TWI560225B - Underlayer composition for imprints and method for manufacturing pattern by using the same,cured object,laminate body,semiconductor device and method for manufacturing the same,and adhesive enhance agent for curable composition and substrate - Google Patents
Underlayer composition for imprints and method for manufacturing pattern by using the same,cured object,laminate body,semiconductor device and method for manufacturing the same,and adhesive enhance agent for curable composition and substrateInfo
- Publication number
- TWI560225B TWI560225B TW102107348A TW102107348A TWI560225B TW I560225 B TWI560225 B TW I560225B TW 102107348 A TW102107348 A TW 102107348A TW 102107348 A TW102107348 A TW 102107348A TW I560225 B TWI560225 B TW I560225B
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- manufacturing
- imprints
- adhesive
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F122/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F122/10—Esters
- C08F122/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F120/10—Esters
- C08F120/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F120/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F120/10—Esters
- C08F120/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F120/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/21—Urea; Derivatives thereof, e.g. biuret
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/02—Homopolymers or copolymers of esters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
-
- H10P76/00—
-
- H10P76/20—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Mechanical Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012076018A JP5891090B2 (ja) | 2012-03-29 | 2012-03-29 | インプリント用下層膜組成物およびこれを用いたパターン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201343745A TW201343745A (zh) | 2013-11-01 |
| TWI560225B true TWI560225B (en) | 2016-12-01 |
Family
ID=49259115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102107348A TWI560225B (en) | 2012-03-29 | 2013-03-01 | Underlayer composition for imprints and method for manufacturing pattern by using the same,cured object,laminate body,semiconductor device and method for manufacturing the same,and adhesive enhance agent for curable composition and substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150014819A1 (zh) |
| JP (1) | JP5891090B2 (zh) |
| KR (1) | KR20140146632A (zh) |
| TW (1) | TWI560225B (zh) |
| WO (1) | WO2013145829A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI767033B (zh) * | 2017-07-18 | 2022-06-11 | 日商富士軟片股份有限公司 | 容器、容器的製造方法及藥液收容體 |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6632340B2 (ja) * | 2015-01-30 | 2020-01-22 | キヤノン株式会社 | 密着層形成組成物、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、インプリント用モールドの製造方法、およびデバイス部品 |
| WO2016120944A1 (en) * | 2015-01-30 | 2016-08-04 | Canon Kabushiki Kaisha | Adhesion layer-forming composition, method of manufacturing cured product pattern, method of manufacturing optical component, method of manufacturing circuit board, method of manufacturing imprinting mold, and device component |
| KR20170118146A (ko) * | 2015-03-18 | 2017-10-24 | 후지필름 가부시키가이샤 | 하층막 형성용 수지 조성물, 임프린트 형성용 키트, 적층체, 패턴 형성 방법 및 디바이스의 제조 방법 |
| US10042253B2 (en) * | 2016-01-11 | 2018-08-07 | Samsung Display Co., Ltd. | Photosensitive resin composition, film prepared by using the photosensitive resin composition, and organic light-emitting display device including the film |
| KR102700011B1 (ko) * | 2016-01-11 | 2024-08-30 | 삼성디스플레이 주식회사 | 감광성 수지 조성물, 이로부터 제조된 막 및 상기 막을 포함하는 유기 발광 표시 장치 |
| JP6983760B2 (ja) * | 2016-04-08 | 2021-12-17 | キヤノン株式会社 | 硬化物パターンの形成方法、加工基板の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法、インプリントモールドの製造方法、およびインプリント前処理コート用材料 |
| WO2018033995A1 (ja) * | 2016-08-19 | 2018-02-22 | 大阪有機化学工業株式会社 | 易剥離膜形成用硬化性樹脂組成物及びその製造方法 |
| TWI852902B (zh) * | 2016-08-19 | 2024-08-21 | 日商大阪有機化學工業股份有限公司 | 易剝離膜形成用硬化性樹脂組合物及其製造方法 |
| KR102495471B1 (ko) * | 2016-10-05 | 2023-02-06 | 덴카 주식회사 | 수지 조성물 및 그것을 사용한 막 구조물 |
| JP7011386B2 (ja) * | 2016-11-16 | 2022-01-26 | キヤノン株式会社 | 密着層形成組成物および物品製造方法 |
| JP6865047B2 (ja) | 2017-01-27 | 2021-04-28 | 東京応化工業株式会社 | インプリント用下層膜形成用組成物及びパターン形成方法 |
| TWI738977B (zh) | 2017-02-28 | 2021-09-11 | 日商富士軟片股份有限公司 | 壓印用密接膜形成用組成物、密接膜、積層體、硬化物圖案之製造方法及電路基板之製造方法 |
| KR102393376B1 (ko) | 2017-04-10 | 2022-05-03 | 삼성디스플레이 주식회사 | 감광성 수지 조성물 및 이를 포함한 패턴 형성용 조성물의 경화물을 포함하는 전자 장치 |
| JP7112220B2 (ja) * | 2017-05-12 | 2022-08-03 | キヤノン株式会社 | 方法、装置、システム、および物品の製造方法 |
| US11520226B2 (en) * | 2017-05-12 | 2022-12-06 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, imprint system, and method of manufacturing article |
| WO2019031409A1 (ja) | 2017-08-10 | 2019-02-14 | キヤノン株式会社 | パターン形成方法 |
| JP7034696B2 (ja) * | 2017-12-14 | 2022-03-14 | キヤノン株式会社 | 硬化物パターンの製造方法、加工基板の製造方法、回路基板の製造方法、電子部品の製造方法、およびインプリントモールドの製造方法 |
| US10780682B2 (en) | 2018-12-20 | 2020-09-22 | Canon Kabushiki Kaisha | Liquid adhesion composition, multi-layer structure and method of making said structure |
| WO2020184497A1 (ja) | 2019-03-14 | 2020-09-17 | 富士フイルム株式会社 | インプリント用の下層膜形成用組成物、下層膜形成用組成物の製造方法、キット、パターン製造方法、および半導体素子の製造方法 |
| TWI900529B (zh) | 2020-02-20 | 2025-10-11 | 日商富士軟片股份有限公司 | 硬化性組成物、套組、中間層、積層體、壓印圖案的製造方法及元件的製造方法 |
| JP7414680B2 (ja) | 2020-09-17 | 2024-01-16 | キオクシア株式会社 | インプリント方法、インプリント装置、及び膜形成装置 |
| CN120153321A (zh) | 2022-11-02 | 2025-06-13 | 日产化学株式会社 | 抗蚀剂下层膜形成用组合物 |
| TW202449516A (zh) | 2023-03-08 | 2024-12-16 | 日商日產化學股份有限公司 | 阻劑下層膜形成組成物 |
| WO2024204232A1 (ja) | 2023-03-27 | 2024-10-03 | 日産化学株式会社 | レジスト下層膜形成組成物 |
| JP2025068357A (ja) | 2023-10-16 | 2025-04-28 | 信越化学工業株式会社 | レジスト下層膜形成用組成物、レジスト下層膜、レジスト下層膜の製造方法、パターン形成方法、及び半導体装置の製造方法 |
| JP2025070979A (ja) | 2023-10-20 | 2025-05-02 | 信越化学工業株式会社 | レジスト下層膜形成用組成物、レジスト下層膜、レジスト下層膜の製造方法、パターン形成方法、及び半導体装置の製造方法 |
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| JP2005350558A (ja) * | 2004-06-10 | 2005-12-22 | Shin Etsu Chem Co Ltd | 多孔質膜形成用組成物、パターン形成方法、及び多孔質犠性膜 |
| TW200848936A (en) * | 2007-01-19 | 2008-12-16 | Az Electronic Materials Usa | Solvent mixtures for antireflective coating compositions for photoresists |
| JP2010245131A (ja) * | 2009-04-01 | 2010-10-28 | Jsr Corp | パターン形成方法 |
| JP2011180425A (ja) * | 2010-03-02 | 2011-09-15 | Jsr Corp | レジスト下層膜形成用組成物及びパターン形成方法 |
| TW201308017A (zh) * | 2011-03-31 | 2013-02-16 | Jsr股份有限公司 | 光阻底層膜組成物及圖型形成方法 |
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| US3279940A (en) * | 1963-05-13 | 1966-10-18 | Gulf Oil Corp | Polyethylene and polypropylene containers coated with a polyester resin |
| JP4303560B2 (ja) * | 2003-10-31 | 2009-07-29 | 富士フイルム株式会社 | 染料含有硬化性組成物、並びに、カラーフィルターおよびその製造方法 |
| JP4308687B2 (ja) * | 2004-03-11 | 2009-08-05 | 富士フイルム株式会社 | 平版印刷版原版 |
| US7871751B2 (en) * | 2004-04-15 | 2011-01-18 | Mitsubishi Gas Chemical Company, Inc. | Resist composition |
| US20060140902A1 (en) * | 2004-12-23 | 2006-06-29 | Kimberly-Clark Worldwide, Inc. | Odor control substrates |
| CN101541903B (zh) * | 2006-12-01 | 2013-04-17 | 日立化成株式会社 | 粘接剂和使用该粘接剂的连接结构体 |
| JP5548427B2 (ja) * | 2009-10-30 | 2014-07-16 | 富士フイルム株式会社 | 組成物、レジスト膜、パターン形成方法、及びインクジェット記録方法 |
| JP2012041521A (ja) * | 2010-05-12 | 2012-03-01 | Fujifilm Corp | 光硬化性組成物およびそれを用いた硬化物の製造方法 |
| JP5647829B2 (ja) * | 2010-07-30 | 2015-01-07 | Agcセイミケミカル株式会社 | 光硬化性組成物および表面に微細パターンを有する成形体の製造方法 |
| JP5634799B2 (ja) * | 2010-08-26 | 2014-12-03 | 株式会社ダイセル | 微細パターン形成用放射線硬化性樹脂組成物、及び該組成物を用いた微細構造体の製造方法 |
| DE102010061963A1 (de) * | 2010-11-25 | 2012-05-31 | Bayer Materialscience Aktiengesellschaft | EL-Elemente enthaltend eine Pigmentschicht mit vernetzenden Systemen mit blockierten Isocyanat-Gruppen |
-
2012
- 2012-03-29 JP JP2012076018A patent/JP5891090B2/ja active Active
-
2013
- 2013-01-25 WO PCT/JP2013/051564 patent/WO2013145829A1/ja not_active Ceased
- 2013-01-25 KR KR1020147030224A patent/KR20140146632A/ko not_active Ceased
- 2013-03-01 TW TW102107348A patent/TWI560225B/zh active
-
2014
- 2014-09-24 US US14/495,289 patent/US20150014819A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005350558A (ja) * | 2004-06-10 | 2005-12-22 | Shin Etsu Chem Co Ltd | 多孔質膜形成用組成物、パターン形成方法、及び多孔質犠性膜 |
| TW200848936A (en) * | 2007-01-19 | 2008-12-16 | Az Electronic Materials Usa | Solvent mixtures for antireflective coating compositions for photoresists |
| JP2010245131A (ja) * | 2009-04-01 | 2010-10-28 | Jsr Corp | パターン形成方法 |
| JP2011180425A (ja) * | 2010-03-02 | 2011-09-15 | Jsr Corp | レジスト下層膜形成用組成物及びパターン形成方法 |
| TW201308017A (zh) * | 2011-03-31 | 2013-02-16 | Jsr股份有限公司 | 光阻底層膜組成物及圖型形成方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI767033B (zh) * | 2017-07-18 | 2022-06-11 | 日商富士軟片股份有限公司 | 容器、容器的製造方法及藥液收容體 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201343745A (zh) | 2013-11-01 |
| KR20140146632A (ko) | 2014-12-26 |
| US20150014819A1 (en) | 2015-01-15 |
| JP5891090B2 (ja) | 2016-03-22 |
| WO2013145829A1 (ja) | 2013-10-03 |
| JP2013202982A (ja) | 2013-10-07 |
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