[go: up one dir, main page]

TWI546173B - 線鋸及於線鋸中對齊輥子的方法 - Google Patents

線鋸及於線鋸中對齊輥子的方法 Download PDF

Info

Publication number
TWI546173B
TWI546173B TW101110670A TW101110670A TWI546173B TW I546173 B TWI546173 B TW I546173B TW 101110670 A TW101110670 A TW 101110670A TW 101110670 A TW101110670 A TW 101110670A TW I546173 B TWI546173 B TW I546173B
Authority
TW
Taiwan
Prior art keywords
roller
steel wire
rollers
tension
reciprocating
Prior art date
Application number
TW101110670A
Other languages
English (en)
Chinese (zh)
Other versions
TW201238726A (en
Inventor
Himeno Takao
Tanizaki Akira
Matsuda Akihiro
Kawatsu Tomoyuki
Original Assignee
Komatsu Ntc Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ntc Ltd filed Critical Komatsu Ntc Ltd
Publication of TW201238726A publication Critical patent/TW201238726A/zh
Application granted granted Critical
Publication of TWI546173B publication Critical patent/TWI546173B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW101110670A 2011-03-30 2012-03-28 線鋸及於線鋸中對齊輥子的方法 TWI546173B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011074515A JP5675462B2 (ja) 2011-03-30 2011-03-30 ワイヤソー及びワイヤソーにおけるローラ位置合わせ方法

Publications (2)

Publication Number Publication Date
TW201238726A TW201238726A (en) 2012-10-01
TWI546173B true TWI546173B (zh) 2016-08-21

Family

ID=46931241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101110670A TWI546173B (zh) 2011-03-30 2012-03-28 線鋸及於線鋸中對齊輥子的方法

Country Status (5)

Country Link
JP (1) JP5675462B2 (ja)
KR (1) KR101884253B1 (ja)
CN (1) CN103347651B (ja)
TW (1) TWI546173B (ja)
WO (1) WO2012133532A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5810299B2 (ja) * 2012-03-19 2015-11-11 パナソニックＩｐマネジメント株式会社 インゴットの切断装置
JP6563240B2 (ja) * 2015-04-24 2019-08-21 株式会社安永 ワイヤソー及び該ワイヤソーを使用し、ワークから複数のスライス品を製造する製造方法
JP6908386B2 (ja) * 2017-01-27 2021-07-28 コマツＮｔｃ株式会社 ワイヤソー及びワイヤによるワークの切断加工方法
JP6857509B2 (ja) * 2017-02-15 2021-04-14 コマツＮｔｃ株式会社 ワイヤソー
EP3476513B1 (en) * 2017-10-26 2022-02-23 Precision Surfacing Solutions GmbH Wire saw
JP7267684B2 (ja) * 2018-05-18 2023-05-02 株式会社小松製作所 ワイヤソーの運転パラメータの設定方法及びワイヤソー
IT201900022743A1 (it) * 2019-12-02 2021-06-02 Pedrini Spa Ad Unico Socio Macchina multifilo di taglio di blocchi di pietra con controllo distanza dei fili.
KR102908461B1 (ko) * 2023-12-19 2026-01-05 한화세미텍 주식회사 멀티와이어쏘 공정에서 스트로크 세팅을 위한 트래버스의 이송범위 설정시스템 및 이의 설정방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01295758A (ja) * 1988-05-19 1989-11-29 Osaka Titanium Co Ltd スライス加工法およびワイヤソーマシン
JPH0264010U (ja) * 1988-10-31 1990-05-14
JPH0871909A (ja) * 1994-09-01 1996-03-19 Tokyo Seimitsu Co Ltd ワイヤーソー
JPH09164524A (ja) * 1995-12-18 1997-06-24 Tokyo Seimitsu Co Ltd ワイヤソーの運転状況判別装置
CN1180328A (zh) * 1996-02-28 1998-04-29 东京制纲株式会社 钢丝式切断加工装置及方法
EP0827822A4 (en) * 1996-02-28 2004-08-18 Tokyo Rope Mfg Co WIRE SAW AND WIRE SAW METHOD
JPH1110509A (ja) * 1997-06-24 1999-01-19 Nippei Toyama Corp ワイヤソーの張力付与機構
JPH1177510A (ja) * 1997-09-05 1999-03-23 Tokyo Seimitsu Co Ltd 固定砥粒ワイヤソー及びその被加工物切断方法
JPH11348029A (ja) 1998-06-08 1999-12-21 Tokyo Seimitsu Co Ltd ワイヤソーのワイヤ捩じり機構
JP4049900B2 (ja) 1998-08-20 2008-02-20 株式会社スーパーシリコン研究所 ワイヤソー切断装置
JP3739603B2 (ja) 1999-07-15 2006-01-25 株式会社日平トヤマ ワイヤソー
JP4129716B2 (ja) * 2001-03-30 2008-08-06 株式会社Ｓｕｍｃｏ ワイヤソー用ガイドローラ
WO2003033207A1 (fr) * 2001-10-17 2003-04-24 Neomax Co., Ltd. Procede de decoupe au moyen d'un fil helicoidal, dispositif de decoupe a fil helicoidal, et procede de fabrication d'un aimant permanent a base de terres rares
JP2005186222A (ja) 2003-12-25 2005-07-14 Nippei Toyama Corp ワイヤソーにおける切断方法

Also Published As

Publication number Publication date
WO2012133532A1 (ja) 2012-10-04
KR101884253B1 (ko) 2018-08-02
JP5675462B2 (ja) 2015-02-25
KR20140005973A (ko) 2014-01-15
TW201238726A (en) 2012-10-01
JP2012206224A (ja) 2012-10-25
CN103347651A (zh) 2013-10-09
CN103347651B (zh) 2016-03-23

Similar Documents

Publication Publication Date Title
TWI546173B (zh) 線鋸及於線鋸中對齊輥子的方法
JP5514229B2 (ja) ワイヤソー装置およびワイヤソー装置を動作させる方法
RU2723124C2 (ru) Малогабаритная четырехосная машина для укладки волокон
CN202805447U (zh) 钢丝式切断装置
KR101545355B1 (ko) 와이어 소 및 피가공물 가공방법
JP2015155119A (ja) ワイヤソー及び切断加工方法
TWI408020B (zh) 線鋸
JP2014114166A (ja) 綾巻きパッケージを製造する繊維機械の作業部用の巻取り装置
JP6991532B2 (ja) 仕上げ列において磨耗体を用いて金属ストリップを案内するデバイス
KR101289658B1 (ko) 잉곳 절단용 와이어 쏘 장치
JP5917252B2 (ja) ワイヤソー
JP2006527696A (ja) 巻取り方法及び巻取り機
JP7130365B2 (ja) クロス捲きパッケージを生産する繊維機械のワークステーションにおける綾振り三角形領域に配置された機械式糸貯留装置用糸ガイドプーリー
TW201511904A (zh) 線鋸及引線進行之工件之切斷方法
KR101290213B1 (ko) 와이어 소
JP3958876B2 (ja) ワイヤ式切断加工装置
JP7425713B2 (ja) レーザ加工装置
JP3660124B2 (ja) ワイヤソーによるインゴットの加工方法及びワイヤソー
KR101194983B1 (ko) 와인더기의 실권취 안내장치
JP2022159163A (ja) 紡糸引取装置
JP2000272828A (ja) 線材巻きｎｃトラバーサー
IT202200026244A1 (it) Macchina per la lavorazione laser di tubi e profilati, in particolare macchina per il taglio laser di tubi e profilati, con sistema per il supporto del tubo o profilato comprendente almeno una sagoma a raggio variabile
JPS60213428A (ja) ワイヤカツト放電加工機の電極ワイヤ供給装置
CN107775826A (zh) 一种避免硅片切割中钢线断裂的布线方法及装置
JP2021025141A (ja) 紡績機