TWI545641B - Protective tape peeling method and protective tape peeling device - Google Patents

Description

Protective tape peeling method and protective tape peeling device

The present invention relates to an adhesive tape for peeling off a protective tape attached to a pattern forming surface of a semiconductor wafer (hereinafter referred to as "wafer" as appropriate), and by peeling off the peeling tape, integrally from the wafer A protective tape peeling method for a peeling protective tape and a protective tape peeling device.

After the protective tape is attached to the surface of the wafer on which the patterning process is completed, the entire back surface is uniformly subjected to a back grinding process. The wafer with the guard tape is stripped of the protective tape from the surface before being transported to the cutting step of fine-cutting into wafers.

For the method of peeling the protective tape from the surface of the wafer, for example, the following embodiments are available. The wafer is attached to the platform with the surface to which the protective tape is attached facing upward. Adhesive tape for peeling is attached to the protective tape with an attaching roller. Thereafter, the adhesive tape is gradually peeled off by the edge member, and the protective tape attached to the adhesive tape is integrally peeled off from the surface of the wafer (refer to Japanese Laid-Open Patent Publication No. 2002-124494).

In recent years, in order to enable high-density packaging that is accompanied by rapid advancement of applications, wafers have been continuously pursued to be thinner. Further, at the same time as the thinning, the size of the wafer tends to become large. As wafers become larger, the platforms that are maintained need to be larger than the wafers.

However, there are minute irregularities on the surface side of the wafer, and adjustment of the parallelism of the holding platform accompanying the enlargement becomes difficult. When the attaching member is horizontally lowered in an inclined state in which the parallelism is not maintained, and the peeling tape is attached to the protective tape while being pressed on one side, the attached member is in contact with the peeling at one end. Off the belt. In addition, there is also a case where the peeling tape is attached slightly away from the attached position of the target.

Therefore, when one end is in contact with the peeling tape, the peeling tape may not be adhered to the protective tape, and the peeling error of the protective tape may not be integrally peeled off. In addition, the pressurization may be applied to the wafer in a balanced manner due to contact at one end, and the wafer may be damaged.

Further, if the attachment position of the release tape starts to shift, the offset width becomes large, and the release tape cannot be attached to the attached attachment position. Therefore, the peeling starting point cannot be formed and a peeling error is caused.

The present invention has been made in view of such circumstances, and its main object is to provide a protective tape peeling method capable of accurately attaching a peeling tape to a protective tape on a surface of a semiconductor wafer and accurately peeling the protective tape from the semiconductor wafer. And protective tape stripping device.

In order to achieve such an object, the present invention adopts the following configuration.

In other words, in the present invention, the release tape is attached to the protective tape attached to the surface of the semiconductor wafer by the attachment member, and the release tape is peeled off from the surface of the semiconductor wafer and the release tape by peeling off the protective tape. According to the method, the method includes a step of slanting the attaching member obliquely in a width direction of the peeling tape attachment surface, and attaching the peeling tape while being kept in a parallel state, by peeling off the peeling tape from the semiconductor wafer The surface and the release tape are integrally peeled off from the protective tape, and the peeled protective tape is taken up on the take-up shaft.

By this method, in the process of attaching the peeling tape to the protective tape, The attaching member is inclined so as to be inclined toward the width direction of the attaching surface, and the front end of the attaching surface and the attaching member can be balanced. Therefore, the peeling tape can be uniformly pressed by the attaching member while being attached to the protective tape. Therefore, since the peeling tape is in close contact with the protective tape, the protective tape is surely peeled off from the surface of the semiconductor wafer with the peeling tape. Further, since the pressing of the attaching member is uniform, it is possible to avoid breakage of the semiconductor wafer due to contact with one end.

Further, in the above method, the peeling tape may be pressure-applied to the attaching member only at a predetermined distance from the end to which the tape is attached, and after the predetermined distance, the peeling member is lifted and the pressurization is released, and the semiconductor is removed from the semiconductor. The surface of the wafer is stripped of the protective tape.

In this case, when the surface of the protective tape is irregularly inclined, it acts effectively. In other words, if the peeling tape is only brought into close contact with a part of the peeling start end side and only the peeling starting point is formed, it is not necessary to frequently shake the attaching member.

Further, in the above method, it is preferable that the meandering of the peeling tape is detected by the detector during the winding of the peeling tape, and according to the detection result, the rocking angle of the attaching member is adjusted to correct the meandering of the peeling tape.

By correcting the meandering of the peeling tape during the winding of the peeling tape, the peeling tape can be guided to the attachment start position of the peeling tape without deviating from the peeling tape attachment start position. Therefore, the peeling tape can be accurately attached to the predetermined position to surely form the peeling starting point, and the peeling error can be avoided.

Further, in order to achieve such a purpose, the present invention adopts the following configuration.

That is, the sticker is attached to the protective tape attached to the surface of the semiconductor wafer. The attachment member is attached with a release tape, and the protective tape peeling device for integrally peeling the protective tape from the surface of the semiconductor wafer and the release tape by peeling off the release tape, the device comprising the following structure: a peeling platform, which is mounted with the aforementioned a semiconductor wafer of a protective tape; a peeling tape supply mechanism for supplying a strip-shaped peeling tape to the attaching member; and a tape peeling mechanism having the above-mentioned attaching member for pressurizing and attaching the peeling tape on the surface of the protective tape The protective tape is attached to the semiconductor wafer held by the peeling platform; the rocking mechanism is configured to obliquely shake the attaching member in a width direction of the peeling tape attaching surface; and the lifting drive mechanism is attached to the attaching a position and a standby position for the attachment member to relatively lift and lower with respect to the peeling platform; a horizontal drive mechanism for moving the peeling platform and the attaching member horizontally relative to each other; and a belt recovery mechanism for winding and recovering the protective tape Integrated stripping tape.

With this configuration, since the attaching member is configured to be rockable in the direction of the bandwidth by the swing mechanism, the attaching member can be tilted in accordance with the inclination of the tape attaching surface. That is, since the tape attachment surface and the front end of the attachment member can be held in parallel, the release tape can be attached to the protective tape with uniform pressure. Therefore, the above method can be suitably carried out.

Furthermore, in the above configuration, it is preferable to provide a detector that winds the peeling tape in the belt after the peeling tape is peeled off. In the process of the recovery mechanism, the meandering of the peeling tape is detected; and the control unit adjusts the rocking angle of the attaching member pressed by the peeling tape according to the detection result, and corrects the meandering of the peeling tape.

With this configuration, during the process of taking up the peeling tape of the protective tape, the meandering of the peeling tape is detected, and the meandering is corrected. Therefore, the transport path from the tape supply mechanism to the peeling tape with the recovery mechanism is kept constant. Therefore, the peeling tape can be surely guided to the predetermined attaching position, so that the peeling tape can be surely attached without deviating from the attaching start position.

Further, in the above configuration, a locking mechanism may be provided which fixes the rocking position of the attaching member.

With this configuration, it is possible to suppress the attachment member from vibrating due to an unnecessary impact or the like so that the level of the pressure changes. Further, by fixing the rocking position in a state where the attachment member is released from the pressure, it is possible to suppress the tape from being caught by the tension when the peeling tape is wound up.

Hereinafter, an embodiment of a semiconductor wafer mounting apparatus including the protective tape peeling apparatus of the present invention will be described with reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially broken perspective view showing the entire structure of a semiconductor wafer mounting apparatus in accordance with an embodiment of the present invention.

The semiconductor wafer mounting apparatus 1 includes a wafer supply unit 2 that houses a plurality of sheets C of a semiconductor wafer W (hereinafter simply referred to as (wafer W)) subjected to back grinding processing; wafer transfer The mechanism 3 includes a robot arm 4 and a pressurizing mechanism 5; an alignment table 7 that performs alignment of the wafer W; and an ultraviolet irradiation unit 14 that is directed to the wafer placed on the alignment stage 7. W is irradiated with ultraviolet rays; a chuck table 15 which adsorbs and holds the wafer W; an annular frame supply portion 16 which accommodates the annular frame f in a plurality of layers; and an annular frame transfer mechanism 17 which moves the annular frame f to the cutting The adhesive tape DT is used for support; the tape processing portion 18 is attached with an adhesive tape DT from the back surface of the annular frame f; and the annular frame lifting mechanism 26 is a ring frame to which the adhesive tape DT is attached. f. The lifting and lowering movement; the mounting frame forming unit 27 is a mounting frame MF in which the wafer W is bonded to the annular frame f to which the adhesive tape DT is attached, and the first mounting frame transport mechanism 29 is transported. The prepared mounting frame MF; the protective tape peeling device 30 for peeling off the protective tape PT attached to the surface of the wafer W; and the second mounting frame transfer mechanism 34 for transporting the protective tape peeling device 30 to peel off the protective tape PT The mounting frame MF; the turntable 35 is for direction switching and transporting of the mounting frame MF; and the mounting frame collecting portion 36 for storing the mounting frame MF in multiple layers.

The wafer supply unit 2 is provided with a wafer stage (not shown). A sheet C of a wafer W on which a protective tape PT is attached to a pattern surface (hereinafter referred to as "surface" as appropriate) is placed on the wafer stage. At this time, the wafer W is maintained in a horizontal posture with the pattern facing upward.

The structure of the wafer transfer mechanism 3 can be rotated and moved up and down by a drive mechanism (not shown). In other words, the wafer holding portion of the robot arm 4 to be described later or the pressure plate 6 provided in the pressurizing mechanism 5 is adjusted in position. Further, the wafer transfer mechanism 3 transports the wafer W from the cassette C to the alignment stage 7.

The robot arm 4 of the wafer transfer mechanism 3 is provided with a horseshoe-shaped wafer holding portion (not shown) at its tip end. Further, the configuration of the robot arm 4 allows the wafer holding portion to advance and retreat in the gap between the wafers W accommodated in the stack C in a plurality of layers. Furthermore, an adsorption hole is provided in the wafer holding portion at the front end of the robot arm The wafer W is vacuum-adsorbed from the back side and held.

The pressurizing mechanism 5 of the wafer transfer mechanism 3 has a circular pressure plate 6 having a shape substantially the same as that of the wafer W at its tip end. This pressing plate 6 is constructed such that the arm portion can advance and retreat to move over the wafer W placed on the alignment stage 7. Further, the shape of the pressure plate 6 is not limited to a circular shape as long as the shape of the warpage generated on the wafer W can be corrected. For example, the tip end of the rod or the like may be pressed against the warped portion of the wafer W.

Further, the pressurizing mechanism 5 operates when the wafer W is placed on the holding platform of the alignment table 7 to be described later. Specifically, when the wafer W is warped and the wafer W cannot be adsorbed and held, the pressurizing plate 6 presses the surface of the wafer W to correct the warpage and to make it planar. In this state, the holding platform vacuum-adsorbs the wafer W from the back side.

The alignment stage 7 is provided with a holding stage for aligning the placed wafer W on the basis of an orientation flat or a notch provided on the periphery thereof, and covering the entire back surface of the wafer W for vacuum suction.

Further, the alignment stage 7 detects a pressure value when the wafer W is vacuum-adsorbed, and compares the measured value with a predetermined value regarding a pressure value during normal operation (when the wafer W is normally adsorbed on the holding stage). value. When the pressure value is higher than the reference value (that is, the pressure in the intake pipe is not sufficiently lowered), it is determined that the wafer W is warped and is not adsorbed on the holding platform. Then, the pressurizing plate 6 is operated to pressurize the wafer W, and the wafer W is adsorbed on the holding platform by correcting warpage.

The alignment stage 7 is configured to be disposed at an intermediate position between the chuck table 15 and the annular frame elevating mechanism 26 that are disposed above the tape processing unit 18, which is disposed at an initial position from which the wafer W is placed. crystal The movement can be carried out in the state of the circle W. That is, the alignment stage 7 is transported to the next step while correcting the warpage of the wafer W and keeping it in a planar state.

The ultraviolet irradiation unit 14 is located above the alignment stage 7 at the initial position. The ultraviolet irradiation unit 14 irradiates ultraviolet rays to the protective tape PT which is an ultraviolet curing adhesive tape attached to the surface of the wafer W. That is, by irradiating the ultraviolet ray, the adhesive layer of the protective tape PT is hardened, and the adhesive force is lowered.

The chuck platform 15 has a circular shape substantially the same shape as the wafer W so as to cover the surface of the wafer W and can be vacuum-adsorbed. The chuck table 15 is moved up and down between the standby position above the tape processing unit 18 and the position where the wafer W is bonded to the annular frame f by a drive mechanism (not shown).

In other words, the chuck table 15 is brought into contact with the wafer W which is held in a flat state by the warpage of the holding platform, and is sucked and held.

Further, the suction cup table 15 is housed in an opening portion of the annular frame elevating mechanism 26 that sucks and holds the annular frame f to which the adhesive tape (cut tape) DT for later support is attached from the back surface, and can be lowered until the wafer W is close to The position of the adhesive tape DT in the center of the annular frame f.

At this time, the suction cup platform 15 and the annular frame elevating mechanism 26 are held by a holding mechanism (not shown).

The annular frame supply unit 16 is a small trolley-shaped member provided with a pulley at the bottom, and is configured to be loaded in the apparatus body. Moreover, the annular frame f which is opened in the upper part and which accommodates the multilayer in the inside is slidably raised and sent out.

The annular frame transport mechanism 17 vacuum-adsorbs the annular frame f accommodated in the annular frame supply unit 16 one by one from the upper side, and sequentially transports the annular frame f to an alignment table (not shown) and attaches the adhesive. With DT position. this Further, when the adhesive tape DT is attached to the annular frame transport mechanism 17, it can also function as a holding mechanism for holding the annular frame f at the attachment position of the adhesive tape DT.

The tape processing unit 18 includes a tape supply unit 19 that supplies the adhesive tape DT, a tension mechanism 20 that applies tension to the adhesive tape DT, a attaching unit 21 that attaches the adhesive tape DT to the annular frame f, and a cutting attached to the ring shape. The cutter mechanism 24 of the adhesive tape DT of the frame f peels off the peeling unit 23 which is not cut by the cutter mechanism 24 from the annular frame f, and the tape collecting portion 25 which collects the unnecessary unnecessary tape after cutting.

The tension mechanism 20 sandwiches the adhesive tape DT from both ends in the width direction and applies tension in the width direction. That is, if a soft adhesive tape DT is used, longitudinal wrinkles are generated on the surface of the adhesive tape DT along the supply direction due to the tension applied to the tape supply direction. In order to avoid this longitudinal wrinkle and uniformly attach the adhesive tape DT to the annular frame f, tension is applied from the side of the width direction.

The attaching unit 21 is provided at a standby position which is held obliquely downward (left obliquely downward in FIG. 1) of the annular frame f held above the adhesive tape DT. Attachment roller 22 is provided on this attachment unit 21. The annular frame transfer mechanism 17 transports and holds the annular frame f to the attachment position of the adhesive tape DT, and starts to supply the adhesive tape DT from the tape supply portion 19, and the attachment roller 22 moves to the right in the tape supply direction. The attachment starts at the location.

The attaching roller 22 that has reached the attachment start position rises and pressurizes the adhesive tape DT to the annular frame f. Thereafter, the attaching roller 22 is rotated from the attaching start position to the standby position, and the adhesive tape DT is attached to the annular frame f while being pressed.

The peeling unit 23 peels off the unnecessary portion of the adhesive tape DT cut by the cutter mechanism 24 which will be described later from the annular frame f. Specifically, after the adhesive tape DT is attached to the annular frame f and the cutting is completed, the opening tension mechanism 20 holds the adhesive tape DT. Next, the peeling unit 23 moves to the belt supply portion 19 side on the annular frame f, and peels off the adhesive tape DT for unnecessary support after cutting.

The cutter mechanism 24 is provided below the adhesive tape DT on which the annular frame f is placed. When the adhesive tape DT is attached to the annular frame f by the attaching unit 21, the open tension mechanism 20 holds the adhesive tape DT, and the cutter mechanism 24 ascends. The ascending cutter mechanism 24 cuts the adhesive tape DT along the annular frame f.

The annular frame elevating mechanism 26 is in a standby position above the position where the adhesive tape DT is attached to the annular frame f. When the loop frame elevating mechanism 26 is attached to the annular frame f by the adhesive tape DT, the process is lowered, and the annular frame f is sucked and held. At this time, the annular frame conveying mechanism 17 holding the annular frame f returns to the initial position above the annular frame supply portion 16.

Further, when the annular frame elevating mechanism 26 sucks and holds the annular frame f, it is raised toward the bonding position with the wafer W. At this time, the chuck table 15 that adsorbs and holds the wafer W also descends to the bonding position of the wafer W.

The mounting frame producing portion 27 includes an attaching roller 28 that is elastically deformable on the circumferential surface. The attaching roller 28 is rotated while being pressed against the non-adhesion surface of the adhesive tape DT attached to the back surface of the annular frame f.

The first mounting frame transport mechanism 29 is a mounting frame MF in which the vacuum frame annular frame f and the wafer W are integrally molded, and is transferred to the peeling platform 37 of the protective tape peeling device 30.

As shown in FIGS. 1 and 2, the protective tape peeling device 30 includes a peeling platform 37 on which the wafer W is placed and moved, and a tape supply for supplying the peeling tape Ts. The portion 31, the peeling unit 32 that performs the peeling and peeling of the peeling tape Ts, and the tape collecting portion 33 that collects the peeled peeling tape Ts and the protective tape PT.

The peeling platform 37 is configured to vacuum-adsorb the mounting frame MF from the back side, and is supported by a movable table that is slidable back and forth by a pair of right and left guide rails 38 that are horizontally disposed in front and rear. Further, the movable table is driven by the screw feed 40 which is driven by the pulse motor 39 in the forward and reverse directions. Further, the guide rail 38, the movable table, the pulse motor 39, the screw shaft 40, and the like constitute the horizontal drive mechanism of the present invention.

The tape supply unit 31 guides the peeling tape Ts leading from the entire roll to the lower end portion of the peeling unit 32. Further, the tape supply unit 31 corresponds to the peeling tape supply mechanism of the present invention.

The tape collecting portion 33 winds up and collects the peeling tape Ts sent from the peeling unit 32. Further, the tape collecting portion 33 corresponds to the peeling tape collecting mechanism of the present invention.

The second mounting frame transport mechanism 34 vacuum-adsorbs the mounting frame MF sent from the protective tape peeling device 30 and transfers it to the turntable 35.

The turntable 35 is configured to be aligned with the mounting frame MF and stored in the mounting frame collecting portion 36. In other words, when the mounting frame MF is placed on the turntable 35 by the second mounting frame transport mechanism 34, the alignment is performed based on the orientation plane of the wafer W or the positioning shape of the annular frame f. Further, in order to change the storage direction of the mounting frame MF in the mounting frame collecting portion 36, the turntable 35 is rotatable. Further, when the storage direction is determined, the turntable 35 pushes out the mounting frame MF by a pusher (not shown) and stores the mounting frame MF in the mounting frame collecting portion 36.

The mounting frame recovery unit 36 is placed on a vertically movable display (not shown) on the platform. In other words, the mounting frame MF pushed out by the pusher can be stored in any layer of the mounting frame collecting portion 36 by moving up and down by the mounting platform.

The main part of the protective tape peeling device 30 is shown in Figs. 2 to 5 . A support frame 42 composed of a pair of left and right vertical frames 41 which are erected on the protective tape peeling device 30 and which is made of an aluminum tensile material is fixed. A box-shaped base 43 is coupled to the left and right central portions of the support frame 42. Further, the ball shaft that is coupled and driven by the motor 46 is lifted and lowered by the elevating table 45 that is slidably lifted and supported by the pair of left and right vertical rails 44 provided on the base 43. A peeling unit 32 is equipped on this lifting table 45.

The lifting platform 45 is configured in a hollow frame shape that penetrates vertically. The peeling unit 32 is formed in an inner lower portion of the side plate 47 provided on the left and right of the elevating table 45. A support frame 48 is fixed to both side plates 47. In the center of the support frame 48, a peeling bar 51 as an attaching member is attached to the lower end portion of the flanged engaging member 50, which is fixed to the front and rear running shafts 49. Further, a gear 52 is attached to the rear end of the rotating shaft 49.

The peeling bar 51 is shorter than the diameter of the wafer W and is formed in a tapered shape that is tapered toward the tip end. Further, as shown in FIGS. 4 and 5, the peeling lever 51 is elastically energized downward by a spring 53 which is attached to a hole formed in the bottom of the support frame 48 of the one side plate 47. In the stationary state, the peeling lever 51 is set to maintain a horizontal state.

A cylinder 54 is provided at an upper portion of the support frame 48 on the mounting side of the spring 53. The air cylinder 54 is laterally fitted to engage the advance and retracted lever to a notch formed on the flange portion of the engaging member 50.

A drive mechanism is attached to the support frame 48 opposite to the spring mounting side, and the drive mechanism is constituted by a motor 55 and a ball shaft 56 that forcibly shake the peeling lever 51. The ball shaft 56 advances and retreats toward the upper surface of the peeling bar 51. Therefore, the ball shaft 56 is configured to resist the biasing force of the spring 53 against the peeling lever 51 by the forward rotation of the motor 55, and the peeling lever 51 is pressed. Further, in the present embodiment, the rocking angle θ is set to be inclined to a maximum of 2 degrees, but the rocking angle θ can be arbitrarily set and changed. Furthermore, the shaking angle can be appropriately set and changed.

Further, an encoder 59 coupled to the rotary plate 58 is provided, and the rotary plate 58 is rotated by engagement with a gear 52 attached to the rear end of the rotary shaft 49. The encoder 59 detects the rotation angle of the rotary shaft 49 and transmits the detection result to the control unit 70.

As shown in FIG. 2, the guide roller 60 for supplying the rear side of the side plate 47 is rotatably supported by the shaft. Further, a plurality of guide rollers 61 for collecting, a nip roller 62, and a tension roller 63 are provided above the peeling unit 32.

The guide roller 61 for recovery is supported by the shaft freely. The tension roller 63 is idly provided on the support arm 64, and is equipped to be swingable via the support arm 64. Therefore, the tension roller 63 is moderately given tension by the peeling tape Ts guided to be wound.

The guide roller 61 and the tension roller 63 for recovery are configured as a wide roll having a length larger than the diameter of the wafer W, and the outer peripheral surface thereof is a difficult-to-contact surface coated with a fluororesin.

The supply guide roller 60 is configured as a roller that is longer than the width of the release tape Ts and shorter than the diameter of the wafer W.

Next, with the above embodiment device, based on the flowchart shown in FIG. Explain a round of action.

The wafer holding portion of the robot arm 4 is inserted into the gap of the sheet bundle C. The wafer W is sucked and held from below and taken out one by one. The wafer W that has been taken out is transported to the alignment stage 7.

The wafer W is placed on the holding platform by the robot arm 4 and is held by the back side. At this time, the adsorption level of the wafer W is detected by a pressure gauge (not shown), and the measured value and the reference value predetermined for the pressure value at the time of normal operation are compared.

When the adsorption abnormality is detected, the wafer W is pressed from the surface by the pressurizing plate 6, and the wafer W is adsorbed and held in a planar state in which the warpage is corrected. Further, the wafer W is aligned based on the orientation flat or the notch (step S10).

When the alignment is completed on the alignment stage 7, the surface of the wafer W is irradiated with ultraviolet rays by the ultraviolet irradiation unit 14 (step S20).

After the ultraviolet ray irradiation treatment is performed, the wafer W is transported to the mounting frame forming portion 27 together with the alignment table 7 while being held by the holding platform. That is, the alignment table 7 is moved to an intermediate position between the suction cup platform 15 and the annular frame lifting mechanism 26.

The alignment stage 7 stands by at a predetermined position, the upper suction cup platform 15 descends, and the bottom surface of the suction tray platform 15 abuts against the wafer W to start vacuum suction. The vacuum suction of the chuck table 15 is started, and the adsorption holding of the platform side is opened and held, and the wafer W is received by the chuck platform 15 while being warped and maintained in a flat state. The alignment stage 7 that has transferred the wafer W returns to the initial position.

Next, the annular frame f accommodated in the annular frame supply unit 16 in multiple layers is vacuum-adsorbed one by one from the upper side by the annular frame conveying mechanism 17. Out. The taken-out annular frame f is aligned on an alignment table (not shown), and then conveyed to the adhesive tape attachment position above the adhesive tape DT.

The annular frame f is held by the annular frame transport mechanism 17 at the attachment position of the adhesive tape DT, and the supply of the adhesive tape DT is started from the tape supply unit 19. At the same time, the attaching roller 22 is moved to the attaching start position.

When the attaching roller 22 reaches the attaching start position, the tension mechanism 20 holds both ends in the width direction of the adhesive tape DT, and applies tension in the direction of the bandwidth.

Next, the attaching roller 22 is raised, and the adhesive tape DT is pressure-attached to the end of the annular frame f. As soon as the adhesive tape DT is attached to the end of the annular frame f, the attaching roller 22 is rotated toward the standby position, that is, the belt supply portion 19. At this time, the attaching roller 22 is rotated from the non-adhesive surface pressure-sensitive adhesive tape DT, and the adhesive tape DT is gradually attached to the annular frame f. When the attaching roller 22 reaches the terminal of the attaching position, the opening tension mechanism 20 holds the adhesive tape DT.

At the same time, the cutter mechanism 24 ascends, and the adhesive tape DT is cut into a circular shape along the annular frame f. When the cutting of the adhesive tape DT is completed, the peeling unit 23 moves to the tape supply portion 19 side, and the unnecessary adhesive tape DT is peeled off.

Next, the tape supply unit 19 operates to release the adhesive tape DT, and the band of the unnecessary portion that has been cut is sent to the tape collecting unit 25. At this time, the attaching roller 22 is moved to the attaching start position to attach the adhesive tape DT to the next annular frame f.

The annular frame f to which the adhesive tape DT is attached is moved upward by the annular frame elevating mechanism 26 sucking and holding the frame portion. At this time, the suction cup platform 15 also descends. That is, the chuck table 15 and the annular frame elevating mechanism 26 move to each other to the position where the wafer W is bonded.

Each of the mechanisms 15, 26 reaches a predetermined position and is respectively held by a not shown Institutional maintenance. Then, the attaching roller 28 is moved to the attachment start position of the adhesive tape DT, and is pressed against the non-adhesion surface of the adhesive tape DT attached to the bottom surface of the annular frame f, and the adhesive tape DT is gradually attached to the wafer W. . As a result, the mounting frame MF in which the annular frame f and the wafer W are integrated is produced (step S30).

Next, the protective tape peeling process using the protective tape peeling device 30 is specifically described based on the flowchart shown in FIG. 7 and FIGS. 8 to 10 (step S40).

As shown in FIG. 8, the peeling platform 37 holding the mounting frame MF is moved from the standby position to the attachment start position of the peeling tape Ts. Next, the rocking lock of the peeling lever 51 by the air cylinder 54 is released (step S41). In the state in which the unlocking is maintained, as shown in FIG. 9, the peeling lever 51 is lowered toward the attachment start end of the wafer W. At this time, the peeling tape Ts wound around the peeling bar 51 is pressed against the protective tape PT attached to the wafer W (step S42).

As shown in FIG. 10, the peeling platform 37 is only moved forward by a predetermined distance. At this time, the peeling lever 51 is kept in a swingable state. Therefore, the slanting angle of the peeling bar 51 is inclined in the direction of the width direction of the protective tape PT, and the peeling tape Ts is uniformly pressurized while the surface of the protective tape PT is kept parallel to the front end of the peeling bar 51. The peeling tape Ts is attached to the protective tape PT until the end of the peeling. At the same time, the protective tape PT is gradually peeled off from the surface of the wafer W while the peeling bar 51 is folded back by the peeling bar 51 (step S43).

The peeling tape Ts integrated with the protective tape PT is gradually taken up by the take-up shaft of the tape collecting portion 33 at the same speed as the peeling speed of the peeling platform 37 (step S44).

The protective tape PT is completely peeled off from the surface of the wafer W, and the peeling unit 32 Go back to the initial state and prepare for the next process.

The mounting frame MF in which the peeling process of the protective tape PT is completed is moved to the standby position of the second mounting frame transfer mechanism 34 by the peeling platform 37.

The mounting frame MF sent from the protective tape peeling device 30 is transferred to the turntable 35 by the second mounting frame transfer mechanism 34. The loaded mounting frame MF adjusts the storage direction while aligning the orientation plane or the notch. Once the alignment and the storage direction are determined, the mounting frame MF is pushed out by the pusher and stored in the mounting frame collecting portion 36 (step S50).

As described above, after one round of the operation of the apparatus of the embodiment is completed, the same operation is repeated until the predetermined number of sheets is reached (step S60).

According to the apparatus of the above-described embodiment, in the peeling process of the protective tape PT, the tilting angle of the peeling bar 51 is made to follow the inclination in the surface width direction of the protective tape PT, and the surface of the protective tape PT and the front end of the peeling bar 51 are held in parallel. . That is, it can be attached to the protective tape PT while uniformly applying the peeling tape Ts. Therefore, since the peeling tape Ts can be adhered to the protective tape PT, peeling errors of poor adhesion can be avoided. Further, it is also possible to prevent the wafer W from being damaged by the contact of one end of the peeling bar 51.

Furthermore, the present invention can also be carried out in the following forms.

(1) In the above embodiment, the peeling tape Ts is continuously pressed by the peeling bar 51 from the attachment start end to the end end of the peeling tape Ts, but it may be carried out as follows. The peeling tape Ts is pressure-applied to the protective tape PT and peeled off only by a predetermined distance attached to the start end side, and only the peeling starting point is formed. Thereafter, the pressurization of the peeling tape Ts can also be released. The peeling process of the specific protective tape PT will be described based on the flowchart shown in FIG. 11 and FIGS. 12 to 14.

First, as in the above embodiment, the peeling of the mounting frame MF is maintained. The platform 37 is moved to the attachment start position of the peeling tape Ts. The release cylinder 54 locks the peeling lever 51 (step S401). When the unlocking state is maintained, the peeling lever 51 is lowered to the end of the wafer W to a predetermined height. At this time, the peeling tape Ts wound around the peeling bar 51 is press-bonded to the protective tape PT on the wafer W (step S402).

As shown in Fig. 12, the peeling platform 37 moves only forward by a predetermined distance. Since the peeling lever 51 is kept in a swingable state, the swinging angle of the peeling lever 51 is inclined to the direction of the width direction of the protective tape PT, and the peeling of the surface of the protective tape PT and the front end of the peeling bar 51 are kept parallel. A pressure side with a uniform Ts is attached to the protective tape PT. At the same time, the protective tape PT is gradually peeled off from the surface of the wafer W while the peeling bar 51 is folded back by the peeling tape 51 (step S403).

The peeling tape Ts integrated with the protective tape PT is taken up by the take-up shaft of the tape collecting portion 33 at the moving speed of the same step as the peeling platform 37.

In this peeling process, the rotation angle of the motor 39 is detected by a detector such as an encoder, and the detection result is transmitted to the control unit 70. The control unit 70 monitors whether or not the peeling platform 37 has reached the predetermined distance by comparing the measured value of the detection result with the predetermined value (step S404).

The peeling platform 37 moves only a predetermined distance to form a peeling starting point, and as shown in FIG. 13, the peeling lever 51 is raised to a predetermined height (step S405). When the peeling bar 51 reaches a predetermined height, the cylinder 54 is operated to engage the rod with the notch of the frame 50, and the peeling bar 51 is locked in a horizontal state (step S406). In this state, the peeling stage 37 is again started to move, and as shown in FIG. 14, the protective tape PT is gradually peeled off from the surface of the wafer W (step S407).

The control unit 70 monitors whether the peeling platform 37 has reached the peeling end ( Step S408). When the peeling platform 37 reaches the peeling end, and the end of the protective tape PT is peeled off, the cylinder 54 is released from the peeling bar 51 (step S409). When the peeling bar 51 is unlocked, the peeled protective tape PT and the peeling tape Ts are taken together in the winding shaft of the tape collecting portion 33 (step S410). After the winding process is completed, the processing of one round is completed, and the same processing is repeated later.

According to this embodiment, the surface undulation of the protective tape PT is irregularly inclined, and when the rocking angle of the peeling bar 51 must be frequently changed, the number of adjustments of the shaking angle can be reduced.

(2) In the above two embodiments, the peeling peeling tape Ts integrated with the protective tape PT is taken up in the winding shaft, and may be controlled to detect the meandering of the peeling tape Ts and correct the meandering.

For example, as shown in FIGS. 15 and 17, a pair of detectors 65 are interposed between the supply guide rollers 60 along the upstream conveyance path of the peeling tape Ts. The detector 65 is composed of a light projector 66 and a light receiver 67, and a predetermined gap x is provided from both end sides of the peeling tape Ts. In other words, the light receiving unit 67 detects whether or not the peeling tape Ts has light from the light projector 66, and transmits the detection result to the control unit 70.

The control unit 70 determines whether or not the peeling tape Ts is meandering based on the intensity change of the detection signal from the light receiver 67. Hereinafter, a round process of correcting the peeling tape Ts during the winding up of the peeling tape Ts will be described based on the flowchart shown in FIG. 16 and FIGS. 18 to 19.

When the protective tape PT is peeled off from the surface of the wafer W, the peeling tape Ts with the protective tape PT is wound up to the take-up shaft of the tape collecting portion 33 (step S441). At this time, the same step as the take-up speed is released from the tape supply unit 31. A strip of tape Ts of a fixed length. The conveyance state of the peeling tape Ts discharged from the tape supply unit 31 is continuously monitored by the detector 65 (step S442).

When the light receiving level of one of the light receivers 67 is lowered or the signal is turned off, the control unit 70 determines that the peeling tape Ts is meandering (step S443). Here, the motor 55 is operated to forcibly change the rocking angle of the peeling bar 51. For example, as shown in FIG. 18, when the peeling tape Ts is inclined from the specification position (center) indicated by a chain double-dashed line to the spring of the support frame 48 shown by the solid line, as shown in FIG. In the forward rotation, the peeling lever 51 on the side opposite to the side on which the spring is disposed is pressed by the ball shaft 56. By this pressing, the snake's peeling tape Ts is returned to the center of the transport path.

Conversely, as shown in Fig. 20, the peeling tape Ts is tilted by the motor 55, and the motor 55 is reversed to raise the ball shaft 56. As shown in Fig. 21, the opposite side of the spring setting side becomes a rockable free end (step S444). Therefore, the peeling tape Ts on one of the free end sides is introduced above the spring energizing side, and the peeling tape Ts on the other spring energizing side is in a depressed state, so that the meandering peeling tape Ts is returned to the center of the transport path. Come.

Further, the rotation angle of the rotating shaft 49 when the peeling lever 51 is forcibly shaken by the forward rotation of the motor 55 is detected by the encoder 59 and transmitted to the control unit 70. Therefore, while the conveyance state of the peeling tape Ts is monitored by the detector 65, the signal level transmitted to the detector 65 is released and returned to a predetermined level (step S445), and the control unit 70 rotates the motor 55 to The rotational speed associated with the rotation angle detected by the encoder 59 cancels the forced pressing operation of the peeling lever 51. By releasing the operation of the peeling lever 51, the peeling lever 51 is returned to the horizontal position, and the rocking end is made free (step S446).

Thereafter, the process from step S442 is repeated until the peeling tape Ts with the protective tape PT is completely taken up to the take-up axis (step S447).

With this configuration, in the process of rolling up the peeling tape Ts with the protective tape PT, the meandering of the peeling tape Ts supplied from the upstream side to the tape attaching position is corrected. Therefore, the peeling tape Ts can be surely guided to a predetermined attaching position, so that the peeling tape Ts can be surely attached to the predetermined position without deviating from the attaching start position.

Further, in this modification, the ball shaft 56 may be coupled to the upper portion of the peeling bar 51, and the press-fitting and introduction of the peeling bar 51 may be controlled by the forward and reverse rotation of the motor 55.

(3) The present invention is also applicable to a case where the peeling tape Ts is attached to the wafer W with the protective tape not held by the annular frame f, and the protective tape PT is peeled off.

(4) In the above embodiment, the peeling unit 32 may be horizontally moved by fixing the position of the mounting frame MF.

(5) In the above embodiment, the peeling tape Ts is attached to the protective tape PT by controlling the lowering of the peeling bar 51, but the peeling platform 37 may be lifted and lowered by the peeling bar 51 that does not move up and down. Implementation.

The present invention may be embodied in other specific forms without departing from the spirit and scope of the invention.

It is to be understood that while the invention has been described in terms of the embodiments, the invention is not to

1‧‧‧Semiconductor wafer mounting device

2‧‧‧ Wafer Supply Department

3‧‧‧ wafer transfer mechanism

4‧‧‧ Robotic arm

5‧‧‧ Pressurizing mechanism

6‧‧‧ Pressurized plate

7‧‧‧Alignment table

14‧‧‧UV irradiation unit

15‧‧‧Sucker platform

16‧‧‧Ring Frame Supply Department

17‧‧‧Circular frame transport mechanism

18‧‧‧With processing department

19‧‧With supply department

20‧‧‧ Tension mechanism

21‧‧‧ Attachment unit

22‧‧‧ Attachment roller

23‧‧‧ peeling unit

24‧‧‧Tools

25‧‧With recycling department

26‧‧‧Ring frame lifting mechanism

27‧‧‧Installation Frame Production Department

28‧‧‧ Attachment roller

29‧‧‧1st mounting frame transport mechanism

30‧‧‧Protective stripping device

31‧‧‧With Supply Department

32‧‧‧ peeling unit

33‧‧With recycling department

34‧‧‧2nd mounting frame transport mechanism

35‧‧‧ turntable

36‧‧‧Installation Frame Recycling Department

37‧‧‧ peeling platform

38‧‧‧rails

39‧‧‧pulse motor

40‧‧‧Spiral axis

41‧‧‧ vertical frame

42‧‧‧Support framework

43‧‧‧Abutment

44‧‧‧ vertical rail

45‧‧‧ Lifting table

46‧‧‧Motor

47‧‧‧ side panels

48‧‧‧Support framework

49‧‧‧Rotary axis

50‧‧‧Joining members

51‧‧‧ peeling rod

52‧‧‧ Gears

53‧‧‧ Spring

54‧‧‧ cylinder

55‧‧‧Motor

56‧‧‧Ball shaft

58‧‧‧Rotating plate

59‧‧‧Encoder

60‧‧‧Guide roller for supply

61‧‧‧ Guide roller for recycling

62‧‧‧Clamping roller

63‧‧‧ Tension roller

64‧‧‧Support arm

65‧‧‧Detector

66‧‧‧Light projector

67‧‧‧Receiver

70‧‧‧Control Department

f‧‧‧Ring frame

C‧‧‧ piece

DT‧‧‧ adhesive tape

MF‧‧‧ installation framework

PT‧‧‧protective tape

Ts‧‧‧ peeling tape

W‧‧‧ wafer

Fig. 1 is a perspective view showing the entire semiconductor wafer mounting apparatus.

Figure 2 is a front elevational view of the protective tape peeling device.

Figure 3 is a plan view of the protective tape peeling device.

Figure 4 is a right side view of the protective tape peeling device.

Figure 5 is a left side view of the protective tape peeling device.

Fig. 6 is a flow chart showing the manufacturing operation of the mounting frame.

Fig. 7 is a flow chart showing the protective tape peeling process.

8 to 10 are views showing a peeling action of the protective tape.

Fig. 11 is a flow chart showing a protective tape peeling process of a modification.

12 to 14 are views showing the peeling action of the protective tape.

Fig. 15 is a front elevational view showing a protective tape peeling device according to a modification.

Fig. 16 is a flow chart showing the protective tape peeling process of the modification.

Fig. 17 is a left side view of the protective tape peeling device according to a modification.

18 to 19 are views showing the peeling belt meandering control of the modification.

20 to 21 are views showing the peeling belt meandering control of the modification.

48‧‧‧Support framework

49‧‧‧Rotary axis

50‧‧‧Joining members

51‧‧‧ peeling rod

53‧‧‧ Spring

54‧‧‧ cylinder

55‧‧‧Motor

58‧‧‧Rotating plate

59‧‧‧Encoder

Claims (6)

A protective tape peeling method is characterized in that a peeling tape is attached to a protective tape attached to a surface of a semiconductor wafer by an attaching member, and the protective tape is integrally peeled off from a surface of the semiconductor wafer and a peeling tape by peeling off the peeling tape. In the tape stripping method, the method includes a step of attaching the peeling tape while slanting the width direction of the peeling tape attachment surface and causing the attaching member to move in a parallel state, and peeling off the peeling tape. The surface of the semiconductor wafer and the release tape are integrally peeled off from the protective tape, and the peeled protective tape is taken up on the take-up reel. The protective tape peeling method according to claim 1, wherein the peeling tape is attached to the peeling tape by a predetermined distance from the tape attaching start end, and the peeling tape is lifted by the predetermined distance. Next, the protective tape is peeled off from the surface of the semiconductor wafer. The protective tape peeling method according to claim 1 or 2, wherein in the process of winding the peeling tape, a serpent of the peeling tape is detected by a detector, and according to the detection result, the rocking angle of the attaching member is adjusted to correct Stripping the snake line. A protective tape peeling device which attaches a peeling tape to a protective tape attached to a surface of a semiconductor wafer by an attaching member, and peels off the protective tape from the surface of the semiconductor wafer and the peeling tape by peeling off the peeling tape a stripping device, the device comprising: a stripping platform for holding a semiconductor wafer with the aforementioned protective tape; a peeling tape supply mechanism that supplies a strip-shaped peeling tape to the attaching member; a tape peeling mechanism that has the above-mentioned attaching member that pressurizes the peeling tape on the surface of the protective tape, and the protective tape is attached a semiconductor wafer held on the peeling platform; a rocking mechanism that is tilted in a width direction of the peeling tape attachment surface to shake the attaching member; and a lifting drive mechanism that extends over the attached position and the standby position The affixing member is relatively raised and lowered with respect to the peeling platform; the horizontal driving mechanism is configured to move the peeling platform and the attaching member horizontally relative to each other; and the belt collecting mechanism is a stripping belt which is taken up and recovered and integrated with the protective tape . The protective tape peeling device according to claim 4, further comprising: a detector for detecting a meandering of the peeling tape during the process of peeling the peeling tape on the tape collecting mechanism after the peeling tape is peeled off; The control unit adjusts the rocking angle of the attaching member that has been lifted by the peeling belt in accordance with the detection result, and corrects the meandering of the peeling tape. A protective tape peeling device according to claim 4 or 5, further comprising a locking mechanism for fixing a rocking position of the attaching member.