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TWI560823B - Heat radiation structure, method for making the same, and device using the same - Google Patents

Heat radiation structure, method for making the same, and device using the same

Info

Publication number
TWI560823B
TWI560823B TW104100619A TW104100619A TWI560823B TW I560823 B TWI560823 B TW I560823B TW 104100619 A TW104100619 A TW 104100619A TW 104100619 A TW104100619 A TW 104100619A TW I560823 B TWI560823 B TW I560823B
Authority
TW
Taiwan
Prior art keywords
same
making
heat radiation
radiation structure
heat
Prior art date
Application number
TW104100619A
Other languages
Chinese (zh)
Other versions
TW201624647A (en
Inventor
Yu-Cheng Huang
Original Assignee
Qi Ding Technology Qinhuangdao Co Ltd
Zhen Ding Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qi Ding Technology Qinhuangdao Co Ltd, Zhen Ding Technology Co Ltd filed Critical Qi Ding Technology Qinhuangdao Co Ltd
Publication of TW201624647A publication Critical patent/TW201624647A/en
Application granted granted Critical
Publication of TWI560823B publication Critical patent/TWI560823B/en

Links

TW104100619A 2014-12-18 2015-01-09 Heat radiation structure, method for making the same, and device using the same TWI560823B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410786714.XA CN105764298A (en) 2014-12-18 2014-12-18 Heat dissipation structure, manufacturing method therefor, and device employing heat dissipation structure

Publications (2)

Publication Number Publication Date
TW201624647A TW201624647A (en) 2016-07-01
TWI560823B true TWI560823B (en) 2016-12-01

Family

ID=56340085

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104100619A TWI560823B (en) 2014-12-18 2015-01-09 Heat radiation structure, method for making the same, and device using the same

Country Status (2)

Country Link
CN (1) CN105764298A (en)
TW (1) TWI560823B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10541156B1 (en) 2018-10-31 2020-01-21 International Business Machines Corporation Multi integrated circuit chip carrier package
CN110494016B (en) * 2019-08-06 2020-10-23 华为技术有限公司 Heat dissipation device and terminal electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200516736A (en) * 2003-11-05 2005-05-16 Siliconware Precision Industries Co Ltd Semiconductor package with heat sink
TW200936028A (en) * 2008-02-05 2009-08-16 Thermoshuttle Co Ltd Thermal module and system applied the phase-change metal thermal interface material
TW201426919A (en) * 2012-11-02 2014-07-01 輝達公司 Opening the solder mask and/or dielectric to improve package coplanarity to increase the thickness and contact area of the cover or ring

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2758975Y (en) * 2004-12-14 2006-02-15 业强科技股份有限公司 Structural Improvement of Vapor Plate
CN201894031U (en) * 2010-11-09 2011-07-06 讯凯国际股份有限公司 vapor chamber
CN103476223A (en) * 2012-06-08 2013-12-25 富瑞精密组件（昆山）有限公司 Phase change heat dissipation device
CN203454876U (en) * 2013-08-29 2014-02-26 讯强电子(惠州)有限公司 Temperature-uniforming plate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200516736A (en) * 2003-11-05 2005-05-16 Siliconware Precision Industries Co Ltd Semiconductor package with heat sink
TW200936028A (en) * 2008-02-05 2009-08-16 Thermoshuttle Co Ltd Thermal module and system applied the phase-change metal thermal interface material
TW201426919A (en) * 2012-11-02 2014-07-01 輝達公司 Opening the solder mask and/or dielectric to improve package coplanarity to increase the thickness and contact area of the cover or ring

Also Published As

Publication number Publication date
CN105764298A (en) 2016-07-13
TW201624647A (en) 2016-07-01

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