[go: up one dir, main page]

TWI560441B - - Google Patents

Info

Publication number
TWI560441B
TWI560441B TW101108552A TW101108552A TWI560441B TW I560441 B TWI560441 B TW I560441B TW 101108552 A TW101108552 A TW 101108552A TW 101108552 A TW101108552 A TW 101108552A TW I560441 B TWI560441 B TW I560441B
Authority
TW
Taiwan
Application number
TW101108552A
Other languages
Chinese (zh)
Other versions
TW201239348A (en
Inventor
Yasuyuki Kuze
Hisashi Yamamoto
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201239348A publication Critical patent/TW201239348A/en
Application granted granted Critical
Publication of TWI560441B publication Critical patent/TWI560441B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/136—Segmentation; Edge detection involving thresholding
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H10P74/203—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Image Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
TW101108552A 2011-03-25 2012-03-14 Exterior inspection method and device for same TW201239348A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011066974 2011-03-25

Publications (2)

Publication Number Publication Date
TW201239348A TW201239348A (en) 2012-10-01
TWI560441B true TWI560441B (en) 2016-12-01

Family

ID=46930066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108552A TW201239348A (en) 2011-03-25 2012-03-14 Exterior inspection method and device for same

Country Status (4)

Country Link
JP (1) JP5917492B2 (en)
CN (1) CN103460029B (en)
TW (1) TW201239348A (en)
WO (1) WO2012132273A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741541B (en) * 2020-03-26 2021-10-01 華邦電子股份有限公司 Image analysis system and image analysis method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5978162B2 (en) * 2013-03-29 2016-08-24 株式会社日立ハイテクノロジーズ Defect inspection method and defect inspection apparatus
TWI494561B (en) * 2013-12-19 2015-08-01 Chroma Ate Inc Method of mapping coordinates for inspecting a wafer
JP6784540B2 (en) * 2015-09-30 2020-11-11 日東電工株式会社 Polarizing plate inspection method and inspection equipment
JP7193728B2 (en) 2019-03-15 2022-12-21 富士通株式会社 Information processing device and stored image selection method
CN112541949B (en) * 2020-12-25 2024-03-29 铜陵三佳山田科技股份有限公司 Chip positioning method for semiconductor chip package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070188859A1 (en) * 2006-02-15 2007-08-16 Olympus Corporation Visual inspection apparatus
CN101339913A (en) * 2007-07-02 2009-01-07 日东电工株式会社 Defect position detection method of semiconductor wafer
TW201036082A (en) * 2009-03-31 2010-10-01 Toray Eng Co Ltd Inspection condition data generation method and inspection system of semiconductor wafer appearance inspection apparatus
JP2011012971A (en) * 2009-06-30 2011-01-20 Toray Eng Co Ltd Method of performing visual examination and visual examination device for performing examination by the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632344A (en) * 1986-06-23 1988-01-07 Matsushita Electric Works Ltd Detecting method for wafer chip
JPH01173173A (en) * 1987-12-28 1989-07-07 Matsushita Electric Ind Co Ltd Recognizing device containing position correcting function
JPH06215992A (en) * 1993-01-12 1994-08-05 Sony Corp Taking-out method for semiconductor device
JP2007017283A (en) * 2005-07-07 2007-01-25 Toshiba Corp Appearance inspection method and appearance inspection apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070188859A1 (en) * 2006-02-15 2007-08-16 Olympus Corporation Visual inspection apparatus
CN101339913A (en) * 2007-07-02 2009-01-07 日东电工株式会社 Defect position detection method of semiconductor wafer
TW201036082A (en) * 2009-03-31 2010-10-01 Toray Eng Co Ltd Inspection condition data generation method and inspection system of semiconductor wafer appearance inspection apparatus
JP2011012971A (en) * 2009-06-30 2011-01-20 Toray Eng Co Ltd Method of performing visual examination and visual examination device for performing examination by the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741541B (en) * 2020-03-26 2021-10-01 華邦電子股份有限公司 Image analysis system and image analysis method

Also Published As

Publication number Publication date
JPWO2012132273A1 (en) 2014-07-24
WO2012132273A1 (en) 2012-10-04
TW201239348A (en) 2012-10-01
CN103460029A (en) 2013-12-18
JP5917492B2 (en) 2016-05-18
CN103460029B (en) 2015-08-19

Similar Documents

Publication Publication Date Title
BR112013022641A2 (en)
BR112013031251A2 (en)
BR112013024383A2 (en)
BR112013023185A2 (en)
BR112013022995A2 (en)
BR112013017670A2 (en)
AP3853A (en)
BR112013023927A2 (en)
BR112013028733A2 (en)
AP2016009466A0 (en)
BR112013031556A2 (en)
BR112013032366A2 (en)
BR112013032380A2 (en)
BR112013032377A2 (en)
BR112013018949A2 (en)
BR112013021637A2 (en)
BR112013023266A2 (en)
BR112013032392A2 (en)
BR112013017878A2 (en)
BR112013032394A2 (en)
BR112013030734A2 (en)
TWI560441B (en)
BR112013027657A2 (en)
BR112013022499A2 (en)
AP3777A (en)