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TWI561277B - Laser system for removing marks and method thereof - Google Patents

Laser system for removing marks and method thereof

Info

Publication number
TWI561277B
TWI561277B TW104137656A TW104137656A TWI561277B TW I561277 B TWI561277 B TW I561277B TW 104137656 A TW104137656 A TW 104137656A TW 104137656 A TW104137656 A TW 104137656A TW I561277 B TWI561277 B TW I561277B
Authority
TW
Taiwan
Prior art keywords
laser system
removing marks
marks
laser
Prior art date
Application number
TW104137656A
Other languages
Chinese (zh)
Other versions
TW201714633A (en
Inventor
da-yong Min
Ching-Fu Hsu
Jia-Chi You
Ta-Yuan Tai
Ying Cheng
Kun Zhao
Original Assignee
Wuhan huagong laser engineering co ltd
Wistron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan huagong laser engineering co ltd, Wistron Corp filed Critical Wuhan huagong laser engineering co ltd
Application granted granted Critical
Publication of TWI561277B publication Critical patent/TWI561277B/en
Publication of TW201714633A publication Critical patent/TW201714633A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW104137656A 2015-10-16 2015-11-16 Laser system for removing marks and method thereof TWI561277B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510676979.9A CN106583929A (en) 2015-10-16 2015-10-16 Laser mark removal system and mark removal method thereof

Publications (2)

Publication Number Publication Date
TWI561277B true TWI561277B (en) 2016-12-11
TW201714633A TW201714633A (en) 2017-05-01

Family

ID=58227240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104137656A TWI561277B (en) 2015-10-16 2015-11-16 Laser system for removing marks and method thereof

Country Status (2)

Country Link
CN (1) CN106583929A (en)
TW (1) TWI561277B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107561851B (en) * 2017-10-12 2023-08-22 佛山市恒灏科技有限公司 Laser mark eliminating device for matched plate punching machine
CN108994446B (en) * 2018-08-30 2021-03-05 合肥联宝信息技术有限公司 Device and method for removing white spots on surface of material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656229A (en) * 1990-02-20 1997-08-12 Nikon Corporation Method for removing a thin film layer
TW200513232A (en) * 2003-08-19 2005-04-16 Gen Hospital Corp Method and apparatus for reducing the appearance of skin markings
WO2007049064A1 (en) * 2005-10-28 2007-05-03 Powerlase Limited A method of laser marking a surface
TW201236707A (en) * 2011-03-15 2012-09-16 Crystalvue Medical Corp Optical apparatus and operating method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6720519B2 (en) * 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
CN102013332B (en) * 2010-11-24 2012-03-07 华中科技大学 Method and device for preparing photo anode in flexible solar cell through selective laser sintering
CN103869473B (en) * 2012-12-14 2016-08-03 中国科学院力学研究所 Laser beam reshaping method, Laser hardening equipment and laser continuous scanning of a surface method for curing
CN103128450B (en) * 2013-02-19 2015-08-19 深圳市海目星激光科技有限公司 A kind of Ultra-Violet Laser processing unit (plant)

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656229A (en) * 1990-02-20 1997-08-12 Nikon Corporation Method for removing a thin film layer
TW200513232A (en) * 2003-08-19 2005-04-16 Gen Hospital Corp Method and apparatus for reducing the appearance of skin markings
WO2007049064A1 (en) * 2005-10-28 2007-05-03 Powerlase Limited A method of laser marking a surface
TW201236707A (en) * 2011-03-15 2012-09-16 Crystalvue Medical Corp Optical apparatus and operating method thereof

Also Published As

Publication number Publication date
TW201714633A (en) 2017-05-01
CN106583929A (en) 2017-04-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees