TWI554739B - Image capture system and defect detection method for a hot object - Google Patents
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- 238000001514 detection method Methods 0.000 title claims description 20
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Description
本發明是有關於一種熱物件影像擷取系統與熱物件瑕疵檢測方法,特別是有關於一種應用光電偵測裝置之熱物件影像擷取系統與熱物件瑕疵檢測方法。 The invention relates to a hot object image capturing system and a hot object detecting method, in particular to a hot object image capturing system and a hot object detecting method using a photoelectric detecting device.
在鋼鐵的生產線中,通常會安裝檢測設備來檢測產品是否合格。例如,利用影像擷取裝置來擷取產品的表面影像,並透過影像處理的技術來判斷產品表面是否出現瑕疵。然而,為了確保檢測作業能順利進行,往往還需要知道產品何時到達檢測設備的安裝地點以及用多少的取樣頻率來進行檢測作業。對於高溫的鋼品而言,利用鋼品的亮度來偵測鋼品位置是常用的方法。例如,使用熱金屬偵測器(HOT METAL DETECTOR)來偵測鋼品位置。又例如,擷取產線影像並對影像亮度進行分析,以取得鋼品位置和移動速度,並推算出取樣頻率。然而,熱金屬偵測器無法單獨用來作為鋼品通過影像擷取裝置前的外在定頻率擷取影像觸 發,而習知的影像亮度分析方式則無法在短距離偵測的情況下,針對單方向移動的長形物件進行偵測。 In steel production lines, testing equipment is usually installed to check if the product is qualified. For example, the image capture device is used to capture the surface image of the product, and the image processing technology is used to determine whether the surface of the product is flawed. However, in order to ensure that the inspection operation can proceed smoothly, it is often necessary to know when the product arrives at the installation location of the detection device and how many sampling frequencies are used for the inspection operation. For high-temperature steels, it is a common method to use the brightness of steel to detect the position of steel. For example, a hot metal detector (HOT METAL DETECTOR) is used to detect the position of the steel. For another example, the production line image is captured and the image brightness is analyzed to obtain the steel product position and moving speed, and the sampling frequency is derived. However, the hot metal detector cannot be used alone as a steel product to capture image touches through the external fixed frequency before the image capturing device. The conventional image brightness analysis method cannot detect long objects moving in one direction under short-distance detection.
因此,需要一種熱物件影像擷取系統與熱物件瑕疵檢測方法來來解決上述問題。 Therefore, there is a need for a thermal object image capture system and a thermal object detection method to solve the above problems.
本發明之一方面是在提供一種熱物件影像擷取系統與熱物件瑕疵檢測方法,其利用光電偵測裝置來偵測鋼品位置,並透過中介裝置(例如,微中央處理器)來發送取樣訊號,以利檢測作業的進行。 One aspect of the present invention provides a method for detecting a thermal object image capturing system and a thermal object detecting device, which uses a photodetecting device to detect a steel product position and transmits a sampling through an intermediary device (for example, a micro central processing unit). Signal to facilitate the inspection operation.
根據本發明之一實施例,此熱物件影像擷取系統包含複數台影像擷取裝置、複數台電腦、光電偵測裝置以及中介裝置。影像擷取裝置係環設於熱物件,以擷取熱物件之複數張部分表面影像。電腦係電性連接至影像擷取裝置,以根據複數個控制訊號來控制影像擷取裝置。光電偵測裝置係用以偵測熱物件,以判斷熱物件是否靠近影像擷取裝置,其中當光電偵測裝置偵測到該熱物件時,送出偵測訊號。中介裝置係電性連接至光電偵測裝置以及電腦,以根據偵測訊號來傳送控制訊號至電腦。 According to an embodiment of the invention, the thermal object image capturing system comprises a plurality of image capturing devices, a plurality of computers, a photodetecting device and an intermediary device. The image capturing device is disposed on the hot object to capture a plurality of surface images of the hot object. The computer is electrically connected to the image capturing device to control the image capturing device according to the plurality of control signals. The photodetecting device is configured to detect the hot object to determine whether the hot object is close to the image capturing device, and when the photo detecting device detects the hot object, the detecting signal is sent. The intermediary device is electrically connected to the photodetection device and the computer to transmit the control signal to the computer according to the detection signal.
根據本發明之另一實施例,在此熱物件瑕疵檢測方法中,首先利用光電偵測裝置來偵測熱物件,以判斷熱物件是否靠近複數台影像擷取裝置。然後,當光電偵測裝置偵測到熱物件時,利用中介裝置來傳送複數個控制訊號至複數台電腦,以透過電腦來控制影像擷取裝置同時擷取熱物件 之複數張部分表面影像。接著,利用電腦來處理熱物件之部分表面影像,以獲得熱物件之表面瑕疵資訊。 According to another embodiment of the present invention, in the method for detecting a hot object, the photodetecting device is first used to detect the hot object to determine whether the hot object is close to the plurality of image capturing devices. Then, when the photodetection device detects the hot object, the intermediary device is used to transmit a plurality of control signals to the plurality of computers to control the image capturing device and simultaneously capture the hot object through the computer. a plurality of partial surface images. Then, a computer is used to process a part of the surface image of the hot object to obtain the surface information of the hot object.
100‧‧‧熱物件影像擷取系統 100‧‧‧Hot object image capture system
110‧‧‧影像擷取裝置 110‧‧‧Image capture device
120‧‧‧電腦 120‧‧‧ computer
130‧‧‧光電偵測裝置 130‧‧‧Photodetection device
132‧‧‧冷卻保護管 132‧‧‧Cooling protection tube
132a‧‧‧入水口 132a‧‧‧ Inlet
132b‧‧‧外層管 132b‧‧‧ outer tube
132c‧‧‧封閉焊件 132c‧‧‧Closed weldment
132d‧‧‧內層管 132d‧‧‧Inner tube
132e‧‧‧出水口 132e‧‧‧ water outlet
134‧‧‧主體 134‧‧‧ Subject
134a‧‧‧內管 134a‧‧‧ inner management
134b‧‧‧外銜接件 134b‧‧‧External joints
134c‧‧‧內銜接件 134c‧‧‧Internal connection
134d‧‧‧絕緣座體 134d‧‧‧Insulated body
134e‧‧‧透明鏡片 134e‧‧‧Transparent lenses
134f‧‧‧絕緣座蓋 134f‧‧‧Insulated cover
136‧‧‧三通管 136‧‧‧ tee
136a‧‧‧訊號出口端部 136a‧‧‧ signal exit end
136b‧‧‧進氣部 136b‧‧‧Intake Department
136c‧‧‧連接部 136c‧‧‧Connecting Department
140‧‧‧中介裝置 140‧‧‧Intermediary device
142‧‧‧微中央處理器 142‧‧‧Micro Central Processing Unit
144‧‧‧複製器 144‧‧‧Replicator
200‧‧‧熱物件瑕疵檢測方法 200‧‧‧Hot object detection method
210-230‧‧‧步驟 210-230‧‧‧Steps
ACH1-3‧‧‧溝槽部 ACH1-3‧‧‧ Groove Department
DB‧‧‧組合部分 DB‧‧‧ combination part
GB‧‧‧座體 GB‧‧‧ body
HO‧‧‧熱物件 HO‧‧‧Hot items
LD‧‧‧光電二極體 LD‧‧‧Photoelectric diode
OP‧‧‧組合孔 OP‧‧‧ combination hole
TB‧‧‧組合部分 TB‧‧‧ combination part
SB‧‧‧座體 SB‧‧‧ body
SCW1-5‧‧‧螺牙部分 SCW1-5‧‧‧ threaded part
為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂,上文特舉數個較佳實施例,並配合所附圖式,作詳細說明如下:圖1係繪示根據本發明實施例之熱物件影像擷取系統的架構示意圖。 The above and other objects, features, and advantages of the present invention will become more apparent and understood. A schematic diagram of the architecture of the thermal object image capturing system of the embodiment of the invention.
圖2係繪示根據本發明實施例之熱物件瑕疵檢測方法的流程示意圖。 FIG. 2 is a schematic flow chart of a method for detecting a hot object 瑕疵 according to an embodiment of the invention.
圖3係繪示根據本發明實施例之光電偵測裝置的冷卻保護管的結構示意圖。 3 is a schematic structural view of a cooling protection tube of a photodetecting device according to an embodiment of the invention.
圖4係繪示根據本發明實施例之光電偵測裝置的主體的結構示意圖。 4 is a schematic structural view of a main body of a photodetecting device according to an embodiment of the invention.
圖5係繪示根據本發明實施例之光電偵測裝置的三通管的結構示意圖。 FIG. 5 is a schematic structural view of a tee of a photodetecting device according to an embodiment of the invention.
請參照圖1,圖1係繪示根據本發明實施例之熱物件影像擷取系統100的架構示意圖。熱物件影像擷取系統100包含複數台影像擷取裝置110、複數台電腦120、光電偵測裝置130以及中介裝置140。影像擷取裝置110係用以擷取擷取熱物件HO的表面影像。在本實施例中,熱物 件HO為產線上的鋼胚,其係透過傳送裝置沿著產線移動,而移動方向則是垂直於圖面。影像擷取裝置110係環繞設置於熱物件HO的周圍,以針對熱物件HO的各個表面部分來擷取影像。在本實施例中,影像擷取裝置110可例如為攝影機,但本發明之實施例並不受限於此。 Please refer to FIG. 1. FIG. 1 is a schematic structural diagram of a thermal object image capturing system 100 according to an embodiment of the invention. The thermal object image capturing system 100 includes a plurality of image capturing devices 110, a plurality of computers 120, a photodetecting device 130, and an intermediary device 140. The image capturing device 110 is configured to capture a surface image of the hot object HO. In this embodiment, the hot object The piece HO is the steel embryo on the production line, which is moved along the production line by the conveying device, and the moving direction is perpendicular to the drawing surface. The image capturing device 110 is disposed around the hot object HO to capture an image for each surface portion of the thermal object HO. In the embodiment, the image capturing device 110 can be, for example, a camera, but the embodiment of the present invention is not limited thereto.
光電偵測裝置130係用以偵測熱物件HO,以判 斷熱物件HO是否靠近。在本實施例中,光電偵測裝置130為光電二極體,其係設置於影像擷取裝置110附近。由於熱物件HO會放出較強的光線,因此當熱物件HO靠近影像擷取裝置110時,光電偵測裝置130便會偵測到熱物件HO的光線並送出偵測訊號至中介裝置140。 The photodetection device 130 is used to detect the hot object HO to judge Whether the heat-insulating object HO is close. In the embodiment, the photodetection device 130 is a photodiode, which is disposed near the image capturing device 110. Since the hot object HO emits a strong light, when the hot object HO approaches the image capturing device 110, the photo detecting device 130 detects the light of the hot object HO and sends a detection signal to the interposer 140.
中介裝置140係電性連接於光電偵測裝置130與 電腦120之間,以根據光電偵測裝置130所傳送的偵測訊號來傳送控制訊號至所有的電腦120,以使電腦120控制影像擷取裝置110來擷取熱物件HO的表面影像。如圖1所示,中介裝置140包含微中央處理器142以及複製器144。微中央處理器142係用以根據光電偵測裝置130之偵測訊號來產生固定頻率的控制訊號,而複製器144則用以複製控制訊號,並將這些控制訊號分別傳送至各電腦120,以使電腦120根據控制訊號來控制影像擷取裝置110。 The mediation device 140 is electrically connected to the photodetection device 130 and Between the computers 120, the control signals are transmitted to all the computers 120 according to the detection signals transmitted by the photodetection device 130, so that the computer 120 controls the image capturing device 110 to capture the surface images of the thermal objects HO. As shown in FIG. 1, the mediation device 140 includes a micro central processor 142 and a replicator 144. The micro central processing unit 142 is configured to generate a fixed frequency control signal according to the detection signal of the photodetection device 130, and the replicator 144 is configured to copy the control signals and transmit the control signals to the computers 120 respectively. The computer 120 is caused to control the image capturing device 110 according to the control signal.
在本實施例中,微中央處理器142所產生的控制 訊號為脈衝訊號,其頻率為6赫茲。意即,當電腦120接收到脈衝訊號後,便會控制影像擷取裝置110以每秒6次的頻率來擷取熱物件HO的表面影像。在本發明之其他實施例 中,微中央處理器142亦可以產生不同頻率的脈衝訊號來控制影像擷取裝置110。 In the present embodiment, the control generated by the micro central processing unit 142 The signal is a pulse signal with a frequency of 6 Hz. That is, when the computer 120 receives the pulse signal, the image capturing device 110 is controlled to capture the surface image of the hot object HO at a frequency of 6 times per second. Other embodiments of the invention The micro central processing unit 142 can also generate pulse signals of different frequencies to control the image capturing device 110.
請參照圖2,圖2係繪示根據本發明實施例之 熱物件瑕疵檢測方法200的流程示意圖。本實施例之熱物件瑕疵檢測方法200係適用於熱物件影像擷取系統100,以針對熱物件HO進行表面瑕疵檢測。在熱物件瑕疵檢測方法200中,首先進行步驟210,以利用光電偵測裝置130來偵測熱物件HO,以判斷熱物件HO是否靠近影像擷取裝置110。然後,進行步驟220,以於光電偵測裝置偵測到熱物件HO時,利用中介裝置140來傳送控制訊號至120電腦,以透過電腦120來控制影像擷取裝置110同時擷取熱物件HO之各部分的表面影像。 Please refer to FIG. 2, which illustrates an embodiment of the present invention. A schematic diagram of the flow of the hot object detection method 200. The hot object detection method 200 of the present embodiment is applied to the thermal object image capturing system 100 for surface flaw detection of the hot object HO. In the hot object detection method 200, step 210 is first performed to detect the hot object HO by using the photodetection device 130 to determine whether the hot object HO is close to the image capturing device 110. Then, step 220 is performed to transmit the control signal to the 120 computer by using the mediation device 140 when the photodetection device detects the hot object HO, and the image capturing device 110 is controlled by the computer 120 to simultaneously capture the hot object HO. Surface image of each part.
在本實施中,由於熱物件HO具有較高的亮度, 故當熱物件HO靠近光電偵測裝置130時,光電偵測裝置130會相應地產生偵測訊號,並傳送至中介裝置140。中介裝置140之微中央處理器142可接收偵測裝置130的偵測訊號,並相應地產生具有固定頻率之脈衝訊號,而複製器144則複製此脈衝訊號並傳送至每台電腦120。當電腦120接收到此脈衝訊號後,便會根據脈衝訊號的頻率來控制影像擷取裝置110進行影像擷取的作業。例如,當脈衝訊號之頻率為6赫茲時,影像擷取裝置110會以每秒6次的頻率來擷取熱物件HO的影像,並傳送至相應的電腦120。 In the present embodiment, since the hot object HO has a high brightness, Therefore, when the hot object HO approaches the photodetection device 130, the photodetection device 130 generates a detection signal correspondingly and transmits it to the interposer 140. The micro central processing unit 142 of the mediation device 140 can receive the detection signal of the detection device 130 and correspondingly generate a pulse signal having a fixed frequency, and the replicator 144 copies the pulse signal and transmits it to each computer 120. When the computer 120 receives the pulse signal, the image capturing device 110 controls the image capturing operation according to the frequency of the pulse signal. For example, when the frequency of the pulse signal is 6 Hz, the image capturing device 110 captures the image of the hot object HO at a frequency of 6 times per second and transmits it to the corresponding computer 120.
在步驟220後,接著進行步驟230,以利用電腦120來處理這些表面影像,例如影像二值化,以獲得熱 物件HO之表面瑕疵資訊。獲得熱物件HO之表面瑕疵資訊後,作業人員便可根據表面瑕疵資訊來進行適當的處理,例如調整製程參數。 After step 220, step 230 is followed to process the surface images, such as image binarization, using computer 120 to obtain heat. The surface of the object HO is 瑕疵 information. After obtaining the surface information of the hot object HO, the operator can perform appropriate processing according to the surface information, such as adjusting the process parameters.
另外,本實施例之光電偵測裝置130包含有多 層套件的保護體,以保護內部的光電二極體不被外部水氣和油污破壞,並提供冷卻效果。以下將詳述光電偵測裝置130之構造。 In addition, the photodetection device 130 of the embodiment includes a plurality of The protection of the layer kit protects the internal photodiode from damage by external moisture and oil and provides a cooling effect. The configuration of the photodetecting device 130 will be described in detail below.
請參照圖3、圖4以及圖5,其係分別繪示根 據本發明實施例之光電偵測裝置130之冷卻保護管132、主體134以及三通管136的結構示意圖。如圖3所示,冷卻保護管132具有入水口132a、外層管132b、封閉焊件132c、內層管132d以及出水口132e。外層管132b、封閉焊件132c與內層管132d係構成管狀的容置空間,以容置冷卻液體,例如水。入水口132a用以供水注入至容置空間中,而出水口132e則用以供容置空間中的水流出,如此可使冷卻保護管132提供冷卻保護的效果。 Please refer to FIG. 3, FIG. 4 and FIG. 5, which respectively show the root A schematic diagram of the structure of the cooling protection tube 132, the main body 134 and the tee tube 136 of the photodetecting device 130 according to the embodiment of the present invention. As shown in FIG. 3, the cooling protection tube 132 has a water inlet 132a, an outer layer tube 132b, a closed weldment 132c, an inner tube 132d, and a water outlet 132e. The outer tube 132b, the closed weldment 132c and the inner tube 132d form a tubular accommodation space for accommodating a cooling liquid such as water. The water inlet 132a is used for injecting water into the accommodating space, and the water outlet 132e is for discharging water in the accommodating space, so that the cooling protection tube 132 can provide the effect of cooling protection.
如圖4所示,主體134包含內管134a、外銜 接件134b、內銜接件134c、絕緣座體134d、光電二極體LD、透明鏡片134e以及絕緣座蓋134f。在本實施例中,內管134a、內銜接件134c、絕緣座體134d、光電二極體LD、透明鏡片134e以及絕緣座蓋134f係依序組裝並穿設於冷卻保護管132中。當前述元件設置於冷卻保護管132內之後,外銜接件134b再鎖固於內管134a與冷卻保護管132中,其中外銜接件134b直徑較小的螺牙部分SCW1係 鎖固於內管134a中,而外銜接件134b直徑較大的螺牙部分SCW2係鎖固於內層管132d的螺牙部分。由於螺牙部分SCW2具有較大的直徑,當螺牙部分SCW1完全鎖入至內管134a後,螺牙部分SCW2便會抵靠在內管134a之環形側壁上,以封閉此內管端部。鎖固完成後,外銜接件134b之座體GB會位於冷卻保護管132的外側,並將冷卻保護管132之內層管132d的一端封閉。 As shown in FIG. 4, the main body 134 includes an inner tube 134a and an outer title. The connector 134b, the inner connector 134c, the insulating base 134d, the photodiode LD, the transparent lens 134e, and the insulating seat cover 134f. In the present embodiment, the inner tube 134a, the inner connecting member 134c, the insulating base 134d, the photodiode LD, the transparent lens 134e, and the insulating seat cover 134f are sequentially assembled and passed through the cooling protection tube 132. After the foregoing components are disposed in the cooling protection tube 132, the outer connecting member 134b is re-locked in the inner tube 134a and the cooling protection tube 132, wherein the outer connecting member 134b has a smaller diameter portion SCW1 The threaded portion SCW2 having a larger diameter of the outer engaging member 134b is locked to the threaded portion of the inner tube 132d. Since the thread portion SCW2 has a large diameter, when the thread portion SCW1 is completely locked into the inner tube 134a, the thread portion SCW2 abuts against the annular side wall of the inner tube 134a to close the inner tube end. After the locking is completed, the seat GB of the outer joint 134b is located outside the cooling protection tube 132, and one end of the inner tube 132d of the cooling protection tube 132 is closed.
內銜接件134c具有螺牙部分SCW3以及組合 部分TB,其中螺牙部分SCW3具有較小的直徑,而組合部分TB具有較大的直徑。螺牙部分SCW3係用以鎖固於內管134a中,以連接內銜接件134c與內管134a。由於組合部分TB具有較大的直徑,當螺牙部分SCW3完全鎖入至內管134a後,組合部分TB便會抵靠在內管134a之環形側壁(未繪示)上,以封閉此內管端部。 The inner joint 134c has a threaded portion SCW3 and a combination Part TB, wherein the thread portion SCW3 has a smaller diameter and the combined portion TB has a larger diameter. The thread portion SCW3 is used to lock in the inner tube 134a to connect the inner joint 134c and the inner tube 134a. Since the combined portion TB has a larger diameter, when the thread portion SCW3 is completely locked into the inner tube 134a, the combined portion TB abuts against the annular side wall (not shown) of the inner tube 134a to close the inner tube. Ends.
絕緣座體134d具有螺牙部分SCW4以及組合 部分DB,其中螺牙部分SCW4具有較小的直徑,而組合部分DB具有較大的直徑。螺牙部分SCW4係用以鎖固於內銜接件134c之組合部分TB中,以連接絕緣座體134d與內銜接件134c。由於組合部分DB具有較大的直徑,當螺牙部分SCW4完全鎖入至組合部分TB後,組合部分DB便會與組合部分TB直接接觸,以封閉內銜接件134c的端部。 Insulating housing 134d has a threaded portion SCW4 and a combination Part DB, in which the thread portion SCW4 has a smaller diameter and the combined portion DB has a larger diameter. The thread portion SCW4 is for locking in the combined portion TB of the inner joint 134c to connect the insulating seat 134d and the inner joint 134c. Since the combined portion DB has a larger diameter, when the thread portion SCW4 is completely locked to the combined portion TB, the combined portion DB is in direct contact with the combined portion TB to close the end of the inner joint 134c.
光電二極體LD係設置於絕緣座體134d之組合部分DB中,以進行熱物件之偵測作業。在本實施例中,絕 緣座體134d係以絕緣材料所製成,以利容置光電二極體LD。 The photodiode LD is disposed in the combined portion DB of the insulating base 134d for detecting the hot object. In this embodiment, absolutely The edge body 134d is made of an insulating material to accommodate the photodiode LD.
絕緣座蓋134f具有螺牙部分SCW5以及座體 SB。螺牙部分SCW5係穿設於冷卻保護管132中,以將透明鏡片134e(例如,玻璃片)設置於光電二極體LD前方來保護光電二極體LD,其中絕緣座蓋134f與絕緣座體134d皆為管狀結構,且螺牙部分SCW5之直徑與冷卻保護管132之內層管132d匹配,故螺牙部分SCW5可鎖入至冷卻保護管132中,並將透明鏡片134e固定於保護光電二極體LD前方。座體SB具有較螺牙部分SCW5大的直徑,當螺牙部分SCW5鎖入至冷卻保護管132後,座體SB會位於組合部分DB外,並將冷卻保護管132之內層管132d的一端封閉。 意即,冷卻保護管132之內層管132d的兩端分別被外銜接件134b之座體GB以及絕緣座蓋134f之座體SB所封閉。 The insulating seat cover 134f has a screw portion SCW5 and a seat body SB. The screw portion SCW5 is disposed in the cooling protection tube 132 to protect the photodiode LD by placing a transparent lens 134e (for example, a glass piece) in front of the photodiode LD, wherein the insulating seat cover 134f and the insulating seat body 134d is a tubular structure, and the diameter of the screw portion SCW5 is matched with the inner tube 132d of the cooling protection tube 132, so the screw portion SCW5 can be locked into the cooling protection tube 132, and the transparent lens 134e is fixed to the protection photoelectric two. The front of the polar body LD. The seat body SB has a larger diameter than the screw portion SCW5. When the screw portion SCW5 is locked to the cooling protection tube 132, the seat body SB is located outside the combined portion DB, and one end of the inner tube 132d of the cooling protection tube 132 is cooled. Closed. That is, both ends of the inner tube 132d of the cooling protection tube 132 are respectively closed by the seat body GB of the outer joint member 134b and the seat body SB of the insulating seat cover 134f.
由上述說明以及圖4之揭露可知內管134a、外 銜接件134b、內銜接件134c以及絕緣座體134d皆為管狀結構,當上述元件依序鎖固組合後,便會在內部形成氣體流道。另外,銜接件134b以及內銜接件134c上分別形成有溝槽部ACH1-ACH3。當上述元件依序鎖固組合後,溝槽部ACH1-ACH3便會提供外部的氣體流道。 From the above description and the disclosure of FIG. 4, the inner tube 134a and the outer tube are known. The connecting member 134b, the inner connecting member 134c and the insulating seat 134d are all tubular structures. When the components are sequentially locked and combined, a gas flow path is formed inside. Further, groove portions ACH1-ACH3 are formed on the joint member 134b and the inner joint member 134c, respectively. When the above components are sequentially locked and combined, the groove portions ACH1-ACH3 provide an external gas flow path.
例如,當氣體從外銜接件134b的組合孔OP進 入至主體134後,便會沿著內部氣體流道一路流至絕緣座體134d的組合部分DB。接著,再透過組合部分DB前端的孔隙回流入溝槽部ACH3。由於內管134a的直徑小於內銜 接件134c之組合部分TB的直徑以及外銜接件134b之螺牙部分SCW2的直徑,故溝槽部ACH3中的氣體可沿著內管134a的表面流入至溝槽部ACH1中,接著再透過溝槽部ACH2流至光電偵測裝置130外部。 For example, when the gas enters from the combined hole OP of the outer joint 134b After entering the main body 134, it flows along the internal gas flow path to the combined portion DB of the insulating seat 134d. Then, the pores of the front end of the combined portion DB are recirculated into the groove portion ACH3. Since the diameter of the inner tube 134a is smaller than the inner position The diameter of the combined portion TB of the joint 134c and the diameter of the threaded portion SCW2 of the outer joint 134b, so that the gas in the groove portion ACH3 can flow into the groove portion ACH1 along the surface of the inner tube 134a, and then pass through the groove. The groove portion ACH2 flows to the outside of the photodetecting device 130.
在本發明之其他實施例中,絕緣座體134d的螺 牙部分SCW4可不完全鎖入至組合部分TB,如此內部氣體流道中的氣體亦可藉由螺牙部分SCW4的氣隙回流至外部氣體流道中。 In other embodiments of the invention, the snail of the insulating base 134d The tooth portion SCW4 may not be completely locked into the combined portion TB, so that the gas in the internal gas flow passage may also be returned to the external gas flow passage by the air gap of the screw portion SCW4.
如圖5所示,三通管136具有訊號出口端部 136a、進氣部136b以及連接部136c,其中連接部136c係連接至外銜接件134b的組合孔OP。進氣部136b係用以供外部氣體輸入,以使外部氣體透過三通管136進入至主體134的內部氣體流道中。訊號出口端部136a係用以供光電二極體LD的訊號線穿設於其中,以使光電二極體LD的訊號能傳送至光電偵測裝置130外。在本實施例中,光電二極體LD的訊號線係設置於主體134的內部氣體流道中以及三通管136的訊號出口端部136a與連接部136c中,但本發明之實施例並不受限於此。 As shown in FIG. 5, the tee 136 has a signal outlet end. 136a, the inlet portion 136b, and the connecting portion 136c, wherein the connecting portion 136c is coupled to the combined hole OP of the outer engaging member 134b. The intake portion 136b is for external air input to allow external air to pass through the tee 136 into the internal gas flow path of the body 134. The signal output end portion 136a is configured to allow the signal line of the photodiode LD to pass through to enable the signal of the photodiode LD to be transmitted outside the photodetecting device 130. In this embodiment, the signal line of the photodiode LD is disposed in the internal gas flow path of the body 134 and the signal exit end 136a and the connection portion 136c of the tee 136, but the embodiment of the present invention is not Limited to this.
另外,值得一提的是本實施例之冷卻保護管 132、內管134a、外銜接件134b以及內銜接件134c之材料為金屬,以利加工與散熱。 In addition, it is worth mentioning that the cooling protection tube of this embodiment 132. The inner tube 134a, the outer connecting member 134b and the inner connecting member 134c are made of metal for processing and heat dissipation.
由以上說明可知,本發明實施例之熱物件影像 擷取系統100與熱物件瑕疵檢測方法200係利用光電偵測裝置130來偵測熱物件的位置,並透過中介裝置140來發 送取樣訊號,如此可有利於檢測作業的進行。其次,本發明實施例之熱物件影像擷取系統100採用了光電偵測裝置130來進行偵測。由於光電偵測裝置130係利用水冷和氣冷兩種方式來降低光電偵測裝置130的溫度,且應用玻璃來防護內部的光電二極體LD,本發明實施例之熱物件影像擷取系統100可應用於高溫的工作現場來進行偵測。 It can be seen from the above description that the hot object image of the embodiment of the present invention The capturing system 100 and the hot object detecting method 200 use the photodetecting device 130 to detect the position of the hot object and send it through the mediation device 140. Send sampling signals, which can be beneficial to the inspection operation. Next, the thermal object image capturing system 100 of the embodiment of the present invention uses the photodetecting device 130 for detection. The thermal object image capturing system 100 of the embodiment of the present invention can be used in the photodetecting device 130 to reduce the temperature of the photodetecting device 130 by using water cooling and air cooling, and the glass is used to protect the internal photodiode LD. It is applied to high temperature work sites for detection.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何在此技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the present invention has been described above by way of example, it is not intended to be construed as a limitation of the scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
100‧‧‧熱物件影像擷取系統 100‧‧‧Hot object image capture system
110‧‧‧影像擷取裝置 110‧‧‧Image capture device
120‧‧‧電腦 120‧‧‧ computer
130‧‧‧光電偵測裝置 130‧‧‧Photodetection device
140‧‧‧中介裝置 140‧‧‧Intermediary device
142‧‧‧微中央處理器 142‧‧‧Micro Central Processing Unit
144‧‧‧複製器 144‧‧‧Replicator
HO‧‧‧熱物件 HO‧‧‧Hot items
Claims (6)
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