TWI557481B - Backlight module - Google Patents
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- TWI557481B TWI557481B TW104130418A TW104130418A TWI557481B TW I557481 B TWI557481 B TW I557481B TW 104130418 A TW104130418 A TW 104130418A TW 104130418 A TW104130418 A TW 104130418A TW I557481 B TWI557481 B TW I557481B
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- guide plate
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- light guide
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- 238000005286 illumination Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Description
本發明係與背光領域相關，尤其是一種將光源直接組設於導光板而為一體之背光模組。 The invention relates to the field of backlights, in particular to a backlight module in which a light source is directly assembled on a light guide plate.
於現今顯示裝置領域中，導光板係調整出光效果之重要元件之一，原理乃透過全反射光學特性將光線導引至導光板遠端，並可利用其上設置之微結構調整垂直射出光線之均勻度與輝度等。 In the field of display devices today, the light guide plate is one of the important components for adjusting the light-emitting effect. The principle is to guide the light to the far end of the light guide plate through the total reflection optical property, and the vertical light can be adjusted by using the microstructure disposed thereon. Uniformity and brightness, etc.
目前背光模組所採用之光源多以發光二極體(下稱LED)為其實施，且該光源可位於導光板底部或側邊，進而相對導光板形成直下式光源或側入式光源。此外，背光模組亦可視需求進一步增設各類光學元件。然，為因應顯示裝置輕薄化趨勢，如何有效將背光模組整體體積縮小與提升光使用效率便為重要之課題。在傳統背光模組中，LED被設置於一電路板上且以導線電性連接其他控制裝置或電源，藉以操控光源之發光狀態。然後，再將電路板及其上之光源與導光板相互組接，利用導光板處理光源發出之光線，便可得到均勻的面光源。然而，由於電路板的存在，導致背光模組整體厚度無法順利降低，且電路板與光源之佈線與電性連接等製程亦相當繁複，進而加劇背光模組製程時間與材料成本。 At present, the light source used in the backlight module is mostly implemented by a light-emitting diode (hereinafter referred to as an LED), and the light source may be located at the bottom or the side of the light guide plate, thereby forming a direct light source or a side-entry light source with respect to the light guide plate. In addition, the backlight module can further add various optical components as needed. However, in order to respond to the trend of thinner and lighter display devices, how to effectively reduce the overall size of the backlight module and improve the light use efficiency is an important issue. In a conventional backlight module, an LED is disposed on a circuit board and electrically connected to other control devices or power sources by wires to control the illumination state of the light source. Then, the circuit board and the light source and the light guide plate are connected to each other, and the light emitted by the light source is processed by the light guide plate to obtain a uniform surface light source. However, due to the existence of the circuit board, the overall thickness of the backlight module cannot be smoothly reduced, and the processes of wiring and electrical connection of the circuit board and the light source are also complicated, thereby increasing the processing time and material cost of the backlight module.
故本發明人係構思一種背光模組，希冀可解決習知背光模組之缺失，除降低組裝製程之繁雜程度與材料成本外，亦可更為符合現今市 場對於背光模組輕薄化之期望。 Therefore, the inventor conceived a backlight module, which can solve the lack of the conventional backlight module, and in addition to reducing the complexity of the assembly process and the material cost, it can also be more in line with the current market. The field is expected to be light and thin for the backlight module.
本發明之一目的，旨在提供一種背光模組，其係可有效簡化背光模組整體組設製程繁雜度，進而降低製造成本及時間成本。 An object of the present invention is to provide a backlight module, which can effectively simplify the complexity of the overall assembly process of the backlight module, thereby reducing manufacturing cost and time cost.
為達上述目的，本發明之背光模組，其包括：一導光板，具有一第一表面及一第二表面，該第二表面係平行且相對該第一表面設置，並於該導光板之一側邊形成有一凹部，該凹部具有一第三表面，該第三表面並平行於該第一表面及該第二表面；一電路層，佈設於該第三表面；及至少一發光源，其係位於該凹部，且電性連接該電路層。藉此，該導光板係透過該凹部，使該發光源可直接設置於該導光板上，以簡化如習知提及需將該發光源先行設置於一電路板之製程，有效降低製程成本，並使該背光模組可更趨薄型化。 To achieve the above objective, the backlight module of the present invention comprises: a light guide plate having a first surface and a second surface, the second surface being parallel and disposed opposite to the first surface, and being disposed on the light guide plate Forming a concave portion on one side, the concave portion having a third surface parallel to the first surface and the second surface; a circuit layer disposed on the third surface; and at least one light source It is located in the recess and is electrically connected to the circuit layer. Thereby, the light guide plate is transmitted through the concave portion, so that the light source can be directly disposed on the light guide plate, so as to simplify the process of setting the light source to a circuit board in advance, thereby effectively reducing the process cost. The backlight module can be made thinner.
於一實施方式中，該凹部係為一溝槽並平行於該導光板之一短軸，並為了進一步提升該導光板對於該發光源之光線利用率，本實施方式更包含一錐形部，其係自該第一表面延伸凸設，並位於該凹部之一側；且該錐形部之一側表面係與該凹部對應該發光源之一入光面為共平面，使該入光面可藉由該錐形部而被延展，以供該發光源發出之光線可全數入射至該導光板內部。 In one embodiment, the recess is a groove and parallel to one of the short axes of the light guide plate, and in order to further improve the light utilization ratio of the light guide plate to the light source, the embodiment further includes a tapered portion. And extending from the first surface and located on one side of the concave portion; and one side surface of the tapered portion is coplanar with the light incident surface of the concave portion corresponding to the concave portion, so that the light incident surface The light can be extended by the tapered portion so that light emitted from the light source can be totally incident inside the light guide plate.
本發明再於另一實施方式中，揭露一種背光模組，其包括：一導光板，具有一第一表面及一第二表面，該第二表面係平行且相對該第一表面設置，且於該第一表面凹設形成有一凹部，該凹部具有一第三表面，該第三表面係平行於該第一表面及該第二表面；一電路層，佈設於該第三 表面；及至少一發光源，其係位於該凹部，並與該電路層電性連接。 In another embodiment, a backlight module includes: a light guide plate having a first surface and a second surface, the second surface being parallel and disposed opposite to the first surface, and The first surface is recessed to form a recess, the recess has a third surface, the third surface is parallel to the first surface and the second surface; a circuit layer is disposed on the third surface a surface; and at least one light source located in the recess and electrically connected to the circuit layer.
基於前述實施方式，本發明於再一實施方式中揭露該凹部係位於該導光板之一長軸中心處，且該凹部係為一溝槽且平行該導光板之一短軸；舉例來說，該凹部之設置方式係可為橫越設置於該第一表面之態樣，亦即，該凹部位於該導光板中央處，使該凹部可對應該發光源而形成至少一入光面，以供光線入射至該導光板內，提升導光板與發光源搭配之設計變化性，以更為符合各類光學需求。 According to the foregoing embodiment, in another embodiment, the recess is located at a center of a long axis of the light guide plate, and the recess is a groove and parallel to one of the short axes of the light guide plate; for example, The concave portion is disposed in a manner of being disposed across the first surface, that is, the concave portion is located at a center of the light guide plate, so that the concave portion can form at least one light incident surface corresponding to the light source for Light is incident on the light guide plate to enhance the design variability of the light guide plate and the light source to better meet various optical requirements.
同前所述，若考量該導光板之光線使用率，於一實施方式中亦可使導光板更進一步包括至少一錐形部，其係自該第一表面延伸凸設，並位於該凹部之至少一側；且該錐形部之一側表面係與該凹部對應該發光源之一入光面為共平面，以透過該錐形部提升該導光板之光線使用率。 In one embodiment, the light guide plate may further include at least one tapered portion extending from the first surface and located in the concave portion, in consideration of the light usage rate of the light guide plate. At least one side; and a side surface of the tapered portion is coplanar with a light incident surface of the concave portion corresponding to the concave portion to enhance the light utilization rate of the light guide plate through the tapered portion.
本發明於次一實施方式中，更揭露一種背光模組，其包括：一導光板，具有一第一表面及一第二表面，該第二表面係平行且相對該第一表面設置，且於該第一表面凹設形成有一凹部，該凹部具有一第三表面，該第三表面係平行於該第一表面及該第二表面；一電路層，佈設於該第三表面；及至少一發光源，其係位於該凹部，並與該電路層電性連接。承前所述，本發明更可於一實施方式中進一步限定該凹部為一溝槽，並形成於該第一表面與該第二表面之間。 In a second embodiment of the present invention, a backlight module includes: a light guide plate having a first surface and a second surface, the second surface being parallel and disposed opposite to the first surface, and The first surface is recessed to form a recess, the recess has a third surface, the third surface is parallel to the first surface and the second surface; a circuit layer is disposed on the third surface; and at least one light is emitted The source is located in the recess and electrically connected to the circuit layer. As described above, the present invention further defines that the recess is a groove and is formed between the first surface and the second surface.
其中，於一實施方式中，該凹部及該發光源可以是多個，且該等凹部係沿該導光板之短軸間隔排列設置，每一該發光源係位於對應之該凹部。藉此，本實施方式可使該等發光源於該導光板之設置上，因應後續搭配應用之需求，或發光源種類等要件，而具有更多的變化性。 In one embodiment, the concave portion and the light source may be plural, and the concave portions are arranged along the short axis of the light guide plate, and each of the light source sources is located corresponding to the concave portion. Therefore, the present embodiment can make the illumination sources from the arrangement of the light guide plate, and has more variability in response to the requirements of the subsequent application, or the type of the illumination source.
綜上所述，本發明所揭露之背光模組，係透過導光板上之凹部以及其內之電路層，使發光源可直接組設於導光板上並與電路層呈電性連接，相較於習知背光模組針對光源與導光板繁雜組裝製程，本發明係可有效簡化製程，免除先行將光源設置於一電路板之步驟，進而降低背光模組製程之時間成本與材料成本。 In summary, the backlight module disclosed in the present invention is configured such that the light source can be directly disposed on the light guide plate and electrically connected to the circuit layer through the concave portion on the light guide plate and the circuit layer therein. In the conventional backlight module for the complicated assembly process of the light source and the light guide plate, the invention can effectively simplify the process, eliminating the step of first setting the light source on a circuit board, thereby reducing the time cost and material cost of the backlight module process.
1‧‧‧背光模組 1‧‧‧Backlight module
10‧‧‧導光板 10‧‧‧Light guide plate
101‧‧‧第一表面 101‧‧‧ first surface
102‧‧‧第二表面 102‧‧‧ second surface
103‧‧‧凹部 103‧‧‧ recess
1031‧‧‧第三表面 1031‧‧‧ third surface
1032‧‧‧入光面 1032‧‧‧Into the glossy surface
11‧‧‧電路層 11‧‧‧ circuit layer
12‧‧‧發光源 12‧‧‧Light source
13‧‧‧錐形部 13‧‧‧Cone
A1‧‧‧長軸 A 1 ‧‧‧ long axis
A2‧‧‧短軸 A 2 ‧‧‧ short axis
第1圖，為本發明第一實施方式之立體組裝示意圖。 Fig. 1 is a perspective view showing the three-dimensional assembly of the first embodiment of the present invention.
第2圖，為本發明第一實施方式之側視平面示意圖。 Fig. 2 is a side plan view showing the first embodiment of the present invention.
第3圖，為本發明第一實施方式之上視平面示意圖。 Fig. 3 is a top plan view showing the first embodiment of the present invention.
第4圖，為本發明第二實施方式之立體組裝示意圖。 Fig. 4 is a perspective view showing the three-dimensional assembly of the second embodiment of the present invention.
第5圖，為本發明第二實施方式之側視平面示意圖。 Figure 5 is a side plan view showing a second embodiment of the present invention.
第6圖，為本發明第二實施方式之上視平面示意圖。 Figure 6 is a top plan view showing a second embodiment of the present invention.
第7圖，為本發明第三實施方式之立體組裝示意圖。 Fig. 7 is a perspective view showing the three-dimensional assembly of the third embodiment of the present invention.
第8圖，為本發明第三實施方式之上視平面示意圖。 Figure 8 is a top plan view showing a third embodiment of the present invention.
為使 貴委員清楚了解本發明內容，以下輔以文字搭配圖式詳細說明，敬請參酌。 In order to make your members understand the contents of the present invention clearly, the following text is accompanied by a detailed description of the text and drawings, please consider.
請參閱第1、2及3圖，其係分別為本發明第一實施方式之立體組裝示意圖、側視平面示意圖及上視平面示意圖。本實施方式所提出之背光模組1，包括一導光板10、一電路層11及至少一發光源12。其中該導光板10具有第一表面101及第二表面102，該第二表面102平行且相對 該第一表面101設置，並於該導光板10之一側邊形成一凹部103，該凹部103具有第三表面1031，且該第三表面1031平行於該第一表面101及該第二表面102。於本實施方式中，該第三表面1031為該凹部103之底部平面；該電路層11佈設於該第三表面1031；該發光源12位於該凹部103內，並電性連接該電路層11。本實施方式透過凹部103將該等發光源12直接設置於導光板10上，進而形成一體式結構有效地簡化習知背光模組之繁複製程步驟。另外，依據各應用領域之光學需求，可進一步地於該背光模組1中增設各式光學元件，例如擴散片或反射片等，藉此使光線具有最適切之出光效果。又該些元件目前發展上已多屬習知，故為凸顯本發明技術特徵，於此不再贅述。 Please refer to Figures 1, 2 and 3, which are respectively a schematic view of a three-dimensional assembly, a side plan view and a top plan view of the first embodiment of the present invention. The backlight module 1 of the present embodiment includes a light guide plate 10, a circuit layer 11, and at least one light source 12. The light guide plate 10 has a first surface 101 and a second surface 102. The second surface 102 is parallel and opposite. The first surface 101 is disposed, and a recess 103 is formed on one side of the light guide plate 10. The recess 103 has a third surface 1031, and the third surface 1031 is parallel to the first surface 101 and the second surface 102. . In the embodiment, the third surface 1031 is a bottom plane of the recess 103. The circuit layer 11 is disposed on the third surface 1031. The light source 12 is located in the recess 103 and electrically connected to the circuit layer 11. In the embodiment, the light source 12 is directly disposed on the light guide plate 10 through the concave portion 103, thereby forming an integrated structure to effectively simplify the complicated copying step of the conventional backlight module. In addition, various optical elements, such as a diffusion sheet or a reflection sheet, may be further added to the backlight module 1 according to the optical requirements of each application field, thereby making the light have an optimum light-emitting effect. Moreover, the development of the components is well known in the prior art, so that the technical features of the present invention are highlighted, and details are not described herein.
此外，由於LED封裝製造技術日趨成熟，是以具高發光效能及低物料成本優點之LED已成當前市場選用之主要考量，例如覆晶封裝LED或晶片級封裝LED即具有此特性。因此本發明之該發光源12較佳者可採用覆晶封裝LED或晶片級封裝LED，並呈複數設置於該凹部103內。 In addition, LED packaging manufacturing technology is becoming more and more mature. LEDs with high luminous efficiency and low material cost have become the main considerations in the current market. For example, flip-chip package LEDs or wafer-level package LEDs have this characteristic. Therefore, the illumination source 12 of the present invention preferably uses a flip chip package LED or a wafer level package LED, and is disposed in the recess 103 in plural.
進一步地，前述之電路層11具體實施上可採用印設有複數接線之薄型板材，而電路層11佈設於該第三表面1031之製程方式可以模內裝飾射出製程技術(In-Mold Decoration,IMD)，如IMR(In-Mold Roller)或IMF(In-Mold Forming)製程方式為之，但並不以此為限。另外，當該等發光源12置於凹部103後，將與該電路層11接線電性連接，供以透過控制裝置或電源調整該等發光源12作動。此外，為使委員理解導光板10上各元件之相對位置關係，該導光板10可定義具有一長軸A1及一短軸A2，該長軸A1係平行導光板10之長邊，該短軸A2係平行導光板10之短邊。於本實施方 式中，該凹部103係為一溝槽且平行短軸A2設置，示意請參照第2圖所示。 Further, the foregoing circuit layer 11 can be implemented by using a thin plate with a plurality of wires, and the circuit layer 11 is disposed on the third surface 1031. The in-mold decoration process technology (In-Mold Decoration, IMD) ), such as IMR (In-Mold Roller) or IMF (In-Mold Forming) process, but not limited to this. In addition, after the light source 12 is placed in the recess 103, it is electrically connected to the circuit layer 11 for adjusting the light source 12 by the control device or the power source. In addition, in order to enable the committee member to understand the relative positional relationship of the components on the light guide plate 10, the light guide plate 10 can be defined to have a long axis A 1 and a short axis A 2 , the long axis A 1 being the long side of the parallel light guide plate 10, The short axis A 2 is the short side of the parallel light guide plate 10. In the present embodiment, the concave portion 103 is a groove and is disposed parallel to the short axis A 2 . Please refer to FIG. 2 for illustration.
由於導光板10之技術發展，以及市場對於導光板10之薄型化要求，本發明所揭示之導光板10厚度可低至約0.2mm~0.7mm。但因當前常用LED高度最低約0.3mm左右，因此該等發光源12設置於凹部103後，可能出現發光源12高度超出導光板10厚度情況，導致該等發光源12所發出之光線無法全數進入導光板10內部，進而造成光利用率下降。為解決此種情況，本發明於另一實施方式中更包含一錐形部13，其係自該第一表面101延伸凸設，並位於該凹部103之一側，使錐形部13之一側表面與凹部103對應該等發光源12之一入光面1032為共平面。藉此，透過該錐形部13延展入光面1032範圍，使該等發光源12所發出之光線全數進入該導光板10內部，有效提升光線使用率。 Due to the technical development of the light guide plate 10 and the market demand for thinning of the light guide plate 10, the thickness of the light guide plate 10 disclosed in the present invention can be as low as about 0.2 mm to 0.7 mm. However, since the current LED height is at least about 0.3 mm, the light source 12 is disposed in the recess 103, and the height of the light source 12 may exceed the thickness of the light guide plate 10, so that the light emitted by the light source 12 cannot be fully entered. The inside of the light guide plate 10 further causes a decrease in light utilization efficiency. In order to solve the above problem, the present invention further includes a tapered portion 13 extending from the first surface 101 and located on one side of the recess 103 to make one of the tapered portions 13 The side surface corresponds to the recess 103 and the light incident surface 1032 of the illumination source 12 is coplanar. Thereby, the tapered portion 13 extends into the range of the light surface 1032, so that all the light emitted by the light source 12 enters the inside of the light guide plate 10, thereby effectively improving the light utilization rate.
請繼續參閱第4、5及6圖，其係分別為本發明第二實施方式之立體組裝示意圖、側視平面示意圖及上視平面示意圖。承第一實施方式，該背光模組1亦包括有該導光板10、該電路層11及該等發光源12。該導光板10具有呈相對平行設置之第一表面101及第二表面102，並凹設形成有該凹部103，該電路層11佈設於凹部103中之第三表面1031，且該第三表面與該第一表面101及該第二表面102平行，該等發光源12係位於該凹部103內，並與電路層11電性連接。於本實施方式中，該凹部103係形成於該第一表面101，並位於該導光板10之長軸A1中心處，且可為一溝槽並平行於該導光板10之短軸A2。於本實施方式，更進一步揭露該凹部103平行於導光板10之短軸A2並位於長軸A1中心處，且同時橫越設置於該第一表面101之態樣，即如第6圖所示。藉此，當該等發光源12設置於凹部 103後，該等發光源12之光線即可透過凹部103之入光面1032進入導光板10內。又如本實施方式揭露之凹部103態樣，該凹部103可對應該等發光源12形成二個入光面1032，該等發光源12可分別利用該等入光面1032投射光線進入導光板10。然而上述之發光源12設置方式，以及該凹部103之態樣皆可依據所需達成之光學需求調整，本發明並不侷限於前述態樣。 Please refer to FIG. 4, FIG. 5 and FIG. 6 respectively, which are respectively a schematic view of a three-dimensional assembly, a side plan view and a top plan view of the second embodiment of the present invention. According to the first embodiment, the backlight module 1 also includes the light guide plate 10, the circuit layer 11, and the illumination sources 12. The light guide plate 10 has a first surface 101 and a second surface 102 disposed in parallel, and is recessed to form the recess 103. The circuit layer 11 is disposed on the third surface 1031 of the recess 103, and the third surface is The first surface 101 and the second surface 102 are parallel, and the light source 12 is located in the recess 103 and electrically connected to the circuit layer 11. In the embodiment, the recessed portion 103 is formed on the first surface 101 and located at the center of the long axis A 1 of the light guide plate 10 , and may be a groove and parallel to the short axis A 2 of the light guide plate 10 . . In this embodiment, it is further disclosed that the concave portion 103 is parallel to the short axis A 2 of the light guide plate 10 and located at the center of the long axis A 1 , and at the same time traverses the aspect disposed on the first surface 101 , that is, as shown in FIG. 6 . Shown. Therefore, after the light source 12 is disposed in the concave portion 103, the light of the light source 12 can pass through the light incident surface 1032 of the concave portion 103 into the light guide plate 10. In addition, as shown in the embodiment of the present invention, the concave portion 103 can form two light-incident surfaces 1032 corresponding to the light-emitting source 12, and the light-emitting sources 12 can respectively project light into the light guide plate 10 by using the light-incident surfaces 1032. . However, the manner in which the illumination source 12 is disposed, and the aspect of the recess 103 can be adjusted according to the optical requirements required, and the present invention is not limited to the foregoing.
同前第一實施方式所述，若需要延展該入光面1032範圍，可透過錐形部13之設置達其目的。當入光面1032為複數設置時，該錐形部13對應各該入光面1032而分別設置於該凹部103之兩側，並使該等錐形部13之一側面與對應之入光面1032為共平面態樣。 As described in the first embodiment, if it is necessary to extend the range of the light incident surface 1032, the purpose of the tapered portion 13 can be achieved. When the light-incident surface 1032 is provided in plural, the tapered portion 13 is disposed on each side of the concave portion 103 corresponding to each of the light-incident surfaces 1032, and one side surface of the tapered portion 13 and the corresponding light-incident surface are provided. 1032 is a coplanar aspect.
請繼續參閱第7及8圖，其係分別為本發明第三實施方式之立體組裝示意圖及上視平面示意圖。承第一及第二實施方式，該背光模組1亦包括有該導光板10、該電路層11及該等發光源12。該導光板10具有呈相互平行設置之該第一表面101與第二表面102，以及凹設成型之凹部103，該電路層11並佈設於該凹部103中之該第三表面1031，該等發光源12則位於凹部103內，而與電路層11電性連接。請再次參閱第7圖，於本實施方式中該凹部103之第三表面1031法線係與該第一表面101平行，該凹部103可呈複數設置且分別為一溝槽，並形成於該第一表面101及第二表面102之間。另，該導光板10亦具有對應其長邊之長軸A1及對應其短邊之短軸A2，而該等凹部103係沿該導光板10之短軸A2間隔排列設置。此外，該等發光源12亦可為複數設置，並分別位於對應之凹部103中。同樣地，各該凹部103亦對應其內之發光源12而形成入光面1032。如前所述，若考量該等發光源12之光線利用率，本發明亦可於一實施方式中，進一步包括自該 第一表面101延伸凸設並位於凹部103一側之錐形部13，且該錐形部13之一側面並分別與入光面1032呈共平面態樣，使該錐形部13對應位於導光板10之短邊設置。於本實施方式中，提供了另種凹部103與該等發光源12之設置態樣，而可因應導光板10之各類光學需求以及該等發光源12之種類變化。 Please refer to FIGS. 7 and 8 , which are respectively a schematic perspective view of a third embodiment of the present invention and a top plan view. According to the first and second embodiments, the backlight module 1 also includes the light guide plate 10, the circuit layer 11, and the illumination sources 12. The light guide plate 10 has the first surface 101 and the second surface 102 disposed in parallel with each other, and a concavely formed concave portion 103. The circuit layer 11 is disposed on the third surface 1031 of the concave portion 103, and the like. The light source 12 is located in the recess 103 and is electrically connected to the circuit layer 11. Referring to FIG. 7 again, in the present embodiment, the third surface 1031 of the concave portion 103 is parallel to the first surface 101. The concave portion 103 may be plurally disposed and respectively formed as a groove, and formed on the first surface. Between a surface 101 and a second surface 102. In addition, the light guide plate 10 also has a major axis A 1 corresponding to the long side thereof and a minor axis A 2 corresponding to the short side thereof, and the concave portions 103 are arranged along the short axis A 2 of the light guide plate 10 . In addition, the illumination sources 12 may also be provided in multiple numbers and respectively located in the corresponding recesses 103. Similarly, each of the recesses 103 also forms a light incident surface 1032 corresponding to the light source 12 therein. As described above, the present invention may further include, in an embodiment, a tapered portion 13 extending from the first surface 101 and located on a side of the concave portion 103, in consideration of the light utilization ratio of the light source 12, One side surface of the tapered portion 13 is coplanar with the light incident surface 1032, and the tapered portion 13 is disposed corresponding to the short side of the light guide plate 10. In the present embodiment, the arrangement of the other recesses 103 and the illumination sources 12 is provided, and the optical requirements of the light guide plate 10 and the types of the illumination sources 12 may be varied.
綜上所述，本發明係透過該凹部103，將該等發光源12先行與導光板10結合，相較習知需將該等發光源12與一電路板進行組裝，再與導光板10結合使用之製程，本發明係可簡化傳統製程，以有效地降低製程時間成本與材料成本。此外，該凹部103之態樣可依據光學需求進行調整，於簡化製程同時，亦可進一步提升導光板10之導光效果。 In summary, the present invention transmits the light source 12 to the light guide plate 10 through the recess 103, and the light source 12 is assembled with a circuit board and then combined with the light guide plate 10. The process of the invention simplifies the conventional process to effectively reduce the process time cost and material cost. In addition, the aspect of the recess 103 can be adjusted according to optical requirements, and the light guiding effect of the light guide plate 10 can be further improved while simplifying the process.
以上所述者，僅為本發明之較佳實施方式而已，並非用以限定本發明實施之範圍；故在不脫離本發明之精神與範圍下所作之均等變化與修飾，皆應涵蓋於本發明之專利範圍內。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; therefore, equivalent changes and modifications may be made without departing from the spirit and scope of the invention. Within the scope of the patent.
1‧‧‧背光模組 1‧‧‧Backlight module
10‧‧‧導光板 10‧‧‧Light guide plate
101‧‧‧第一表面 101‧‧‧ first surface
102‧‧‧第二表面 102‧‧‧ second surface
103‧‧‧凹部 103‧‧‧ recess
1031‧‧‧第三表面 1031‧‧‧ third surface
11‧‧‧電路層 11‧‧‧ circuit layer
12‧‧‧發光源 12‧‧‧Light source
13‧‧‧錐形部 13‧‧‧Cone
Claims (10)
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| TW104130418A TWI557481B (en) | 2015-09-15 | 2015-09-15 | Backlight module |
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| TW104130418A TWI557481B (en) | 2015-09-15 | 2015-09-15 | Backlight module |
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| TWI557481B true TWI557481B (en) | 2016-11-11 |
| TW201710761A TW201710761A (en) | 2017-03-16 |
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| TWI663450B (en) * | 2018-04-03 | 2019-06-21 | Global Lighting Technologies Inc. | A thin light guide structure and assembly method of thin optical module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7997784B2 (en) * | 2009-05-12 | 2011-08-16 | Global Lighting Technologies (Taiwan) Inc. | Light guide apparatus of backlight module |
| TW201137466A (en) * | 2010-04-21 | 2011-11-01 | Foxsemicon Integrated Tech Inc | Backlight module |
| US8480286B2 (en) * | 2009-05-12 | 2013-07-09 | Global Lighting Technologies Inc. | Light guide apparatus for backlight module |
| CN203082685U (en) * | 2012-12-17 | 2013-07-24 | 达运精密工业（厦门）有限公司 | Backlight module and display device provided with same |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7997784B2 (en) * | 2009-05-12 | 2011-08-16 | Global Lighting Technologies (Taiwan) Inc. | Light guide apparatus of backlight module |
| US8480286B2 (en) * | 2009-05-12 | 2013-07-09 | Global Lighting Technologies Inc. | Light guide apparatus for backlight module |
| TW201137466A (en) * | 2010-04-21 | 2011-11-01 | Foxsemicon Integrated Tech Inc | Backlight module |
| CN203082685U (en) * | 2012-12-17 | 2013-07-24 | 达运精密工业（厦门）有限公司 | Backlight module and display device provided with same |
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