[go: up one dir, main page]

TWI546205B - Manufacturing method of decorative metal pattern and electronic device - Google Patents

Manufacturing method of decorative metal pattern and electronic device Download PDF

Info

Publication number
TWI546205B
TWI546205B TW101143966A TW101143966A TWI546205B TW I546205 B TWI546205 B TW I546205B TW 101143966 A TW101143966 A TW 101143966A TW 101143966 A TW101143966 A TW 101143966A TW I546205 B TWI546205 B TW I546205B
Authority
TW
Taiwan
Prior art keywords
pattern
metal pattern
decorative metal
layer
decorative
Prior art date
Application number
TW101143966A
Other languages
Chinese (zh)
Other versions
TW201420374A (en
Inventor
胡智凱
莊益誠
Original Assignee
宏達國際電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏達國際電子股份有限公司 filed Critical 宏達國際電子股份有限公司
Priority to TW101143966A priority Critical patent/TWI546205B/en
Publication of TW201420374A publication Critical patent/TW201420374A/en
Application granted granted Critical
Publication of TWI546205B publication Critical patent/TWI546205B/en

Links

Landscapes

  • Telephone Set Structure (AREA)

Description

裝飾性金屬圖案的製造方法及電子裝置 Method for manufacturing decorative metal pattern and electronic device

本發明是有關於一種金屬圖案的製造方法及電子裝置,且特別是有關於一種裝飾性金屬圖案的製造方法及包括裝飾性金屬圖案的電子裝置。 The present invention relates to a method of manufacturing a metal pattern and an electronic device, and more particularly to a method of manufacturing a decorative metal pattern and an electronic device including the decorative metal pattern.

現今,為了增進商品美觀,在商品的殼體上形成圖案已是相當常見的一種方式。通常可利用在商品的殼體上噴塗油墨或是利用熱轉印膜片來將油墨層熱轉印到產品的殼體表面等方式完成。隨著製程進步與美感提升,產品外觀的質感提升越來越多被重視。 Nowadays, in order to enhance the aesthetics of goods, it is quite common to form a pattern on the casing of a commodity. This can usually be accomplished by spraying ink onto the shell of the article or by thermal transfer of the ink layer to the surface of the shell of the product. As the process progresses and the aesthetics improves, the texture of the product's appearance is more and more valued.

目前,若欲在商品的殼體外觀上表現出金屬質感,一般是直接使用金屬外殼或是將金屬利用電鍍方式鍍到殼體上。但這樣的殼體若是應用於行動電話上,則會限制天線的設計。若是將仿金屬的材料利用噴漆、噴墨或是熱轉印的方式,噴塗到局部的殼體上,則又因為材料質感的限制,而無法表現出真實的金屬光澤。 At present, if a metal texture is to be exhibited on the outer casing of the product, it is generally used directly on the metal casing or by electroplating the metal onto the casing. However, if such a casing is applied to a mobile phone, the design of the antenna is limited. If the metal-like material is sprayed onto a partial casing by means of painting, inkjet or thermal transfer, the true metallic luster cannot be expressed due to the limitation of the material texture.

本發明提供一種裝飾性金屬圖案的製造方法,可將裝飾性金屬圖案設置於殼體的局部表面,以在商品的殼體外觀上表現出金屬質感,並且可避開特定元件的位置。 The present invention provides a method of manufacturing a decorative metal pattern in which a decorative metal pattern is provided on a partial surface of a casing to exhibit a metallic texture on the appearance of a casing of a commodity, and to avoid the position of a specific component.

本發明提供一種電子裝置,包括上述之裝飾性金屬圖 案。 The invention provides an electronic device comprising the above decorative metal figure case.

本發明提出一種裝飾性金屬圖案的製造方法,包括:提供一殼體,其中殼體具有一表面;形成一金屬層於殼體之表面;形成一第一蝕刻罩幕至金屬層上;蝕刻部分暴露於第一蝕刻罩幕外的金屬層以形成一裝飾性金屬圖案;移除第一蝕刻罩幕。 The invention provides a method for manufacturing a decorative metal pattern, comprising: providing a casing, wherein the casing has a surface; forming a metal layer on the surface of the casing; forming a first etching mask to the metal layer; etching the portion Exposing a metal layer outside the first etch mask to form a decorative metal pattern; removing the first etch mask.

在本發明之一實施例中,上述之形成第一蝕刻罩幕的步驟包括形成一第一光阻層至金屬層上;曝光第一光阻層;顯影已曝光的第一光阻層以形成第一蝕刻罩幕。 In an embodiment of the invention, the step of forming the first etching mask comprises forming a first photoresist layer onto the metal layer; exposing the first photoresist layer; and developing the exposed first photoresist layer to form The first etching mask.

在本發明之一實施例中,上述之形成第一蝕刻罩幕的步驟更包括設置一第一光罩於位在表面之一第一區域上的第一光阻層上;曝光第一區域上的第一光阻層;設置一第二光罩於位在表面之一第二區域上的第一光阻層上,其中第一區域與第二區域位於表面之不同的平面;以及曝光第二區域上的第一光阻層。 In an embodiment of the invention, the step of forming the first etch mask further includes disposing a first reticle on the first photoresist layer on a first region of the surface; exposing the first region a first photoresist layer; a second mask disposed on the first photoresist layer on a second region of the surface, wherein the first region and the second region are on different planes of the surface; and the second exposure The first photoresist layer on the area.

在本發明之一實施例中,上述之殼體之表面具有一凹槽,且裝飾性金屬圖案位於凹槽。 In an embodiment of the invention, the surface of the housing has a recess and the decorative metal pattern is located in the recess.

在本發明之一實施例中,更包括形成一第二蝕刻罩幕至裝飾性金屬圖案上;蝕刻部分暴露於第二蝕刻罩幕外的裝飾性金屬圖案以形成;凸版圖案或一凹版圖案於裝飾性金屬圖案上;移除第二蝕刻罩幕。 In an embodiment of the invention, the method further includes forming a second etching mask onto the decorative metal pattern; the etching portion is exposed to the decorative metal pattern outside the second etching mask to form; the relief pattern or a gravure pattern is On the decorative metal pattern; the second etching mask is removed.

在本發明之一實施例中,上述之形成第一蝕刻罩幕的步驟包括形成一第二光阻層至裝飾性金屬圖案上;曝光第二光阻層;顯影已曝光的第二光阻層以形成第二蝕刻罩幕。 In an embodiment of the invention, the step of forming the first etching mask comprises forming a second photoresist layer onto the decorative metal pattern; exposing the second photoresist layer; and developing the exposed second photoresist layer To form a second etching mask.

在本發明之一實施例中,上述之在形成金屬層於殼體之表面的步驟中,金屬層是以濕式電鍍的方式形成於表面。 In an embodiment of the invention, in the step of forming the metal layer on the surface of the casing, the metal layer is formed on the surface by wet plating.

在本發明之一實施例中,上述之殼體之材質為塑膠。 In an embodiment of the invention, the material of the housing is plastic.

在本發明之一實施例中,上述之殼體之材質包括丙烯睛-丁二烯-苯乙烯(ABS)或聚碳酸酯(PC)。 In an embodiment of the invention, the material of the housing comprises acrylonitrile butadiene styrene (ABS) or polycarbonate (PC).

在本發明之一實施例中,在形成金屬層於殼體之表面的步驟中,更包括先設置一活化層於殼體之表面上,再設置金屬層於活化層上。 In an embodiment of the present invention, in the step of forming the metal layer on the surface of the casing, the method further includes disposing an activation layer on the surface of the casing and then providing a metal layer on the activation layer.

在本發明之一實施例中,上述之表面為殼體的一外表面。 In an embodiment of the invention, the surface is an outer surface of the housing.

在本發明之一實施例中,上述之裝飾性金屬圖案形成於殼體之外表面的一部分,殼體具有相對外表面之一內表面。 In an embodiment of the invention, the decorative metal pattern is formed on a portion of an outer surface of the housing, the housing having an inner surface opposite the outer surface.

在本發明之一實施例中,上述之外表面為一外凸曲面,且內表面為一內凹曲面。 In an embodiment of the invention, the outer surface is a convex curved surface, and the inner surface is a concave curved surface.

在本發明之一實施例中,更包括設置一天線於裝飾性金屬圖案相對於殼體的另一表面,且天線大致上對應於金屬層被蝕刻的部分。 In an embodiment of the invention, the method further includes disposing an antenna on the other surface of the decorative metal pattern relative to the housing, and the antenna substantially corresponds to a portion where the metal layer is etched.

在本發明之一實施例中,上述之金屬層包括銅、鎳、鋁、金、銀或鈀。 In an embodiment of the invention, the metal layer comprises copper, nickel, aluminum, gold, silver or palladium.

本發明更提出一電子裝置,包括一殼體、一裝飾性金屬圖案及一天線。殼體具有相對之一外表面及一內表面。裝飾性金屬圖案形成於殼體之外表面的一部分。天線設置於內表面上且大致上對應至殼體之外表面未形成裝飾性圖 案的另一部分。 The invention further provides an electronic device comprising a casing, a decorative metal pattern and an antenna. The housing has a relatively outer surface and an inner surface. The decorative metal pattern is formed on a portion of the outer surface of the housing. The antenna is disposed on the inner surface and substantially corresponds to the outer surface of the housing without forming a decorative pattern Another part of the case.

在本發明之一實施例中,上述之裝飾性金屬圖案包括一凸版圖案或一凹版圖案。 In an embodiment of the invention, the decorative metal pattern comprises a relief pattern or a gravure pattern.

在本發明之一實施例中,上述之殼體之材質包括丙烯睛-丁二烯-苯乙烯或聚碳酸酯。 In an embodiment of the invention, the material of the casing comprises acrylonitrile butadiene styrene or polycarbonate.

在本發明之一實施例中,上述之裝飾性金屬圖案之材質包括銅、鎳、鋁、金、銀或鈀。 In an embodiment of the invention, the material of the decorative metal pattern comprises copper, nickel, aluminum, gold, silver or palladium.

在本發明之一實施例中,上述之外表面為一外凸曲面,且內表面為一內凹曲面。 In an embodiment of the invention, the outer surface is a convex curved surface, and the inner surface is a concave curved surface.

基於上述,本發明透過蝕刻的方式在殼體的局部區域製作出裝飾性金屬圖案,以使殼體具有金屬質感與光澤的圖案造型。並且,對於應用在行動電話的殼體而言,本發明之裝飾性金屬圖案的製造方法可避開殼體內的天線,以避免影響天線效能。此外,本發明更透過蝕刻的方式在裝飾性金屬圖案上製作出凸版圖案或凹版圖案,以增加金屬圖案的豐富性。 Based on the above, the present invention creates a decorative metal pattern in a partial area of the casing by etching to make the casing have a metallic texture and a glossy pattern. Moreover, for the housing applied to the mobile phone, the method of manufacturing the decorative metal pattern of the present invention can avoid the antenna in the housing to avoid affecting the antenna performance. In addition, the present invention further forms a relief pattern or a gravure pattern on the decorative metal pattern by etching to increase the richness of the metal pattern.

為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.

圖1是依照本發明之一實施例之一種裝飾性金屬圖案的製造方法的流程示意圖。圖2A至圖2F是圖1之裝飾性金屬圖案的製造方法的示意圖。圖3A至圖3F是圖2A至圖2F的局部剖面示意圖。 1 is a flow chart showing a method of manufacturing a decorative metal pattern in accordance with an embodiment of the present invention. 2A to 2F are schematic views of a method of manufacturing the decorative metal pattern of Fig. 1. 3A to 3F are partial cross-sectional views of Figs. 2A to 2F.

本實施例之裝飾性金屬圖案的製造方法S100,包括下列步驟。請參考圖1、圖2A及圖3A,首先,提供一殼體110,其中殼體110具有一表面112(步驟S110)。在本實施例中,殼體110為電子裝置的殼體,電子裝置可為行動電話,在其他實施例中,電子裝置亦可為筆記型電腦或平板電腦,電子裝置的種類並不以上述為限制。如圖2A所示,殼體110的表面112為一外表面,在本實施例中,外表面為一外凸曲面,但外表面並不以此為限制。此外,殼體110之材質為塑膠,例如是丙烯睛-丁二烯-苯乙烯(ABS)或聚碳酸酯(PC),但殼體110的材質不以此為限制。 The manufacturing method S100 of the decorative metal pattern of this embodiment includes the following steps. Referring to FIG. 1, FIG. 2A and FIG. 3A, first, a housing 110 is provided in which the housing 110 has a surface 112 (step S110). In this embodiment, the housing 110 is a housing of an electronic device, and the electronic device can be a mobile phone. In other embodiments, the electronic device can also be a notebook computer or a tablet computer. limit. As shown in FIG. 2A, the surface 112 of the housing 110 is an outer surface. In this embodiment, the outer surface is a convex curved surface, but the outer surface is not limited thereto. In addition, the material of the housing 110 is plastic, such as acrylonitrile butadiene styrene (ABS) or polycarbonate (PC), but the material of the housing 110 is not limited thereto.

接著,請參考圖2B及圖3B,形成一金屬層119於殼體110之表面112(步驟S120)。在本實施例中,金屬層119之材質包括銅、鎳、鋁、金、銀或鈀,且金屬層119是以濕式電鍍的方式形成於表面112。本實施例之金屬層119透過濕式電鍍的方式,可使金屬層119牢固地固定在表面112上。當然,金屬層119之材質與金屬層119形成於表面112的方式並不以此為限制。 Next, referring to FIG. 2B and FIG. 3B, a metal layer 119 is formed on the surface 112 of the casing 110 (step S120). In the present embodiment, the material of the metal layer 119 includes copper, nickel, aluminum, gold, silver or palladium, and the metal layer 119 is formed on the surface 112 by wet plating. The metal layer 119 of the present embodiment can be firmly fixed to the surface 112 by wet plating. Of course, the manner in which the material of the metal layer 119 and the metal layer 119 are formed on the surface 112 is not limited thereto.

當殼體110的材質(例如聚碳酸酯)與金屬層119的直接接合效果較差時,為增進殼體110之表面112與金屬層119的接合狀況,可在殼體110的表面112與金屬層119之間鋪塗一活化層116,以輔助金屬層119均勻地形成在殼體110的表面112。在本實施例中,活化層116的材質可為金屬或是樹酯,金屬與樹酯可分別採用濺鍍與水鍍的 方式形成於表面112,但活化層116之材質種類以及形成方式可不以此為限制。 When the direct bonding effect of the material of the casing 110 (for example, polycarbonate) and the metal layer 119 is poor, in order to promote the bonding state of the surface 112 of the casing 110 and the metal layer 119, the surface 112 and the metal layer of the casing 110 may be provided. An activation layer 116 is applied between 119 to assist the metal layer 119 to be uniformly formed on the surface 112 of the housing 110. In this embodiment, the material of the active layer 116 may be metal or resin. The metal and the resin may be formed on the surface 112 by sputtering and water plating, respectively. However, the material type and formation manner of the active layer 116 may not be This is a limitation.

再來,形成一第一蝕刻罩幕至金屬層119上(步驟S130)。在本實施例中,形成第一蝕刻罩幕的步驟如下:第一,請參考圖2C及圖3C,形成一第一光阻層120至金屬層119上(步驟S132)。第二,請參考圖2D及圖3D,設置一第一光罩130於第一光阻層120上。第三,請參考圖2E及圖3E,曝光第一光阻層120(步驟S134)。在本實施例中,使用立體曝光的技術,以對覆蓋在表面112(外表面)及金屬層119上的第一光阻層120進行曝光程序。最後,顯影已曝光的第一光阻層120以形成第一蝕刻罩幕(步驟S136)。在其他實施例中,殼體110之表面112可包括位於不同平面的第一區域與第二區域,藉由設置第一光罩於位在表面112之第一區域上的第一光阻層120上,曝光第一區域上的第一光阻層120之後。再設置第二光罩於位在表面112之一第二區域上的第一光阻層120上,曝光第二區域上的第一光阻層120,不同平面的第一區域與第二區域藉由不同的光罩多次曝光後,顯影已曝光的第一光阻層120以形成第一蝕刻罩幕,但形成第一蝕刻罩幕的方式不以此為限制。 Then, a first etching mask is formed on the metal layer 119 (step S130). In this embodiment, the first etching mask is formed as follows: First, referring to FIG. 2C and FIG. 3C, a first photoresist layer 120 is formed on the metal layer 119 (step S132). Secondly, referring to FIG. 2D and FIG. 3D, a first mask 130 is disposed on the first photoresist layer 120. Third, referring to FIG. 2E and FIG. 3E, the first photoresist layer 120 is exposed (step S134). In the present embodiment, a technique of stereo exposure is used to expose the first photoresist layer 120 overlying the surface 112 (outer surface) and the metal layer 119. Finally, the exposed first photoresist layer 120 is developed to form a first etch mask (step S136). In other embodiments, the surface 112 of the housing 110 can include first and second regions on different planes by providing a first photomask to the first photoresist layer 120 on the first region of the surface 112. Upper, after exposing the first photoresist layer 120 on the first region. The second photomask is further disposed on the first photoresist layer 120 on the second region of the surface 112, and the first photoresist layer 120 on the second region is exposed, and the first region and the second region of the different planes are borrowed. After multiple exposures by different masks, the exposed first photoresist layer 120 is developed to form a first etch mask, but the manner in which the first etch mask is formed is not limited thereto.

接著,蝕刻部分暴露於第一蝕刻罩幕外的金屬層119以形成一裝飾性金屬圖案150(步驟S140)。最後,移除第一蝕刻罩幕(步驟S150),請參考圖2F及圖3F,裝飾性金屬圖案150形成於殼體110之外表面的一部分。在本 實施例中採用正光阻,但在其他實施例中,亦可採用負光阻,其可得到與圖3F相反之圖案。 Next, the etched portion is exposed to the metal layer 119 outside the first etch mask to form a decorative metal pattern 150 (step S140). Finally, the first etching mask is removed (step S150). Referring to FIG. 2F and FIG. 3F, the decorative metal pattern 150 is formed on a portion of the outer surface of the housing 110. In this A positive photoresist is used in the embodiment, but in other embodiments, a negative photoresist may also be used, which results in a pattern opposite to that of Fig. 3F.

在本實施例中,殼體110具有相對外表面之一內表面,且一天線10於裝飾性金屬圖案150相對於殼體110的另一表面,且天線10大致上對應於金屬層119被蝕刻的部分。也就是說,天線10設置於內表面上對應至外表面的另一部分。在本實施例中,內表面為一內凹曲面,但內表面並不以此為限制。本實施例之裝飾性金屬圖案150的製造方法可在殼體110的外表面的局部區域形成裝飾性金屬圖案150,以提供殼體110具有金屬質感與光澤的造型。此外,由於裝飾性金屬圖案150僅分布於部分的外表面,因此,若殼體110為行動電話的殼體,裝飾性金屬圖案150於外表面的位置可避開殼體110內部的天線10位置,以避免影響天線10效能。 In the present embodiment, the housing 110 has an inner surface opposite the outer surface, and an antenna 10 is disposed on the other surface of the decorative metal pattern 150 relative to the housing 110, and the antenna 10 is substantially etched corresponding to the metal layer 119. part. That is, the antenna 10 is disposed on the inner surface to correspond to another portion of the outer surface. In this embodiment, the inner surface is a concave curved surface, but the inner surface is not limited thereto. Method for manufacturing decorative metal pattern 150 of the present embodiment A decorative metal pattern 150 may be formed in a partial area of the outer surface of the housing 110 to provide a shape in which the housing 110 has a metallic texture and gloss. In addition, since the decorative metal pattern 150 is only distributed on the outer surface of the portion, if the housing 110 is the housing of the mobile phone, the position of the decorative metal pattern 150 on the outer surface can avoid the position of the antenna 10 inside the housing 110. To avoid affecting the performance of the antenna 10.

圖4A至圖4F是圖1之裝飾性金屬圖案的製造過程的剖面示意圖。圖4A至圖4F與圖3A至圖3F的主要差異在於,圖4A之殼體210的表面212為具有凹槽212a的外表面214,且裝飾性金屬圖案250形成於凹槽212a內,而圖3A之殼體110的表面112為平滑的外表面114。本實施例之裝飾性金屬圖案250的製造過程詳述如下。 4A to 4F are schematic cross-sectional views showing a manufacturing process of the decorative metal pattern of Fig. 1. The main difference between FIGS. 4A to 4F and FIGS. 3A to 3F is that the surface 212 of the housing 210 of FIG. 4A is an outer surface 214 having a recess 212a, and the decorative metal pattern 250 is formed in the recess 212a. The surface 112 of the housing 110 of 3A is a smooth outer surface 114. The manufacturing process of the decorative metal pattern 250 of the present embodiment is described in detail below.

首先,請參考圖4A,提供殼體210,其中殼體210的表面212是具有凹槽212a的外表面,本實施例之外表面為一外凸曲面,但外表面不以此為限制。接著,請參考圖4B,形成一金屬層219於殼體210之表面212。在本實施例中, 金屬層219包括銅、鎳、鋁、金、銀或鈀,且金屬層219是以濕式電鍍的方式形成於表面,但金屬層219的材質與形成金屬層219的方式不以此為限制。 First, referring to FIG. 4A, a housing 210 is provided, wherein the surface 212 of the housing 210 is an outer surface having a recess 212a. The outer surface of the embodiment is a convex curved surface, but the outer surface is not limited thereto. Next, referring to FIG. 4B, a metal layer 219 is formed on the surface 212 of the housing 210. In this embodiment, The metal layer 219 includes copper, nickel, aluminum, gold, silver or palladium, and the metal layer 219 is formed on the surface by wet plating, but the material of the metal layer 219 and the manner of forming the metal layer 219 are not limited thereto.

再來,形成一第一蝕刻罩幕240至金屬層219上。在本實施例中,形成第一蝕刻罩幕240的步驟如下:第一,請參考圖4C,形成一第一光阻層220至金屬層219上。第二,請參考圖4D,設置第一光罩230於第一光阻層220上且曝光第一光阻層220。在本實施例中,使用立體曝光的技術,以對覆蓋在表面212(外表面)及金屬層219上的第一光阻層220進行曝光程序。最後,請參考圖4E,顯影已曝光的第一光阻層220以形成第一蝕刻罩幕240。 Then, a first etching mask 240 is formed on the metal layer 219. In this embodiment, the first etching mask 240 is formed as follows: First, referring to FIG. 4C, a first photoresist layer 220 is formed on the metal layer 219. Secondly, referring to FIG. 4D, the first photomask 230 is disposed on the first photoresist layer 220 and the first photoresist layer 220 is exposed. In the present embodiment, a technique of stereo exposure is used to expose the first photoresist layer 220 overlying the surface 212 (outer surface) and the metal layer 219. Finally, referring to FIG. 4E, the exposed first photoresist layer 220 is developed to form a first etch mask 240.

最後,蝕刻部分暴露於第一蝕刻罩幕240外的金屬層219以形成一裝飾性金屬圖案250,並移除第一蝕刻罩幕240。請參考圖4F,裝飾性金屬圖案250形成於殼體210之表面212的凹槽212a內,以提供殼體210的局部區域具有金屬質感與光澤的造型。 Finally, the etched portion is exposed to the metal layer 219 outside the first etch mask 240 to form a decorative metal pattern 250, and the first etch mask 240 is removed. Referring to FIG. 4F, a decorative metal pattern 250 is formed in the recess 212a of the surface 212 of the housing 210 to provide a metallic and glossy shape of a portion of the housing 210.

除了可在外表面上製作出裝飾性金屬圖案150、250之外,亦可透過相同的方式在裝飾性金屬圖案上製作出凸版圖案或凹版圖案,以提供更豐富與多元的金屬圖案形成在殼體的外表面上。圖5是依照本發明之一實施例之一種凸版圖案或凹版圖案的製造方法的流程示意圖。圖6A至圖6I是圖5之凹版圖案的製造方法的示意圖。本實施例之凹版圖案的製造方法S300詳述如下。 In addition to the decorative metal patterns 150, 250 being formed on the outer surface, a relief pattern or a gravure pattern can be formed on the decorative metal pattern in the same manner to provide a richer and more diverse metal pattern formed in the housing. On the outer surface. FIG. 5 is a flow chart showing a method of fabricating a relief pattern or a gravure pattern according to an embodiment of the present invention. 6A to 6I are schematic views of a method of manufacturing the intaglio pattern of Fig. 5. The manufacturing method S300 of the gravure pattern of this embodiment is described in detail below.

首先,請參考圖5及圖6A,提供一殼體310,其中殼 體310具有一表面312(步驟S310)。在本實施例中,表面312為殼體310的一外表面,本實施例之外表面為一外凸曲面,但外表面不以此為限制。殼體310可為行動電話的殼體,但殼體310的種類不以此為限制。此外,殼體310之材質可為塑膠,例如是丙烯睛-丁二烯-苯乙烯(ABS)或聚碳酸酯(PC),但不以此為限。 First, please refer to FIG. 5 and FIG. 6A, a housing 310 is provided, wherein the shell The body 310 has a surface 312 (step S310). In this embodiment, the surface 312 is an outer surface of the housing 310. The outer surface of the embodiment is a convex curved surface, but the outer surface is not limited thereto. The housing 310 may be a housing of a mobile phone, but the type of the housing 310 is not limited thereto. In addition, the material of the housing 310 may be plastic, such as acrylonitrile butadiene styrene (ABS) or polycarbonate (PC), but not limited thereto.

接著,請參考圖6A與6B,形成一金屬層319於殼體310之表面312(步驟S320)。在本實施例中,金屬層319包括銅、鎳、鋁、金、銀或鈀,且金屬層319是以濕式電鍍的方式形成於表面312。此外,本實施例之金屬層319的厚度可大於圖2G中的金屬層119的厚度,以便後續在裝飾性金屬圖案350上製作出凹版圖案390。 Next, referring to FIGS. 6A and 6B, a metal layer 319 is formed on the surface 312 of the housing 310 (step S320). In the present embodiment, the metal layer 319 includes copper, nickel, aluminum, gold, silver or palladium, and the metal layer 319 is formed on the surface 312 by wet plating. In addition, the thickness of the metal layer 319 of the present embodiment may be greater than the thickness of the metal layer 119 in FIG. 2G in order to subsequently form the intaglio pattern 390 on the decorative metal pattern 350.

再來,形成一第一蝕刻罩幕至金屬層319上(步驟S330)。在本實施例中,形成第一蝕刻罩幕的過程如下:第一,請參考圖6C,形成一第一光阻層320至金屬層319上(步驟S332)。第二,請參考圖6D,設置一第一光罩330於第一光阻層320上且曝光第一光阻層320(步驟S334)。在本實施例中,使用立體曝光的技術,以對覆蓋在表面312(外表面)及金屬層319上的第一光阻層320進行曝光程序。最後,顯影已曝光的第一光阻層320以形成第一蝕刻罩幕(步驟S336)。第一蝕刻罩幕的圖案對應於第一光罩330之圖案。 Then, a first etching mask is formed on the metal layer 319 (step S330). In the present embodiment, the process of forming the first etching mask is as follows: First, referring to FIG. 6C, a first photoresist layer 320 is formed on the metal layer 319 (step S332). Secondly, referring to FIG. 6D, a first mask 330 is disposed on the first photoresist layer 320 and the first photoresist layer 320 is exposed (step S334). In the present embodiment, a technique of stereo exposure is used to expose the first photoresist layer 320 over the surface 312 (outer surface) and the metal layer 319. Finally, the exposed first photoresist layer 320 is developed to form a first etch mask (step S336). The pattern of the first etch mask corresponds to the pattern of the first reticle 330.

接著,蝕刻部分暴露於第一蝕刻罩幕外的金屬層319以形成一裝飾性金屬圖案350(步驟S340)。再來,移除 第一蝕刻罩幕(步驟S350)。請參考圖6E,裝飾性金屬圖案350形成於殼體310之外表面的一部分。 Next, the etched portion is exposed to the metal layer 319 outside the first etch mask to form a decorative metal pattern 350 (step S340). Come back, remove The first etching mask (step S350). Referring to FIG. 6E, the decorative metal pattern 350 is formed on a portion of the outer surface of the housing 310.

再來,形成一第二蝕刻罩幕380至裝飾性金屬圖案350上(步驟S360)。形成第一蝕刻罩幕380的過程如下:第一,請參考圖6F,形成一第二光阻層360至裝飾性金屬圖案350上(步驟S362)。第二,請參考圖6G,設置一第二光罩370於第二光阻層360上且曝光第二光阻層360(步驟S364)。最後,請參考圖6H,顯影已曝光的第二光阻層360以形成第二蝕刻罩幕380(步驟S366),其中第二蝕刻罩幕380的圖案對應於第二光罩370之圖案。 Then, a second etching mask 380 is formed on the decorative metal pattern 350 (step S360). The process of forming the first etch mask 380 is as follows: First, referring to FIG. 6F, a second photoresist layer 360 is formed onto the decorative metal pattern 350 (step S362). Secondly, referring to FIG. 6G, a second mask 370 is disposed on the second photoresist layer 360 and exposes the second photoresist layer 360 (step S364). Finally, referring to FIG. 6H, the exposed second photoresist layer 360 is developed to form a second etch mask 380 (step S366), wherein the pattern of the second etch mask 380 corresponds to the pattern of the second mask 370.

接著,蝕刻部分暴露於第二蝕刻罩幕380外的裝飾性金屬圖案350以形成一凹版圖案390於裝飾性金屬圖案350上(步驟S370)。最後,移除第二蝕刻罩幕380(步驟S380)。請參考圖6I,凹版圖案390形成於殼體310之外表面的裝飾性金屬圖案350上。在本實施例中,部分的第二蝕刻罩幕380分布於裝飾性金屬圖案350的外圍,經過蝕刻程序之後,相較於裝飾性金屬圖案350的內部被移除的部份,裝飾性金屬圖案350的外圍並不會被移除,因此,凹版圖案390便形成於裝飾性金屬圖案350上。 Next, the etched portion is exposed to the decorative metal pattern 350 outside the second etch mask 380 to form a gravure pattern 390 on the decorative metal pattern 350 (step S370). Finally, the second etching mask 380 is removed (step S380). Referring to FIG. 6I, a gravure pattern 390 is formed on the decorative metal pattern 350 on the outer surface of the housing 310. In this embodiment, a portion of the second etching mask 380 is distributed on the periphery of the decorative metal pattern 350, and after the etching process, the decorative metal pattern is compared with the removed portion of the decorative metal pattern 350. The periphery of the 350 is not removed, and therefore, the intaglio pattern 390 is formed on the decorative metal pattern 350.

此外,在本實施例中,殼體310具有相對外表面之一內表面,且一天線10於裝飾性金屬圖案350相對於殼體310的另一表面,且天線10大致上對應於金屬層319被蝕刻的部分。也就是說,天線10設置於內表面上對應至外表面的另一部分。本實施例之內表面為一內凹曲面,但內表 面不以此為限制。本實施例之凹版圖案390的製造方法可在殼體310的外表面的局部區域形成裝飾性金屬圖案350後,再在裝飾性金屬圖案350上形成凹版圖案390。凹版圖案390可透過深度差所產生的光影差異,提供殼體310更豐富的金屬圖案造型。此外,由於凹版圖案390僅分布於部分的外表面,因此,若殼體310為行動電話的殼體,凹版圖案390於外表面的位置可避開殼體310內部的天線10位置,以避免影響天線10效能。 In addition, in the present embodiment, the housing 310 has an inner surface opposite to the outer surface, and an antenna 10 is disposed on the other surface of the decorative metal pattern 350 relative to the housing 310, and the antenna 10 substantially corresponds to the metal layer 319. The portion to be etched. That is, the antenna 10 is disposed on the inner surface to correspond to another portion of the outer surface. The inner surface of this embodiment is a concave curved surface, but the inner surface This is not a limitation. In the method of manufacturing the intaglio pattern 390 of the present embodiment, after the decorative metal pattern 350 is formed in a partial region of the outer surface of the casing 310, the intaglio pattern 390 is formed on the decorative metal pattern 350. The gravure pattern 390 can provide a richer metal pattern of the housing 310 by transmitting light and shadow differences caused by the difference in depth. In addition, since the intaglio pattern 390 is only distributed on the outer surface of the portion, if the housing 310 is the housing of the mobile phone, the position of the intaglio pattern 390 on the outer surface can avoid the position of the antenna 10 inside the housing 310 to avoid the influence. Antenna 10 performance.

圖7A至圖7C是圖5之凸版圖案的製造方法的部份示意圖。圖7A至圖7C與圖6G至圖6I的主要差異在於,圖7A至圖7C是用來製造出凸版圖案490,而圖6G至圖6I是用來製造出凹版圖案390。在本實施例中,先如同圖6A至圖6F所示,首先,形成一裝飾性金屬圖案350於殼體310之外表面的一部分後,形成一第二光阻層360至裝飾性金屬圖案350上,步驟於圖6A至圖6F已詳細敘述,在此不多加贅述。 7A to 7C are partial schematic views showing a method of manufacturing the relief pattern of Fig. 5. The main difference between FIGS. 7A to 7C and FIGS. 6G to 6I is that FIGS. 7A to 7C are for producing the relief pattern 490, and FIGS. 6G to 6I are for manufacturing the intaglio pattern 390. In this embodiment, first, as shown in FIG. 6A to FIG. 6F, first, after forming a decorative metal pattern 350 on a portion of the outer surface of the casing 310, a second photoresist layer 360 is formed to the decorative metal pattern 350. The steps are described in detail in FIGS. 6A to 6F, and are not described here.

接著,請參考圖7A,設置一第二光罩470於第二光阻層360上且曝光第二光阻層360。此處使用立體曝光的技術,以對第二光阻層360進行曝光程序。再來,請參考圖7B,顯影已曝光的第二光阻層360以在裝飾性金屬圖案350上以形成第二蝕刻罩幕480,其中第二蝕刻罩幕480的圖案對應於第二光罩470之圖案。最後,蝕刻部分暴露於第二蝕刻罩幕480外的裝飾性金屬圖案350以形成一凸版圖案490於裝飾性金屬圖案350上,且移除第二蝕刻罩 幕480。請參考圖7C,凸版圖案490即可形成於殼體310之外表面的裝飾性金屬圖案350上。 Next, referring to FIG. 7A, a second mask 470 is disposed on the second photoresist layer 360 and exposes the second photoresist layer 360. The technique of stereo exposure is used here to expose the second photoresist layer 360. Next, referring to FIG. 7B, the exposed second photoresist layer 360 is developed to form a second etching mask 480 on the decorative metal pattern 350, wherein the pattern of the second etching mask 480 corresponds to the second mask. 470 pattern. Finally, the etched portion is exposed to the decorative metal pattern 350 outside the second etch mask 480 to form a relief pattern 490 on the decorative metal pattern 350, and the second etch mask is removed. Curtain 480. Referring to FIG. 7C, the relief pattern 490 may be formed on the decorative metal pattern 350 on the outer surface of the housing 310.

在本實施例中,第二蝕刻罩幕480分布於裝飾性金屬圖案350的內部,經過蝕刻程序之後,相較於裝飾性金屬圖案350的外圍被移除的部份,部份內部的裝飾性金屬圖案350並不會被移除,便形成了凸版圖案490。 In this embodiment, the second etching mask 480 is distributed inside the decorative metal pattern 350, and after the etching process, the interior of the decorative metal pattern 350 is removed, and part of the interior is decorative. The metal pattern 350 is not removed, and a relief pattern 490 is formed.

也就是說,透過第二蝕刻罩幕在裝飾性金屬圖案上的分布狀況,製造者可自行決定要在裝飾性金屬圖案形成凹版圖案或是凸版圖案,以增添形成於殼體的外表面上的金屬圖案的多元性。當然,在其他實施例中,亦可透過重複多次上述步驟,以製作出具有更多光影變化的金屬圖案。 That is to say, through the distribution of the second etching mask on the decorative metal pattern, the manufacturer can decide to form a gravure pattern or a relief pattern on the decorative metal pattern to add on the outer surface of the casing. The diversity of metal patterns. Of course, in other embodiments, the above steps may be repeated a plurality of times to create a metal pattern having more light and shadow changes.

綜上所述,本發明透過微影蝕刻的方式在殼體的局部區域製作出裝飾性金屬圖案,以使殼體具有金屬質感與光澤的圖案造型。並且,對於應用在行動電話的殼體而言,本發明之裝飾性金屬圖案的製造方法可避開殼體內的天線,以避免影響天線效能。此外,本發明更透過在裝飾性金屬圖案上形成第二蝕刻罩幕,以在裝飾性金屬圖案上製作出凸版圖案或凹版圖案,增加金屬圖案的豐富性。 In summary, the present invention creates a decorative metal pattern in a partial area of the casing by means of lithography etching, so that the casing has a metallic texture and a glossy pattern. Moreover, for the housing applied to the mobile phone, the method of manufacturing the decorative metal pattern of the present invention can avoid the antenna in the housing to avoid affecting the antenna performance. In addition, the present invention further increases the richness of the metal pattern by forming a second etching mask on the decorative metal pattern to form a relief pattern or a gravure pattern on the decorative metal pattern.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

S110-S150‧‧‧步驟 S110-S150‧‧‧Steps

10‧‧‧天線 10‧‧‧Antenna

110、210、310‧‧‧殼體 110, 210, 310‧‧‧ housing

112、212、312‧‧‧表面 112, 212, 312‧‧‧ surface

116‧‧‧活化層 116‧‧‧Active layer

119、219、319‧‧‧金屬層 119, 219, 319‧‧‧ metal layers

120、220、320‧‧‧第一光阻層 120, 220, 320‧‧‧ first photoresist layer

130、230、330‧‧‧第一光罩 130, 230, 330‧‧‧ first mask

150、250、350‧‧‧裝飾性金屬圖案 150, 250, 350‧‧‧ decorative metal patterns

212a‧‧‧凹槽 212a‧‧‧ Groove

240‧‧‧第一蝕刻罩幕 240‧‧‧First etching mask

360‧‧‧第二光阻層 360‧‧‧second photoresist layer

370、470‧‧‧第二光罩 370, 470‧‧‧ second mask

380、480‧‧‧第二蝕刻罩幕 380, 480‧‧‧ second etching mask

390‧‧‧凹版圖案 390‧‧ ‧ gravure pattern

490‧‧‧凸版圖案 490‧‧‧ Letterpress pattern

圖1是依照本發明之一實施例之一種裝飾性金屬圖案的製造方法的流程示意圖。 1 is a flow chart showing a method of manufacturing a decorative metal pattern in accordance with an embodiment of the present invention.

圖2A至圖2F是圖1之裝飾性金屬圖案的製造方法的示意圖。 2A to 2F are schematic views of a method of manufacturing the decorative metal pattern of Fig. 1.

圖3A至圖3F是圖2A至圖2F的局部剖面示意圖。 3A to 3F are partial cross-sectional views of Figs. 2A to 2F.

圖4A至圖4F是圖1之裝飾性金屬圖案的製造過程的剖面示意圖。 4A to 4F are schematic cross-sectional views showing a manufacturing process of the decorative metal pattern of Fig. 1.

圖5是依照本發明之一實施例之一種凸版圖案或凹版圖案的製造方法的流程示意圖。 FIG. 5 is a flow chart showing a method of fabricating a relief pattern or a gravure pattern according to an embodiment of the present invention.

圖6A至圖6I是圖5之凹版圖案的製造方法的示意圖。 6A to 6I are schematic views of a method of manufacturing the intaglio pattern of Fig. 5.

圖7A至圖7C是圖5之凸版圖案的製造方法的部份示意圖。 7A to 7C are partial schematic views showing a method of manufacturing the relief pattern of Fig. 5.

S110-S150‧‧‧步驟 S110-S150‧‧‧Steps

Claims (9)

一種裝飾性金屬圖案的製造方法,包括:提供一殼體,其中該殼體具有一表面;形成一金屬層於該殼體之該表面上;形成一第一蝕刻罩幕至該金屬層上;蝕刻部分暴露於該第一蝕刻罩幕外的該金屬層以形成一裝飾性金屬圖案;移除該第一蝕刻罩幕;形成一第二蝕刻罩幕至該裝飾性金屬圖案上;蝕刻部分暴露於該第二蝕刻罩幕外的該裝飾性金屬圖案以形成一凸版圖案或一凹版圖案於該裝飾性金屬圖案上;移除該第二蝕刻罩幕;以及設置一天線於該裝飾性金屬圖案相對於該殼體的另一表面,且該天線大致上對應於該金屬層被蝕刻的部分。 A method of manufacturing a decorative metal pattern, comprising: providing a casing, wherein the casing has a surface; forming a metal layer on the surface of the casing; forming a first etching mask to the metal layer; The etched portion is exposed to the metal layer outside the first etch mask to form a decorative metal pattern; the first etch mask is removed; a second etch mask is formed onto the decorative metal pattern; and the etched portion is exposed The decorative metal pattern outside the second etching mask to form a relief pattern or a gravure pattern on the decorative metal pattern; removing the second etching mask; and providing an antenna to the decorative metal pattern Relative to the other surface of the housing, and the antenna substantially corresponds to the portion of the metal layer that is etched. 如申請專利範圍第1項所述之裝飾性金屬圖案的製造方法,其中形成該第一蝕刻罩幕的步驟包括:形成一第一光阻層至該金屬層上;曝光該第一光阻層;以及顯影已曝光的該第一光阻層以形成該第一蝕刻罩幕。 The method for manufacturing a decorative metal pattern according to claim 1, wherein the step of forming the first etching mask comprises: forming a first photoresist layer onto the metal layer; and exposing the first photoresist layer And developing the exposed first photoresist layer to form the first etch mask. 如申請專利範圍第2項所述之裝飾性金屬圖案的製造方法,其中形成該第一蝕刻罩幕的步驟更包括:設置一第一光罩於位在該表面之一第一區域上的該第一光阻層上; 曝光該第一區域上的該第一光阻層;設置一第二光罩於位在該表面之一第二區域上的該第一光阻層上,其中該第一區域與該第二區域位於該表面之不同的平面;以及曝光該第二區域上的該第一光阻層。 The method of manufacturing the decorative metal pattern of claim 2, wherein the step of forming the first etch mask further comprises: disposing a first reticle on the first region of the surface On the first photoresist layer; Exposing the first photoresist layer on the first region; and providing a second photomask on the first photoresist layer on a second region of the surface, wherein the first region and the second region Located on different planes of the surface; and exposing the first photoresist layer on the second region. 如申請專利範圍第1項所述之裝飾性金屬圖案的製造方法,其中該殼體之該表面具有一凹槽,且該裝飾性金屬圖案位於該凹槽。 The method of manufacturing a decorative metal pattern according to claim 1, wherein the surface of the casing has a groove, and the decorative metal pattern is located in the groove. 如申請專利範圍第1項所述之裝飾性金屬圖案的製造方法,其中形成該第一蝕刻罩幕的步驟包括:形成一第二光阻層至該裝飾性金屬圖案上;曝光該第二光阻層;以及顯影已曝光的該第二光阻層以形成該第二蝕刻罩幕。 The method for manufacturing a decorative metal pattern according to claim 1, wherein the forming the first etching mask comprises: forming a second photoresist layer onto the decorative metal pattern; and exposing the second light a resist layer; and developing the exposed second photoresist layer to form the second etch mask. 如申請專利範圍第1項所述之裝飾性金屬圖案的製造方法,其中在形成該金屬層於該殼體之該表面的步驟中,該金屬層是以濕式電鍍的方式形成於該表面。 The method of manufacturing a decorative metal pattern according to claim 1, wherein in the step of forming the metal layer on the surface of the casing, the metal layer is formed on the surface by wet plating. 如申請專利範圍第1項所述之裝飾性金屬圖案的製造方法,其中在形成該金屬層於該殼體之該表面的步驟中,更包括先設置一活化層於該殼體之該表面上,再設置該金屬層於該活化層上。 The method of manufacturing the decorative metal pattern of claim 1, wherein the step of forming the metal layer on the surface of the housing further comprises first providing an activation layer on the surface of the housing. And then disposing the metal layer on the active layer. 一電子裝置,包括:一殼體,具有相對之一外表面及一內表面;一裝飾性金屬圖案,形成於該殼體之該外表面上,其中該裝飾性金屬圖案包括一凸版圖案或一凹版圖案;以及 一天線,設置於該內表面上且大致上對應至該殼體之該外表面上未形成該裝飾性圖案的另一部分。 An electronic device comprising: a housing having an opposite outer surface and an inner surface; a decorative metal pattern formed on the outer surface of the housing, wherein the decorative metal pattern comprises a relief pattern or a Gravure pattern; An antenna is disposed on the inner surface and substantially corresponds to another portion of the outer surface of the housing where the decorative pattern is not formed. 如申請專利範圍第8項所述之電子裝置,其中該外表面為一外凸曲面,且該內表面為一內凹曲面。 The electronic device of claim 8, wherein the outer surface is a convex curved surface, and the inner surface is a concave curved surface.
TW101143966A 2012-11-23 2012-11-23 Manufacturing method of decorative metal pattern and electronic device TWI546205B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101143966A TWI546205B (en) 2012-11-23 2012-11-23 Manufacturing method of decorative metal pattern and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101143966A TWI546205B (en) 2012-11-23 2012-11-23 Manufacturing method of decorative metal pattern and electronic device

Publications (2)

Publication Number Publication Date
TW201420374A TW201420374A (en) 2014-06-01
TWI546205B true TWI546205B (en) 2016-08-21

Family

ID=51393161

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101143966A TWI546205B (en) 2012-11-23 2012-11-23 Manufacturing method of decorative metal pattern and electronic device

Country Status (1)

Country Link
TW (1) TWI546205B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651194B (en) * 2015-05-26 2019-02-21 綠點高新科技股份有限公司 A method of manufacturing appearance products having decorative effect, appearance products and electronic devices
TWI584967B (en) * 2015-07-16 2017-06-01 許銘案 Device with colored photoresist pattern and manufacturing method thereof

Also Published As

Publication number Publication date
TW201420374A (en) 2014-06-01

Similar Documents

Publication Publication Date Title
JP2005345737A5 (en)
JP2006152396A (en) Manufacturing method of metal mask, electroforming mask master and master master
JP2021059781A5 (en)
US20120219701A1 (en) Method for fabricating touch sensor structure
TWI546205B (en) Manufacturing method of decorative metal pattern and electronic device
JP2012138570A5 (en)
CN104183911A (en) How to make an antenna
CN105159028A (en) Nanometer pattern impression mask and manufacturing method thereof
JP2006119651A5 (en)
CN205946087U (en) wireless bluetooth headset
TW201310770A (en) Portable electronic device and antenna structure and antenna producing process thereof
TWM523881U (en) Curved mask, curved surface device with colored resist pattern
CN103834947A (en) Method for manufacturing decorative metal pattern and electronic device
JP5236168B2 (en) Master plate for mesh-integrated mask and manufacturing method thereof
TWI605741B (en) Circuit board and manufacturing method thereof
CN107203093B (en) Substrate with thin film pattern and method for forming thin film pattern on substrate
KR20190050680A (en) Menufacturing method for three-dimensional shape metal mask using electroforming
TWI547008B (en) Antenna producing process
TWI605298B (en) Curved shaped mask, curved device having color resists pattern and method for manufacturing the same
TWI514670B (en) Method for making an antenna
WO2018056089A1 (en) Conductive film, touch panel, photomask, imprint template, conductive film-forming laminate, method for manufacturing conductive film, and method for manufacturing electronic device
TWI669994B (en) Method for manufacturing miniaturized circuit and its products
TWI703301B (en) The manufacture method of the heat dissipation component
TWM527383U (en) Non-planar tempered glass with grain decoration
TWM519808U (en) Device with colored photoresist pattern