TWI543278B - Method and mechanism for supplying resin material of compression molding apparatus, compression molding method and compression molding apparatus - Google Patents

Description

Resin material supply method and supply mechanism of compression molding device, compression molding method and compression molding device

The present invention relates to a method of resin-sealing an electronic component such as a semiconductor wafer, and more particularly to a resin material such as a pellet, a powder, a paste, a liquid or the like for compression molding (hereinafter, simply referred to as a resin material) A method and apparatus for supplying a "resin material" to a cavity of a mold.

With the thinning of electronic parts, compression molding has gradually begun to be used. In the compression molding, the resin material is supplied to the cavity of the lower mold covered by the release film, and the resin material is heated and melted, and the substrate mounted on the upper mold and mounted with the electronic component is immersed in the resin material, and then The lower mold and the upper mold are clamped to compress the resin to perform forming. In such compression molding, in order to integrally form a large-sized substrate without defects, it is important to uniformly and precisely supply a specific amount of resin material to the cavity.

Patent Document 1 describes a method of supplying a granular resin R to a cavity at a uniform thickness as described below (see FIG. 1). First, the release film 12 is coated under the rectangular frame 11 having an opening having a shape corresponding to the opening of the cavity 18a of the lower mold 18 The portion is opened, and the release film 12 is attracted to the lower surface of the rectangular frame 11 to form a concave receiving portion 13 (a). The concave accommodating portion 13 is placed on the mounting table 14, and the granular resin R(b) is supplied from the hopper 15 so as to have a uniform thickness on the release film 12. Thereafter, a portion of the release film 12 surrounded by the rectangular frame 11 is brought right above the cavity 18a, and the concave receiving portion 13 containing the particulate resin R is placed on the mold surface of the lower mold 18 (c After the release of the release film 12 on the lower surface of the rectangular frame 11, the release film 12 is attracted together with the particulate resin R located thereon and introduced into the cavity 18a (d). Thereby, the uniform thickness of the particulate resin R is supplied into the cavity 18a. Thereafter, the molten particulate resin R(e) is heated, and the molten resin Rm is contained in the cavity 18a, and the lower mold 18 and the substrate 21 on which the electronic component 20 is mounted are mounted with the mounting surface facing downward. The upper mold 19 is mold-locked, whereby the electronic component 20 is immersed in the molten resin Rm, and the molten resin Rm(f) is pressed by the cavity bottom surface member 18b for resin pressurization. The resin-sealed molded article (g) of the electronic component 20 is obtained by opening the upper mold 19 and the lower mold 18 after the molten resin Rm is cured.

As a method of supplying the particulate resin R so as to have a uniform thickness on the release film 12, a method of supplying pellets from the linear feeder 15 at a fixed supply speed as shown in Fig. 2(a) can be employed. The resin R is moved at a constant speed with respect to the resin supply port 15a of the linear feeder 15 while covering the entire surface of the concave accommodating portion 13 so that the trajectories do not intersect, thereby supplying the thickness in a uniform thickness. Granular resin R. Hereinafter, such a moving method is referred to as a one-line path moving method.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-036542

As the size of the substrate increases, the cavity and the frame (concave housing portion) also increase in size, and the above method has the following problems. As described above, when the granular resin is supplied by the linear feeder, the linear feeder is vibrated in order to make the supply speed a fixed speed. In order to surely vibrate the linear feeder at a specific vibration speed (frequency) in this manner, it is necessary to support the accommodating portion 17 with a high rigidity as shown in FIG. 2(b), and the accommodating portion 17 is accommodated. There is a particulate resin R to be supplied to the linear feeder 15. Therefore, the concave accommodating portion 13 cannot be drilled under the accommodating portion 17, and when the feeding is performed by the one-way path moving method as described above, the length of the linear feeder 15 must be set to be larger than the concave accommodating portion 13 in advance. Size (maximum diameter).

On the other hand, the linear feeder can be excited efficiently by vibrating the linear feeder near its resonance frequency, but if the linear feeder becomes longer, the resonance frequency is closer to the mounting portion of the linear feeder. Unlike the front end portion, it becomes impossible to quantitatively supply the particulate resin.

Further, as the concave accommodating portion is enlarged, in the above-described conventional method, if it is desired to supply the granular resin to the entire surface of the concave accommodating portion by the one-way path moving method, the linear feeder must be extended, and thus, the linear feeder is extended. The particulate resin cannot be supplied to the concave accommodating portion in a state where it is accurately metered and flattened, and it is difficult to stably supply the granular resin to the concave accommodating portion.

An object of the present invention is to provide a resin material supply method and a supply mechanism capable of uniformly supplying a resin material into a cavity in a cavity without reducing productivity.

In order to solve the above problems, the resin material supply method of the compression molding apparatus of the present invention is to supply a resin material in a uniform thickness to a cavity under the compression molding die composed of an upper mold and a lower mold, and to resin materials. Supply to the concave receiving portion, the concave receiving portion is a frame having an opening having a shape corresponding to the opening of the lower mold, and a lower portion of the frame The resin material supply method of the compression molding apparatus is characterized in that: a) a disposing step of dividing the concave accommodating portion into a plurality of planar regions, wherein one of the divided regions is located The concave storage portion is disposed to be disposed below the resin supply port of the linear feeder of the fixed position, and b) a resin supply step of supplying the resin material from the resin supply port of the linear feeder to the concave shape The accommodating portion is moved relative to the resin supply port of the linear feeder, whereby the resin material is supplied to the divided region in a uniform thickness; and c) the region moving step is another divided region other than the divided region The concave storage portion is moved so as to be located below the resin supply port.

In the resin material supply method of the compression molding apparatus of the present invention, first, the concave accommodating portion is disposed in such a manner that one of the divided regions of the concave accommodating portion divided into a plurality of planar regions is located in the linear feeder Below the resin supply port. Then, by moving the concave accommodating portion with respect to the resin supply port of the linear feeder, a resin material such as a pellet, a powder, a paste, or a liquid is supplied to the divided region in a uniform thickness. As a method of making the thickness of the resin material uniform in the divided region, a method may be employed in which the resin supply port of the linear feeder is relatively moved in the divided region by the single-row path moving method (actually, the linear feeder side) The resin material is supplied from the resin supply port of the linear feeder at a fixed supply rate while being fixed and the divided area = the concave accommodating portion. Further, the resin supply speed from the resin supply port of the linear feeder can be made uniform in conjunction with the moving speed of the one-way path moving method.

After forming a resin material layer having a uniform thickness in the divided region, the concave accommodating portion is moved, and the concave accommodating portion is disposed such that the other divided region is located below the resin supply port of the linear feeder. Thereafter, a resin material layer having a uniform thickness is formed in a divided region disposed under the resin supply port of the linear feeder by the resin supply step similar to the above. borrow Since the moving step and the resin supply step are performed in all of the divided regions, the resin material is supplied to the entire concave receiving portion in a uniform thickness.

According to the resin material supply method of the compression molding apparatus of the present invention, the maximum distance of the relative movement distance between the resin supply port of the linear feeder and the concave housing portion when the resin material is supplied from the linear feeder is not the size of the entire concave housing portion, and The concave receiving portion is divided into a plurality of planar regions and the size of one of the divided regions, so that the linear feeder is not required to be extended. Therefore, the supply speed of the resin material is not lowered, and the productivity is not lowered.

In the resin material supply method, preferably, in the region moving step, the concave accommodating portion is rotationally moved about a center of gravity thereof.

According to this configuration, the movement space of the entire concave accommodating portion required for all the divided regions to be located below the resin supply port can be minimized.

Further, it is preferable that all of the plurality of planar regions have the same shape.

According to this configuration, the single-row path moving method can be performed in the same trajectory in each divided region. Therefore, the operation can be simplified, and the resin material can be efficiently supplied.

In order to solve the above problems, the resin material supply mechanism for a compression molding apparatus of the present invention is a resin material which is supplied to a mold cavity under a compression molding die composed of an upper mold and a lower mold in a uniform thickness. Provided to the concave accommodating portion formed by a frame having an opening having a shape corresponding to an opening of the lower cavity and a release film covering an opening at a lower portion of the frame, and the compression forming device The resin material supply mechanism is characterized in that: a) a resin supply means for supplying a resin material from a resin supply port of a linear feeder provided at a fixed position; and b) a moving means for moving the concave accommodation portion; c) a region movement control means for controlling the moving means by dividing the concave accommodating portion into a plurality of planar regions, wherein each of the divided regions is located below the resin supply port; and d) a resin supply control means In order to supply the resin material in a uniform thickness in each of the plurality of divided regions, the moving means is controlled by supplying the resin material from the resin supply port of the linear feeder to the divided region by the resin supply means. The concave accommodating portion is moved relative to the resin supply port of the linear feeder.

In the resin material supply mechanism for a compression molding apparatus of the present invention, first, one of the divided regions of the concave accommodating portion divided into a plurality of planar regions is located below the resin supply port of the linear feeder by the region movement control means. , configured with a concave receiving portion. Then, the resin material is supplied to the divided region in a uniform manner in the divided region by the resin supply control means. After the resin material layer having a uniform thickness is formed in the divided region, the concave accommodating portion is moved by the region movement control means so that the other divided region is positioned below the resin supply port of the linear feeder to arrange the concave accommodating portion. In the divided region disposed under the resin supply port of the linear feeder, a resin material layer having a uniform thickness is formed by a resin supply control means in the same manner as described above. A uniform thickness of the resin material is supplied to the entire concave receiving portion by performing such region movement and resin supply in all of the divided regions.

According to the resin material supply mechanism for a compression molding apparatus of the present invention, when the resin is supplied from the linear feeder, the maximum distance of the relative movement distance between the resin supply port and the concave housing portion of the linear feeder is not the size of the entire concave housing portion. The concave accommodating portion is divided into a plurality of planar regions and the size of one of the divided regions, so that it is not necessary to extend the linear feeder. Therefore, the supply speed of the resin material is not lowered, and the productivity is not lowered.

Preferably, the area movement control means controls the movement means such that the concave accommodation portion is rotationally moved about the center of gravity thereof.

Further, it is preferable that all of the plurality of divided regions have the same shape.

According to the resin material supply method and the supply mechanism of the compression molding apparatus of the present invention, the resin material can be uniformly supplied into the cavity without lowering the productivity.

30‧‧‧Resin material supply mechanism for compression molding device

31‧‧‧Frame

32‧‧‧ release film

33‧‧‧ concave housing

33A, 33B‧‧‧ Division

34‧‧‧mounting table

35‧‧‧Line Feeder

35a‧‧‧Resin supply port

35b‧‧‧ Keeping Department

36‧‧‧Base

37‧‧‧ hopper

38‧‧‧Baffle

39‧‧‧Vibration mechanism

40‧‧‧ load weight

41‧‧‧Mobile agencies

41a‧‧‧Parallel movement

41b‧‧‧Rotating and moving department

50‧‧‧Control Department

52‧‧‧Resin Supply Control Department

53‧‧‧Regional Mobile Control Department

55‧‧‧ Input Department

60‧‧‧Compression forming device

61‧‧‧Forming unit

62‧‧‧Compression molding die

63‧‧‧Down mold cavity

71‧‧‧Substrate unit

72‧‧‧Substrate loader

73‧‧‧Forming substrate housing

74‧‧‧Formed substrate housing

75‧‧‧ Robot arm mechanism

76a‧‧‧Forming substrate

76b‧‧‧Formed substrate

80‧‧‧Resin supply unit

81‧‧‧Resin loader

82‧‧‧Reprocessing agency

83, 83a‧‧‧ release film

84‧‧‧ fixture

85‧‧‧mounting table

86‧‧‧membrane cutting mechanism

87‧‧‧Line Feeder

88‧‧‧Frame

89‧‧‧ Track

90‧‧‧Control Department

R, Rm‧‧‧ granular resin

Fig. 1 is a schematic view showing the sequence of the previous compression forming.

Fig. 2 is a schematic view showing a one-line path moving method.

Fig. 3 is a plan view (a) and a side view (b) of a resin material supply mechanism for a compression molding apparatus according to an embodiment of the present invention.

Fig. 4 is a functional block diagram of the resin material supply mechanism of this embodiment.

Fig. 5 is a flow chart showing a method of supplying a resin material of the resin material supply mechanism of the embodiment.

FIG. 6 is a view showing a positional relationship between the concave accommodating portion and the resin supply port and a moving direction of the concave accommodating portion in the resin material supply method of the resin material supply portion of the embodiment.

Fig. 7 is a view showing another example of dividing the concave accommodating portion.

Fig. 8 is a schematic configuration diagram of a compression molding apparatus having the resin material supply mechanism of the embodiment.

(Resin material supply mechanism)

An embodiment of a resin material supply mechanism for a compression molding apparatus according to the present invention will be described with reference to Figs. 3 and 4 . The resin material supply mechanism 30 (hereinafter, simply referred to as "resin supply mechanism") for the compression molding apparatus is provided with a device for supplying a resin material to a mold cavity under a compression molding model including an upper mold and a lower mold. a resin supply unit including a linear feeder 35 provided on a susceptor 36 disposed at a fixed position, and a top portion disposed on the upper portion of the holding portion 35b a hopper 37 accommodating the granular resin R; a concave accommodating portion 33 formed by the frame 31 and the release film 32 so as to correspond to the shape of the lower mold cavity; and a mounting table 34 for mounting the concave portion Shaped storage portion 33. The hopper 37 is provided with a hopper vibration mechanism 37a for stably supplying the particulate resin R accommodated in the hopper 37 to the holding portion 35b of the linear feeder 35, and a baffle 37b for controlling the holding The portion 35b supplies/stops the particulate resin R. Below the holding portion 35b of the linear feeder 35, a load cell 40 for measuring the weight of the holding portion 35b (i.e., the weight of the particulate resin R in the holding portion 35b) is provided. The linear feeder 35 is provided with a vibrating mechanism 39 for supplying the granular resin R at a fixed supply speed (supply amount per unit time) from the resin supply port 35a of the linear feeder 35. The linear feeder 35 vibrates. A baffle 38 for controlling supply/stop of the resin material from the linear feeder 35 to the concave accommodating portion 33 is provided in front of the resin supply port 35a. A moving mechanism 41 for moving the mounting table 34 is provided on the mounting table 34. In the present embodiment, the moving mechanism 41 is constituted by a parallel moving portion 41a that rotates the mounting table 34 in two directions parallel to the surface thereof (the surface is set to the XY plane). Moving, the rotational moving portion 41b rotates the mounting table 34 about its center of gravity (center).

The resin supply mechanism 30 further includes a control unit 50. The control unit 50 includes a resin supply control unit 52 that controls the vibration mechanism 39, a shutter 38, and a movement mechanism 41. The area movement control unit 53 controls the movement mechanism 41. The functions of these control units will be described below. Further, an input unit 55 is connected to the control unit 50.

The operation of each mechanism when the granular resin R is supplied to the concave accommodating portion 33 by the resin supply mechanism 30 will be described with reference to FIGS. 4 to 6 . First, the operator selects and inputs the shape and size of the frame 31 corresponding to the cavity of the mold to be formed later from the predetermined candidate by the input unit 55 (for example, a rectangle of 180 mm × 200 mm, a square of 200 mm × 200 mm) , a diameter of 200mm, etc.) and to be supplied to the concave housing The input amount W of the particulate resin R of 33 or the like (step S11). The concave accommodating portion 33 corresponding to each of the frames 31 having the respective shapes and sizes of the candidates is divided into a specific number of planar regions (divided regions) in advance, and when the operator selects the frame 31, the divided regions are automatically Determined.

The control unit 50 determines the operating conditions of the respective mechanisms as described below based on the setting of the worker (step S12). First, the starting point, the trajectory, and the end point predetermined for each divided area are read from a specific database. Then, based on the input amount W input, the supply amount per unit time of the resin supplied from the resin supply port 35a of the linear feeder 35, and the length of the trajectory of the single-row path in each divided area, the calculation is performed in each divided area. The moving speed of the one-way path moving method (that is, the moving speed of the concave accommodating portion 33 in the XY direction). Then, the operator is instructed to place the concave accommodating portion 33 at a specific position of the mounting table 34. The worker places the concave frame accommodating portion 33 formed by the selected frame 31 and the release film 32 adsorbed and held on the lower surface thereof at the above-described specific position on the mounting table 34 (step S13).

When the operator places the concave accommodating portion 33 at a specific position and presses the start button of the input unit 55, the area movement control unit 53 moves the placing table 34 by the parallel moving portion 41a and the rotational moving portion 41b of the moving mechanism 41. The starting point of the predetermined first divided area is brought directly under the resin supply port 35a (step S14).

In the present embodiment, as shown in FIG. 6(a), a square concave accommodating portion 33 is selected, and the concave accommodating portion 33 is divided into two rectangular divided regions 33A, 33B having the same shape. Further, the divided area 33A is set as the first divided area, and the tracks in each of the divided areas 33A and 33B are the Y direction (1) → the X direction (2) → the Y direction (3) → the X direction (4) → the Y direction ( 5) → X direction (6) → Y direction (7). The trajectory is set to cover the entire surface of the divided area and does not intersect the line drawn. Further, the specific position of the mounting table 34 is determined such that the plane position of the center of gravity of the concave accommodating portion 33 coincides with the rotation center of the motor (rotation moving portion 41b) included in the moving mechanism 41.

The resin supply control unit 52 controls the respective mechanisms as described below, and supplies the particulate resin R to the first divided region 33A. First, the linear feeder 35 is vibrated by the vibration mechanism 39, and the shutter 38 is opened to drop the particulate resin R from the linear feeder 35 to the concave housing portion 33. Then, the mounting table 34 is moved in the X-Y direction by the parallel moving portion 41a of the moving mechanism 41 so that the resin supply port 35a moves along the predetermined trajectory with respect to the divided region 33A. At this time, the parallel moving portion 41a moves the mounting table 34 at the moving speed calculated as described above (step S15, FIG. 6(b)).

Since the linear feeder 35 vibrates at a specific vibration speed (frequency), the granular resin R is supplied from the resin supply port 35a of the linear feeder 35 to a specific supply amount per unit time, during which the stage 34 is placed. The concave accommodating portion 33 (divided region 33A) also moves at a fixed moving speed. As a result, the particulate resin R in an amount of 1/2 of the input amount W is deposited on the divided region 33A in a layer having a specific uniform thickness.

When the trajectory comes to the end point, the entire surface of the divided area 33A is covered by the granular resin R (Fig. 6(c)), the shutter 38 is closed to stop the supply of the granular resin R from the linear feeder 35, and the moving mechanism 41 is caused The parallel moving portion 41a is stopped.

Thereafter, the control unit 50 determines whether or not all of the divided regions have been placed below the resin supply port 35a (step S16), and in the case of NO, the region movement control unit 53 operates the rotationally moving portion 41b of the moving mechanism 41. The mounting table 14 is moved so that the other divided area is disposed below the resin supply port 15a (step S17, FIG. 6(d)). In the present embodiment, the divided region 33B has not been disposed below the resin supply port 15a (NO in step S16). Therefore, the region movement control unit 53 causes the rotational movement portion 41b to rotate the mounting table 14 by 180°. action. As a result, the divided region 33B is disposed below the resin supply port 35a (FIG. 6(e)). Then, the process returns to step S14, and the starting point of the trajectory of the divided area 33B (in the present embodiment, the trajectory of the divided area 33B is the same as the trajectory of the divided area 33A) is disposed below the resin supply port 35a (Fig. 6 (f )), the granular resin R is supplied to the divided area in step S15 33B. In the same manner as in the divided region 33A, the divided region 33B is supplied with the particulate resin R in an amount equal to 1/2 of the input amount W in a specific uniform thickness. Thereafter, the shutter 38 is closed to stop the supply of the particulate resin R from the linear feeder 35, the vibration of the linear feeder 35 is stopped, and the parallel moving portion 41a of the moving mechanism 41 is stopped.

Thereafter, the process proceeds to step S16, and it is determined whether or not all of the divided regions have been disposed below the resin supply port 35a. In the present embodiment, all of the divided regions 33A and 33B are disposed below the resin supply port 35a (YES in step S16), so that the supply of the particulate resin R is completed.

As described above, according to the resin supply mechanism 30 of the present embodiment, each of the divided regions 33A and 33B of the concave accommodating portion 33 divided into a plurality of planar regions can be disposed in the linear feeder 35 by the region movement control unit 53. Below the resin supply port 35a, the resin supply control unit 52 can be used to allow the entire surface of the divided region to pass under the resin supply port 35a, so that a uniform thickness of the particulate resin R can be supplied to the entire surface in each divided region. The maximum relative distance between the resin supply port 35a of the linear feeder 35 and the concave receiving portion 33 in the X direction (the longitudinal direction of the linear feeder 35) when the granular resin R is supplied from the linear feeder 35 is not concave. The shape of the accommodating portion 33 is entirely sized, and the concave accommodating portion 33 is divided into two planar regions and the size of one of the divided regions 33A or 33B, so that it is not necessary to extend the linear feeder 35. Therefore, the supply speed of the particulate resin R is not lowered, and the productivity is not lowered.

In addition, when the divided area disposed under the resin supply port 35a of the linear feeder 35 is changed from the divided area 33A to the divided area 33B, the concave shaped portion 33 is rotationally moved around the center of gravity thereof to make the divided area Minimize the space required for movement. On the contrary, in the case where the usable space is limited, the granular resin R can be supplied to the entire surface of the concave accommodating portion having a larger planar area, and resin molding of a larger substrate can be performed.

The resin supply mechanism of the above-described embodiment is an example of the present invention, and it is allowed to appropriately deform, modify, or add to the scope of the gist of the present invention. For example, dividing the concave housing portion The number is not limited to two. For example, as shown in FIG. 7( a ), the rectangular concave receiving portion 56 may be divided into four equal rectangular planar regions 56A to 56D, as shown in FIG. 7( b ). The circular concave receiving portion 57 is divided into six equal sector-shaped planar regions 57A to 57F. It is also possible for the operator to specify the number of divisions or the method of division by the input unit 55.

Further, in the above embodiment, the shapes of the plurality of divided planar regions are all the same, and therefore the trajectories in the respective divided regions may be the same, and the control is made easy, but an appropriate trajectory can be established. , it is not necessary to set all the divided areas to the same shape.

Further, in the above-described embodiment, the movement of the divided area is performed only by the rotational movement portion 41b, and the single-row path movement is performed only by the parallel moving portion 41a. However, the movement of the divided portions is not limited as described above, and the movement of the divided area may be performed. The parallel moving portion 41a is used to move the single-row path using the rotational moving portion 41b (for example, a case where the circular concave-shaped receiving portion is divided into a plurality of divided regions of concentric circles), and the movement of the divided region and the movement of the single-row path are also possible. The two moving parts 41a and 41b are used in combination.

Further, in Fig. 7(b), 58 is a circular frame, and 59 is a circular release film. The circular release film 59 is a release film which is separated into a circular shape by a rotary cutter or the like from a long release film which is wound into a roll shape.

In the above embodiment, a particulate resin is used as the resin material, but the same mechanism can be used even if the resin material is a powdery resin. In the case where the resin material is a paste or a liquid resin, it is not necessary to provide a vibrating mechanism to the linear feeder, and it is only necessary to keep the holding portion at a substantially constant amount of a paste or liquid resin.

In the present specification, the term "liquid" means that it is liquid at normal temperature and has various fluidity, and the liquid resin contains a liquid resin which does not immediately diffuse into the concave accommodating portion when supplied.

(compression forming device)

Fig. 8 is a schematic configuration diagram of a compression molding apparatus having the resin material supply mechanism of the above embodiment. The compression molding device 60 has the following members, that is, a forming unit 61 that will be mounted The electronic component such as the semiconductor wafer of the pre-molding substrate 76a is resin-sealed in the lower mold cavity 63 to form the molded substrate 76b. The substrate unit 71 supplies the pre-molding substrate 76a to the molding unit 61, and is housed by the molding unit 61. The formed molded substrate 76b; the resin supply unit 80 which supplies the particulate resin R to the release film 83 in a uniform thickness, and supplies the particulate resin R to the lower mold of the compression molding die 62 in this state. Inside the cavity 63, a track 89 connecting the units; and a control unit 90 controlling the parts. The substrate unit 71 and the resin supply unit 80 are disposed apart from each other on both sides of the forming unit 61. The track 89 is arranged to extend in the direction in which the units are arranged.

The molding unit 61 includes a compression molding die 62 which is composed of an upper die and a lower die, and a heating means that heats and melts the particulate resin R. The lower surface of the upper mold is provided to supply the upper mold substrate mounting portion in a state in which the front substrate 76a on which the electronic component is mounted is placed downward. In the lower mold, a lower mold cavity 63 is provided, and in the lower mold cavity 63, a cavity bottom member for pressurizing the resin which is heated and melted is provided.

The substrate unit 71 includes a substrate loader 72, a pre-molded substrate accommodating portion 73, a formed substrate accommodating portion 74, and a mechanical arm mechanism 75. The substrate loader 72 supplies the pre-molding substrate 76a to the molding unit 61, and accommodates the formed substrate 76b formed by the molding unit 61, and is disposed on the rail 89.

The resin supply unit 80 is provided with a long release film 83a wound in a roll shape, a jig 84 that grips the front end of the long release film 83a and pulls it out, and cuts the long release film 83a. The film cutting mechanism 86 which is separated by the required length, the mounting table 85 on which the long release film 83a is placed, and the linear feeder 87 which is a supply mechanism of the particulate resin R, etc., are used in the resin material supply mechanism 30 of the above embodiment. Departments. The mounting table 85 includes a moving mechanism including a parallel moving portion and a rotational moving portion. Further, in the present compression molding apparatus 60, the resin material supply mechanism 30 of the above-described embodiment can be controlled by the control unit 90 of the compression molding apparatus 60 because the control unit 50 is electrically connected to the control unit 90 of the compression molding apparatus 60. .

Further, the resin supply unit 80 has an integrated resin loader 81 and a post-processing mechanism 82. The resin loader 81 disposes the held rectangular frame 88 on the release film 83 which is pulled out onto the mounting table 85, and is placed on the release film 83 which is stretched on the lower surface of the rectangular frame 88. The particulate resin R is supplied into the lower mold cavity 63 below the compression molding die 62 in this state. The post-processing mechanism 82 is integrally provided with an upper die face cleaner on the upper side and a release film removing mechanism on the lower side. The resin loader 81 and the post-processing mechanism 82 are disposed on the rail 89.

The control unit 90 controls the respective portions in order to form the molded substrate 76b by resin sealing the electronic components mounted on the pre-molding substrate 76a.

First, in the substrate unit 71, the control unit 90 drives the arm mechanism 75, and the pre-molding substrate 76a is taken out from the pre-molding substrate accommodating portion 73, and the front surface and the back surface are reversed, and the mounting surface side of the electronic component is placed downward. Substrate loader 72. The pre-molding substrate 76a is transported to the forming unit 61 on the rail 89 by the substrate loader 72, and is placed on the upper mold upper mold substrate.

In the resin supply unit 80, after the jig 84 grips the front end of the long strip release film 83a wound into a roll shape and pulls the release film 83 onto the mounting table 85, the film cutting mechanism 86 demolds the mold. The film 83 is cut over the full width at the end of the portion to be pulled out. Thereafter, the rectangular frame 88 is placed on the release film 83 by the resin loader 81. Thereafter, the release film 83 is attached to the lower surface of the rectangular frame 88 to form a concave receiving portion. According to the resin material supply method of the above embodiment, the particulate resin R is supplied to the concave accommodating portion in a uniform thickness.

The concave accommodating portion to which the granular resin R is supplied in a uniform thickness is transported from the resin supply unit 80 to the forming unit 61 on the rail 89 by the resin loader 81, and placed on the opening of the lower mold. Thereafter, the release film 83 is introduced into the lower mold cavity 63 together with the particulate resin R thereon. Thereafter, the rectangular frame 88 is removed from the lower mold by the resin loader 81, and then the molten particulate resin R is heated by a heating means. The mold is molded by the lower mold and the upper mold, and the electronic component is immersed in the molten resin, and the molten resin is pressed by the cavity bottom member. After the molten resin is cured, the upper mold and the lower mold are opened to obtain a formed substrate 76b (resin sealing molded article of electronic parts).

The formed substrate 76b is transferred from the forming unit 61 to the substrate unit 71 from the forming unit 61 by the substrate loader 72, and is taken out from the substrate loader 72 by the mechanical arm mechanism 75 at this position, and the front and back sides are reversed. The resin-sealed side is housed in the formed substrate accommodating portion 74 upward.

After the formed substrate 76b is taken out from the forming unit 61, the upper mold substrate setting portion is cleaned by the upper surface cleaning device of the post-processing mechanism 82. In parallel with this or at the time of the shift, the release film 83 is removed from the lower mold by the release film removing mechanism.

As described above, the compression molding device 60 can be operated as a fully automatic device by the control unit 90.

Further, in the present compression molding apparatus 60, the substrate unit 71 and the resin supply unit 80 are disposed to be opposed to each other on both sides of the molding unit 61, and therefore, the fine powder of the particulate resin R can be prevented from coming into contact with the pre-formed substrate 76a. . As a result, there is a concern that the fine powder of the particulate resin R adheres to the pre-formed substrate 76a to cause molding failure, or the fine powder of the particulate resin R adheres to the formed substrate 76b. The steps lead to concerns about adverse effects.

Further, in the above embodiment, each unit is separated and can be detachably attached to each other by a connecting means such as a bolt or a nut. In this case, in the compression molding device 60, the substrate unit 71 or the resin supply unit 80 can be separated from the molding unit 61, and after the other molding unit 61 is mounted on the molding unit 61, the previous separation is performed. The substrate unit 71 or the resin supply unit 80 is again mounted to the forming unit 61 at the end. That is, a plurality of forming units 61 of a desired number can be set in an increaseable or decreasing state.

Further, in the case where there is no concern that the fine powder of the resin material adheres to the pre-molded substrate or the formed substrate (for example, the resin material is in the form of a paste or a liquid, or the resin material is not provided) The substrate unit and the resin supply unit may be collectively disposed on one side of the molding unit in the case of a mechanism in which the fine powder adheres. In this case, the substrate unit and the resin supply unit become the mother unit, and the molding unit becomes the sub unit. Further, the other forming units can be detachably formed with respect to the forming unit, so that a desired number of the plurality of forming units can be set in an increaseable or decreasing state. When a plurality of forming units are disposed between the substrate unit and the resin supply unit, and when a plurality of sub-units (forming units) are sequentially disposed with respect to the mother unit, it is preferable to form a plurality of forming units along the track. Arrange the direction of the extension.

Of course, one of the substrate unit, the resin supply unit, and the molding unit may be integrated and used as one compression molding device.

Furthermore, it is also possible to provide not only a plurality of molding units but also a plurality of substrate units and/or resin supply units and rails, and to use them appropriately.

The compression molding apparatus of the above-described embodiment is an example of the present invention, and it is allowed to appropriately deform, correct, or add to the scope of the present invention.

For example, in the above embodiment, a rectangular frame is used in order to mold an electronic component mounted on a rectangular substrate, but a circular frame may be used in order to form an electronic component mounted on a disk-shaped substrate such as a wafer. In this case, for example, a circular release film (or a substantially circular, 楕 circular release film) which can be obtained by cutting a circular release film into a circular shape is placed on a circular frame (or substantially circular). The circular frame is moved or rotated in the horizontal direction by the moving mechanism (parallel moving portion and rotating moving portion), thereby using a single-row path moving method from the linear feeder (resin supply port) A resin material such as a particulate resin is supplied onto the release film of the concave accommodating portion (or in a divided region in the circular frame).

Further, although the above embodiment is a compression molding apparatus for resin sealing an electronic component, the present invention is not limited thereto, and optical components such as a lens, an optical module, and a light guide plate, and other resin products may be manufactured by compression molding. In this case, the resin material supply method and supply mechanism of the present invention, and the compression molding apparatus having the above-described respective units are applied.

31‧‧‧Frame

32‧‧‧ release film

33‧‧‧ concave housing

33A, 33B‧‧‧ Division

35a‧‧‧Resin supply port

R‧‧‧granular resin

Claims (10)

A resin material supply method for supplying a resin material to a concave accommodating portion in a uniform thickness in order to supply a resin material to a cavity under a compression molding die composed of an upper mold and a lower mold, the concave accommodating portion Formed by a frame having an opening having a shape corresponding to the opening of the lower cavity and a release film covering the opening of the lower portion of the frame; the resin material supply method is characterized by comprising: a) a configuration step, which is Disposing the concave receiving portion in a manner that the concave receiving portion is divided into a plurality of planar regions, wherein one of the divided regions is located below the resin supply port of the linear feeder provided at the fixed position; b) a resin supply step While supplying the resin material from the resin supply port of the linear feeder, the concave accommodating portion is moved to the resin supply port of the linear feeder, whereby the resin material is supplied to the divided region in a uniform thickness; and a region moving step of placing the other divided region other than the divided region below the resin supply port The concave portion accommodating movement. The resin material supply method according to claim 1, wherein in the region moving step, the concave accommodating portion is rotationally moved about a center of gravity thereof. The resin material supply method according to claim 1 or 2, wherein the plurality of planar regions are all of the same shape. A compression molding method using the resin material supply method according to any one of claims 1 to 3. A resin material supply mechanism for supplying a resin material to a concave accommodating portion in a uniform thickness for supplying a resin material to a cavity under a compression molding die composed of an upper mold and a lower mold, the concave accommodating portion The frame is formed by a frame having an opening having a shape corresponding to the opening of the lower cavity and a release film covering the opening of the lower portion of the frame; the resin material supply mechanism is characterized by: a) a resin supply means for supplying a resin material from a resin supply port of a linear feeder equipped at a fixed position; b) a moving means for moving the concave containing portion; c) a region moving control means for causing the concave portion The partitioning portion is divided into a plurality of planar regions, wherein each of the divided regions is located below the resin supply port, and the moving means is controlled; and d) a resin supply control means for uniforming each of the plurality of divided regions The thickness is supplied to the resin material, and the moving means is controlled such that the resin supply material is supplied from the resin supply port of the linear feeder by the resin supply means, and the concave storage portion is made to be linear with respect to the linear region in the divided region. The resin supply port of the feeder moves. The resin material supply mechanism according to claim 5, wherein the area moving control means controls the moving means such that the concave receiving portion is rotationally moved about a center of gravity thereof. The resin material supply mechanism of claim 5 or 6, wherein the plurality of divided regions are all of the same shape. A compression molding apparatus comprising the resin material supply mechanism according to any one of claims 5 to 7. The compression molding apparatus according to claim 8, further comprising a substrate supply and storage unit having a housing portion for molding the front substrate and a housing portion for the formed substrate. The compression molding apparatus according to the eighth aspect of the invention, wherein the resin material supply mechanism, the substrate supply storage mechanism, and the compression molding mechanism are detachably arranged in an arbitrary number and arbitrarily arranged, wherein the substrate supply and storage mechanism is supplied and formed. a mechanism of the front substrate, and having a receiving portion for forming the front substrate and a receiving portion of the formed substrate, and the compression forming mechanism The pre-molding substrate supplied from the substrate supply and storage unit and the resin material supplied from the resin material supply mechanism are resin-sealed to form the molded substrate.