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TWI560026B - Semiconductor manufacturing apparatus and method of manufacturing a semiconductor device - Google Patents

Semiconductor manufacturing apparatus and method of manufacturing a semiconductor device

Info

Publication number
TWI560026B
TWI560026B TW101115928A TW101115928A TWI560026B TW I560026 B TWI560026 B TW I560026B TW 101115928 A TW101115928 A TW 101115928A TW 101115928 A TW101115928 A TW 101115928A TW I560026 B TWI560026 B TW I560026B
Authority
TW
Taiwan
Prior art keywords
manufacturing
semiconductor
semiconductor device
manufacturing apparatus
semiconductor manufacturing
Prior art date
Application number
TW101115928A
Other languages
English (en)
Other versions
TW201317081A (zh
Inventor
Yen Chang Chao
Kei Wei Chen
Ying Lang Wang
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW201317081A publication Critical patent/TW201317081A/zh
Application granted granted Critical
Publication of TWI560026B publication Critical patent/TWI560026B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW101115928A 2011-10-20 2012-05-04 Semiconductor manufacturing apparatus and method of manufacturing a semiconductor device TWI560026B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/277,609 US20130102152A1 (en) 2011-10-20 2011-10-20 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
TW201317081A TW201317081A (zh) 2013-05-01
TWI560026B true TWI560026B (en) 2016-12-01

Family

ID=48136314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101115928A TWI560026B (en) 2011-10-20 2012-05-04 Semiconductor manufacturing apparatus and method of manufacturing a semiconductor device

Country Status (2)

Country Link
US (1) US20130102152A1 (zh)
TW (1) TWI560026B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3406402B1 (en) * 2010-08-06 2021-06-30 Applied Materials, Inc. Substrate edge tuning with retaining ring
TWI639485B (zh) * 2012-01-31 2018-11-01 Ebara Corporation 基板保持裝置、研磨裝置、及研磨方法
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
JP2015188955A (ja) * 2014-03-27 2015-11-02 株式会社荏原製作所 研磨装置
TWI658899B (zh) * 2014-03-31 2019-05-11 Ebara Corporation 研磨裝置及研磨方法
WO2016093504A1 (ko) * 2014-12-08 2016-06-16 유현정 화학연마장치용 캐리어 헤드의 리테이너링 및 이를 포함하는 캐리어 헤드
US10160091B2 (en) * 2015-11-16 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. CMP polishing head design for improving removal rate uniformity
CN108791441B (zh) * 2018-07-24 2019-11-12 徐州兴隆工具有限公司 一种采用搅拌摩擦技术的五金工具转运装置
US12296428B2 (en) 2018-10-29 2025-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
JP7458407B2 (ja) * 2019-02-28 2024-03-29 アプライド マテリアルズ インコーポレイテッド 化学機械研磨キャリアヘッドのためのリテーナ
CN112388506A (zh) * 2019-08-19 2021-02-23 联芯集成电路制造(厦门)有限公司 研磨装置
CN111590459A (zh) * 2020-05-26 2020-08-28 湘潭大学 一种带断屑槽硬质合金刀片化学机械抛光设备控制系统
WO2021240949A1 (ja) * 2020-05-29 2021-12-02 信越半導体株式会社 研磨ヘッド及びウェーハの片面研磨方法
JP7345433B2 (ja) * 2020-05-29 2023-09-15 信越半導体株式会社 研磨ヘッド及びウェーハの片面研磨方法
US11660721B2 (en) * 2021-02-18 2023-05-30 Applied Materials, Inc. Dual loading retaining ring

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307674A (ja) * 2007-06-18 2008-12-25 Tokyo Seimitsu Co Ltd 分割加圧型リテーナリング

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
KR100264228B1 (ko) * 1996-05-10 2000-12-01 미다라이 후지오 화학 기계 연마 장치 및 방법
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US6241582B1 (en) * 1997-09-01 2001-06-05 United Microelectronics Corp. Chemical mechanical polish machines and fabrication process using the same
US6196896B1 (en) * 1997-10-31 2001-03-06 Obsidian, Inc. Chemical mechanical polisher
US6272902B1 (en) * 1999-01-04 2001-08-14 Taiwan Semiconductor Manufactoring Company, Ltd. Method and apparatus for off-line testing a polishing head
TW436382B (en) * 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6368968B1 (en) * 2000-04-11 2002-04-09 Vanguard International Semiconductor Corporation Ditch type floating ring for chemical mechanical polishing
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
JP2008173741A (ja) * 2007-01-22 2008-07-31 Elpida Memory Inc 研磨装置
EP3406402B1 (en) * 2010-08-06 2021-06-30 Applied Materials, Inc. Substrate edge tuning with retaining ring
TWI639485B (zh) * 2012-01-31 2018-11-01 Ebara Corporation 基板保持裝置、研磨裝置、及研磨方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307674A (ja) * 2007-06-18 2008-12-25 Tokyo Seimitsu Co Ltd 分割加圧型リテーナリング

Also Published As

Publication number Publication date
US20130102152A1 (en) 2013-04-25
TW201317081A (zh) 2013-05-01

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