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TWI560787B - Interconnect structure and manufacturing method thereof - Google Patents

Interconnect structure and manufacturing method thereof

Info

Publication number
TWI560787B
TWI560787B TW103116348A TW103116348A TWI560787B TW I560787 B TWI560787 B TW I560787B TW 103116348 A TW103116348 A TW 103116348A TW 103116348 A TW103116348 A TW 103116348A TW I560787 B TWI560787 B TW I560787B
Authority
TW
Taiwan
Prior art keywords
manufacturing
interconnect structure
interconnect
Prior art date
Application number
TW103116348A
Other languages
English (en)
Other versions
TW201508850A (zh
Inventor
Meng Tse Chen
Hsiu Jen Lin
Chih Wei Lin
Ming Da Cheng
Chih-Hang Tung
Chung Shi Liu
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW201508850A publication Critical patent/TW201508850A/zh
Application granted granted Critical
Publication of TWI560787B publication Critical patent/TWI560787B/zh

Links

Classifications

    • H10W90/00—
    • H10W72/90—
    • H10W74/01—
    • H10W72/012—
    • H10W72/01215—
    • H10W72/01225—
    • H10W72/01235—
    • H10W72/01255—
    • H10W72/01935—
    • H10W72/01938—
    • H10W72/072—
    • H10W72/07232—
    • H10W72/07253—
    • H10W72/07255—
    • H10W72/221—
    • H10W72/222—
    • H10W72/223—
    • H10W72/232—
    • H10W72/234—
    • H10W72/241—
    • H10W72/242—
    • H10W72/245—
    • H10W72/251—
    • H10W72/252—
    • H10W72/29—
    • H10W72/923—
    • H10W72/952—
    • H10W74/00—
    • H10W80/314—
    • H10W90/722—
    • H10W90/724—
TW103116348A 2013-08-29 2014-05-08 Interconnect structure and manufacturing method thereof TWI560787B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/013,597 US9331038B2 (en) 2013-08-29 2013-08-29 Semiconductor interconnect structure

Publications (2)

Publication Number Publication Date
TW201508850A TW201508850A (zh) 2015-03-01
TWI560787B true TWI560787B (en) 2016-12-01

Family

ID=52582062

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103116348A TWI560787B (en) 2013-08-29 2014-05-08 Interconnect structure and manufacturing method thereof

Country Status (2)

Country Link
US (3) US9331038B2 (zh)
TW (1) TWI560787B (zh)

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TWI822659B (zh) 2016-10-27 2023-11-21 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
US9917071B1 (en) * 2016-12-07 2018-03-13 Advanced Semiconductor Engineering, Inc. Semiconductor packages
US10707152B2 (en) * 2017-01-16 2020-07-07 Innolux Corporation High-frequency device and manufacturing method thereof
CN108321503B (zh) * 2017-01-16 2020-05-15 群创光电股份有限公司 液晶天线装置
US10515913B2 (en) 2017-03-17 2019-12-24 Invensas Bonding Technologies, Inc. Multi-metal contact structure
US10446441B2 (en) 2017-06-05 2019-10-15 Invensas Corporation Flat metal features for microelectronics applications
WO2019066813A1 (en) * 2017-09-27 2019-04-04 Intel Corporation METHOD, DEVICE AND SYSTEM FOR PROVIDING GRAZED METALLIZATION STRUCTURES
JP6698231B2 (ja) * 2018-02-01 2020-05-27 パナソニック株式会社 半導体装置および半導体装置の製造方法
US10872861B2 (en) * 2018-02-07 2020-12-22 Advanced Semiconductor Engineering, Inc. Kaohsiung, Taiwan Semiconductor packages
US11244916B2 (en) 2018-04-11 2022-02-08 Invensas Bonding Technologies, Inc. Low temperature bonded structures
US10790262B2 (en) 2018-04-11 2020-09-29 Invensas Bonding Technologies, Inc. Low temperature bonded structures
JP7158179B2 (ja) * 2018-05-30 2022-10-21 シャープ株式会社 半導体チップ積層体および半導体チップ積層体の製造方法
KR102179167B1 (ko) * 2018-11-13 2020-11-16 삼성전자주식회사 반도체 패키지
WO2020121793A1 (ja) 2018-12-14 2020-06-18 パナソニックセミコンダクターソリューションズ株式会社 半導体装置
US11244920B2 (en) 2018-12-18 2022-02-08 Invensas Bonding Technologies, Inc. Method and structures for low temperature device bonding
US11735523B2 (en) 2020-05-19 2023-08-22 Adeia Semiconductor Bonding Technologies Inc. Laterally unconfined structure
TWI777232B (zh) * 2020-08-31 2022-09-11 欣興電子股份有限公司 電子元件之接合結構及其製造方法
CN114121691B (zh) * 2020-08-31 2025-04-22 欣兴电子股份有限公司 电子元件的接合结构及其制造方法
CN112614807B (zh) * 2020-12-14 2024-04-02 长江存储科技有限责任公司 晶圆键合方法及键合晶圆
EP4264660A4 (en) * 2020-12-16 2024-11-27 The University of Hong Kong Cu-cu direct welding for packaging application in semiconductor industry
KR20230126736A (ko) 2020-12-30 2023-08-30 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 전도성 특징부를 갖는 구조 및 그 형성방법
CN114975143A (zh) * 2021-02-22 2022-08-30 联华电子股份有限公司 半导体结构及其制作方法
WO2022187402A1 (en) 2021-03-03 2022-09-09 Invensas Bonding Technologies, Inc. Contact structures for direct bonding
US20240170428A1 (en) 2021-03-06 2024-05-23 Atotech Deutschland GmbH & Co. KG Method for copper-to-copper direct bonding and assembly
US11442440B1 (en) * 2021-03-24 2022-09-13 Changxin Memory Technologies, Inc. Method and apparatus of handling control wafer, method of testing by using control wafer
KR20230013556A (ko) * 2021-07-19 2023-01-26 삼성전자주식회사 반도체 패키지
JP2024543728A (ja) * 2021-12-17 2024-11-22 アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド ダイレクトボンディングのための導電性フィーチャを有する構造及びその形成方法
EP4515594A1 (en) 2022-04-25 2025-03-05 Adeia Semiconductor Bonding Technologies Inc. Expansion controlled structure for direct bonding and method of forming same
TWI859609B (zh) * 2022-10-21 2024-10-21 國立陽明交通大學 電性連接體與其形成方法
US12506114B2 (en) 2022-12-29 2025-12-23 Adeia Semiconductor Bonding Technologies Inc. Directly bonded metal structures having aluminum features and methods of preparing same

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Also Published As

Publication number Publication date
US20150061115A1 (en) 2015-03-05
US9331038B2 (en) 2016-05-03
US20180151523A1 (en) 2018-05-31
US20160211234A1 (en) 2016-07-21
US11121104B2 (en) 2021-09-14
TW201508850A (zh) 2015-03-01
US9881888B2 (en) 2018-01-30

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