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TWI560813B - Method for manufacturing package on package - Google Patents

Method for manufacturing package on package

Info

Publication number
TWI560813B
TWI560813B TW104137783A TW104137783A TWI560813B TW I560813 B TWI560813 B TW I560813B TW 104137783 A TW104137783 A TW 104137783A TW 104137783 A TW104137783 A TW 104137783A TW I560813 B TWI560813 B TW I560813B
Authority
TW
Taiwan
Prior art keywords
package
manufacturing
manufacturing package
Prior art date
Application number
TW104137783A
Other languages
Chinese (zh)
Other versions
TW201620082A (en
Inventor
Jong Myoung Choi
Hansung Lee
Sang Hoon Lee
Original Assignee
Protec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Protec Co Ltd filed Critical Protec Co Ltd
Publication of TW201620082A publication Critical patent/TW201620082A/en
Application granted granted Critical
Publication of TWI560813B publication Critical patent/TWI560813B/en

Links

Classifications

    • H10W90/00—
    • H10W40/10—
    • H10W40/22—
    • H10W40/259—
    • H10W74/00—
    • H10W74/10—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/20—
TW104137783A 2014-11-18 2015-11-17 Method for manufacturing package on package TWI560813B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140160693A KR101619455B1 (en) 2014-11-18 2014-11-18 Method for Manufacturing Package On Package

Publications (2)

Publication Number Publication Date
TW201620082A TW201620082A (en) 2016-06-01
TWI560813B true TWI560813B (en) 2016-12-01

Family

ID=55989292

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104137783A TWI560813B (en) 2014-11-18 2015-11-17 Method for manufacturing package on package

Country Status (3)

Country Link
KR (1) KR101619455B1 (en)
CN (1) CN105609492B (en)
TW (1) TWI560813B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9824998B2 (en) * 2015-02-06 2017-11-21 Semigear, Inc. Device packaging facility and method, and device processing apparatus utilizing DEHT
CN108328562B (en) * 2018-02-28 2024-05-17 山东盛芯电子科技有限公司 Packaging method of pressure sensor packaging structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878435B2 (en) * 2001-07-19 2005-04-12 Korea Advanced Institute Of Science And Technology High adhesion triple layered anisotropic conductive adhesive film
US7227267B2 (en) * 2004-10-11 2007-06-05 Samsung Electro-Mechanics Co., Ltd. Semiconductor package using flip-chip mounting technique
JP2011146408A (en) * 2008-03-28 2011-07-28 Nec Corp Wiring board, semiconductor package, and method of manufacturing the wiring board
US8030200B2 (en) * 2009-06-22 2011-10-04 Electronics And Telecommunications Research Institute Method for fabricating a semiconductor package
US20120049357A1 (en) * 2000-03-10 2012-03-01 Stats Chippac, Ltd. Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003318361A (en) * 2002-04-19 2003-11-07 Fujitsu Ltd Semiconductor device and method of manufacturing the same
KR20070034200A (en) * 2005-09-23 2007-03-28 삼성전자주식회사 Laminated package having adhesive layer and method for manufacturing same
JP5860431B2 (en) * 2013-04-25 2016-02-16 東京エレクトロン株式会社 Joining apparatus, joining system, and joining method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120049357A1 (en) * 2000-03-10 2012-03-01 Stats Chippac, Ltd. Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package
US6878435B2 (en) * 2001-07-19 2005-04-12 Korea Advanced Institute Of Science And Technology High adhesion triple layered anisotropic conductive adhesive film
US7227267B2 (en) * 2004-10-11 2007-06-05 Samsung Electro-Mechanics Co., Ltd. Semiconductor package using flip-chip mounting technique
JP2011146408A (en) * 2008-03-28 2011-07-28 Nec Corp Wiring board, semiconductor package, and method of manufacturing the wiring board
US8030200B2 (en) * 2009-06-22 2011-10-04 Electronics And Telecommunications Research Institute Method for fabricating a semiconductor package

Also Published As

Publication number Publication date
CN105609492B (en) 2018-09-07
TW201620082A (en) 2016-06-01
KR101619455B1 (en) 2016-05-11
CN105609492A (en) 2016-05-25

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