[go: up one dir, main page]

TWI560715B - A nonvoltile resistance memory and its operation thereof - Google Patents

A nonvoltile resistance memory and its operation thereof

Info

Publication number
TWI560715B
TWI560715B TW104124275A TW104124275A TWI560715B TW I560715 B TWI560715 B TW I560715B TW 104124275 A TW104124275 A TW 104124275A TW 104124275 A TW104124275 A TW 104124275A TW I560715 B TWI560715 B TW I560715B
Authority
TW
Taiwan
Prior art keywords
nonvoltile
resistance memory
memory
resistance
nonvoltile resistance
Prior art date
Application number
TW104124275A
Other languages
English (en)
Other versions
TW201604872A (zh
Inventor
Steve S Chung
Eray Hsieh
Original Assignee
Univ Nat Chiao Tung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Chiao Tung filed Critical Univ Nat Chiao Tung
Publication of TW201604872A publication Critical patent/TW201604872A/zh
Application granted granted Critical
Publication of TWI560715B publication Critical patent/TWI560715B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0007Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0026Bit-line or column circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0028Word-line or row circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/841Electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • G11C2013/0045Read using current through the cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • G11C2013/005Read using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/50Resistive cell structure aspects
    • G11C2213/53Structure wherein the resistive material being in a transistor, e.g. gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/24Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/883Oxides or nitrides
    • H10N70/8833Binary metal oxides, e.g. TaOx

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Memories (AREA)
TW104124275A 2014-07-28 2015-07-27 A nonvoltile resistance memory and its operation thereof TWI560715B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201462029582P 2014-07-28 2014-07-28

Publications (2)

Publication Number Publication Date
TW201604872A TW201604872A (zh) 2016-02-01
TWI560715B true TWI560715B (en) 2016-12-01

Family

ID=55167237

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104124275A TWI560715B (en) 2014-07-28 2015-07-27 A nonvoltile resistance memory and its operation thereof

Country Status (4)

Country Link
US (1) US9336869B2 (zh)
CN (1) CN105304126B (zh)
TW (1) TWI560715B (zh)
WO (1) WO2016015610A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI699915B (zh) * 2018-01-10 2020-07-21 華邦電子股份有限公司 一次性編程電阻式隨機存取記憶體位元及其形成方法與一次性編程電阻式隨機存取記憶體

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3123522A4 (en) * 2014-03-27 2017-11-22 Intel Corporation Multiplexor logic functions implemented with circuits having tunneling field effect transistors (tfets)
US10379737B2 (en) * 2015-10-19 2019-08-13 Apple Inc. Devices, methods, and graphical user interfaces for keyboard interface functionalities
CN105788632B (zh) * 2016-02-26 2019-04-02 江苏时代全芯存储科技有限公司 记忆体电路
WO2017171780A1 (en) * 2016-03-31 2017-10-05 Intel Corporation 1t1r rram architecture
US10341122B2 (en) * 2016-07-15 2019-07-02 Hiroshi Watanabe Electronic appliance and network of the same
CN107887389B (zh) * 2016-09-30 2020-08-04 财团法人交大思源基金会 集成电路记忆体及其操作方法
US11151296B2 (en) * 2018-05-18 2021-10-19 Taiwan Semiconductor Manufacturing Company, Ltd. Memory cell array circuit
US11017856B1 (en) * 2020-02-18 2021-05-25 Applied Materials, Inc. Soft reset for multi-level programming of memory cells in non-Von Neumann architectures
US11764255B2 (en) * 2021-04-28 2023-09-19 National Central University Memory circuit, memory device and operation method thereof
US20250006271A1 (en) * 2023-06-28 2025-01-02 Eraytroniks Co., Ltd. Memory array circuit, ternary content addressable memory and operation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050094457A1 (en) * 1999-06-10 2005-05-05 Symetrix Corporation Ferroelectric memory and method of operating same
US6940740B2 (en) * 2001-06-22 2005-09-06 Matsushita Electric Industrial Co., Ltd. Multilevel semiconductor memory device and method for driving the same as a neuron element in a neural network computer
US20110228585A1 (en) * 2010-03-16 2011-09-22 Samsung Electronics Co., Ltd. Variable resistance memory device and related method of operation
US20140169060A1 (en) * 2012-12-14 2014-06-19 Palo Alto Research Center Incorporated Pulse Generator and Ferroelectric Memory Circuit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6746910B2 (en) * 2002-09-30 2004-06-08 Sharp Laboratories Of America, Inc. Method of fabricating self-aligned cross-point memory array
US8014199B2 (en) * 2006-05-22 2011-09-06 Spansion Llc Memory system with switch element
CN201965932U (zh) * 2010-12-30 2011-09-07 天津南大强芯半导体芯片设计有限公司 一种新型存储器电路
US20130148404A1 (en) * 2011-12-08 2013-06-13 Abhijit Bandyopadhyay Antifuse-based memory cells having multiple memory states and methods of forming the same
CN102709192A (zh) * 2012-06-21 2012-10-03 复旦大学 一种集成阻变存储器的mos晶体管结构的制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050094457A1 (en) * 1999-06-10 2005-05-05 Symetrix Corporation Ferroelectric memory and method of operating same
US6940740B2 (en) * 2001-06-22 2005-09-06 Matsushita Electric Industrial Co., Ltd. Multilevel semiconductor memory device and method for driving the same as a neuron element in a neural network computer
US20110228585A1 (en) * 2010-03-16 2011-09-22 Samsung Electronics Co., Ltd. Variable resistance memory device and related method of operation
US20140169060A1 (en) * 2012-12-14 2014-06-19 Palo Alto Research Center Incorporated Pulse Generator and Ferroelectric Memory Circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI699915B (zh) * 2018-01-10 2020-07-21 華邦電子股份有限公司 一次性編程電阻式隨機存取記憶體位元及其形成方法與一次性編程電阻式隨機存取記憶體

Also Published As

Publication number Publication date
US9336869B2 (en) 2016-05-10
CN105304126A (zh) 2016-02-03
WO2016015610A1 (en) 2016-02-04
TW201604872A (zh) 2016-02-01
US20160027507A1 (en) 2016-01-28
CN105304126B (zh) 2018-10-26

Similar Documents

Publication Publication Date Title
TWI560715B (en) A nonvoltile resistance memory and its operation thereof
IL247014A0 (en) 6-heteroaryloxy and 6-aryloxy-quinoline-2-carboxamides and their use
GB201418282D0 (en) Storage device and assembly
GB201507766D0 (en) A device
GB201417841D0 (en) Morphable Packer
GB2525904B (en) Memory unit
DK3233227T3 (en) A sensing device and construction elements comprising a sensing device
PL3107946T3 (pl) Poliizomocznik
IL249230A0 (en) A combination that includes glucocorticoid and edo-s101
SG10201506045VA (en) Sorting device and slat
PL3163300T3 (pl) Struktura oporowa
TWI562158B (en) Non-volatile memory device and controller
IL252511A0 (en) An element capable of injecting light
GB2565257B (en) A memory unit
GB201407404D0 (en) A Storage Device
GB201419066D0 (en) A device
GB201407900D0 (en) A seating device
SG11201803277XA (en) Electroentropic memory device
GB201509351D0 (en) A storage device
GB201408710D0 (en) A device
GB201402247D0 (en) A footgauge
TWI561187B (en) A furniture device
PL3009221T3 (pl) Urządzenie do zgrzewania oporowego
ZA201506353B (en) A block element
GB201414191D0 (en) A multi-level memory device