TWI542061B - Electrical device - Google Patents

Description

Electrical device

The present invention relates to an electrical device and a method of manufacturing the same.

An electronic component having an organic layer as a constituent element, for example, an electronic component such as an organic electroluminescent element, an organic photoelectric conversion element, or an organic transistor, is generally exposed to the atmosphere to compare luminescence characteristics. It is easy to deteriorate. In order to suppress deterioration of characteristics of such an electronic component, a sealing step is generally performed on an electronic component having an organic layer.

The sealing will be described with reference to Fig. 5. Figure 5 is a schematic view showing the sealing step.

In the sealing step, for example, the sealing member 52 is placed so as to surround the electronic component 54 mounted on the support substrate 51, and then the sealing substrate 53 is bonded to the support substrate 51 through the sealing member 52. Thereby, the electronic component 54 is surrounded by the support substrate 51, the sealing substrate 53, and the sealing member 52, and is isolated from the outside.

The sealing member 52 is made of a high gas barrier material. For example, in the case of such a sealing member 52, a frit sealing step using a glass frit containing glass (frit) has been reviewed.

The glass frit is composed of flaky or powdery glass which is melted at a relatively low temperature (hereinafter, abbreviated as "glass frit glass powder"). In the frit sealing step, a glass frit obtained by dispersing the frit glass powder in a solvent is used.

In the frit sealing step, first, the support material sheet 51 on which the electronic component 54 is mounted is linearly supplied with the glass frit so as to continuously surround the electronic component 54, and then preliminary calcination is performed to remove the glass frit in advance. The solvent component of the agent is then bonded to the support substrate 51 and the sealing substrate 53 which are next to the glass frit. The frit glass powder is then temporarily melted by irradiating the frit with laser light. When the irradiation of the laser light is stopped, the temperature of the frit is lowered and the frit is hardened again. In this manner, the sealing member 52 made of the glass in which the glass frit is cured is formed, and the surrounding region is hermetically sealed by the supporting substrate 51, the sealing substrate 53, and the sealing member 52 (see, for example, Patent Document 1).

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-123966.

The heating of the glass frit is performed by irradiating the laser light to the glass frit and scanning the entire glass frit along the entire circumference. When this heating is performed, when the heating temperature of the glass frit is uneven due to the position, the molten state of the frit is uneven. As a result, unevenness occurs in the property of the sealing member itself, the sealing substrate or the supporting substrate, the adhesion to the sealing member, and the like, and the reliability of the sealing is lowered. Therefore, in the frit sealing step, it is necessary to uniformly heat the supplied glass frit throughout the entire circumference to be melted.

However, only the laser light is uniformly irradiated throughout the entire circumference of the frit, which causes uneven heating in the frit. The glass frit is not applied (coated) on a base layer composed of a uniform material, and is usually applied to a base layer having a different material depending on the position.

For example, in an electrical device, a plurality of electrical wirings 55 for inputting an electrical signal to an electronic component from the outside are disposed so as to intersect the glass frit. Therefore, in the base layer to which the glass frit is applied, the portion where the electric wiring 55 is provided and the portion where the electric wiring 55 is not provided exist alternately. The temperature rise characteristic of the glass frit when irradiating the laser light varies depending on the material of the undercoat layer on which the glass frit is applied. Therefore, in the above-described electric device, there is a glass frit applied to the electric wiring 55 and a glass frit applied to a portion where the electric wiring 55 is not provided, when the laser beam is irradiated. This causes the heating temperature of the frit to form different, and the problem of unevenness occurs in the molten state of the frit.

Accordingly, an object of the present invention is to provide an electrical device capable of constituting a sealing material (glass frit) to be uniformly heated and melted.

The present invention provides the following [1] to [6].

[1] An electrical device comprising: a support substrate provided with a sealing region; an electrical circuit disposed in the sealing region; and an electrical wiring on the support substrate from the sealing region to the sealing region An external extension is provided, and an electrical signal input/output source and an electrical circuit are electrically connected; a sealing member is disposed on the support substrate surrounding the sealing region; and the sealing substrate is adhered to the sealing member through the sealing member The electric circuit includes an electronic component having an organic layer, and the electrical wiring is formed of a translucent electrical wiring in an intersection region where the electrical wiring intersects the sealing member.

[2] The electrical device according to [1], wherein the thickness of the light-transmitting electrical wiring is 50 nm or more and less than 300 nm.

[3] The electrical device according to [2], wherein the light-transmitting electrical wiring has a resistivity of less than 300 μΩcm.

[4] The electrical device according to [1] or [2] wherein the electronic component is an organic electroluminescent device, an organic photoelectric conversion device, or an organic transistor.

[5] A method of manufacturing an electrical device according to any one of [1] to [4], comprising: a step of preparing a support substrate, the support substrate being set to have a seal a region, and an electrical circuit disposed in the sealing region and an electrical wiring electrically connecting the electrical signal input/output source and the electrical circuit; and supplying a sealing material along an outer edge of the sealing region a step of bonding the sealing substrate to the support substrate through a sealing material; irradiating the sealing material with an electromagnetic beam to heat and melt the sealing material; and cooling the sealing material to harden it to form a sealing member The steps.

[6] The method for producing an electrical device according to [5], wherein, in the step of heating and melting the sealing material, the electromagnetic beam is irradiated with the same intensity over the entire region in which the sealing material is disposed.

According to the present invention, it is possible to provide an electric device which does not reduce the degree of freedom of design and which can uniformly heat and melt the sealing material.

Embodiments of the present invention will be described below with reference to the drawings. In addition, each drawing is a schematic display of the shape, size, and arrangement of the constituent elements to the extent that the invention can be understood. The present invention is not limited to the following description, and various constituent elements can be appropriately changed without departing from the scope of the invention. In the drawings, the same components are denoted by the same reference numerals, and the description thereof will not be repeated. Further, the configuration of the embodiment of the present invention is not necessarily manufactured or used in the arrangement of the drawings.

The electrical device of the present invention is an electrical device having a supporting substrate, an electrical circuit, an electrical wiring, a sealing member, and a sealing substrate, wherein the electrical circuit is provided with an electronic component having an organic layer, and In the intersection region where the electrical wiring intersects with the sealing member, the electrical wiring is formed of a translucent electrical wiring; the supporting substrate is provided with a sealing region; and the electrical circuit is disposed in the sealing region The electrical wiring is disposed on the support substrate and extends from the inside of the sealing region to the outside of the sealing region, and is electrically connected to the electrical signal input/output source and the electrical circuit; the sealing member surrounds the sealing The region is provided on the support substrate; and the sealing substrate is bonded to the support substrate through the sealing member.

The present invention can be applied to any type of device as long as it includes an electronic component having an organic layer and an electrical device in which an electrical circuit for operating the electronic component is built. Examples of the electronic component having an organic layer include an organic electroluminescence device, an organic photoelectric conversion device, an organic transistor, and the like. For example, the electrical device of the present invention can be applied to a light source or a backlight using an organic electroluminescent element as a pixel; and an organic photoelectric conversion element as a display device for building an electrical circuit, a solar cell, and a light sensing And a photoelectric conversion device built into the electrical circuit; and an organic device for driving or controlling the organic electric field light-emitting element, the organic photoelectric conversion element, and other electronic components to be built into the electrical circuit of the electrical circuit. In the following, an electric device according to the present invention will be described by taking an organic electroluminescence device as a pixel light source and a display device in which an electric circuit is built.

The display device can be roughly classified into an active matrix drive type device and a passive matrix drive type device. The present invention can be applied to both types of display devices. However, in the present embodiment, an active matrix drive type display device will be described as an example.

<Configuration of display device>

First, the configuration of the display device 11 will be described with reference to FIGS. 1 and 2 . Fig. 1 is a plan view schematically showing a display device. Fig. 2 is a schematic cross-sectional view showing a display device having a cross section taken along the line II-II of Fig. 1.

A display device 11 belonging to an electrical device includes a support substrate 12, an electrical circuit 14, an electrical wiring 15, a sealing member 16, and a sealing substrate 17; the support substrate 12 is provided with a sealing region; the electrical circuit 14 The electrical wiring 15 is disposed on the support substrate 12 and extends from the inside of the sealing region 13 to the outside of the sealing region 13 to input an electrical signal to the output source 19 and the electrical circuit. The sealing member 16 is provided on the support substrate 12 so as to surround the sealing region 13 , and the sealing substrate 17 is passed through the sealing member 16 and bonded to the support substrate 12 .

In the first diagram, a region indicated by a broken line surrounding the electric circuit 14 corresponds to the sealing member 16, and a portion surrounded by the sealing member 16 corresponds to the sealing region 13.

The electrical circuit 14 in the present embodiment includes a plurality of organic electroluminescent elements as a light source of a pixel and a pixel circuit that individually drives the organic electroluminescent element. The pixel circuit is viewed from one side in the thickness direction of the support substrate 12 (hereinafter, referred to as "viewing in a plane"), and is formed in an area where image information is displayed (hereinafter, referred to as an image display area 18). The situation). The pixel circuit is composed of an organic transistor, an inorganic transistor, a capacitor, or the like. A planarization film covering the pixel circuit is formed on the pixel circuit formed on the support substrate 12. The planarizing film is made of, for example, an organic insulating film or an inorganic insulating film. Further, since a part of the insulating film is heated while the glass frit is heated to be melted, it is preferable to use a film having heat resistance for the insulating film. Therefore, in the insulating film, the insulating film provided in the portion heated when the glass frit is heated to melt is preferably composed of an inorganic insulating film from the viewpoint of heat resistance. As such an inorganic insulating film, for example, a metal oxide film such as a tantalum oxide film, a tantalum nitride film, or a hafnium oxynitride film can be used. The thickness of the inorganic insulating film is usually from about 50 nanometers (nm) to about 300 nm. In the step of forming an electric circuit, the insulating film can be formed by a conventional film forming method such as a plasma CVD method or a sputtering method.

A plurality of organic electroluminescent elements are disposed on the pixel circuit. That is, the organic electric field light-emitting element is provided on the flattening film in the image display region 18. The organic electroluminescent elements are arranged, for example, in a matrix, and are arranged in the image display region 18 at a predetermined interval in the column direction X and the row direction Y, respectively. The organic electroluminescence element and the pixel circuit are electrically connected to each other through a conductor that penetrates the planarization film in the thickness direction.

As described above, the electrical circuit 14 is disposed in the sealing region 13 defined on the support substrate 12. In other words, the sealing region 13 is set in a region including the image display region 18 in which the electrical circuit 14 is provided.

The support substrate 12 on which the electrical circuit 14 is provided is formed, for example, by a glass plate, a metal plate, a resin film, and a laminate of the above. When a so-called bottom emission type organic electroluminescence element that emits light toward the support substrate 12 is mounted on the support substrate 12, the support substrate 12 is formed by a member that exhibits light transmittance.

In the display device 11, a plurality of electrical wirings 15 for inputting a predetermined electrical signal to the electrical circuit 14 are provided. The predetermined electrical signal refers to an electrical signal for causing a plurality of organic electroluminescent elements to emit light at a predetermined luminous intensity, for example, for individually selecting a plurality of organic electric field light-emitting elements. An electrical signal of an organic electroluminescent element that emits light, and an electrical signal that specifies the luminous intensity of the organic electroluminescent element. Since a plurality of organic electric field light-emitting elements are provided on the display device 11, a plurality of electrical wirings for transmitting electrical signals are formed.

The electrical signal is input from the external electrical signal input/output source 19 to the electrical circuit 14. In the display device 11, the electrical signal input/output source 19 is realized by a so-called drive circuit. Since the plurality of electrical wirings 15 are provided for connecting the electrical signal input/output source 19 and the electrical circuit 14, the support substrate 12 is provided to extend from the inside of the sealing region 13 to the outside of the sealing region 13. Further, a case where an insulating film is provided on the plurality of electrical wirings 15 is also provided.

As shown in Fig. 1, in the present embodiment, a plurality of electrical wires 15 extend from the inside of the sealing region 13 to the outside of the sealing region 13 through one side of the outer edge of the rectangular sealing region 13, and the 俾 is directed to the electrical signal input. The output source 19 is agglomerated. The plurality of electrical wires 15 may extend radially from the inside of the sealing region 13 to the outside of the sealing region 13 around the electrical circuit 14 . Further, the electric signal input/output source 19 is provided closer to the outside than the sealing region 13, and the electric device (display device 11) of the present embodiment may be provided as a drive circuit, and further, an electric signal input/output source 19 It may not be installed in an electrical device.

The sealing member 16 is attached to the support substrate 12 along the outer edge of the sealing region 13 so as to surround the sealing region 13. In other words, the sealing region 13 is the region surrounded by the sealing member 16, and its outer edge is defined by the sealing member 16. Since the plurality of electrical wirings 15 are provided extending from the inside of the sealing region 13 to the outside of the sealing region, the sealing member 16 extending along the outer edge of the sealing region is intersected by the plurality of electrical wirings 15 when viewed in plan. Configured in a way.

A more specific configuration of the display device will be described with reference to FIGS. 3 and 4. Fig. 3 is a view schematically showing an enlarged region (region A: see Fig. 1) in which the sealing member 16 and the electric wiring 15 intersect each other in plan view. Fig. 4 is a schematic cross-sectional view showing a display device having a cross section taken along the line IV-IV shown in Fig. 3.

In the following description, a region in which the electrical wiring 15 and the sealing member 16 intersect and overlap each other in the entire extended region of the sealing member 16 will be referred to as an intersection region (L1), and The remaining area outside the intersection area is called the non-intersection area.

As shown in Fig. 3, a plurality of electrical wirings 15 are arranged to be separated from each other when viewed in plan. The sealing member 16 is provided on a plurality of electrical wirings 15 and extends continuously across a plurality of electrical wirings 15.

In the intersection region where the electrical wiring 15 and the sealing member 16 intersect, the electrical wiring 15 is formed by a light-transmissive electrical wiring. The electrical wiring 15 is configured such that only the intersection region and the vicinity thereof are formed by the transparent electrical wiring, and the electrical wiring of the electrical wiring having a smaller resistivity than the optically conductive wiring constitutes an intersection region and a portion other than the vicinity thereof. Better. This is because the electrical resistance of the entire electrical wiring can be reduced. However, the entire electrical wiring 15 may be formed of a light-transmitting electrical wiring. In addition, since the electrical wiring having a non-translucent property is smaller than the electrically conductive wiring having a lower electric resistance, the electric resistance is smaller than the transmissive electric power in the intersection region of the electrical wiring 15 and the portion other than the vicinity thereof. For the electrical wiring of the wiring, a non-transparent electrical wiring can be used.

As shown in FIG. 4, the electrical wiring 15 of the present embodiment is composed of a pixel-side wiring portion 15a, a cross-wiring portion 15b, and a terminal-side wiring portion 15c. The pixel-side wiring portion 15a is disposed in the sealing region 13, that is, an electrical wiring disposed on the pixel circuit side, and one end thereof is connected to the electrical circuit 14. The cross wiring portion 15b is an electrical wiring disposed in the intersection region and the vicinity thereof. The terminal-side wiring portion 15c is an electrical wiring disposed outside the sealing region 13, and one end thereof is connected to a terminal of the electrical signal input/output source 19. One end of the cross wiring portion 15b is physically connected to the other end of the pixel side wiring portion 15a, and the other end of the cross wiring portion 15b is physically connected to the other end of the terminal side wiring portion 15c. In this manner, the pixel-side wiring portion 15a, the intersecting wiring portion 15b, and the terminal-side wiring portion 15c are electrically connected. In the configuration shown in FIG. 4, both end portions of the cross wiring portion 15b are connected so as to be placed on the pixel side wiring portion 15a and the terminal side wiring portion 15c, respectively. In the cross-wiring portion 15b, the pixel-side wiring portion 15a, and the terminal-side wiring portion 15c, one of the pixel-side wiring portion 15a and the terminal-side wiring portion 15c is placed on both ends of the intersecting wiring portion 15b and the wiring portion 15b is crossed. The other of the pixel side wiring portion 15a and the terminal side wiring portion 15c or the pixel side wiring portion 15a and the terminal side wiring portion 15c may be placed on the cross wiring portion 15b.

In the present embodiment, the cross-wiring portion 15b is formed of a light-transmissive electric wiring, and the pixel-side wiring portion 15a and the terminal-side wiring portion 15c are each an electrical wiring having a smaller electric resistance than the cross wiring portion 15b. It is also composed of electrically non-transparent electrical wiring.

The length L2 of the extending direction of the cross wiring portion 15b is preferably short from the viewpoint of electric resistance. Here, the length L2 in the extending direction of the cross wiring portion 15b refers to the length of the cross wiring portion 15b between one end of the pixel side wiring portion 15a and one end of the terminal side wiring portion 15c. As will be described later, the sealing member 16 on the cross wiring portion 15b is irradiated with an electromagnetic beam. Therefore, the length L2 of the extending direction of the cross wiring portion 15b is preferably larger than the spot diameter of the electromagnetic beam irradiated to the sealing member 16. This is to prevent the electromagnetic beam from being irradiated to the electrically non-transparent electrical wiring.

In the present specification, the diameter of the spot of the electromagnetic beam means that the intensity of the electromagnetic beam on the plane perpendicular to the optical axis extending in the direction of the illumination is connected to the intensity on the optical axis. The diameter of the slightly closed curve that becomes the position of "1/e ² ". The symbol "e" indicates the Napier logarithm. Further, the slightly circular closed curve does not necessarily become a true circle. However, when the diameter of the circular closed curve is approximated, the diameter of the slightly circular closed curve may be approximated by a circle to calculate the diameter. The length L2 of the extending direction of the cross wiring portion 15b is preferably about three times the width L1 of the sealing member 16. Here, the width L1 of the sealing member 16 means the length of the sealing member 16 in the width direction orthogonal to the thickness direction of the support substrate 12 and the extending direction of the sealing member 16.

The light-transmitting electrical wiring in the electrical wiring 15 is formed of a thin film such as a metal thin film or a transparent conductive oxide. Specifically, it is made of Au, Ag, Al, Cu, Cr, W, Mo, Mg, Ta, Ti, indium tin oxide (ITO), indium zinc oxide (IZO). A thin film or a laminated film of the foregoing. Further, when a metal thin film is used, it can be used as a translucent electrode by an extremely thin thickness. However, when the thickness of the metal thin film is too small, the electric resistance becomes high. Therefore, it is preferable to use a transparent conductive oxide film such as ITO or IZO for the translucent electrical wiring.

The thickness of the light-transmitting electrical wiring is preferably 50 nm or more and less than 300 nm.

Further, the electric resistance of the translucent electrical wiring is preferably less than 300 micro ohm-cm (μΩcm). Further, the lower limit value of the resistivity of the light-transmitting electrical wiring is not particularly limited. The electric resistance of the translucent electrical wiring is usually 80 μΩcm or more.

The translucent electrical wiring can be made to penetrate the electromagnetic beam that is irradiated onto the sealing material 16. The light-transmitting electrical wiring is preferably such that the total light transmittance of the electromagnetic beam is 70% or more, and more preferably 80% or more. Further, the translucent electrical wiring is preferably, for example, a visible light transmittance of 80% or more, more preferably 90% or more.

Among the electrical wirings, the non-translucent electrical wirings of the pixel portion wiring 15a and the terminal portion wiring 15c are formed of, for example, a metal thin film. Specifically, it is composed of a film of Au, Ag, Al, Cu, Cr, W, Mg, Ta, Ti, and Mo, or a laminated film of the above. The electrical wiring showing non-transparent properties is capable of reducing the resistance by thickening the thickness, so the thickness is usually 300 angstroms ( ) to 10000 And with 1000 To 5000 It is better.

As shown in FIG. 3 and FIG. 4, in the portion where the sealing member 16 overlaps the electrical wiring 15, the electrical wiring 15 is formed of a translucent electrical wiring, so that the electromagnetic member is irradiated to the sealing member 16. The beam will penetrate the electrical wiring 15. Thereby, the electrical wiring 15 can absorb the energy of the electromagnetic beam and can prevent the temperature of the electrical wiring from rising due to the irradiation of the electromagnetic beam, and as a result, the presence of the electrical wiring 15 can be reduced and brought to the sealing member 16. The effect of temperature rise. Therefore, even if the sealing member 16 is provided on the electric wiring 15 in plan view, the sealing member 16 in the intersecting region and the sealing member 16 in the non-intersecting region can be similarly heated, and unevenness in heating temperature can be suppressed. Since the adhesion and the airtightness are uniform, the reliability of the seal can be improved.

The width and thickness of the sealing member 16 are set in consideration of the required gas density, the characteristics of the sealing material, and the like. The width L1 of the sealing member 16 is usually about 500 μm to 2000 μm, and the thickness of the sealing member 16 is usually about 5 μm to 50 μm.

The sealing substrate 17 is bonded to the support substrate 12 through the sealing member 16. The sealing substrate 17 is composed of a glass plate, a metal plate, a resin film, and a laminate of the above. Further, when the organic electroluminescence device is a so-called top emission type element that emits light toward the sealing substrate 17, the sealing substrate 17 is formed of a member that exhibits light transmittance.

<Method of Manufacturing Display Device>

Next, a description will be given of a manufacturing method of a display device belonging to an electrical device.

A method of manufacturing an electrical device according to the present invention includes: preparing a sealed region, and providing an electrical circuit disposed in the sealed region; and electrically connecting the electrical signal input/output source to the electrical circuit a step of supporting the substrate with the electrical wiring; a step of supplying the sealing material along the outer edge of the sealing region; a step of bonding the sealing substrate to the supporting substrate through the sealing material; and irradiating the sealing material with the electromagnetic beam, a step of heating and melting the sealing material; and a step of cooling the sealing material and hardening it to form the sealing member.

(Steps to prepare the support substrate)

In this step, first, the support substrate 12 provided with the electrical circuit 14 and the electrical wiring 15 is prepared. In the present embodiment, for example, an electric circuit 14 composed of a circuit for driving an organic electroluminescence element and a plurality of organic electroluminescent elements, and an electrical wiring 15 are formed on the support substrate 12. In addition, in this step, a substrate on which the electrical circuit 14 and the electrical wiring 15 are provided in advance may be obtained as the support substrate 12 from the market surface.

Further, when the support substrate 12 is prepared, the substrate is first prepared, and a circuit for driving the organic electroluminescent element and the electrical wiring 15 are formed on the substrate, and a plurality of organic electric field light-emitting elements are further formed on the electrical wiring 15 as The electric circuit 14 and the support substrate 12 of the electric wiring 15 may be used.

The pixel circuit and the electrical wiring 15 which have been described can be formed by a known manufacturing technique of a semiconductor element. In addition, for example, the pixel side wiring portion 15a and the terminal side wiring portion 15c are formed first, and then the intersection portion 15b is formed, or the intersection portion 15b is formed first, and then the pixel side wiring portion 15a is formed. The terminal side wiring portion 15c is formed. The electrical wiring 15 can be formed by, for example, a coating method, a vapor deposition method, a sputtering method, or the like.

Further, the electrical wiring 15 can be patterned by photolithography.

The organic electroluminescent device is composed of a pair of electrodes and a light-emitting layer provided between the pair of electrodes.

Further, in addition to the electrode and the light-emitting layer of the organic electroluminescence element, a predetermined layer may be provided as needed. Examples of such a predetermined layer include a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer. The organic electroluminescent device can be formed on a pixel circuit by laminating a plurality of layers of the organic electroluminescent device. Although the organic electroluminescent device has a low molecular type organic electroluminescent device and a polymer type organic electroluminescent device, the present invention can be applied to any type of organic electroluminescent device. Each layer of the organic electroluminescence device can be a dry method such as a vapor deposition method or a sputtering method, or a wet method such as an ink jet method, a nozzle printing method, or a spin coating method. The predetermined method of stacking is sequentially performed.

(Step of supplying sealing material)

In this step, the sealing material is supplied along the outer edge of the sealing region 13. The sealing material may be supplied to at least one of the support substrate 12 and the sealing substrate 17.

In the present embodiment, a sealing material is supplied onto the sealing substrate 17.

In the present embodiment, a paste-like glass frit is used as the sealing material. The paste-like glass frit contains a glass frit glass powder and a vehicle. The vehicle liquid is composed of a binder and a solvent for dispersing the binder and the glass frit powder.

In the frit glass powder, a low melting point containing V ₂ O ₅ , VO, SnO, SnO ₂ , P ₂ O ₅ , Bi ₂ O ₃ , B ₂ O ₃ , ZnO, and SiO _{2 may} be used. Glass powder. For the glass frit glass powder, for example, BAS115, BNL115BB-N, FP-74 (trade name) manufactured by Asahi Glass Co., Ltd., or the like can be used.

For the adhesive, nitro cellulose, methyl acrylate, ethyl acrylate, butyl acrylate, ethyl cellulose may be used. , hydroxypropyl cellulose, butyl cellulose, and the like.

As the solvent, butyl carbitol acetate, propylene glycol diacetate, methyl ethyl ketone, ethyl carbitol acetate may be used. , amyl acetate and the like.

The sealing material is supplied to at least one of the support substrate 12 and the sealing substrate 17, for example, by a predetermined coating method. The sealing material is supplied by a printing method such as a screen printing method, a lithography method, an inkjet printing method, or a nozzle printing method, and a coating method using a dispenser. Screen printing is preferred among the various methods. It is easy to control the uniformity of the thickness of the sealing material, the reproducibility of the coating state, and the like on the coated surface, and it is possible to apply it in a short time.

Next, preliminary calcination in this embodiment is carried out. By performing preliminary calcination, unnecessary components in the sealing material can be removed. That is, the vehicle liquid is removed from the frit by performing preliminary calcination of the vaporizing solvent and burning the adhesive. As a result, the frit glass powder remains on the sealing substrate 17. The preliminary calcination is carried out at a temperature capable of removing the vehicle liquid, for example, at 300 ° C to 500 ° C. Further, in addition to the sealing material, when the sealing substrate 17 is provided with a member which undergoes chemical change by heating, it is preferable to selectively heat only the sealing material and the vicinity thereof in the preliminary firing. For example, when a part of the electric circuit 14 is also formed on the sealing substrate 17, it is preferable to perform preliminary calcination without heating the electric circuit 14 formed on the sealing substrate 17. Further, in the present embodiment, although the sealing material is supplied onto the sealing substrate 17, when the sealing material is initially supplied on the supporting substrate 12, and the preliminary sealing of the sealing material is further performed, in order to prevent the organic electroluminescent element from being caused by the preliminary calcination And the pixel circuit is degraded to preferably only heat the sealing material and its surrounding area.

(Steps of bonding the sealing substrate and the supporting substrate)

Next, the sealing substrate 17 is bonded to the support substrate 12. In the present embodiment, preliminary sealing is performed using a photocurable resin. The preliminary sealing is, for example, first, the photocurable resin is supplied along the sealing material in the region on the outer side of the supplied sealing material, and then the sealing substrate 17 and the supporting substrate 12 are bonded in a vacuum or an inert gas atmosphere.

The bonding of the sealing substrate 17 and the support substrate 12 can be performed based on an alignment mark. For example, a correction mark is previously provided on the sealing substrate 17 and the support substrate 12, and the position of the alignment mark is recognized by the optical sensor, and the alignment of the sealing substrate 17 and the support substrate 12 is performed based on the recognized position information. It suffices that the sealing substrate 17 and the support substrate 12 are bonded together.

After bonding the sealing substrate 17 and the support substrate 12, the photocurable resin is irradiated with light to cure the photocurable resin. Thereby the sealing area 13 is initially sealed. As the photocurable resin, for example, an ultraviolet curable epoxy resin or an ultraviolet curable acrylic resin can be used. In the first to fourth figures, the photocurable resin is not shown, but when the preliminary sealing is performed, since the photocurable resin extends along the sealing member 16, in actuality, for example, the sealing member is shown in FIG. A line of 16 and two lines representing the line of the photocurable resin are formed to extend along the outer edge of the sealing region 13. Further, when the photocurable resin and the sealing member 16 are provided adjacent to each other, when the sealing material is heated and melted by laser (electromagnetic beam), since the photocurable resin is burned, the photocurable resin and the sealing member 16 are used. It is preferable to arrange it by isolating, for example, 0.5 mm or more.

Further, in other embodiments, although the preliminary sealing is an essential part, after the glass frit sealing step, unnecessary portions of the electrical device may be separated from the electrical device. For example, the photocurable resin used for preliminary sealing is cut between the sealing member 16 and the portion of the photocurable resin disposed outside the sealing member 16 is separated from the electrical device as an unnecessary portion. In this case, at the time of preliminary sealing, the photocurable resin may be separated from the sealing member 16 by a predetermined distance, and may be disposed to surround the sealing member 16.

When the preliminary sealing is performed in a vacuum, the degree of vacuum is preferably from 1 Pa to 90 kPa. Further, in the case of initial sealing in an inert gas atmosphere, it is preferred to perform preliminary sealing in an inert gas atmosphere having a dew point of -70 ° C or less. Further, as the inert gas, argon gas or nitrogen gas can be used. Further, in the light irradiated to the photocurable resin, ultraviolet rays can be used. Thus, by performing a preliminary seal in a vacuum or an inert gas atmosphere, the initial seal in the atmosphere can reduce the moisture concentration and the oxygen concentration in the sealed region. Further, in the preliminary sealing, although it is not necessarily a high gas density, in the state of the preliminary sealing, by performing the frit sealing described later, the gas density in the sealed region can be increased, whereby the water in the sealed region can be obtained. The concentration and oxygen concentration are kept in a state where the gas is more reduced.

(Step of heating and sealing the sealing material)

In the present embodiment, after the preliminary sealing, the sealing material is heated and melted in the atmosphere. The heating and melting of the sealing material is performed by irradiating the sealing material with an electromagnetic beam.

In the present embodiment, the irradiation of the electromagnetic beam is performed from the side of the sealing substrate 17 among the support substrate 12 and the sealing substrate 17. For example, a head that emits an electromagnetic beam (hereinafter, referred to as an electromagnetic head) is disposed on the sealing substrate 17, and an electromagnetic beam is irradiated toward the sealing substrate 17. The electromagnetic beam emitted from the electromagnetic beam irradiation head penetrates the sealing substrate 17 and is irradiated to the sealing material. In the electromagnetic beam, it is suitable to use light with high energy density, so it is suitable to use laser light. Further, in the case of the electromagnetic beam, it is preferable to use light having a wavelength at which the sealing material efficiently absorbs light energy, and light having a high transmittance to penetrate the wavelength of the sealing substrate 17. In other words, it is suitable for the sealing substrate 17 to employ a member that easily penetrates the electromagnetic beam, and for the sealing material, a material that easily absorbs the electromagnetic beam is suitably employed. The peak wavelength of the light used for the electromagnetic beam is usually from 190 nm to 1200 nm, and preferably from 300 nm to 1100. For the laser device that radiates the electromagnetic beam, for example, a YAG laser device, a semiconductor laser device, an argon ion laser device, and an eximer laser device can be employed.

The irradiation of the electromagnetic beam is, for example, a control device capable of spatially moving (scanning) the electromagnetic beam head by three degrees. For example, the electromagnetic beam irradiation head may be disposed at a predetermined interval from the sealing material, and the sealing material may be irradiated with an electromagnetic beam, and the electric beam irradiation head may be scanned along the sealing material. Further, the irradiation of the electromagnetic beam may be performed by varying the intensity of the electromagnetic beam with time, but the electromagnetic beam is not irradiated, and the electromagnetic field is irradiated with the same intensity over the entire area in which the sealing material is disposed. The beam is better. This is because the setting of the device has become simple.

In addition, when changing the intensity of the electromagnetic beam, there is a case where it is necessary to reduce the scanning speed of the electromagnetic beam irradiation head, but when the electromagnetic beam irradiation head is scanned while maintaining a certain strength, There is no need to reduce the speed of the scanning, so the time required for the electromagnetic beam irradiation head to circumnze the sealing material for one week can be shortened. Further, the irradiation of the electromagnetic beam may be performed by scanning the electromagnetic radiation head with respect to the sealed sealing substrate 17 and the supporting substrate 12, but it is not limited to the electromagnetic beam irradiation head, for example, by The bonded sealing substrate 17 and the supporting substrate 12 may be moved or may be moved by moving both the bonded sealing substrate 17 and the supporting substrate 12 and the electromagnetic beam irradiation head. The movement of the bonded sealing substrate 17 and the supporting substrate 12 can be performed by placing the bonded sealing substrate 17 and the supporting substrate 12 on the stage on which the moving mechanism is placed, and moving the platform.

The diameter of the spot of the electromagnetic beam is preferably adjusted. The size of the spot diameter can be adjusted by using optical elements such as a condenser lens.

(Steps of forming a sealing member)

Next, the molten sealing material is cooled and hardened to form the sealing member 16. Further, the melted sealing material can be cooled by lowering the temperature around the display device, or can be lowered by natural cooling. For example, since the temperature of the sealing material is naturally lowered by stopping the irradiation of the electromagnetic beam, the melted sealing material naturally hardens. Thus, the sealing member 16 is formed, and the sealing portion 13 is hermetically sealed.

According to the above description, in the cross-sectional region where the electrical wiring 15 and the sealing member 16 intersect in the plan view, the electrical wiring 15 is formed by the translucent electrical wiring, so that the electromagnetic radiation is applied to the sealing member 16. The bundle will penetrate the electrical wiring 15. Thereby, it is possible to suppress the energy of the electromagnetic wiring 15 from being absorbed by the electrical wiring 15 and to suppress the temperature of the electrical wiring 15 from rising due to the irradiation of the electromagnetic beam. As a result, the influence of the temperature rise of the sealing member 16 can be reduced by reducing the presence of the electric wiring 15. Therefore, even if the sealing member 16 is provided on the electric wiring 15 in plan view, the sealing member 16 in the intersecting region and the sealing member 16 in the non-intersecting region can be similarly heated, that is, the unevenness of the heating temperature can be suppressed. Thereby, the molten sealing material can be uniformly heated, and as a result, the property of the sealing member 16 itself, the sealing property of the sealing substrate 17 or the support substrate 12, and the sealing member 16 can be made uniform, and the reliability of the sealing can be improved. .

Further, since the outer shape of the electrical wiring 15 can be made the same as that of a conventional electrical device, the design of a mask used when the electrical wiring 15 is formed by a vapor deposition method can be used. The design of the technical mask.

In the above-described embodiment, a display device in which the electrical circuit 14 is provided on the support substrate 12 will be described. However, it is also possible to provide the electrical circuit 14 on the side of the sealing substrate 17. For example, the pixel circuit may be provided on the support substrate 12 and the organic electroluminescent device may be provided on the sealing substrate 17. Further, the pixel circuit provided on the support substrate 12 and the organic electroluminescent device provided on the sealing substrate 17 may be electrically connected by a predetermined conductive member.

Further, in the above-described embodiment, the active matrix drive type display device will be described, but the present invention is also applicable to a passive matrix drive type display device.

Further, in the above-described embodiment, a display device provided with an organic electroluminescent device as an electronic component having an organic layer will be described as an example. However, an organic transistor having an organic layer is also exemplified. Therefore, the present invention is also applicable to a display device using an organic transistor for a transistor constituting a part of a pixel circuit.

11. . . Display device

12. . . Support substrate

13. . . Sealed area

14. . . Electrical circuit

15. . . Electrical wiring

16. . . Sealing member

17. . . Sealing substrate

18. . . Image display area

19. . . Electrical signal input and output source

51. . . Support substrate

52. . . Sealing member

53. . . Sealing substrate

54. . . Electronic component

55. . . Electrical wiring

Fig. 1 is a plan view schematically showing a display device.

Fig. 2 is a schematic cross-sectional view showing a display device having a cross section taken along the line II-II of Fig. 1.

Fig. 3 is a view schematically showing an area where the enlarged sealing member and the electric wiring intersect.

Fig. 4 is a schematic cross-sectional view showing a display device having a cross section taken along the line IV-IV shown in Fig. 3.

Figure 5 is a schematic view showing the sealing step.

11. . . Display device

12. . . Support substrate

13. . . Sealed area

14. . . Electrical circuit

15. . . Electrical wiring

16. . . Sealing member

17. . . Sealing substrate

18. . . Image display area

19. . . Electrical signal input and output source

Claims (6)

An electrical device includes: a support substrate having a sealing region; an electrical circuit disposed in the sealing region; and an electrical wiring extending from the sealing region to the outside of the sealing region on the support substrate Providing and electrically connecting an electrical signal input/output source and the electrical circuit; a sealing member is disposed on the support substrate surrounding the sealing region; and sealing the substrate to exhibit light transmittance and transmitting through the sealing member And the electrical circuit is provided with an electronic component having an organic layer, and the electrical wiring is configured by: transmitting light at an intersection of the electrical wiring and the sealing member; Electrically-conductive wiring; an opaque electrical wiring connected to one end of the light-transmitting electrical wiring and having a smaller resistivity than the transparent electrical wiring; and a light-transmitting property provided outside the sealing region The other end of the electrical wiring is connected, and the opaque electrical wiring having a smaller resistivity than the translucent electrical wiring is provided. The electrical device according to claim 1, wherein the thickness of the light-transmitting electrical wiring is 50 nm or more and less than 300 nm. The electrical device according to claim 1, wherein the translucent electrical wiring has a resistivity of less than 300 μΩcm. An electrical device according to claim 1, wherein the electronic component The component is an organic electric field light-emitting element, an organic photoelectric conversion element, or an organic transistor. A method of manufacturing an electrical device according to claim 1, comprising the steps of: preparing a supporting substrate, wherein the supporting substrate is provided with a sealing region, and is provided with An electrical circuit in the sealing region and an electrical wiring electrically connecting the electrical signal input/output source and the electrical circuit; a step of supplying a sealing material along an outer edge of the sealing region; and transmitting the sealing material a step of bonding the sealing substrate to the support substrate; and irradiating the sealing material with an electromagnetic beam from the sealing substrate side to heat and melt the sealing material; and cooling the sealing material to cure the sealing member step. The method for producing an electrical device according to claim 5, wherein in the step of heating and melting the sealing material, the electromagnetic beam is irradiated with the same intensity over the entire region in which the sealing material is disposed.