TWI560599B - Touch panel and bonding pad structure thereof - Google Patents

Touch panel and bonding pad structure thereof

Info

Publication number: TWI560599B
Authority: TW; Taiwan
Prior art keywords: touch panel; bonding pad; pad structure; bonding; touch
Prior art date: 2015-04-12

Application number

TW104124168A

Other languages

Chinese (zh)

Other versions

TW201636791A (en

Inventor

Pu-Di Hong

Jui Hsing Li

Pu Hsin Chang

rong-lin Wu

Fu-Cheng Chen

Original Assignee

Tpk Touch Systems Xiamen Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-04-12

Filing date

2015-07-24

Publication date

2016-12-01

2015-07-24 Application filed by Tpk Touch Systems Xiamen Inc filed Critical Tpk Touch Systems Xiamen Inc

2016-10-16 Publication of TW201636791A publication Critical patent/TW201636791A/en

2016-12-01 Application granted granted Critical

2016-12-01 Publication of TWI560599B publication Critical patent/TWI560599B/en

Links

TW104124168A 2015-04-12 2015-07-24 Touch panel and bonding pad structure thereof TWI560599B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CN201510185020.5A CN106155395A (en)	2015-04-12	2015-04-12	Contact panel and connected structure thereof

Publications (2)

Publication Number	Publication Date
TW201636791A TW201636791A (en)	2016-10-16
TWI560599B true TWI560599B (en)	2016-12-01

Family

ID=55218883

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
TW104124168A TWI560599B (en)	2015-04-12	2015-07-24	Touch panel and bonding pad structure thereof
TW104212026U TWM511646U (en)	2015-04-12	2015-07-24	Touch panel and bonding structure thereof

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
TW104212026U TWM511646U (en)	2015-04-12	2015-07-24	Touch panel and bonding structure thereof

Country Status (2)

Country	Link
CN (1)	CN106155395A (en)
TW (2)	TWI560599B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN106155395A (en) *	2015-04-12	2016-11-23	宝宸（厦门）光学科技有限公司	Contact panel and connected structure thereof
CN108628488B (en) *	2017-03-24	2021-06-29	南京瀚宇彩欣科技有限责任公司	In-cell touch display device and related test system and test method
CN107204346B (en) *	2017-07-27	2019-09-24	厦门天马微电子有限公司	Array substrate, display panel and display device
TWI648573B (en)	2017-09-11	2019-01-21	Au Optronics Corporation	Array substrate
JP6886907B2 (en)	2017-10-31	2021-06-16	日本航空電子工業株式会社	Touch panel and touch panel production method
CN109166839B (en) *	2018-08-30	2020-06-16	业成科技（成都）有限公司	Area structure of bonding pad
CN109378306B (en) *	2018-12-03	2020-03-24	武汉华星光电半导体显示技术有限公司	Display and display terminal structure
CN111007963A (en) *	2019-12-30	2020-04-14	业成光电(无锡)有限公司	Flexible circuit board, touch sensing film, touch panel and display panel

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW201220146A (en) *	2010-11-01	2012-05-16	Au Optronics Corp	Contact pad array
US20130015592A1 (en) *	2011-07-12	2013-01-17	Intersil Americas Inc.	Bond pad configurations for semiconductor dies
TW201401146A (en) *	2012-06-18	2014-01-01	Interflex Co Ltd	Bezeless monolayer sensor panel
TWM473562U (en) *	2013-07-19	2014-03-01	Tpk Touch Solutions Xiamen Inc	Touch panel
US20140076706A1 (en) *	2012-09-19	2014-03-20	Fu-Yuan Hsueh	Touch panel
TWM511646U (en) *	2015-04-12	2015-11-01	Tpk Touch Systems Xiamen Inc	Touch panel and bonding structure thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN203799349U (en) *	2014-03-06	2014-08-27	宝宸（厦门）光学科技有限公司	Touch panel
CN204856421U (en) *	2015-04-12	2015-12-09	宝宸（厦门）光学科技有限公司	Touch panel and connected structure thereof

2015
- 2015-04-12 CN CN201510185020.5A patent/CN106155395A/en active Pending
- 2015-07-24 TW TW104124168A patent/TWI560599B/en not_active IP Right Cessation
- 2015-07-24 TW TW104212026U patent/TWM511646U/en not_active IP Right Cessation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW201220146A (en) *	2010-11-01	2012-05-16	Au Optronics Corp	Contact pad array
US20130015592A1 (en) *	2011-07-12	2013-01-17	Intersil Americas Inc.	Bond pad configurations for semiconductor dies
TW201401146A (en) *	2012-06-18	2014-01-01	Interflex Co Ltd	Bezeless monolayer sensor panel
US20140076706A1 (en) *	2012-09-19	2014-03-20	Fu-Yuan Hsueh	Touch panel
TWM473562U (en) *	2013-07-19	2014-03-01	Tpk Touch Solutions Xiamen Inc	Touch panel
TWM511646U (en) *	2015-04-12	2015-11-01	Tpk Touch Systems Xiamen Inc	Touch panel and bonding structure thereof

Also Published As

Publication number	Publication date
TWM511646U (en)	2015-11-01
CN106155395A (en)	2016-11-23
TW201636791A (en)	2016-10-16

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Legal Events

Date	Code	Title	Description
2021-09-01	MM4A	Annulment or lapse of patent due to non-payment of fees