TWI548004B - Chip-arranged-and-orientated apparatus and method using the same - Google Patents

Description

Grain positioning arrangement device and die positioning arrangement method

The present invention relates to a die positioning device and a die positioning arrangement method, and more particularly to a die positioning device and a die positioning arrangement method for increasing positioning efficiency.

In the process of semiconductor wafer level packaging, the wafer must be cut into a plurality of crystal grains, and then the good products are picked out and reconfigured onto a circular substrate for subsequent processing. Since the die is subjected to re-distribution, winding, ball-planting, etc. after reconfiguration, the die must be placed on the substrate with very precise positioning. In general, the error is required to be controlled within 2 microns. The traditional approach is to select a location on the substrate, pick up a die with a robotic arm, and place the die at the selected location of the controller. It can be imagined that the robot can only place one die at a time, and the efficiency is very limited. And after each die is placed on the substrate, a process time is required to allow the robot to apply force to the die to engage the substrate. This is a serious slowdown in the rate at which the robot arm lays out the grain, resulting in a limited overall rate. For the semiconductor industry with extremely high capacity requirements, it is an important part of the urgent need for improvement.

Therefore, in order to solve the above problems, an object of the present invention is to provide a die positioning arrangement device and a die positioning arrangement method using the same, which can greatly increase the rate at which a die is positioned and disposed on a substrate.

The technical means adopted by the present invention for solving the problems of the prior art provides a die positioning arrangement device for increasing the efficiency of positioning and positioning, and is used for positioning a plurality of crystal grains in a to-be-arranged region of a substrate, the die positioning arrangement The device comprises: a supporting member having a supporting surface for arranging the plurality of crystal grains thereon; an arrangement mechanism for arranging the plurality of crystal grains on the supporting surface of the supporting member; and The transposition mechanism is configured to rotate the support member from a feeding orientation corresponding to the receiving surface to a certain orientation, wherein the supporting surface of the supporting member faces the feeding orientation The arranging mechanism, wherein the arranging mechanism arranges the plurality of dies, and in the fixed orientation, the receiving member and the substrate are relatively inverted, and the supporting surface of the receiving member faces the substrate A region to be disposed, and a relative displacement between the support member and the substrate to position a plurality of dies in the region to be disposed of the substrate.

In an embodiment of the invention, a die positioning arrangement device for increasing the efficiency of positioning arrangement is provided, and the arrangement mechanism is correspondingly provided in plurality.

In an embodiment of the invention, there is provided a die positioning arrangement device for increasing the efficiency of positioning arrangement, further comprising a circulation member disposed at a position corresponding to the transposition mechanism and corresponding to the arrangement mechanism The plurality of support members are cyclically transported between the positions.

In an embodiment of the invention, a die positioning arrangement device for increasing the efficiency of positioning arrangement is provided, the substrate being a wafer, a glass, a PCB, and a ceramic substrate.

In an embodiment of the invention, there is provided a die positioning arrangement device for increasing the efficiency of positioning arrangement, the size of the receiving member being substantially equal to a unit exposure range of an exposure mechanism, the exposure mechanism being arranged in a subsequent process The crystal grains of the substrate are subjected to exposure processing.

Another technical means adopted by the present invention to solve the problems of the prior art is to provide a die positioning arrangement method for increasing the efficiency of positioning and positioning, which is to position a plurality of crystal grains on a substrate by using a die positioning device. The die positioning device includes a receiving member, an arranging mechanism, and a transposition mechanism, and the locating method includes: a preset step of arranging the plurality of dies by the arranging mechanism And a transposition step, wherein the transposition mechanism rotates the support member from a feeding orientation corresponding to the receiving surface to a certain orientation, wherein In the feeding direction, the supporting surface of the supporting member faces the arrangement mechanism, and the arrangement mechanism arranges the crystal grains, and in the fixed orientation, the receiving member and the substrate are relatively inverted, The support surface is oriented toward the area to be disposed of the substrate, and the relative displacement between the support member and the substrate is such that the plurality of dies are positioned at the region to be disposed of the substrate.

In an embodiment of the invention, there is provided a die positioning arrangement method for increasing the efficiency of positioning arrangement, wherein in the transposing step, the transposition is flipped by the transposition mechanism at an angle to the receiving member.

In an embodiment of the present invention, a die positioning arrangement method for increasing positioning efficiency is provided. After the transposing step, a separating step is further included: relatively separating the receiving member and the substrate, and leaving the plurality of crystals The particles are in the area to be arranged.

In an embodiment of the present invention, there is provided a die positioning arrangement method for increasing positioning efficiency, wherein the receiving member is provided in plural, and in the preset step, the plurality of crystals are arranged by the arrangement mechanism The pellets are respectively arranged in a plurality of support members, and in the transposing step, the plurality of support members are transposed by the transposition mechanism.

In an embodiment of the present invention, a die positioning arrangement method for increasing positioning efficiency is provided, wherein the die positioning device further includes a cycle member, and after the transposing step, further includes a cycle step, The circulation member transports the transposed support member to a position corresponding to the arrangement for re-supporting the die.

By the technical means adopted by the present invention, instead of the conventional method of arranging only one single crystal at a time, a plurality of crystal grains can be positioned on the substrate in a short time, the number of times of moving back and forth of the device is reduced, and the overall processing time is shortened. Significantly increase the rate of grain placement, increase production capacity, and indirectly reduce production costs.

The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.

Hereinafter, embodiments of the present invention will be described based on Figs. 1 to 4 . This description is not intended to limit the embodiments of the invention, but is an embodiment of the invention.

Referring to FIG. 1 and FIG. 2, a die positioning apparatus 100 according to an embodiment of the present invention is for positioning a plurality of crystal grains D in a region R to be disposed of a substrate S. The die positioning arrangement 100 comprises a support member 1, an arrangement 2, a transposition mechanism 3, and a controller 4 for the electrical connection arrangement 2 and the transposition mechanism 3. The support member 1 is an intermediate carrier responsible for carrying a plurality of crystal grains D, and has a support surface 11 on which a plurality of crystal grains D are arranged. The support member 1 can be, for example, a viscous tray or a combination of a plurality of vacuum nozzles for the die D to be fixed thereto.

The arrangement mechanism 2 is for arranging a plurality of crystal grains D on the support surface 11 of the support member 1. In one embodiment, the arranging mechanism 2 is a mechanical arm, and the controller 4 controls the arranging mechanism 2 to arbitrarily arrange a plurality of dies D located in the die storage area Z one by one onto the support surface 11, but the present invention Not limited to this.

The transposition mechanism 3 is arranged to transfer the receiving member 1 from a loading direction P1 corresponding to the receiving surface 11 to a certain orientation P2. The so-called feeding orientation P1 means that the supporting surface 11 of the receiving member 1 faces the arrangement mechanism 2 for the arrangement mechanism 2 to arrange a plurality of crystal grains D. In contrast, the so-called fixed orientation P2 refers to the relative inversion of the support member 1 and the substrate S, so that the receiving surface 11 of the receiving member 1 faces the region R to be arranged of the substrate S, and via the receiving member 1 and the substrate S The relative displacement between them is such that a plurality of crystal grains D are positioned in the region R of the substrate S to be arranged. In Fig. 2, the transposition mechanism 3 inverts the receiving member 1 at an angle to be placed in the fixed orientation P2. However, in practice, the substrate S or the angle between the support member 1 and the substrate S may be reversed to achieve the "region R to be disposed of the support surface 11 of the support member 1 facing the substrate S". After the support member is transferred to the fixed orientation P2, the controller 4 controls the transposition mechanism 3 with respect to the separation support member 1 and the substrate S, leaving a plurality of crystal grains D in the region R to be arranged. The relative separation may be that the transfer member 1 is moved away from the substrate S by the transposition mechanism 3, or the substrate S is moved away from the support member 1, and of course, the relative displacement may be generated by moving both of them.

In addition to the actions for controlling the arrangement mechanism 2 and the turning mechanism 3, the controller 4 also determines the position of each of the crystal grains D on the support surface 11, and determines the region R to be disposed on the substrate S.

Referring to FIG. 3, the method for arranging the grain positioning provided by the present invention comprises a preset step and a transposition step.

In one embodiment, the receiving member 1 is a square carrier, and the substrate S may be a wafer, a glass, a PCB, a ceramic substrate, or other materials, and the invention is not limited thereto. The size of the receiving member 1 is substantially equal to one unit exposure range of an exposure mechanism, and the exposure mechanism performs exposure processing on the crystal grains D disposed on the substrate S in a subsequent process. That is, the size of the receiving member 1 is determined according to the exposure mechanism used for subsequent processing, and the pitch of the arrangement position of the support surface 11 to the plurality of crystal grains D can be further defined by the exposure mechanism. Under the design of the receiving member 1 corresponding to the exposure mechanism, the relative positions of the plurality of crystal grains D arranged on the substrate S and the relative positions of the crystal grains and the substrate S can be completely matched with the exposure mechanism. Unit exposure range minimizes errors.

Referring to Figures 4 and 5, the present invention proposes yet another embodiment. The difference from the previous embodiment is that the die positioning device 100a of the present embodiment further includes a circulation member 5. Further, in the present embodiment, the support members 1 are provided in plural, and the arrangement mechanism 2 is also provided in plurality, but the number of the support members 1 and the arrangement mechanism 2 are not necessarily equal. The circulation member 5 is arranged to circulate a plurality of support members 1 to a position close to a plurality of arrangement members 2 at a position corresponding to the transposition mechanism 3 and a position corresponding to the arrangement mechanism 2, the plurality of arrangement mechanisms 2 having a plurality of crystals The particles D are arranged on a plurality of support members 1, and the transposition mechanism 3 transposes a plurality of crystal grains D to a plurality of regions R to be arranged.

That is to say, in the present embodiment, in order to further increase the productivity, a plurality of support members 1 and a plurality of arrangement mechanisms 2 are employed. A plurality of arrangement mechanisms 2 are simultaneously operated to arrange a plurality of crystal grains D to a plurality of support members 1. In other words, compared with the previous embodiment, in this embodiment, more support members 1 can be arranged with a plurality of crystal grains D per unit time. This avoids that the arrangement rate of the single arrangement mechanism 2 cannot keep up with the transposition rate of the transposition mechanism 3 and slows down the efficiency, and allows the transposition mechanism to transpose the support member 1 without interruption.

In the transposition process, as in the previous embodiment, the support member 1 is also transposed from the loading direction P1 to the fixed orientation P2. And after the support member 1 is transferred to the fixed orientation P2, the transposition mechanism 3 is controlled by the controller 4 to relatively separate the plurality of support members 1 and the substrate S, leaving a plurality of crystal grains D in the region R to be arranged. Thereafter, the transposed support member 1 is transported by the circulation member 5 to a position corresponding to the arrangement mechanism 2 for re-supporting the crystal grains.

With the die positioning device 100a and the die positioning arrangement method of the present invention, the inversion mechanism 3 can transpose a plurality of crystal grains D to the region R of the substrate S to be disposed at one time, thereby eliminating a lengthy arrangement time and greatly increasing the fast rate. . In detail, the transposition mechanism 3 can save a lot of time "moving back and forth between the die storage area Z and the substrate S" every time the support member 1 is rotated. In a practical example, if the support member 1 supports N crystal grains D, the transposition mechanism 3 transposes the support member 1 once, and the time for the N-1 unit to move back and forth is omitted. In addition, the prior art arranging one crystal grain requires one process time. However, in the present invention, the plurality of crystal grains D disposed on the support member 1 simultaneously contact the substrate S, so that the plurality of crystal grains D are also Only one process time is required. When the transposition mechanism 3 transposes N crystal grains on the substrate S at a time, the process time of N-1 units is saved. In summary, the die positioning device and the die positioning arrangement method of the present invention can greatly increase the productivity, thereby reducing the production cost.

The above description and description are only illustrative of the preferred embodiments of the present invention, and those of ordinary skill in the art can make other modifications in accordance with the scope of the invention as defined below and the description above, but such modifications should still be It is within the scope of the invention to the invention of the invention.

100‧‧‧Grade positioning equipment
1‧‧‧Supporting components
11‧‧‧Support surface
2‧‧‧Arrangement agency
3‧‧‧Transplantation agency
4‧‧‧ Controller
5‧‧‧Circular components
D‧‧‧ grain
P1‧‧‧ feeding orientation
P2‧‧‧ Positioning
R‧‧‧Awaiting area
S‧‧‧Substrate
S101‧‧‧Steps
S102‧‧‧Steps
S201‧‧‧ steps
S202‧‧‧Steps
S203‧‧‧Steps
S204‧‧‧Steps
Z‧‧‧Grade storage area

FIG. 1 is a perspective view showing a die positioning device according to an embodiment of the invention. Fig. 2 is a side elevational view showing a portion of a grain positioning arrangement apparatus according to an embodiment of the present invention. FIG. 3 is a flow chart showing a method of arranging a grain in accordance with an embodiment of the present invention. Fig. 4 is a perspective view showing a grain positioning arrangement apparatus according to still another embodiment of the present invention. Fig. 5 is a flow chart showing a method of arranging a grain in accordance with still another embodiment of the present invention.

100‧‧‧Grade positioning equipment

1‧‧‧Supporting components

11‧‧‧Support surface

2‧‧‧Arrangement agency

3‧‧‧Transplantation agency

4‧‧‧ Controller

D‧‧‧ grain

R‧‧‧Awaiting area

S‧‧‧Substrate

Z‧‧‧Grade storage area

Claims (10)

A die positioning device for positioning a plurality of crystal grains in a region to be arranged of a substrate, the die positioning device comprising: a supporting member having a supporting surface for the plurality of die arrangements An arrangement mechanism for arranging the plurality of crystal grains on the support surface of the support member; and a transposition mechanism configured to self-support the support member from the support surface The feeding direction is transferred to a certain orientation, wherein the supporting surface of the supporting member faces the arrangement mechanism, and the arrangement mechanism arranges the plurality of crystal grains, and the fixed orientation And the supporting member and the substrate are relatively reversed such that the supporting surface of the receiving member faces the region to be disposed of the substrate, and the relative displacement between the receiving member and the substrate is used to make the plural The dies are positioned in the area to be arranged of the substrate. The locating device according to claim 1, wherein the supporting member is provided in plural, and the arranging mechanism is provided in plurality. The die positioning device of claim 2, further comprising a circulation member configured to cyclically transport between a position corresponding to the transposition mechanism and a position corresponding to the arrangement mechanism A plurality of supporting members. The die positioning device of claim 1, wherein the substrate is a wafer, a glass, a PCB, and a ceramic substrate. The die positioning device of claim 1, wherein the receiving member has a size substantially equal to a unit exposure range of an exposure mechanism, and the exposure mechanism is a crystal disposed on the substrate in a subsequent process. The granules are subjected to exposure treatment. A method for locating a crystal grain by using a die positioning device to position a plurality of dies on a substrate to be arranged, the die positioning device comprising a supporting member, an arranging mechanism and a transposition The mechanism, the grain positioning arrangement method comprises: a preset step of arranging the plurality of crystal grains on a support surface of the support member by the arrangement mechanism; and a transposing step by the transposition mechanism Transmitting the support member from a loading direction corresponding to the receiving surface to a certain orientation, wherein the supporting surface of the receiving member faces the arrangement mechanism for the feeding direction Arranging the plurality of dies in the arranging mechanism, and in the fixed orientation, the receiving member and the substrate are relatively inverted, such that the receiving surface faces the region to be disposed of the substrate, and via the receiving member and the The relative displacement between the substrates is such that the plurality of dies are positioned in the region to be disposed of the substrate. The method for arranging a grain positioning according to claim 6, wherein in the transposing step, the transposition is performed by the transposition mechanism to invert the support member at an angle. The method for arranging a grain positioning method according to claim 6 , further comprising a separating step after the transposing step: relatively separating the supporting member and the substrate, and leaving the plurality of crystal grains in the area to be arranged . The method for arranging a grain positioning according to claim 6, wherein the supporting member is provided in plural, and in the presetting step, the plurality of dies are respectively arranged by the plurality of arranging mechanisms A plurality of supporting members, wherein in the transposing step, the plurality of receiving members are transposed by the transposing mechanism. The method for arranging a grain positioning according to claim 6, wherein the die positioning device further comprises a circulation component, and after the transposing step, further comprising: a cycle step, wherein the cycle component is rotated The disposed support member is transported to a position corresponding to the arrangement for re-supporting the die.