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TWI548140B - 阻抗匹配裝置及阻抗匹配方法 - Google Patents

阻抗匹配裝置及阻抗匹配方法 Download PDF

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Publication number
TWI548140B
TWI548140B TW101113392A TW101113392A TWI548140B TW I548140 B TWI548140 B TW I548140B TW 101113392 A TW101113392 A TW 101113392A TW 101113392 A TW101113392 A TW 101113392A TW I548140 B TWI548140 B TW I548140B
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signal transmission
transmission line
pad
impedance matching
impedance
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TW101113392A
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TW201345038A (zh
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吳開文
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鴻海精密工業股份有限公司
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Priority to TW101113392A priority Critical patent/TWI548140B/zh
Priority to US13/534,217 priority patent/US8887385B2/en
Publication of TW201345038A publication Critical patent/TW201345038A/zh
Priority to US14/520,294 priority patent/US20150034375A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

阻抗匹配裝置及阻抗匹配方法
本發明涉及一種阻抗匹配裝置及阻抗匹配方法。
無線高頻收發模組連接技術作為一種新的光纖連接器標準，已經逐步應用到了電子產品中。目前的無線高頻收發模組單向傳輸架構一般至少會達到單通道10Gb/s的速度，在如此高頻的傳輸系統中，阻抗匹配就顯的特別重要，若是阻抗不匹配，則會產生很大的能量損耗，增加誤碼率，因此阻抗匹配設計，在高頻系統中是相當重要的。現有技術一般採用改變高頻電路的電路設計的方式以改變高頻電路的阻抗從而實現與其連接電路之間的阻抗匹配，匹配方法較為複雜，同時，改變高頻電路的電路設計難免會存在設計誤差，如此會造成阻抗匹配特性不理想。
有鑒於此，有必要提供一種阻抗匹配特性好的阻抗匹配裝置及其方法。
一種阻抗匹配裝置，其包括一電路板、多個焊墊及多條訊號傳輸線。所述多個焊墊均形成在所述電路板上。多條訊號傳輸線均包括一連接端。多個所述連接端分別電性連接至一對應的焊墊上。每個所述訊號傳輸線具有與其連接的所述焊墊相同的阻抗值。
一種阻抗匹配方法，其用於使一焊墊與所述焊墊連接的一訊號傳輸線的連接端阻抗匹配，所述阻抗匹配方法包括以下步驟：獲取焊墊或訊號傳輸線的阻抗值；當獲取到焊墊的阻抗值時，將所述訊號傳輸線製成具有一預定長度及且使訊號傳輸線的連接端具有一預定橫截面積，以使所述訊號傳輸線具有與所述焊墊相同的阻抗值，當獲取到訊號傳輸線的阻抗值時，將所述訊號傳輸線製成具有一預定長度及且使訊號傳輸線的連接端具有一預定橫截面積，以使所述訊號傳輸線具有與所述焊墊相同的阻抗值；將所述訊號傳輸線的連接端連接至所述焊墊。
相對于先前技術，由於所述訊號傳輸線的連接端與所述焊墊的阻抗值相同，因此，無論所述訊號傳輸線的連接端與所述焊墊的接觸點在何位置，仍然可完成特定的特性阻抗設計，則可降低所述訊號傳輸線的連接端與所述焊墊的接觸點的不確定因素，使電路設計更容易達成阻抗匹配，可大幅增進電路特性。
100‧‧‧阻抗匹配裝置
10‧‧‧電路板
20‧‧‧焊墊
30‧‧‧訊號傳輸線
31‧‧‧連接端
圖1為本發明的阻抗匹配裝置的示意圖。
圖2為本發明第一實施方式提供的阻抗匹配方法的流程圖。
圖3是圖1中的電路板與焊墊的示意圖。
圖4是圖3沿II-II線的剖示圖。
圖5為本發明第二實施方式提供的阻抗匹配方法的流程圖。
圖6為本發明第三實施方式提供的阻抗匹配方法的流程圖。
請參考圖1，為本發明多重負載拓撲佈線架構較佳實施方式之示意圖。於一印刷電路板中，一訊號傳送端40電性連接一第一訊號接收端10、一第二訊號接收端20、及一第三訊號接收端30。該訊號傳送端40經由一第一電阻R1電性連接一第一直流電壓Vcc1。該第三訊號接收端30經由一第二電阻R2電性連接一第二直流電壓Vcc2。
下面將結合附圖，對本發明實施方式作進一步之詳細說明。
請參閱圖1，為本發明實施方式提供的阻抗匹配裝置100，其包括一電路板10、多個焊墊20及多條訊號傳輸線30。所述多個焊墊20均形成在所述電路板10上。多條訊號傳輸線30均包括一連接端31。多個所述連接端31分別電性連接至一對應的焊墊20上。本實施方式中，每個所述訊號傳輸線30具有與其連接的所述焊墊20相同的阻抗值。
由於所述訊號傳輸線30的連接端31已經達成與所述焊墊20相同的電阻阻值，因此，無論所述訊號傳輸線30的連接端31與所述焊墊20的接觸點在何位置，仍然可完成特定的特性阻抗設計，則可降低所述訊號傳輸線30的連接端31與所述焊墊20的接觸點的不確定因素，使電路設計更容易達成阻抗匹配，可大幅增進電路特性。
請參閱圖2，為本發明第一實施方式提供的阻抗匹配方法，用於使一焊墊20與所述焊墊20連接的一訊號傳輸線30的連接端31阻抗匹配，所述阻抗匹配方法包括以下步驟：
S101：請一併參閱圖3與圖4，在電路板10上形成一預定厚度及一 預定橫截面積的焊墊20，以使所述焊墊20具有一預定的阻抗值，並通過萬用表獲取所述預定的阻抗值； 根據公式：，其中，R為阻抗值(單元為歐姆)，L為 焊墊的厚度(單元為米)，A為所述焊墊的橫截面積(單元為平方米)，ρ為電阻率(單元為歐姆．米)，因此，只要控制所述焊墊的厚度與橫截面積便可使所述焊墊具有任意預定的阻抗值。本實施方式中，所述預定的阻抗值為50歐姆。
S102：將所述訊號傳輸線30製成具有一預定長度及且使訊號傳輸線30的連接端31具有一預定橫截面積，以使所述訊號傳輸線30具有與所述焊墊20相同的阻抗值； 同樣地，根據公式：，其中，R為阻抗值(單元為歐 姆)，L為訊號傳輸線30的長度(單元為米)，A為所述訊號傳輸線30的橫截面積(單元為平方米)，ρ為電阻率(單元為歐姆．米)，因此，只要控制所述訊號傳輸線30的長度與橫截面積便可使所述訊號傳輸線30具有任意預定的阻抗值。
S103：請一併參閱圖4，將所述訊號傳輸線30的連接端31連接至所述焊墊20。
請參閱圖5，為本發明第二實施方式提供的阻抗匹配方法，用於使一焊墊20與所述焊墊20連接的一訊號傳輸線30的連接端31阻抗匹配，所述阻抗匹配方法包括以下步驟：
S201：測量焊墊20的阻抗值；本實施方式中，通過萬用表量測所述焊墊20的阻抗值。
S202：將所述訊號傳輸線30製成具有一預定長度及且使訊號傳輸線30的連接端31具有一預定橫截面積，以使所述訊號傳輸線30具有與所述焊墊20相同的阻抗值；
S203：將所述訊號傳輸線30的連接端31連接至所述焊墊20。
請參閱圖6，為本發明第三實施方式提供的阻抗匹配方法，用於使一焊墊20與所述焊墊20連接的一訊號傳輸線30的連接端31阻抗匹配，所述阻抗匹配方法包括以下步驟：
S301：測量訊號傳輸線30的阻抗值；本實施方式中，通過萬用表量測所述訊號傳輸線30的阻抗值。
S302：在電路板10上形成一預定厚度及一預定橫截面積的焊墊20，以使所述焊墊20具有與所述訊號傳輸線30的阻抗值；
S303：將所述訊號傳輸線30的連接端31連接至所述焊墊20。
另外，本領域技術人員還可在本發明精神內做其他變化，當然，這些依據本發明精神所做之變化，都應包括在本發明所要求保護之範圍之內。
100‧‧‧阻抗匹配裝置
10‧‧‧電路板
20‧‧‧焊墊
30‧‧‧訊號傳輸線
31‧‧‧連接端

Claims (6)

  1. 一種阻抗匹配裝置，其包括一電路板、複數個焊墊及複數條訊號傳輸線，所述複數個焊墊均形成在所述電路板上，多條訊號傳輸線均包括一連接端，複數個所述連接端分別電性連接至一對應的焊墊上，其改進在於，每個所述訊號傳輸線具有與其連接的所述焊墊相同的阻抗值。
  2. 如申請專利範圍第1項所述之阻抗匹配裝置，其中，所述訊號傳輸線與所述焊墊的阻抗值均為50歐姆。
  3. 一種阻抗匹配方法，其用於使一焊墊與所述焊墊連接的一訊號傳輸線的連接端阻抗匹配，所述阻抗匹配方法包括以下步驟：(1)獲取焊墊或訊號傳輸線的阻抗值；(2)當獲取到焊墊的阻抗值時，將所述訊號傳輸線製成具有一預定長度及且使訊號傳輸線的連接端具有一預定橫截面積，以使所述訊號傳輸線具有與所述焊墊相同的阻抗值，當獲取到訊號傳輸線的阻抗值時，將所述訊號傳輸線製成具有一預定長度及且使訊號傳輸線的連接端具有一預定橫截面積，以使所述訊號傳輸線具有與所述焊墊相同的阻抗值；(3)將所述訊號傳輸線的連接端連接至所述焊墊。
  4. 如申請專利範圍第3項所述之阻抗匹配方法，其中，所述預定的阻抗值為50歐姆。
  5. 如申請專利範圍第3項所述之阻抗匹配方法，其中，通過萬用表量測所述焊墊或所述訊號傳輸線的阻抗值。
  6. 如申請專利範圍第3項所述之阻抗匹配方法，其中，在步驟(1)前進一步包括一步驟：在電路板上形成一預定厚度及一預定橫截面積的焊墊，以使所述焊墊具有一預定的阻抗值。
TW101113392A 2012-04-16 2012-04-16 阻抗匹配裝置及阻抗匹配方法 TWI548140B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW101113392A TWI548140B (zh) 2012-04-16 2012-04-16 阻抗匹配裝置及阻抗匹配方法
US13/534,217 US8887385B2 (en) 2012-04-16 2012-06-27 Impedance matching method
US14/520,294 US20150034375A1 (en) 2012-04-16 2014-10-21 Circuit board assembly with pads and connection lines having same resistance value as the pads and impedance matching method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102334547B1 (ko) * 2014-06-17 2021-12-03 삼성디스플레이 주식회사 어레이 기판 및 이를 이용한 집적 회로 실장 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070065697A1 (en) * 2005-09-20 2007-03-22 Hsi-Ming Shu Fuel cell having serial/parallel connecting mechanism of golden finger
TW200835071A (en) * 2007-02-05 2008-08-16 Hon Hai Prec Ind Co Ltd Electrical connector assembly
US20080290884A1 (en) * 2007-05-25 2008-11-27 King Yuan Electronics Co., Ltd. Probe card assembly with ZIF connectors, method of assembling, wafer testing system and wafer testing method introduced by the same
TW201138565A (en) * 2010-04-20 2011-11-01 Hon Hai Prec Ind Co Ltd Flexible printed circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696466A (en) * 1995-12-08 1997-12-09 The Whitaker Corporation Heterolithic microwave integrated impedance matching circuitry and method of manufacture
US7064278B2 (en) * 2002-03-25 2006-06-20 Seckora Michael C Impedance matching connection scheme for high frequency circuits
US7227254B2 (en) * 2002-04-02 2007-06-05 Agilent Technologies, Inc. Integrated circuit package
US7233061B1 (en) * 2003-10-31 2007-06-19 Xilinx, Inc Interposer for impedance matching
US8248183B2 (en) * 2009-07-30 2012-08-21 Sierra Wireless, Inc. Circuit board pad having impedance matched to a transmission line and method for providing same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070065697A1 (en) * 2005-09-20 2007-03-22 Hsi-Ming Shu Fuel cell having serial/parallel connecting mechanism of golden finger
TW200835071A (en) * 2007-02-05 2008-08-16 Hon Hai Prec Ind Co Ltd Electrical connector assembly
US20080290884A1 (en) * 2007-05-25 2008-11-27 King Yuan Electronics Co., Ltd. Probe card assembly with ZIF connectors, method of assembling, wafer testing system and wafer testing method introduced by the same
TW201138565A (en) * 2010-04-20 2011-11-01 Hon Hai Prec Ind Co Ltd Flexible printed circuit board

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