-01-06 Orthodyne Electronics Corporation Systems and methods for processing solar substrates
JPWO2010131581A1 (ja) * 2009-05-12 2012-11-01 シャープ株式会社 基板洗浄方法および基板洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050602A (ja) * 2000-08-01 2002-02-15 Ebara Corp 基板洗浄装置
JP2002313767A (ja) * 2001-04-17 2002-10-25 Ebara Corp 基板処理装置
JP2008130820A (ja) * 2006-11-21 2008-06-05 Tokyo Seimitsu Co Ltd 洗浄装置

Also Published As

Publication number Publication date
US10707103B2 (en) 2020-07-07
US9978617B2 (en) 2018-05-22
CN104584197A (zh) 2015-04-29
CN104584197B (zh) 2017-11-24
WO2014030640A1 (ja) 2014-02-27
SG11201501012UA (en) 2015-04-29
KR20180126082A (ko) 2018-11-26
SG10201610272PA (en) 2017-02-27
KR102025600B1 (ko) 2019-09-27
JP5878441B2 (ja) 2016-03-08
US20150221531A1 (en) 2015-08-06
TW201706045A (zh) 2017-02-16
TW201416141A (zh) 2014-05-01
JP2014038983A (ja) 2014-02-27
US20180240687A1 (en) 2018-08-23
KR20150043387A (ko) 2015-04-22
KR101919652B1 (ko) 2018-11-16

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