TWI559093B - A screen exposure machine monitor system - Google Patents

Description

Stencil exposure machine monitoring system

The present invention relates to the field of stencil manufacturing, and more particularly to a stencil exposure machine monitoring system that can improve the exposure quality of stencils.

With the development of circuit board miniaturization and functional enhancement, the requirements for the width and line spacing of the pattern wires of the circuit board are also higher and higher, and in the overall manufacturing process of the circuit board, the exposure process of the circuit board is One of the crucial steps.

However, in the existing production industry, PCB boards are often inaccurate in exposure, and the conductivity and aesthetics of the PCB are affected. Therefore, how to overcome the above defects is the technical problem to be solved by the present invention.

In view of the above problems of the prior art, the object of the present invention is to provide a stencil exposure machine monitoring system, which can monitor the working state of the exposure device of the stencil exposure machine, so as to easily screen out the defective products and analyze the poor exposure. the reason.

Another object of the present invention is to provide a screen exposure machine monitoring system that can control the exposure apparatus to automatically adjust the working state to ensure the exposure quality of the product and extend the working life of the parts of the machine.

To achieve the above and other objects, the present invention provides a screen exposure machine monitoring system for a screen exposure machine having an exposure apparatus for monitoring an operation state of an exposure apparatus of the screen exposure apparatus, the system comprising: The exposure monitoring module has: an exposure parameter setting unit, configured to provide an exposure parameter value for setting the exposure device and an corresponding abnormal processing operation flow; the exposure detector is disposed in the exposure device of the screen exposure machine, And the exposure device has an optical component, the exposure detector is configured to continuously detect the instantaneous optical power (mW) of the optical component, and output the detected instantaneous optical power (mW) value; the exposure analysis unit is For collecting the instantaneous optical power (mW) value of the optical component output by the exposure detector, and analyzing the instantaneous optical power (mW) value of the output does not match the exposure parameter value set by the exposure parameter setting unit And outputting an abnormal signal; and the abnormal processing module is configured to receive the abnormal signal output by the exposure analyzing unit, according to the abnormal processing of the setting Performs a corresponding operation of the workflow.

Preferably, the abnormal processing operation flow set by the exposure parameter setting unit at least includes: outputting an alarm signal, adjusting an operating state of the optical component, and one of a group of groups for causing the screen exposure machine to stop operating. .

Preferably, the system further comprises: a recording module, recording an exposure processing message of the exposure of the screen exposure machine to the stencil, and recording the abnormal signal corresponding to the output when the exposure analysis unit outputs an abnormal signal Exposure work data. The exposure job data includes one of a group of the time when the abnormal signal is output and the optical power (mW) value of the optical component at the time of outputting the abnormal signal.

Preferably, the exposure parameter setting unit in the system provides a setting of a customized standard operating procedure (SOP) metering function for the user to set the value of the light energy (mJ) to be input for the exposure operation. The exposure analysis unit controls the accumulated light energy in a linear processing manner according to the light energy value set by the user. In addition, the exposure parameter setting unit provides a function setting of the double exposure, and a movable filter is disposed in the optical path of the optical component, and the exposure analysis unit is configured according to the function of the double exposure set by the exposure parameter setting unit. In the exposure operation, the optical element is supplied with a predetermined wavelength. After a predetermined time, the movement of the filter is controlled to adjust the predetermined wavelength provided by the optical element to achieve exposure of multiple wavelengths at a single wavelength.

Preferably, the system is provided with a data transmission interface, and the data transmission interface is used for setting the exposure parameter value of the exposure device and the corresponding abnormal processing operation flow of the user at the near end or the far end.

Preferably, the stencil exposure machine monitoring system comprises: a vacuum monitoring module for detecting a vacuum pressure value in an exposure chamber of the exposure device, the vacuum monitoring module having: a vacuum parameter setting unit for providing settings The vacuum parameter value in the exposure chamber and the corresponding abnormal processing operation flow; the pressure sensor is configured to sense the vacuum pressure in the exposure chamber, and output the sensed vacuum pressure value; and the vacuum analysis unit is used for Receiving the vacuum pressure value output by the pressure sensor, and outputting the abnormal signal when the vacuum pressure value of the output is not consistent with the vacuum parameter value set by the vacuum parameter setting unit. Preferably, the exception processing module comprises: when receiving the abnormal signal output by the vacuum analysis unit, performing a corresponding operation according to the abnormal processing operation flow set by the vacuum parameter setting unit. Furthermore, the abnormality processing module determines that the exposure operation and the alarm status message are stopped when the vacuum pressure cannot reach the set vacuum parameter value for a predetermined time.

Preferably, the system further comprises: a temperature monitoring module, comprising: a temperature parameter setting unit, configured to provide an operating temperature parameter value for setting an optical component in the exposure device; and a heat dissipation unit disposed on the exposure device And a temperature sensor for sensing a current operating temperature of the optical component and outputting the sensed working temperature value; and a temperature control unit for receiving the temperature sense The operating temperature value outputted by the detector, and when the operating temperature value of the output is higher than the operating temperature parameter value set by the temperature parameter setting unit, the heat dissipation unit is activated to perform a cooling operation on the optical component.

Preferably, the system further comprises: a contact temperature sensor contacting the exposure glass table for sensing the temperature of the exposure glass table, and the temperature control unit is configured to analyze the contact temperature sensor When the output temperature value is higher than the operating temperature parameter value set by the temperature parameter setting unit, the heat dissipation unit in the exposure device of the screen is activated to perform a cooling operation on the exposure glass table. In addition, the abnormality processing module determines to stop the exposure operation and issue an alarm status message when the exposure glass table temperature is not lowered for a predetermined time.

Compared with the prior art, the present invention can detect the working state of the exposure device of the screen exposure machine, and output an alarm signal when the operation of the analysis machine is abnormal, so that it can be easily found out under the condition that the machine is poorly exposed. Defective product. Furthermore, the present invention can automatically adjust the working state of the exposure device of the machine through the preset abnormal processing operation flow when the problem of poor exposure is detected by the detecting machine exposure device to reduce the occurrence of defective defective products. In addition, the present invention provides a user with the input mode of the local end, the near end or the far end of the stencil exposure machine to set parameters required for the exposure operation, thereby improving the convenience of the exposure operation. In addition, in response to the user's use requirements, the user can set the required light energy value (mJ) of the lamp to provide a customized function setting of the standard operating program.

The other aspects of the present invention will be readily understood by those skilled in the art from this disclosure. The invention may also be embodied or applied by other different embodiments. The details of the present invention can be variously modified and changed without departing from the spirit and scope of the invention.

Please refer to FIG. 1 , which is a system architecture diagram of a first embodiment of a screen exposure machine monitoring system of the present invention. The screen exposure machine monitoring system 100 of the present invention is applied to a screen exposure machine 200 having an exposure device 210 for use. For monitoring the working state of the exposure device 210 of the stencil exposure machine 200, as shown in FIG. 1, the system 100 includes an exposure monitoring module 110 and an exception processing module 120.

The exposure monitoring module 110 has an exposure parameter setting unit 111, an exposure detector 113, and an exposure analysis unit 115.

The exposure parameter setting unit 111 is configured to provide a human-machine interface, and the user sets the corresponding exposure parameter value and the corresponding abnormal processing operation flow for the exposure device 210 of the screen exposure machine 200. In this embodiment, the The setting of the abnormal processing operation flow refers to a series of subsequent processing operations performed on the screen exposure machine 200 when the system 100 detects that the exposure value of the exposure device 210 does not match the set parameter value. The subsequent processing operations may include: outputting an alarm signal, adjusting an operating state of the exposure device 210, and one of a group of groups for causing the screen exposure machine 200 to stop the exposure operation (please refer to the subsequent details). It should be noted that the human-machine interface provided by the exposure parameter setting unit 111 further includes: a control function of the operation authority, thereby effectively protecting the information security of the exposure parameters of the specific network board, and also avoiding an abnormal situation of personnel misoperation. occur.

The exposure detector 113 is disposed in the exposure device 210 of the screen exposure machine 200. The exposure device 210 is provided with an optical component 211 (for example, a light tube), and the exposure detector 113 is used for detecting The optical power (mW) of the optical element 211 outputs the detected optical power (mW) value. In the preferred embodiment, the exposure detector 113 continuously detects the instantaneous optical power (mW) of the optical component 211 during exposure and outputs the detected instantaneous optical power (mW) value.

The exposure analyzing unit 115 is configured to collect the instantaneous optical power (mW) value of the optical component 211 output by the exposure detector 113, and analyze whether the instantaneous optical power (mW) value of the output is set by the user by using the exposure parameter. The exposure parameter values set by the unit 111 are consistent, and an abnormal signal is output when the two are not matched.

The exception processing module 120 is configured to perform a corresponding operation according to the abnormal processing operation flow set by the exposure parameter setting unit 111 when receiving the abnormal signal output by the exposure analyzing unit 115, for example, if the exposure When the analysis unit 115 analyzes that the instantaneous optical power (mW) value of the output is within the allowable range, the abnormality processing module 120 can output only an alarm signal to alert the operator; if the exposure The analysis unit 115 analyzes that the instantaneous optical power (mW) value continuously collected during a period of time is relatively weaker than the exposure parameter value, and can determine that the optical component 211 starts to aging, and the abnormality processing can be performed at this time. The module 120 automatically adjusts the working state of the optical component 211, for example, controlling the optical component 211 to appropriately extend the exposure time to perform exposure compensation, so that the actual exposure can still meet the setting requirement of the exposure parameter value, and further, if The exposure analyzing unit 115 analyzes that the instantaneous optical power (mW) value of the output and the deviation of the exposure parameter value continuously exceed the warning range. Preliminary determination may need to be replaced and has been aged for an optical element 211, and even if the exception processing module 120 forcibly exposing the screen 200 stops the exposure operation. Therefore, it can be seen that even if the light tube changes the optical power (mW) according to the time of use and the environment change, by the instant detection of the lamp of the present invention, when the light power (mW) of the lamp is changed, the user can obtain the instant light. Power (mW) change data.

It should be particularly noted here that the exposure parameter setting unit 111 further provides a function setting of the double exposure in addition to the exposure time value required for the user to set the required exposure time and the accumulated light energy (mJ). The function of the so-called double exposure means that the exposure monitoring module 110 controls the exposure device 210 to provide two kinds of light wavelengths during the exposure process according to the function setting of the double exposure, specifically, the coating of the specific screen. The material, after exposure in a single wavelength band, causes the edge of the wire after the exposure of the screen to be uneven, and the uneven wire diameter margin easily leads to poor electrical characteristics, such as easy to produce between two adjacent wires. Short circuit, and the screen exposure machine monitoring system of the present invention can solve such a problem. In detail, in the exposure apparatus 210 of the present invention, a movable filter is disposed in the optical path of the optical element 211 (here When the optical element 211 is a lamp tube that provides a high wavelength, that is, the high wavelength is used as the light band of the first exposure, the filter is moved to the optical element 211 for exposure operation. In the light path, the wavelength of the optical path of the optical element 211 is changed, and the changed wavelength is used as the optical band of the second exposure. Therefore, the exposure analyzing unit 111 controls the movement of the filter according to the function of the double exposure set by the exposure parameter setting unit 111, and achieves multiple wavelength exposure using a single-wavelength lamp, thereby solving the exposure of the aforementioned screen. The problem of uneven edge of the wire diameter. In addition, in order to highlight the effect of the exposure of the screen of the present invention, a convex lens (not shown) may be disposed on the light-emitting path of the optical element 211 to uniformly diverge the light passing through, so that the traveling direction of the light tends to be Consistent.

Moreover, the existing screen printing machine for the light energy detection mode of the lamp, the user mostly uses an external light energy detector for the lamp detection, in response to the detection mode, the screen exposure machine monitoring system 100 of the present invention further provides a The setting of the custom standard operating procedure (SOP) metering function, specifically, the user can measure the light energy value (mJ) of the local optical component 211 after using an external light energy detector to transmit the exposure parameter. The setting unit 111 further sets the light energy value (mJ) measured by the user, that is, the setting of the user to turn on the customized standard working program photometry function, so that the exposure analysis unit 115 is set according to the user during the exposure operation. The light energy value is controlled by linear processing to accumulate the light energy, that is, the accumulated light energy (mJ) = exposure time * cumulative optical power (mW), and the effective setting of the screen and the lamp is achieved by setting the aforementioned demand parameters. Quality control.

It should be further noted that the screen exposure machine monitoring system of the present invention is provided with an input/output interface (not shown here), such as an input unit including a button or a keyboard, and a display screen for the user. Setting the exposure parameter value of the exposure device and the corresponding abnormal processing operation flow, except that the user can set the input interface of the local end of the stencil exposure machine monitoring system, the stencil exposure machine monitoring system is provided with data The transmission interface (not shown here) is externally connected to an information processing device such as a computer device (not shown here), and the information processing device is compared with the network board according to the transmission communication specification of the data transmission interface. The exposure machine 200 can be a near-end device or a remote device. Therefore, the exposure parameter value of the exposure device and its corresponding abnormal processing operation flow can be set by the data transmission interface at the near end or the far end.

Please refer to FIG. 2, which is a system architecture diagram for explaining a second embodiment of the screen exposure machine monitoring system of the present invention. The second embodiment is substantially the same as the system architecture of the foregoing first embodiment. The only difference is that the screen exposure machine monitoring system 100A of the second embodiment further includes: a recording module 130. To avoid repeated description, the following is only The foregoing differences are specifically described. In this embodiment, the recording module 130 is configured to record an exposure processing message for exposing the screen 201 by the screen exposure machine 200A, and the exposure processing information may include: exposure group data, exposure parameters, and exposure time. Further, when the exposure analysis unit 115 outputs the abnormal signal, the exposure job data corresponding to the output abnormal signal may be further recorded, for example, the optical component 211 at the time when the abnormal signal is outputted. The optical power (mW) value and/or the time at which the abnormal signal is output (that is, the time at which the abnormal signal is output and the optical power (mW) value of the optical element at the time of outputting the abnormal signal) And the exposure job data may further include: group identification data of the stencil 201 exposed by the stencil exposure machine 200A at the time of outputting the abnormal signal (for example, the first group and the number of the groups) In addition, all the exposure processing information or the exposure job data generated by the recording module 130 can be loaded into the information processing device 300 for storage by relevant personnel. Follow-up check or other treatment.

It is to be noted that the information processing device 300 can be, for example, a computer device electrically connected to the stencil exposure machine 200A, and the computer device can be connected to another electronic device at the remote end through the network system. The management of the end performs quality backtracking and control of the exposed stencil 201. Specifically, the remote management personnel can use the stored exposure job data to obtain the stencil 201 exposed at the time when the abnormal signal occurs, and query the abnormal information corresponding to the exposure time to find out that the stencil 201 is generated. The reason why 瑕疵 is, for example, voltage fluctuation, aging of the optical element, etc., therefore, the present invention can easily find a defective printed circuit which is exposed at a time when the instantaneous optical power (mW) value of the optical element 211 fluctuates. .

3 is a system architecture diagram for explaining a third embodiment of the screen exposure machine monitoring system of the present invention. The third embodiment is substantially the same as the system architecture of the foregoing second embodiment. The only difference is that the screen exposure machine monitoring system 100B of the third embodiment further includes: a vacuum monitoring module 150. The differences from the foregoing are specifically described. In the network exposure machine 200B of the embodiment, the vacuum monitoring module 150 is configured to detect a vacuum pressure value in the exposure chamber of the exposure device 210 and a vacuum pressure value of the vacuum source. The vacuum monitoring module 150 includes: The vacuum parameter setting unit 151, the pressure sensor 153, and the vacuum analysis unit 155. The vacuum parameter setting unit 151 is configured to provide a human-machine operation interface, and the user can set a required vacuum parameter value and a corresponding abnormal processing operation flow for the vacuum pressure in the exposure chamber. The pressure sensor 153 is configured to sense the vacuum pressure in the exposure chamber, and output the sensed vacuum pressure value. In this embodiment, the pressure sensor 153 is used to sense the exposure chamber. The vacuum pressure and the vacuum pressure of the vacuum source. In terms of the vacuum pressure of the exposure chamber, the pressure sensor may be disposed in the rubber bead around the cover edge of the operation cover of the screen exposure machine or on the inner surface of the operation cover. Thereby, the screen and the film vacuum value in the exposure chamber of the screen exposure machine and the airtightness of the rubber bead can be sensed; in the vacuum pressure of the vacuum source, the pressure sensor can be disposed on the screen exposure A vacuum pump, a vacuum line, a solenoid valve control unit, etc. in the machine to sense whether the operating state of the vacuuming element in the screen exposure machine is normal. The vacuum analysis unit 155 is configured to receive the vacuum pressure value output by the pressure sensor 153, and output an abnormal signal when the vacuum pressure value of the output is not consistent with the vacuum parameter value set by the vacuum parameter setting unit 151. . When receiving the abnormal signal output by the vacuum analysis unit 155, the abnormality processing module 120 performs a corresponding operation according to the set abnormal processing operation flow, for example, if it is determined that the predetermined time or vacuum pressure cannot be reached at all When the vacuum parameter value is set, the abnormality processing module 120 stops the exposure operation and issues an alarm status message.

4 is a system architecture diagram for explaining a fourth embodiment of the screen exposure machine monitoring system of the present invention. The fourth embodiment is substantially the same as the system architecture of the foregoing second embodiment. The only difference is that the screen exposure machine monitoring system 100C of the fourth embodiment further includes: a temperature monitoring module 160, which is required to be described. The application architecture of the monitoring module 160 is not limited to that shown in FIG. 2. The temperature monitoring module 160 in this embodiment may also be added to the system architecture shown in FIG. 3 or FIG. In order to avoid repeated description, only the temperature monitoring module 160 in this embodiment will be specifically described below. In the stencil exposure machine 200C of the embodiment, the temperature monitoring module 160 has a temperature parameter setting unit 161, a heat dissipation unit 163 disposed adjacent to the optical element 211, a temperature sensor 165, and a temperature control unit 167. The temperature parameter setting unit 161 is for providing an operating temperature parameter value for setting the optical element 211 in the exposure device 210. The heat dissipation unit 163 is used to lower the operating temperature of the optical component 211. The temperature sensor 165 is configured to sense the current operating temperature of the optical component 211 and output the sensed operating temperature value. The temperature control unit 167 is configured to receive the operating temperature value output by the temperature sensor 165, and start the heat dissipation when the operating temperature value of the output is higher than the operating temperature parameter value set by the temperature parameter setting unit 161. The unit 163 performs a temperature-lowering operation on the optical element 211. Further, if the temperature control unit 167 fails to cool the temperature of the optical element 211 within a predetermined time, the abnormality processing module 120 stops the exposure operation and issues an alarm status message. This prevents the optical element 211 from operating at an excessively high temperature, thereby extending the operational life of the optical element 211 and reducing the cost of replacing the hardware components.

In addition, it should be particularly noted that the temperature-monitored object in the embodiment is not limited to the optical component 211 in the exposure device 210, and can also monitor the temperature of the exposure glass table, specifically, The exposure glass substrate (which is not shown here) carrying the negative film and the stencil will continue to rise in temperature due to the continuous irradiation of ultraviolet light, in order to prevent the temperature of the exposure glass table from being too high under the exposure operation for a long time. In the embodiment, a temperature sensor can be disposed on the exposure glass table. In a preferred embodiment, the temperature sensor is a contact temperature sensor, and the exposure glass is touched. The table is in contact with each other. Therefore, when the temperature control unit 167 analyzes that the temperature value output by the contact temperature sensor is higher than the operating temperature parameter value set by the temperature parameter setting unit 161 (at this time, the abnormality processing module) 120 may also issue an alarm status message to inform the user) to activate the heat dissipation unit in the screen exposure machine 200C (different from the heat dissipation unit 163 for cooling the temperature of the optical element 211). For example, in the stencil exposure machine 200C, at least one glass mesa heat dissipating unit is disposed adjacent to the exposure glass mesa to perform a cooling operation on the exposure glass mesa, and wherein the temperature is calculated by using a two-dimensional linear equation. The relationship with exposure (glass table temperature change) to effectively achieve the film does not deform under long exposure operation. Of course, after the temperature control unit 167 starts the cooling unit 163 to perform the cooling operation on the exposure glass table, it is still analyzed that the temperature value output by the contact temperature sensor is still higher than the temperature parameter setting unit 161. The exception handling module 120 can issue an alarm status message to notify the user of the operating temperature parameter value.

FIG. 5 is a flow chart of the exposure monitoring operation performed by applying the system architecture diagram of FIG. 1. As shown in FIG. 5, step S101 is first performed, and the screen exposure machine monitoring system provides a man-machine interface for setting the exposure parameter value of the exposure device and the corresponding abnormal processing operation flow. In this embodiment, the setting is performed. The abnormal processing operation flow at least includes: outputting an alarm signal, adjusting an operating state of the optical component, and one of a group of groups for causing the screen exposure machine to stop operating, and then proceeding to step S103.

In step S103, the screen exposure machine monitoring system detects the instantaneous optical power (mW) of the optical component in the exposure apparatus, and outputs the detected instantaneous optical power (mW) value, and then proceeds to step S105.

In step S105, the screen exposure machine monitoring system collects the output instantaneous optical power (mW) value, and analyzes whether the output instantaneous optical power (mW) value matches the set exposure parameter value, and analyzes the When the two do not match, an abnormal signal is output, and then step S107 is performed.

In step S107, the stencil exposure machine monitoring system responds to the output abnormal signal, and performs a corresponding operation according to the set abnormal processing operation flow. Specifically, if the output instantaneous optical power (mW) value is analyzed, When the deviation of the exposure parameter value is within the allowable range, only one alarm signal can be output to remind the operator; if the analysis is continuously collected, the instantaneous optical power (mW) value is compared with the exposure parameter value. When weak, it can be judged that the optical component begins to age, and the working state of the optical component can be automatically adjusted at this time, for example, the optical component is controlled to appropriately extend the exposure time to perform exposure compensation so that the actual exposure can still meet the exposure parameter value. The setting requirement is that if the deviation between the instantaneous optical power (mW) value of the output and the exposure parameter value continuously exceeds the warning range, it can be determined that the optical component 211 has been aged and needs to be replaced, that is, the stencil exposure machine is forced. Stop the exposure operation.

Preferably, the screen exposure machine monitoring system 100 of the present invention shown in FIG. 1 can further perform the following steps in the process of performing exposure monitoring on the exposure device 210: the screen exposure machine monitoring system records the abnormal signal corresponding to the output. The exposure work data, for example, the time when the abnormal signal is output and/or the instantaneous optical power (mW) value of the optical component at the time of outputting the abnormal signal; in addition, the screen exposure machine monitoring system 100 targets the The stencil exposed by the stencil exposure machine 200 identifies a unique identification label, and the exposure time corresponding to the stencil is recorded in the identification label, so as to provide management personnel with quality control for the exposed stencil, which can be easily found. A defective printed circuit that is exposed when the exposure is poor.

Please continue to refer to FIG. 6, which is a flow chart of the vacuum monitoring operation performed by applying the system architecture diagram of FIG. As shown in FIG. 6, first, step S201 is performed to set the vacuum parameter value in the exposure chamber and the corresponding abnormal processing operation flow, and then proceed to step S203.

In step S203, the screen exposure machine monitoring system senses the vacuum pressure in the exposure chamber, and outputs the sensed vacuum pressure value, and then proceeds to step S205.

In step S205, the screen exposure machine monitoring system analyzes whether the vacuum pressure value of the output matches the set vacuum parameter value, and outputs an abnormal signal when the analysis result is that the two do not match; in response to the abnormal signal of the output, And according to the set exception handling operation flow, the corresponding operation is performed.

Next, please refer to FIG. 7 , which is a flow chart of the temperature monitoring operation performed by applying the system architecture diagram of FIG. 4 . As shown in FIG. 7, first, step S301 is performed to set the operating temperature parameter value of the optical element in the exposure apparatus, and then step S303 is performed.

In step S303, the screen exposure machine monitoring system senses the current operating temperature of the optical component, and outputs the sensed operating temperature value, and then proceeds to step S305.

In step S305, the screen exposure machine monitoring system receives the output operating temperature value, and when the operating temperature value of the output is higher than the set operating temperature parameter value, the heat dissipation unit disposed on the exposure device is activated. A cooling operation is performed on the optical element to prevent the operating temperature of the optical element from being excessively high and damaged.

In summary, the stencil exposure machine monitoring system of the present invention detects the working state of the exposure device of the stencil exposure machine through the whole process, including: the instantaneous optical power (mW) value of the optical component and the current working temperature, and the exposure chamber. The vacuum pressure value, when the above work indicators do not match the preset working parameter values, can immediately send a warning to remind the operator, and can also control the zeros on the machine according to the preset abnormal operation processing flow. The parts automatically adjust the working state to reduce the occurrence of defective exposure products, and also extend the working life of the machine parts, thereby reducing production costs.

The above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be as defined in the scope of the invention.

100,100A, 100B, 100C‧‧‧ stencil exposure machine monitoring system
110‧‧‧Exposure Monitoring Module
111‧‧‧Exposure parameter setting unit
113‧‧‧Exposure Detector
115‧‧‧Exposure analysis unit
120‧‧‧Exception handling module
130‧‧‧recording module
150‧‧‧vacuum monitoring module
151‧‧‧vacuum parameter setting unit
153‧‧‧ Pressure sensor
155‧‧‧vacuum analysis unit
160‧‧‧temperature monitoring module
161‧‧‧Temperature parameter setting unit
163‧‧‧Heat unit
165‧‧‧temperature sensor
167‧‧‧temperature control unit
200,200A,200B,200C‧‧‧ stencil exposure machine
201‧‧‧ stencil
210‧‧‧Exposure device
211‧‧‧Optical components
300‧‧‧Information processing equipment
S101~S107‧‧‧Steps
S201~S207‧‧‧Steps
S301~S305‧‧‧Steps

1 is a system architecture diagram for explaining a first embodiment of a screen exposure machine monitoring system of the present invention. 2 is a system architecture diagram for explaining a second embodiment of the screen exposure machine monitoring system of the present invention. 3 is a system architecture diagram for explaining a third embodiment of the screen exposure machine monitoring system of the present invention. 4 is a system architecture diagram for explaining a fourth embodiment of the screen exposure machine monitoring system of the present invention. FIG. 5 is a flow chart of the exposure monitoring operation performed by applying the system architecture diagram of FIG. 1. FIG. 6 is a flow chart of the vacuum monitoring operation performed by applying the system architecture diagram of FIG. 3. FIG. 7 is a flow chart of the temperature monitoring operation performed by applying the system architecture diagram of FIG. 4.

100‧‧‧ stencil exposure machine monitoring system

110‧‧‧Exposure Monitoring Module

111‧‧‧Exposure parameter setting unit

113‧‧‧Exposure Detector

115‧‧‧Exposure analysis unit

120‧‧‧Exception handling module

200‧‧‧ stencil exposure machine

210‧‧‧Exposure device

211‧‧‧Optical components

Claims (16)

A stencil exposure machine monitoring system is applied to a stencil exposure machine having an exposure device for monitoring an operation state of an exposure device of the stencil exposure machine, the system comprising: an exposure monitoring module having: an exposure parameter setting unit And an exposure processing parameter for setting the exposure device and an corresponding abnormal processing operation flow; the exposure detector is disposed in the exposure device of the screen exposure machine, and the exposure device has an optical component, the exposure The detector is configured to continuously detect the instantaneous optical power (mW) of the optical component, and output the detected instantaneous optical power (mW) value; and an exposure analyzing unit for collecting the output of the exposure detector The instantaneous optical power (mW) value of the optical component, and outputting an abnormal signal when the instantaneous optical power (mW) value of the output does not match the exposure parameter value set by the exposure parameter setting unit; and the abnormal processing mode The group, when receiving the abnormal signal output by the exposure analyzing unit, performs a corresponding operation according to the set abnormal processing operation flow, wherein the exposure parameter setting unit Providing a function setting of the double exposure, and a movable filter is disposed in the optical path of the optical component, and the exposure analyzing unit performs the function of the double exposure set by the exposure parameter setting unit to make the optical component in the exposure operation A predetermined wavelength is provided, and after a predetermined time, the movement of the filter is controlled to adjust the predetermined wavelength provided by the optical element to achieve multiple wavelength exposure at a single wavelength. The stencil exposure machine monitoring system of claim 1, wherein the abnormal processing operation flow set by the exposure parameter setting unit includes at least: outputting an alarm signal, adjusting an operating state of the optical component, and One of the group of groups in which the stencil exposure machine stops operating. The stencil exposure machine monitoring system of claim 1, wherein the recording module is configured to record an exposure processing message of the stencil exposure machine for exposing the stencil. The stencil exposure machine monitoring system of claim 3, wherein the recording module records an exposure job data corresponding to the output abnormal signal when the exposure module outputs an abnormal signal, and the exposure operation The data includes one of a group of the time when the abnormal signal is output and the optical power (mW) value of the optical component at the time when the abnormal signal is output. The stencil exposure machine monitoring system of claim 1, wherein the exposure parameter setting unit provides a setting of a customizing standard operating procedure metering function for the user to set the value of the light energy to be input. (mJ), in the exposure operation, the exposure analyzing unit controls the accumulated light energy in a linear processing manner according to the light energy value set by the user. The stencil exposure machine monitoring system of claim 1, wherein a convex lens is disposed in the light path of the optical element to uniformly diverge the light passing through, so that the traveling direction of the light tends to be uniform. The stencil exposure machine monitoring system according to claim 1, wherein the data transmission interface is provided, and the data transmission interface is used for setting the exposure parameter value of the exposure device and the corresponding value thereof by the user at the near end or the distal end. The exception handling operation flow. The stencil exposure machine monitoring system of claim 1, wherein a convex lens is disposed on the light path of the optical element to uniformly diverge the passing light. The stencil exposure machine monitoring system of claim 1, further comprising: a vacuum monitoring module, the vacuum monitoring module having: a vacuum parameter setting unit, configured to provide a vacuum parameter value for setting the exposure chamber and The corresponding exception processing operation flow; a pressure sensor for sensing a vacuum pressure in the exposure chamber and outputting the sensed vacuum pressure value; and a vacuum analysis unit for receiving a vacuum pressure value output by the pressure sensor and analyzing the same When the vacuum pressure value of the output does not match the vacuum parameter value set by the vacuum parameter setting unit, an abnormal signal is output. The stencil exposure machine monitoring system of claim 9, wherein the exception processing module comprises: when receiving the abnormal signal output by the vacuum analysis unit, according to the vacuum parameter setting unit The exception handling operation flow performs the corresponding operation. The stencil exposure machine monitoring system of claim 10, wherein the plurality of pressure sensors are respectively disposed in an exposure chamber and a vacuum source of the screen exposure machine, respectively for sensing The vacuum pump vacuum in the screen exposure machine, the screen provided in the exposure chamber of the screen exposure machine, the vacuum value of the film, the airtightness of the rubber bead, and the vacuuming element provided in the screen exposure machine status. The stencil exposure machine monitoring system of claim 9, wherein the abnormality processing module determines to stop the exposure operation and issue an alarm status message when the vacuum pressure cannot reach the set vacuum parameter value for a predetermined time. The stencil exposure machine monitoring system of claim 1, further comprising: a temperature monitoring module, comprising: a heat dissipating unit disposed adjacent to the optical component for reducing an operating temperature of the optical component; a temperature sensor for sensing a current operating temperature of the optical component and outputting the sensed operating temperature value; The temperature control unit is configured to receive the working temperature value output by the temperature sensor, and start the heat dissipation unit pair when analyzing the working temperature value of the output is higher than the working temperature parameter value set by the temperature parameter setting unit The optical element performs a cooling operation. The stencil exposure machine monitoring system of claim 13, wherein the abnormality processing module determines to stop the exposure operation and issue an alarm status message when the optical element temperature is not lowered for a predetermined time. The stencil exposure machine monitoring system according to claim 13 , further comprising: a contact temperature sensor and a glass table heat dissipating unit, wherein the contact temperature sensor is in contact with the exposure glass table for sensing Measuring the temperature of the exposed glass table, when the temperature control unit analyzes that the temperature value output by the contact temperature sensor is higher than the working temperature parameter value set by the temperature parameter setting unit, starting the glass table heat dissipation unit The exposure glass countertop is subjected to a cooling operation. The stencil exposure machine monitoring system of claim 15, wherein the abnormality processing module determines to stop the exposure operation and issue an alarm status message when the exposure glass table temperature is not lowered for a predetermined time.