TWI542869B - Automatic dimming method for optical detection and its optical inspection machine - Google Patents
Automatic dimming method for optical detection and its optical inspection machine Download PDFInfo
- Publication number
- TWI542869B TWI542869B TW104106592A TW104106592A TWI542869B TW I542869 B TWI542869 B TW I542869B TW 104106592 A TW104106592 A TW 104106592A TW 104106592 A TW104106592 A TW 104106592A TW I542869 B TWI542869 B TW I542869B
- Authority
- TW
- Taiwan
- Prior art keywords
- illumination
- type
- configuration
- light
- value
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 31
- 230000003287 optical effect Effects 0.000 title claims description 26
- 238000001514 detection method Methods 0.000 title claims description 16
- 238000007689 inspection Methods 0.000 title claims description 14
- 238000005286 illumination Methods 0.000 claims description 271
- 229910000679 solder Inorganic materials 0.000 claims description 63
- 239000002184 metal Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000003384 imaging method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
本發明係關於一種用於光學檢測的自動調光方法及其光學檢測機台,更特別的是關於一種可對不同種類之待測電路板進行照射光源組態的自動最佳化的自動調光方法及使用該自動調光方法之光學檢測機台。The invention relates to an automatic dimming method for optical detection and an optical detecting machine thereof, and more particularly to an automatic optimized automatic dimming for illuminating light source configuration of different kinds of circuit boards to be tested. Method and optical inspection machine using the automatic dimming method.
自動光學檢測(AOI)在軟式或硬式電路板上的檢測係扮演著舉足輕重的腳色。舉例來說,在各種電路板的製造過程中,皆須經過精密的自動光學檢測以辨別電路板的優劣,進行品質的管控。Automated Optical Inspection (AOI) plays a pivotal role in the detection of soft or hard boards. For example, in the manufacturing process of various boards, precise automatic optical inspection is required to distinguish the advantages and disadvantages of the board and to carry out quality control.
自動光學檢測係由光學檢測機台的運作來進行,在檢測過程中,係以光線照射至電路板上,再透過攝像裝置擷取電路板被照射後的圖像來進行瑕疵的判斷,也因此,光學檢測機台上之照明裝置所提供的光源品質在檢測上就具有著相當的影響力,一旦光源品質不佳或與先前採用之組態不同時,檢測結果就會因檢測數據的偏移而造成結果失準或產品品質的不穩定。The automatic optical inspection is performed by the operation of the optical inspection machine. During the detection process, the light is irradiated onto the circuit board, and then the image of the printed circuit board is captured by the imaging device to determine the flaw, and thus The quality of the light source provided by the illumination device on the optical inspection machine has a considerable influence on the detection. Once the quality of the light source is not good or the configuration is different from the previous one, the detection result will be shifted due to the detection data. The result is inaccurate or the quality of the product is unstable.
傳統上,光學檢測機台上之光源裝置的照射組態(即各照射光的強弱控制)皆是由人工根據經驗法則或直接套用類似電路板之照射組態來進行的,然而,如此的設定不但未經過均一化的程序控制,更可能因人為疏失而導致不良品的產生,一旦待測電路板的類型眾多而需對應地不斷更動照射組態時,透過人工的逐一設定調整不但費時且亦無法使各機台間之檢測標準均一化,這樣的缺點往往造成通過檢測的產品無法維持穩定的產品品質。Traditionally, the illumination configuration of the light source device on the optical inspection machine (ie, the intensity control of each illumination light) is performed manually according to the rule of thumb or directly applying the illumination configuration of a similar circuit board. However, such setting Not only is it not controlled by the normalization process, but it is also likely to cause the generation of defective products due to human error. Once the type of the circuit board to be tested needs to be constantly changed, the manual adjustment is not only time-consuming but also time-consuming. It is impossible to homogenize the testing standards between the machines. Such shortcomings often result in products that fail to maintain stable product quality.
本發明之一目的在於維持穩定的電路板檢驗品質。It is an object of the present invention to maintain a stable board inspection quality.
本發明之另一目的在於自動對各種類型之電路板進行光源照射組態的自動調光。Another object of the present invention is to automatically perform automatic dimming of light source illumination configurations for various types of circuit boards.
為達上述目的及其他目的,本發明提出一種用於光學檢測的自動調光方法,係供一光學檢測機台在不同種類之待測電路板間進行照射光源的自動調整,包含:擷取更換種類後之一待測電路板上的影像資料;調光區域設定步驟,係根據該影像資料以設定至少一調光區域及其對應的類型,該調光區域的類型係包含金屬類型、文字類型及防焊層類型此三者中的至少其二者;進行調光步驟,係藉由側向照射光以及側向照射光與正向照射光之兩種組態的照射下,以選定的一種調光區域的類型為基準,且基於每一種照射組態當下所擷取到之所選定類型調光區域的影像資料以及基於與所選定類型調光區域之預儲存的亮度門檻值標準資料的比較下,調整照射光之強弱,再根據側向照射光與正向照射光同時照射的該組態下所擷取之任兩類型之調光區域間之影像資料的亮度值,取得對應的亮度差異程度,選定一照射光調整組態;以及儲存該照射光調整組態,以供同種類電路板之檢測的進行。In order to achieve the above and other objects, the present invention provides an automatic dimming method for optical detection, which is an optical detecting machine for automatically adjusting an illumination source between different types of circuit boards to be tested, including: picking and replacing The image data on the circuit board to be tested after the type; the dimming area setting step is to set at least one dimming area and its corresponding type according to the image data, the type of the dimming area includes a metal type and a text type. And at least two of the three types of solder mask; the dimming step is performed by lateral illumination and lateral illumination and forward illumination, and the selected one is selected The type of dimming area is a reference, and based on each of the illumination configurations, the image data of the selected type of dimming area and the pre-stored brightness threshold value data based on the selected type of dimming area are compared. Next, adjusting the intensity of the illumination light, and then according to the image data of any two types of dimming regions taken under the configuration that the side illumination light and the forward illumination light are simultaneously irradiated Value, to obtain the degree of difference in luminance corresponding to a selected one of the irradiation light adjustment configuration; and storing the irradiated light adjustment configuration for detecting the same type of circuit board.
於本發明之一實施例中,於該調光步驟包含:進行側光調整步驟,係提供側向入射該待測電路板的側向照射光,其起始之照射強度的調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第一目標區間值內,以取得一側光照射組態的設定值;進行正光調整步驟,在維持該側光照射組態之設定值的照射下,更提供正向入射該待測電路板的正向照射光,該正向照射光之起始照射強度的調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第二目標區間值內,以取得一第一次正光照射組態的設定值,且在該側光照射組態與該第一次正光照射組態的設定值下,擷取任兩類型之調光區域間之影像資料的亮度值,取得對應之亮度差異程度;以及進行第二次正光調整步驟,在維持該側光照射組態之設定值的照射下,更調整該正向照射光以提供高於該第一次正光照射組態之設定值的正向照射光,該正向照射光的進一步調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第三目標區間值內,以取得一第二次正光照射組態的設定值,且在該側光照射組態與該第二次正光照射組態的設定值下,擷取任兩類型之調光區域間之影像資料的亮度值,取得對應之亮度差異程度,以選定該照射光調整組態。In an embodiment of the present invention, the dimming step includes: performing a sidelight adjusting step to provide lateral illumination light that is laterally incident on the circuit board to be tested, and the initial illumination intensity adjustment is selected. In the dimming area of the type, adjust to the value of the image brightness in the captured image to reach a first target interval value to obtain the set value of the side light illumination configuration; perform the positive light adjustment step to maintain the side Under the illumination of the set value of the light illumination configuration, the forward illumination light that is positively incident on the circuit board to be tested is further provided, and the initial illumination intensity of the forward illumination light is adjusted in the selected type of dimming region. Adjusting the brightness value of the image in the captured image to a second target interval value to obtain a set value of the first positive light illumination configuration, and configuring the side light illumination and the first positive light Under the set value of the illumination configuration, the brightness value of the image data between the two types of dimming areas is obtained, and the corresponding brightness difference degree is obtained; and the second positive light adjustment step is performed, and the side light illumination configuration is maintained. Set value Under illumination, the forward illumination light is further adjusted to provide a forward illumination light that is higher than a set value of the first positive illumination illumination configuration, the further adjustment of the forward illumination light being within a selected type of dimming region, Adjusting to the value of the image brightness in the captured image to reach a third target interval value, to obtain a set value of the second positive light illumination configuration, and the side light illumination configuration and the second positive light Under the setting value of the illumination configuration, the brightness value of the image data between the two types of dimming areas is extracted, and the corresponding brightness difference degree is obtained, and the illumination light adjustment configuration is selected.
於本發明之一實施例中,於該調光步驟中,於第二次正光調整步驟後且於選定該照射光調整組態前,更包含:關閉所有照射組態;進行第二輪側光調整步驟,係提供側向入射該待測電路板的側向照射光,其起始之照射強度的調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第二輪第一目標區間值內,以取得一第二輪側光照射組態的設定值;進行第二輪正光調整步驟,在維持該第二輪側光照射組態之設定值的照射下,更提供正向入射該待測電路板的正向照射光,該正向照射光之起始照射強度的調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第二輪第二目標區間值內,以取得一第二輪第一次正光照射組態的設定值,且在該第二輪側光照射組態與該第二輪第一次正光照射組態的設定值下,擷取任兩類型之調光區域間之影像資料的亮度值,取得對應之亮度差異程度;以及進行第二輪第二次正光調整步驟,在維持該第二輪第側光照射組態之設定值的照射下,更調整該正向照射光以提供高於該第二輪第一次正光照射組態之設定值的正向照射光,該正向照射光的進一步調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第二輪第三目標區間值內,以取得一第二輪第二次正光照射組態的設定值,且在該側光照射組態與該第二輪第二次正光照射組態的設定值下,擷取任兩類型之調光區域間之影像資料的亮度值,取得對應之亮度差異程度,以選定該照射光調整組態,其中,該第二輪第一目標區間值的最大數值係大於該第一目標區間值的最大數值,該第二輪第二目標區間值係等於該第二目標區間值,該第二輪第三目標區間值係等於該第三目標區間值。In an embodiment of the present invention, in the dimming step, after the second positive light adjustment step and before the selection of the illumination light adjustment configuration, the method further includes: turning off all illumination configurations; performing the second round side illumination The adjusting step is to provide lateral illumination light that is laterally incident on the circuit board to be tested, and the initial illumination intensity is adjusted in the selected type of dimming region to adjust the image brightness in the currently captured image. The value reaches a second round of the first target interval value to obtain a set value of the second round side light illumination configuration; and the second round of the positive light adjustment step is performed to maintain the set value of the second round side light illumination configuration Under the illumination, the positive illumination light that is positively incident on the circuit board to be tested is further provided, and the initial illumination intensity of the forward illumination light is adjusted in the selected type of dimming region, and is adjusted to be captured at the present time. The image brightness value in the image reaches a second round of the second target interval value to obtain a set value of the second round of the first positive light illumination configuration, and the second wheel side light illumination configuration and the second The set value of the first positive illumination of the wheel The brightness value of the image data between the two types of dimming areas is obtained, and the corresponding brightness difference degree is obtained; and the second round of the second positive light adjusting step is performed, and the second side first side light irradiation configuration is maintained. Under the illumination of the set value, the forward illumination light is further adjusted to provide a forward illumination light higher than a set value of the first positive illumination illumination configuration of the second round, and the further adjustment of the forward illumination light is based on the selected type In the dimming area, adjusting the brightness value of the image in the captured image to a second round of the third target interval value to obtain a set value of the second round of the second positive illumination configuration, and The brightness of the image data between the two types of dimming areas is obtained by the side light illumination configuration and the set value of the second positive light illumination configuration of the second round, and the corresponding brightness difference degree is obtained to select the The illumination light adjustment configuration, wherein the maximum value of the first target interval value of the second round is greater than the maximum value of the first target interval value, and the second target second target interval value is equal to the second target interval value. The second round Interval equal to the target value based third target value range.
於本發明之一實施例中,該調光區域的類型係為金屬類型、文字類型、防焊層的亮區類型及防焊層的暗區類型此四者,且於選定該照射光調整組態的步驟中,係自該側光照射組態與該第一次正光照射組態的設定值、該側光照射組態與該第二次正光照射組態的設定值、該第二輪側光照射組態與該第二輪第一次正光照射組態的設定值、該第二輪側光照射組態與該第二輪第二次正光照射組態的設定值,此四者中判定一者作為該照射光調整組態,其中,判定規則的先後係以下列順序來進行,於差異程度之結果相同時始須進入下一規則進行判定,於差異程度之結果不同時係以差異程度大的組態設定值為該照射光調整組態;第一、防焊層的亮區類型與防焊層的暗區類型間的亮度差異程度;第二、金屬類型與文字類型間的亮度差異程度;第三、防焊層的亮區類型及防焊層的暗區類型之最大值與文字類型間的亮度差異程度;以及第四、金屬類型與防焊層的亮區類型及防焊層的暗區類型之最大值間的亮度差異程度。In an embodiment of the present invention, the type of the dimming area is a metal type, a text type, a bright area type of the solder resist layer, and a dark area type of the solder resist layer, and the illumination light adjustment group is selected. In the step of the state, the set value of the side light illumination configuration and the first positive light illumination configuration, the side light illumination configuration and the set value of the second positive light illumination configuration, the second wheel side The light illumination configuration and the set value of the first positive light illumination configuration of the second round, the second wheel side light illumination configuration and the set value of the second round of the second positive illumination configuration, the determination among the four One is used as the illumination light adjustment configuration, wherein the order of the determination rules is performed in the following order, and when the results of the degree of difference are the same, the next rule is required to be determined, and the difference degree is different when the result of the difference degree is different. The large configuration setting value is the illumination light adjustment configuration; first, the brightness difference between the bright area type of the solder mask and the dark area type of the solder resist layer; second, the brightness difference between the metal type and the text type Degree; third, the type of bright area of the solder mask The luminance difference between the maximum value of the degree of the dark region of the solder resist layer type and text type; and fourth, the luminance difference between the maximum value of the degree of the dark area and bright area type solder resist layer and the metal type of the solder resist layer type.
於本發明之一實施例中,所選定之該調光區域的類型係為該金屬類型,於基於每一種照射組態當下所擷取到之對應該至少一調光區域中之其一的影像資料以及基於與所選定類型調光區域之預儲存的亮度門檻值標準資料的比較下的步驟中,係以該影像資料中之紅光波長段的影像資料來進行比較。In an embodiment of the present invention, the selected type of the dimming area is the metal type, and the image corresponding to at least one of the dimming areas is captured based on each illumination configuration. The data and the comparison based on the pre-stored luminance threshold data of the selected type of dimming region are compared using the image data of the red wavelength segment in the image data.
於本發明之一實施例中,於該調光區域設定步驟中,係基於使用者的劃定來設定該至少一調光區域及其對應的類型。In an embodiment of the present invention, in the dimming region setting step, the at least one dimming region and its corresponding type are set based on a user's delimitation.
為達上述目的及其他目的,本發明復提出一種光學檢測機台,係包含一照射光源組、一攝像組及一控制組,該控制組係控制該照射光源組的光強度調整及接收該攝像組所擷取的影像資料,於該光學檢測機台在不同種類之待測電路板間進行照射光源的自動調整時,該控制組係運作來執行如前所述之自動調光方法。In order to achieve the above and other objects, the present invention further provides an optical detecting machine comprising an illumination source group, a camera group and a control group, wherein the control group controls the light intensity adjustment of the illumination source group and receives the camera. The image data captured by the group is operated by the optical inspection machine to automatically adjust the illumination source between different types of circuit boards to be tested, and the control group operates to perform the automatic dimming method as described above.
藉此,本發明透過各調光區域的類型設定以及側光、側光加正光此二種照射組態的依序照射來進行對應的調光處理,不但使得本案揭露之光學檢測機台可對不同種類之待測電路板進行照射光源組態的自動最佳化,更使得受檢電路板均能在均一化的條件下被予以檢測,進而可維持電路板的品質均一。Therefore, the present invention performs corresponding dimming processing through the type setting of each dimming area and the sequential illumination of the two kinds of illumination configurations of side light, side light plus positive light, which not only makes the optical detecting machine disclosed in the present invention correct. Different types of boards to be tested are automatically optimized for the configuration of the illumination source, so that the boards to be inspected can be detected under uniform conditions, thereby maintaining the uniform quality of the board.
為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.
首先請參閱圖1及圖2,圖1係本發明一實施例中之自動調光方法的流程圖,圖2係本發明一實施例中之光學檢測機台的示意圖。1 and FIG. 2, FIG. 1 is a flowchart of an automatic dimming method in an embodiment of the present invention, and FIG. 2 is a schematic diagram of an optical detecting machine in an embodiment of the present invention.
光學檢測機台係包含一照射光源組(包含側向照射光光源201及正向照射光光源203)、一攝像組300及一控制組100。該控制組100係連接該攝像組300及該照射光源組(圖未示),以控制該照射光源組的光強度調整及接收該攝像組300所擷取的影像資料,於該光學檢測機台在不同種類之待測電路板500間進行照射光源的自動調整時,該控制組100可運作來執行本發明所揭露之自動調光方法。其中,圖2所示之正向照射光光源203於操作上可基於與兩側向照射光光源201位於同一平面上的配置關係來避免遮住攝像組300的攝像範圍。The optical inspection machine includes an illumination source group (including a lateral illumination light source 201 and a forward illumination light source 203), an imaging group 300, and a control group 100. The control group 100 is connected to the camera group 300 and the illumination source group (not shown) to control the light intensity adjustment of the illumination source group and receive the image data captured by the camera group 300 on the optical inspection machine. The control group 100 is operable to perform the automatic dimming method disclosed herein when performing automatic adjustment of the illumination source between different types of circuit boards 500 to be tested. The forward illumination light source 203 shown in FIG. 2 can be operated to avoid obscuring the imaging range of the imaging group 300 based on the arrangement relationship with the two sides of the illumination light source 201 on the same plane.
本發明一實施例中之自動調光方法主要係先對更換種類後之待測電路板擷取影像資料,以供調光區域及其對應類型的設定,其中調光區域及其對應類型的設定係可由使用者自行劃定調光區域及選定其對應的類型,或者是由該控制組100根據調光前所擷取的影像資料以及電路板上各類型會有的影像特徵(如:金屬線路上的反光在紅光波長段的影像下會具有最高的亮度)來自動辨識出電路板上對應各種類型下的調光區域,並可選擇出影像品質較佳的區域來供後續調光流程的進行。本發明後續之實施例係以使用者手動選取的方式作為示例。The automatic dimming method in an embodiment of the present invention mainly captures image data of a circuit board to be tested after replacing the type for setting the dimming area and its corresponding type, wherein the dimming area and its corresponding type are set. The user can specify the dimming area and select the corresponding type, or the image data acquired by the control group 100 according to the dimming and the image features of each type on the circuit board (eg, metal lines). The upper reflection will have the highest brightness under the image of the red wavelength range) to automatically identify the dimming areas corresponding to various types on the circuit board, and select the area with better image quality for the subsequent dimming process. get on. Subsequent embodiments of the present invention are exemplified by the manner manually selected by the user.
如圖1所示,本發明一實施例中之自動調光方法係執行如下:As shown in FIG. 1, the automatic dimming method in an embodiment of the present invention is performed as follows:
首先步驟S100,係判定是否接收到進行不同種類電路板之檢測的更換指令,於「是」時進入下一步驟S200,於「否」時進入下一步驟S101而維持目前的照射組態。First, in step S100, it is determined whether or not a replacement command for detecting a different type of circuit board is received. If YES, the process proceeds to the next step S200. If NO, the process proceeds to the next step S101 to maintain the current illumination configuration.
接著步驟S200,係接收更換電路板種類後之待測電路板上各調光區域的類型設定。此處所謂之類型設定係根據電路板表面會有的各種型態來定義,舉例來說包含:作為導線的金屬類型、受文字打印的文字類型及各種顏色防焊層之防焊層類型。一般說來,形成於電路板上的金屬線路有被披覆有機防焊劑(OSP)的,也有直接鍍錫或以化學鎳金方式形成的;電路板上打印的文字有白色、黑色或其他色等;防焊層則是有綠、藍、白、紅等的顏色。操作者係在更換欲進行自動調光之電路板後,透過該攝像組300所擷取的影像資料,顯示於該控制組100之螢幕(圖未示)上,再透過該控制組100之輸入介面(如:滑鼠、鍵盤等)來框選拖曳劃定出需進行調光的各個調光區域,以使該等調光區域被設定於該控制組100中,以及進行該等調光區域之類型的設定(如前述之金屬類型、文字類型或防焊層類型)。Next, in step S200, the type setting of each dimming area on the circuit board to be tested after replacing the type of the circuit board is received. The type setting here is defined according to various types of the surface of the board, and includes, for example, a metal type as a wire, a type of text printed by a character, and a solder resist type of various color solder resist layers. Generally speaking, the metal lines formed on the circuit board are covered with an organic solder resist (OSP), or directly tinned or formed by chemical nickel gold; the printed characters on the board are white, black or other colors. Etc.; the solder mask is green, blue, white, red, etc. After the operator replaces the circuit board to be automatically dimmed, the image data captured by the camera group 300 is displayed on the screen of the control group 100 (not shown), and then input through the control group 100. Interfaces (eg, mouse, keyboard, etc.) to select each of the dimming regions that are to be dimmed, such that the dimming regions are set in the control group 100, and the dimming regions are The type of setting (such as the metal type, text type or solder mask type mentioned above).
其中,調光區域及其類型的設定係至少選擇二組,亦即,金屬類型、文字類型及防焊層類型此三者中的至少其二者,以供調光步驟的進行。舉例來說,防焊層類型通常又可分為防焊層的亮區類型(防焊層下面有金屬線路層)及防焊層的暗區類型(防焊層下面沒有金屬線路層),因此,調光步驟即是要使至少兩者之間的影像資料能夠被清楚辨識,亦即影像資料在不同調光區域類型間的亮度值基於預設的目標值之下必須能被檢測系統區分出來,進而使調光的基準一致,受檢電路板均能在均一化的條件下被予以檢測。此外,舉例來說,一般的電路檢測通常必須至少採用金屬類型與防焊層類型來做設定,因電路板的檢測通常是針對金屬線路要能配置正確,而要讓系統清楚辨識出電路板上的金屬線路就有賴金屬線路旁之區域(通常為防焊層類型)與金屬線路的影像差異程度,差異越大就越容易辨識。然上述僅為示例,並非為一種限制,電路板的檢測亦可能針對其他類型來做設定,皆不離開本發明的範疇。Wherein, the setting of the dimming area and its type is at least two sets, that is, at least two of the metal type, the text type and the solder mask type, for the dimming step. For example, the type of solder mask is usually divided into the bright area type of the solder resist layer (the metal wiring layer under the solder resist layer) and the dark area type of the solder resist layer (the metal trace layer is not under the solder resist layer), so The dimming step is to enable at least the image data between the two to be clearly identified, that is, the brightness value of the image data between different dimming area types must be distinguished by the detection system based on the preset target value. In turn, the dimming reference is consistent, and the board under test can be detected under uniform conditions. In addition, for example, general circuit detection must usually be set using at least metal type and solder mask type, because the board inspection is usually configured correctly for the metal line, and the system must clearly identify the board. The metal line depends on the image difference between the area next to the metal line (usually the type of solder mask) and the metal line. The larger the difference, the easier it is to identify. However, the above is merely an example, and is not a limitation. The detection of the board may also be set for other types without departing from the scope of the present invention.
接著步驟S300,進行調光步驟。本步驟係藉由第一種之單純側向照射光,以及第二種之側向照射光與正向照射光搭配,此兩種組態的照射下,以已選定的一種調光區域的類型為基準(通常為金屬類型,以下以金屬類型來說明)來進行。即,基於每一種照射組態當下所擷取到之對應金屬類型之調光區域的影像資料,依據金屬類型調光區域之預儲存的亮度門檻值標準資料來進行調光。換言之,即是在與亮度門檻值標準資料的比較下,於預設調整範圍內調整照射光之強弱。接著再根據側向照射光與正向照射光同時照射的該組態下所擷取之任兩類型(如金屬類型與防焊層類型)之調光區域間之影像資料的亮度值,取得對應的亮度差異程度,選定一照射光調整組態。。Next, in step S300, a dimming step is performed. This step is performed by the first type of simple lateral illumination and the second type of lateral illumination combined with the forward illumination. Under the illumination of the two configurations, the type of dimming area selected has been selected. This is done for the benchmark (usually the metal type, described below in terms of metal type). That is, the image data of the dimming area corresponding to the metal type captured under the current illumination configuration is dimmed according to the pre-stored brightness threshold value standard data of the metal type dimming area. In other words, the intensity of the illumination light is adjusted within the preset adjustment range in comparison with the standard data of the luminance threshold value. Then, according to the brightness values of the image data between the two types of dimming regions (such as the metal type and the solder mask type) taken under the configuration in which the lateral illumination light and the forward illumination light are simultaneously irradiated, the corresponding values are obtained. The degree of brightness difference is selected and an illumination light is selected to adjust the configuration. .
舉例來說,就金屬類型的調光區域來說,欲使所擷取影像中可清楚識別出金屬線路,就要使該區域內之金屬反射光的最小光強度值要高於其他類型之調光區域的最大反射光強度值,較佳係以紅光波長段作為判斷條件。再舉例來說,要將白色文字從防焊層中可被清楚識別出則當搭配綠色防焊層時要以藍光波段的光強度值來檢視之,當搭配藍色防焊層時要以綠光波段的光強度值來檢視之,搭配紅色防焊層時要以綠光(優先)或藍光波段的光強度值來檢視之;要將黑色文字從防焊層中可被清楚識別出則當搭配綠色防焊層時要以綠光(優先)或藍光波段的光強度值來檢視之,當搭配藍色防焊層時要以藍光波段的光強度值來檢視之,搭配紅色防焊層時要以綠光(優先)或藍光波段的光強度值來檢視之。For example, in the case of a metal-type dimming area, in order to clearly identify the metal line in the captured image, the minimum light intensity of the metal reflected light in the area is higher than other types of adjustment. The maximum reflected light intensity value of the light region is preferably determined by the red light wavelength band. For another example, the white text can be clearly identified from the solder mask. When the green solder mask is used, the light intensity value of the blue light band should be used. When the blue solder resist layer is used, the green color should be green. The light intensity value of the optical band is checked. When matching the red solder mask, the light intensity value of the green light (priority) or blue light band is used to check; the black text can be clearly recognized from the solder resist layer. When matching with the green solder mask, check the light intensity value of the green (priority) or blue light band. When using the blue solder mask, check the light intensity value of the blue light band. When paired with the red solder mask It should be viewed in light intensity values in the green (priority) or blue light bands.
接著步驟S400,儲存該照射光調整組態,以供同種類電路板之檢測的進行。Next, in step S400, the illumination light adjustment configuration is stored for the detection of the same type of circuit board.
據此,本發明之自動調光即是在側光照射組態與正光照射組態的各種搭配之設定值下,選取不同類型調光區域間之亮度差異程度最大的情況(即相差之數值的絕對值最大)下來決定照射光調整組態。Accordingly, the automatic dimming of the present invention is to select the maximum degree of brightness difference between different types of dimming regions under the set values of the sidelight illumination configuration and the positive light illumination configuration (ie, the value of the phase difference) The absolute value is the largest) down to determine the illumination adjustment configuration.
接著請參閱第3(a)圖,係本發明另一實施例中之自動調光方法的流程圖。本發明基於金屬線路為電路板檢測的主要項目,係進一步在調光步驟中進行下述步驟來取得可對金屬線路之擷取影像較佳化的照射光調整組態。Next, please refer to FIG. 3(a), which is a flowchart of an automatic dimming method in another embodiment of the present invention. The invention is based on the metal line as the main item of the circuit board detection, and further performs the following steps in the dimming step to obtain an illumination light adjustment configuration that can optimize the captured image of the metal line.
首先,在無照射光之前提下先進行側光調整步驟S301,係提供側向入射該待測電路板的側向照射光220,其起始之照射強度的調整係於所選定類型之調光區域(例如金屬類型)內,調整側向照射光至在當下所擷取影像中的影像亮度值達到一第一目標區間值內(以金屬類型來說,此第一目標區間值舉例來說可為120~140,此數值係以亮度值範圍在0~255為例),以取得一側光照射組態的設定值(即側向照射光為了滿足前面條件所被調整的輸出值)。First, the sidelight adjustment step S301 is performed before the illumination is not provided, and the lateral illumination light 220 that is laterally incident on the circuit board to be tested is provided, and the initial illumination intensity is adjusted according to the selected type of dimming. In the area (for example, metal type), the lateral illumination light is adjusted until the brightness value of the image captured in the current image reaches a first target interval value (in the case of the metal type, the first target interval value may be, for example, For the range of 120 to 140, the value is in the range of 0 to 255. In order to obtain the set value of the side illumination configuration (ie, the output value of the lateral illumination to be adjusted to meet the previous conditions).
接著進行正光調整步驟S302,在維持該側光照射組態之設定值的照射下,更提供正向入射該待測電路板的正向照射光,該正向照射光之起始照射強度的調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第二目標區間值內(以金屬類型來說,此第二目標區間值舉例來說可為160~180,此數值係以亮度值範圍在0~255為例,此數值係指側光照射及正光照射下之疊加下所取得的數值),以取得一第一次正光照射組態的設定值(即正向照射光為了滿足前面條件所被調整的輸出值),且在該側光照射組態與該第一次正光照射組態的設定值下,擷取任兩類型之調光區域間之影像資料的亮度值,取得對應之亮度差異程度。Then, the positive light adjustment step S302 is performed, and under the illumination of maintaining the set value of the side light illumination configuration, the forward illumination light that is positively incident on the circuit board to be tested is further provided, and the initial illumination intensity of the forward illumination light is adjusted. Adjusting to the dimming area of the selected type, adjusting the brightness value of the image in the captured image to a second target interval value (in the case of the metal type, the second target interval value may be, for example, 160~180, this value is based on the brightness value range of 0~255. This value refers to the value obtained by the superposition of the sidelight illumination and the positive illumination, to obtain the setting of the first positive illumination configuration. Value (ie, the output value of the forward illuminating light adjusted to meet the previous conditions), and taking any two types of dimming regions under the sidelight illumination configuration and the set value of the first positive illuminating configuration The brightness value of the image data between the two is obtained, and the corresponding brightness difference degree is obtained.
在前述二步驟後係即找到一組正光與側光的設定值以作為該照射光調整組態。但較佳的是如第3(a)圖所示,再更包含:一正光第二次調整步驟S303,係在維持該側光照射組態之設定值的照射下,更調整該正向照射光以提供高於該第一次正光照射組態之設定值的正向照射光,該正向照射光的進一步調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第三目標區間值內(以金屬類型來說,此第二目標區間值舉例來說可為180~200,此數值係以亮度值範圍在0~255為例,此數值係指側光照射及正光照射下之疊加下所取得的數值),以取得一第二次正光照射組態的設定值,且在該側光照射組態與該第二次正光照射組態的設定值下,擷取任兩類型之調光區域間之影像資料的亮度值,取得對應之亮度差異程度。After the foregoing two steps, a set of positive and side light settings are found to be used as the illumination light adjustment configuration. Preferably, as shown in FIG. 3(a), further comprising: a positive second adjustment step S303, adjusting the forward illumination while maintaining the set value of the side illumination configuration. Light is provided to provide a forward illumination light that is higher than a set value of the first positive illumination configuration, the further adjustment of the forward illumination light being within a selected type of dimming region, adjusted to be captured in the current image The image brightness value reaches a third target interval value (in the case of the metal type, the second target interval value can be, for example, 180 to 200, and the value is in the range of 0 to 255. Refers to the value obtained by superposition of side light illumination and positive light illumination) to obtain a set value of a second positive light illumination configuration, and in the configuration of the side light illumination configuration and the second positive light illumination configuration Under the set value, the brightness value of the image data between the two types of dimming areas is obtained, and the corresponding brightness difference degree is obtained.
於選定該照射光調整組態的程序中,舉例來說,該調光區域的類型係為金屬類型、文字類型、防焊層的亮區類型及防焊層的暗區類型此四者,於選定該照射光調整組態的步驟中,係自該側光照射組態與該第一次正光照射組態的設定值、該側光照射組態與該第二次正光照射組態的設定值,此二者中判定一者作為該照射光調整組態,其中,判定規則的先後係以下列順序來進行,於差異程度之結果相同時始須進入下一規則進行判定,於差異程度之結果不同時係以差異程度大的組態設定值為該照射光調整組態; 第一、防焊層的亮區類型與防焊層的暗區類型間的亮度差異程度; 第二、金屬類型與文字類型間的亮度差異程度; 第三、防焊層的亮區類型及防焊層的暗區類型之最大值與文字類型間的亮度差異程度;以及 第四、金屬類型與防焊層的亮區類型及防焊層的暗區類型之最大值間的亮度差異程度。In the program for selecting the illumination light adjustment configuration, for example, the type of the dimming area is a metal type, a text type, a bright area type of the solder resist layer, and a dark area type of the solder resist layer. The step of selecting the illumination light adjustment configuration is performed from the sidelight illumination configuration and the set value of the first positive illumination illumination configuration, the side illumination illumination configuration, and the set value of the second positive illumination illumination configuration. One of the two is determined as the illumination light adjustment configuration, wherein the order of the determination rules is performed in the following order, and when the result of the difference degree is the same, the next rule is required to be determined, and the result of the degree of difference At different times, the configuration setting value with a large degree of difference is adjusted according to the illumination light; first, the degree of brightness difference between the bright area type of the solder resist layer and the dark area type of the solder resist layer; second, the metal type and The degree of brightness difference between text types; third, the type of bright area of the solder mask and the difference between the maximum value of the dark area type of the solder resist layer and the brightness of the text type; and the fourth, the metal type and the brightness of the solder resist layer Zone type and anti-welding The degree of brightness difference between the maximum values of the dark area types of the layers.
舉例來說,當該側光照射組態與該第一次正光照射組態的設定值之下,第一規則規範下的數值為10;當該側光照射組態與該第二次正光照射組態的設定值之下,第一規則規範下的數值亦為10,即二者皆相同(或差異於一定範圍內),此時進入第二規則來判斷。當該側光照射組態與該第一次正光照射組態的設定值之下,第二規則規範下的數值為32;當該側光照射組態與該第二次正光照射組態的設定值之下,第二規則規範下的數值亦為30,即有一較大者出現,據此,該照射光調整組態即是選定為「該側光照射組態與該第一次正光照射組態的設定值」,亦即,以差異程度大的組態設定值為該照射光調整組態。For example, when the sidelight illumination configuration and the set value of the first positive illumination configuration are below, the value under the first rule specification is 10; when the sidelight illumination configuration and the second positive illumination Under the configured set value, the value under the first rule specification is also 10, that is, both are the same (or different within a certain range), and then enter the second rule to judge. When the side light illumination configuration and the set value of the first positive light illumination configuration are below, the value under the second rule specification is 32; when the side light illumination configuration and the second positive light illumination configuration are set Below the value, the value under the second rule specification is also 30, that is, there is a larger one. According to this, the illumination light adjustment configuration is selected as "the side light illumination configuration and the first positive light illumination group. The set value of the state, that is, the configuration setting with a large difference is the adjustment configuration of the illumination light.
接著請參閱第3(b)圖,係本發明再一實施例中之自動調光方法的流程圖。接續第3(a)圖的步驟,係再執行第二輪的調光步驟,而於該正光第二次調整步驟S303後且於該照射光調整組態被記錄之前(步驟S400),更包含: 步驟S310、關閉所有照射組態; 步驟S311、進行第二輪側光調整步驟,係提供側向入射該待測電路板的側向照射光,其起始之照射強度的調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第二輪第一目標區間值內且該第二輪第一目標區間值的最大數值係大於該第一目標區間值的最大數值(以金屬類型來說,此第二輪第一目標區間值舉例來說可為140~160,此數值係以亮度值範圍在0~255為例,此數值係指側光照射及正光照射下之疊加下所取得的數值),以取得一第二輪側光照射組態的設定值。 步驟S312、進行第二輪第一次正光調整步驟,在維持該第二輪側光照射組態之設定值的照射下(即該第二輪第二目標區間值係等於該第二目標區間值),更提供正向入射該待測電路板的正向照射光,該正向照射光之起始照射強度的調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第二輪第二目標區間值內(以金屬類型來說,此第二輪第二目標區間值舉例來說可為160~180,此數值係以亮度值範圍在0~255為例,此數值係指側光照射及正光照射下之疊加下所取得的數值),以取得一第二輪第一次正光照射組態的設定值,且在該第二輪側光照射組態與該第二輪第一次正光照射組態的設定值下,擷取任兩類型之調光區域間之影像資料的亮度值,取得對應之亮度差異程度。 步驟S313、進行第二輪第二次正光調整步驟,係在維持該第二輪第側光照射組態之設定值的照射下(即該第二輪第三目標區間值係等於該第三目標區間值),更調整該正向照射光以提供高於該第二輪第一次正光照射組態之設定值的正向照射光,該正向照射光的進一步調整係於所選定類型之調光區域內,調整至在當下所擷取影像中的影像亮度值達到一第二輪第三目標區間值內(以金屬類型來說,此第二輪第三目標區間值值舉例來說可為180~200,此數值係以亮度值範圍在0~255為例,此數值係指側光照射及正光照射下之疊加下所取得的數值),以取得一第二輪第二次正光照射組態的設定值,且在該側光照射組態與該第二輪第二次正光照射組態的設定值下,擷取任兩類型之調光區域間之影像資料的亮度值,取得對應之亮度差異程度。Next, please refer to FIG. 3(b), which is a flowchart of an automatic dimming method in still another embodiment of the present invention. Following the step of FIG. 3(a), the second round of dimming step is performed, and after the positive second adjustment step S303 and before the illumination light adjustment configuration is recorded (step S400), Step S310: Turn off all illumination configurations; Step S311: Perform a second round side light adjustment step to provide lateral illumination light that is laterally incident on the circuit board to be tested, and the initial illumination intensity adjustment is selected. In the dimming area of the type, the brightness value of the image in the captured image reaches a second target first target interval value and the maximum value of the second target first target interval value is greater than the first target The maximum value of the interval value (in the case of the metal type, the first target interval value in the second round can be, for example, 140 to 160. This value is in the range of 0 to 255. The value refers to the side light. The value obtained by superimposing under illumination and under normal illumination is obtained to obtain a set value of the second wheel side illumination configuration. Step S312, performing a second round of the first positive light adjustment step, under the illumination of maintaining the set value of the second round side light illumination configuration (ie, the second round of the second target interval value is equal to the second target interval value Providing a forward illumination light that is positively incident on the circuit board to be tested, and the initial illumination intensity of the forward illumination light is adjusted in the selected type of dimming region, and is adjusted to be captured in the current image. The brightness value of the image reaches a second target interval value of the second round (in the case of the metal type, the second target interval value of the second round may be 160 to 180, for example, the value is in the range of 0~ 255 is an example. This value refers to the value obtained by superposition of side light illumination and positive light illumination) to obtain a set value of the first positive illumination illumination configuration of the second round, and the second round side illumination Under the configuration and the set value of the first positive light illumination configuration of the second round, the brightness value of the image data between the two types of dimming areas is extracted, and the corresponding brightness difference degree is obtained. Step S313, performing a second round of the second positive light adjustment step, under the illumination of maintaining the set value of the second round of the first side light illumination configuration (ie, the second round of the third target interval value is equal to the third target The interval value) further adjusts the forward illumination light to provide a forward illumination light that is higher than a set value of the first positive illumination configuration of the second round, and the further adjustment of the forward illumination light is based on the selected type of adjustment In the light region, the brightness value of the image in the image captured in the current image is adjusted to a value of the third target interval of the second round (in the case of the metal type, the second target value of the third target interval may be, for example, 180~200, this value is based on the brightness value range of 0~255. This value refers to the value obtained by the superposition of the side light and the positive light, to obtain a second round of the second positive illumination group. The set value of the state, and in the set configuration value of the side light illumination configuration and the second positive light illumination configuration of the second round, extract the brightness value of the image data between the two types of dimming regions, and obtain corresponding values The degree of brightness difference.
其中,該第二輪第一目標區間值的最大數值係大於該第一目標區間值的最大數值,該第二輪第二目標區間值的最大數值可等於或大於該第二輪第二目標區間值的最大數值,該第二輪第三目標區間值的最大數值可等於或大於該第二輪第三目標區間值的最大數值。較佳的,該第二輪第二目標區間值的最大數值等於該第二輪第二目標區間值的最大數值(或為相同範圍區間),該第二輪第三目標區間值的最大數值等於該第二輪第三目標區間值的最大數值(或為相同範圍區間)。The maximum value of the first target interval value of the second round is greater than the maximum value of the first target interval value, and the maximum value of the second target second interval value may be equal to or greater than the second target second target interval. The maximum value of the value, the maximum value of the third target interval value of the second round may be equal to or greater than the maximum value of the third target interval value of the second round. Preferably, the maximum value of the second target interval value of the second round is equal to the maximum value of the second target interval value of the second round (or the same range interval), and the maximum value of the second target third interval value is equal to The maximum value of the third target interval value of the second round (or the same range interval).
同樣地,該調光區域的類型舉例來說為金屬類型、文字類型、防焊層的亮區類型及防焊層的暗區類型此四者,且於選定該照射光調整組態的步驟中,係自該側光照射組態與該第一次正光照射組態的設定值、該側光照射組態與該第二次正光照射組態的設定值、該第二輪側光照射組態與該第二輪第一次正光照射組態的設定值、該第二輪側光照射組態與該第二輪第二次正光照射組態的設定值,此四者中判定一者作為該照射光調整組態,其中,判定規則的先後係以下列順序來進行,於差異程度之結果相同時始須進入下一規則進行判定,於差異程度之結果不同時係以差異程度大的組態設定值為該照射光調整組態: 第一、 防焊層的亮區類型與防焊層的暗區類型間的亮度差異程度; 第二、 金屬類型與文字類型間的亮度差異程度; 第三、 防焊層的亮區類型及防焊層的暗區類型之最大值與文字類型間的亮度差異程度;以及 第四、 金屬類型與防焊層的亮區類型及防焊層的暗區類型之最大值間的亮度差異程度。Similarly, the type of the dimming area is, for example, a metal type, a text type, a bright area type of the solder resist layer, and a dark area type of the solder resist layer, and in the step of selecting the illumination light adjustment configuration. And the setting value of the side light illumination configuration and the first positive light illumination configuration, the side light illumination configuration and the set value of the second positive light illumination configuration, and the second wheel side illumination configuration And the set value of the first positive light illumination configuration of the second round, the second wheel side light illumination configuration, and the set value of the second round of the second positive light illumination configuration, one of the four is determined as the The illumination light adjustment configuration, wherein the order of the determination rules is performed in the following order, and when the result of the difference degree is the same, the next rule is required to be determined, and when the result of the difference degree is different, the configuration with a large degree of difference is adopted. The set value is the illumination light adjustment configuration: first, the degree of brightness difference between the bright area type of the solder resist layer and the dark area type of the solder resist layer; second, the brightness between the metal type and the text type Degree of difference; third, the type of bright area of the solder mask and the difference between the maximum value of the dark area type of the solder resist layer and the brightness of the text type; and the fourth type, the type of the metal and the bright area of the solder resist layer and solder resist The degree of brightness difference between the maximum values of the dark area types of the layers.
此外,對於金屬類型的調光區域來說,於基於每一種照射組態當下所擷取到之對應該至少一調光區域中之其一的影像資料,以及基於與所選定類型調光區域之預儲存的亮度門檻值標準資料的比較下的步驟中,係以該影像資料中之「紅光波長段」的影像資料來進行比較。In addition, for the metal type dimming region, image data corresponding to one of the at least one dimming region captured under the current illumination configuration, and based on the selected type dimming region In the comparison of the pre-stored luminance threshold data, the image data of the "red wavelength range" in the image data is compared.
綜合上述,本發明利用所擷取影像中代表的光強度值來進行自動調光,且可針對不同類型區域做最佳化處理,使得受檢電路板能在均一化的條件下被檢測,進而可維持電路板的品質均一。In summary, the present invention utilizes the light intensity values represented in the captured images to perform automatic dimming, and can optimize for different types of regions, so that the tested circuit boards can be detected under uniform conditions, and further Can maintain the quality of the board is uniform.
本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.
100‧‧‧控制組
201‧‧‧側向照射光光源
220‧‧‧側向照射光
203‧‧‧正向照射光光源
300‧‧‧攝像組
500‧‧‧待測電路板
S100~S400‧‧‧步驟100‧‧‧Control Group
201‧‧‧ lateral illumination light source
220‧‧‧ lateral illumination
203‧‧‧ Forward illumination source
300‧‧‧ camera group
500‧‧‧Device board to be tested
S100~S400‧‧‧Steps
[圖1]係為本發明一實施例中之自動調光方法的流程圖。 [圖2]係為本發明一實施例中之光學檢測機台的示意圖。 [圖3(a)]係為本發明另一實施例中之自動調光方法的流程圖。 [圖3(b)]係為本發明再一實施例中之自動調光方法的流程圖。1 is a flow chart of an automatic dimming method in an embodiment of the present invention. Fig. 2 is a schematic view showing an optical detecting machine in an embodiment of the present invention. FIG. 3(a) is a flowchart of an automatic dimming method in another embodiment of the present invention. FIG. 3(b) is a flowchart of an automatic dimming method in still another embodiment of the present invention.
S100~S400‧‧‧步驟 S100~S400‧‧‧Steps
Claims (9)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104106592A TWI542869B (en) | 2015-03-03 | 2015-03-03 | Automatic dimming method for optical detection and its optical inspection machine |
| CN201510120954.0A CN106033062B (en) | 2015-03-03 | 2015-03-19 | Automatic dimming method for optical detection and optical detection machine platform thereof |
| JP2015077826A JP6038992B2 (en) | 2015-03-03 | 2015-04-06 | Automatic light control method used in optical inspection and optical inspection apparatus therefor |
| KR1020150052187A KR101675339B1 (en) | 2015-03-03 | 2015-04-14 | Automatic light control method and optical inspection apparatus thereof for optical inspection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104106592A TWI542869B (en) | 2015-03-03 | 2015-03-03 | Automatic dimming method for optical detection and its optical inspection machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI542869B true TWI542869B (en) | 2016-07-21 |
| TW201632874A TW201632874A (en) | 2016-09-16 |
Family
ID=56846813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104106592A TWI542869B (en) | 2015-03-03 | 2015-03-03 | Automatic dimming method for optical detection and its optical inspection machine |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6038992B2 (en) |
| KR (1) | KR101675339B1 (en) |
| CN (1) | CN106033062B (en) |
| TW (1) | TWI542869B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11788972B2 (en) | 2021-04-29 | 2023-10-17 | Industrial Technology Research Institute | Method of automatically setting optical parameters and automated optical inspection system using the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI733062B (en) * | 2018-11-06 | 2021-07-11 | 晶彩科技股份有限公司 | Optical image automatic capture method for compound detection conditions |
| CN112051279B (en) * | 2019-06-06 | 2024-06-21 | 深圳市瑞微智能有限责任公司 | Circuit board welding quality detection method and assembly |
| CN116399869A (en) * | 2021-12-27 | 2023-07-07 | 致茂电子(苏州)有限公司 | Irradiation light adjustment method for flux inspection and inspection equipment using same |
| TWI849992B (en) * | 2023-06-21 | 2024-07-21 | 友達光電股份有限公司 | Method and device of adjusting automated optical inspection (aoi) parameter |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL94368A (en) * | 1990-05-11 | 1993-07-08 | Orbot Systems Ltd | Optic inspection apparatus and illumination system particularly useful therein |
| JP3254873B2 (en) * | 1993-12-03 | 2002-02-12 | ソニー株式会社 | Package visual inspection device and visual inspection method |
| JP3784603B2 (en) * | 2000-03-02 | 2006-06-14 | 株式会社日立製作所 | Inspection method and apparatus, and inspection condition setting method in inspection apparatus |
| JP2003149169A (en) * | 2001-11-16 | 2003-05-21 | Tokyo Seimitsu Co Ltd | Wafer defect examining device |
| JP2003256814A (en) * | 2002-02-27 | 2003-09-12 | Olympus Optical Co Ltd | Substrate checking device |
| JP2006058170A (en) * | 2004-08-20 | 2006-03-02 | Dainippon Screen Mfg Co Ltd | Visual confirmation device and inspection system |
| CN1618421A (en) * | 2004-11-30 | 2005-05-25 | 上海金纳德制药设备科技发展有限公司 | Adjustable luminous source system used for on-line lamp-examination |
| JP2007139676A (en) * | 2005-11-21 | 2007-06-07 | Nec Tohoku Sangyo System Kk | Device and method for inspecting substrate |
| CN101556381A (en) * | 2008-04-10 | 2009-10-14 | 东捷科技股份有限公司 | Detection device and image illumination compensation method thereof |
| US7973921B2 (en) * | 2008-06-25 | 2011-07-05 | Applied Materials South East Asia Pte Ltd. | Dynamic illumination in optical inspection systems |
| JP2013015328A (en) * | 2011-06-30 | 2013-01-24 | Hitachi High-Technologies Corp | Display panel inspection device and display panel inspection method |
| CN103743749A (en) * | 2014-01-03 | 2014-04-23 | 苏州吉视电子科技有限公司 | Device and method for detecting surface quality of flaky parts |
-
2015
- 2015-03-03 TW TW104106592A patent/TWI542869B/en active
- 2015-03-19 CN CN201510120954.0A patent/CN106033062B/en active Active
- 2015-04-06 JP JP2015077826A patent/JP6038992B2/en active Active
- 2015-04-14 KR KR1020150052187A patent/KR101675339B1/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11788972B2 (en) | 2021-04-29 | 2023-10-17 | Industrial Technology Research Institute | Method of automatically setting optical parameters and automated optical inspection system using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160107080A (en) | 2016-09-13 |
| TW201632874A (en) | 2016-09-16 |
| JP2016161564A (en) | 2016-09-05 |
| CN106033062A (en) | 2016-10-19 |
| CN106033062B (en) | 2018-10-23 |
| KR101675339B1 (en) | 2016-11-11 |
| JP6038992B2 (en) | 2016-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10890537B2 (en) | Appearance inspection device, lighting device, and imaging lighting device | |
| TWI542869B (en) | Automatic dimming method for optical detection and its optical inspection machine | |
| JP5861462B2 (en) | Inspection standard registration method for solder inspection and board inspection apparatus using the method | |
| JP2014526706A (en) | Non-contact type component inspection apparatus and component inspection method | |
| TW201531695A (en) | Automatic appearance inspection device | |
| TWI480541B (en) | Wafer pattern inspection method and device | |
| JP2015232477A (en) | Inspection device, inspection method, and program | |
| JP2014038045A (en) | Inspection device, illumination, inspection method, program and substrate producing method | |
| CN110196576A (en) | Image processing system and setting method | |
| KR101679314B1 (en) | Method for inspection of overlapping exposure image mixing using multiple exposure | |
| JP4910897B2 (en) | Solder fillet inspection method and board appearance inspection device | |
| JP5182121B2 (en) | Library data creation method and inspection data creation method for substrate visual inspection | |
| JP5316198B2 (en) | Appearance inspection device | |
| US12260541B2 (en) | Soldering quality inspection method and soldering quality inspection apparatus | |
| JP6461692B2 (en) | Board inspection equipment | |
| TWI487924B (en) | Method and device for inspecting printed circuit board | |
| KR101107562B1 (en) | Lighting Method of Machine Vision System | |
| JP2020134491A (en) | Inspection unit, program and storage medium | |
| JP6825067B2 (en) | Inspection equipment and its control method | |
| TW201928307A (en) | Inspecting system and method for light emitting source | |
| JP6792283B2 (en) | Visual inspection equipment | |
| JP2006275609A (en) | Periodic pattern unevenness inspection apparatus and unevenness inspection method | |
| JP4386326B2 (en) | Printed circuit board inspection method and apparatus used therefor | |
| JP6762614B2 (en) | Board inspection equipment | |
| JP2004146108A (en) | Phosphor inspection method and apparatus |