TWI541511B - Probe card - Google Patents

Description

Probe card

This invention relates to a probe card, and more particularly to a cantilever probe card.

The main purpose of the probe card is to directly contact the solder pads or bumps on the object to be tested (such as a wafer) by its probe, and cooperate with the peripheral test machine and software control to achieve automatic measurement purposes, and further Screening out the defective product, usually by sending the test signal through the test machine, the probe is stuck to the object to be tested, and then the test result signal is sent back by the test object, and the probe is stuck to the test instrument for analysis.

The probe card has a precision contact mechanism to test the circuit on the wafer and perform electrical testing to ensure that the electrical characteristics and performance of the wafer are manufactured according to design specifications. During the test, it is often necessary to install some electronic circuits on the probe card to ensure that the signal sent to the chip is correct. However, due to the space of the printed circuit board on the probe card, these electronic circuits are often not fully installed, or the difficulty of the layout of the probe card circuit is increased, resulting in an increase in design cost and even a limitation in circuit layout. The components of the electronic circuit cannot be placed adequately, making the test results inconsistent with the requirements.

One aspect of the present invention is to provide a probe card that provides sufficient space for the electronic circuit to be fully installed without being limited by the limited space on the printed circuit board.

According to an embodiment of the invention, a probe card comprises a printed circuit board, at least one power/signal conductor piece, at least one ground conductor piece, at least one insulator, at least one electronic circuit, at least one power source/signal probe and at least one Ground probe. The power/signal conductor is electrically connected to the power supply or signal. The grounding conductor piece is electrically connected to the ground potential. The insulator is located between the power/signal conductor piece and the ground conductor piece. The two ends of the electronic circuit are electrically connected to the power supply/signal conductor piece and the grounding conductor piece, respectively. The power/signal probe is electrically connected to the power/signal conductor, and the power/signal probe is directly or indirectly connected to the printed circuit board for touching at least one power/signal contact of at least one object to be tested. The power/signal conductor piece is located between the printed circuit board and the power/signal probe. The grounding probe is electrically connected to the grounding conductor piece, and the grounding probe is directly or indirectly connected to the printed circuit board for contacting at least one grounding contact of the object to be tested, and the grounding conductor piece is located between the printed circuit board and the grounding probe.

The above-described embodiments of the present invention, as compared to the prior art, provide sufficient space for the power/signal conductor strips and the ground conductor strips to be adequately mounted without being limited by the limited space on the printed circuit board.

100‧‧‧ probe card

110‧‧‧Printed circuit board

113‧‧‧Input area

115‧‧‧Drop area

117‧‧‧ probe area

117a‧‧‧metal solder joints

120, 120a, 120b, 120c‧‧‧Power/signal conductor

130, 130a, 130b, 130c‧‧‧ Grounding conductor pieces

140, 140a, 140b, 140c‧‧‧ insulators

150, 150a, 150b, 150c‧‧‧ electronic circuits

160, 160a, 160b, 160c‧‧‧Power/Signal Probes

170, 170a, 170b, 170c‧‧‧ Grounding probe

160r, 170r‧‧‧ needle tip

160s, 170s‧‧‧ needle tail

160t, 170t‧‧‧ oblique extension

160u, 170u‧‧‧ bends

200, 200a, 200b‧‧‧ test objects

201, 201a, 201b‧‧‧ power/signal contacts

202, 202a, 202b‧‧‧ grounding contacts

300‧‧‧Connecting parts

M‧‧‧ partial

W1‧‧‧ first width

W2‧‧‧ second width

W3‧‧‧ third width

1 is a front elevational view of a probe card in accordance with an embodiment of the present invention.

Fig. 2 is a front elevational view showing a portion M of the probe card of Fig. 1.

Fig. 3 is a side view showing a portion M of Fig. 1.

FIG. 4 is a partial schematic view showing the power/signal probe and the grounding probe of FIG. 2 touching the object to be tested.

FIG. 5 is a partial schematic view showing the power/signal probe and the grounding probe of FIG. 2 touching the object to be tested.

Figure 6 is a front elevational view of a probe card in accordance with another embodiment of the present invention.

Figure 7 is a front elevational view of a probe card in accordance with still another embodiment of the present invention.

Figure 8 is a side elevational view of the probe card of Figure 7.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Unless otherwise defined, all terms (including technical and scientific terms) used herein are intended to mean the meaning Furthermore, the above vocabulary is commonly used. The definitions in the dictionary should be interpreted as meanings consistent with the field of the invention in the context of the present specification. Unless specifically defined, these terms are not to be interpreted as idealized or overly formal.

1 is a front elevational view of a probe card 100 in accordance with an embodiment of the present invention. 2 is a front elevational view of a portion M of the probe card 100 of FIG. 1. Fig. 3 is a side view showing a portion M of Fig. 1. As shown in FIGS. 1 to 3, the probe card 100 includes a printed circuit board 110, at least one power/signal conductor piece 120, at least one grounding conductor piece 130, at least one insulator 140, at least one electronic circuit 150, at least one power source/ The signal probe 160 is coupled to at least one ground probe 170. The power/signal conductor piece 120 is electrically connected to a power source or a signal. The grounding conductor piece 130 is electrically connected to the ground potential. The insulator 140 is located between the power/signal conductor piece 120 and the ground conductor piece 130. Further, the power/signal conductor piece 120, the insulator 140, and the ground conductor piece 130 are stacked. The power circuit/signal conductor piece 120 and the grounding conductor piece 130 are electrically connected to the two ends of the electronic circuit 150 respectively. The power/signal probe 160 is electrically connected to the power/signal conductor piece 120, and the power/signal probe 160 is directly or indirectly connected to the printed circuit board 110 for touching at least one object to be tested (Device Under Test; DUT, 1st) At least one power/signal contact of ~3 (not shown). The power/signal conductor patch 120 is located between the printed circuit board 110 and the power/signal probe 160. The grounding probe 170 is electrically connected to the grounding conductor piece 130, and the grounding probe 170 is directly or indirectly connected to the printed circuit board 110 for contacting at least one grounding contact of the object to be tested. The grounding conductor piece 130 is located on the printed circuit board 110. Grounded between probes 170. In this way, the power/signal conductor piece 120 and the grounding conductor piece 130 will be able to provide sufficient space to install appropriate electronic power. Road 150.

In the present embodiment, the power supply/signal conductor piece 120, the grounding conductor piece 130, the insulator 140, the electronic circuit 150, the power/signal probe 160, and the grounding probe 170 of the probe card 100 are three sets. In order to avoid the complexity of the drawing, in some drawings (for example, Figures 1 and 3), only one group is represented as a representative, and in some parts that need to distinguish each group (for example, Figure 2), the tail is added. The codes a, b, and c are distinguished.

In a practical application, the power/signal conductor piece 120 can be electrically connected to a power source or a signal. Generally, the signal refers to a test signal. When the power source is electrically connected, the power/signal conductor piece 120 can be further referred to as a power conductor piece. The electronic circuit 150 can be a capacitor, a voltage stabilizing circuit or a filter circuit. The power/signal probe 160 is a power probe, and is electrically connected to the power conductor piece for contacting at least one power contact of the object to be tested. When the signal is electrically connected, the power/signal conductor piece 120 can be further referred to as a signal conductor piece, and the electronic circuit 150 can be an electrostatic discharge (ESD) protection circuit or an impedance matching circuit, and the power/signal probe 160 is a signal probe. The signal conductor piece is electrically connected to touch at least one signal contact of the object to be tested. Further, the ground potential must be defined according to the actual situation, that is, whether the ground potential is electrically independent. If the ground potential is not electrically independent, it means that the power or signal uses a common ground potential as a reference. If the ground potential is electrically independent and is used for power and signal, when the power/signal conductor piece 120 is used as the power conductor piece, the grounding conductor piece 130 needs to be electrically connected to the ground potential used by the power source, when the power/signal conductor piece 120 As the signal conductor piece, the grounding conductor piece 130 needs to be electrically connected to the ground potential used for the signal. Power/signal conductor The chip 120 takes a power conductor piece as an example, and the electronic circuit 150 takes a capacitor as an example to filter out noise in the power source. Specifically, when the power source and the test signal enter the object to be tested through the probe card 100, since the power source is DC and the test signal is AC, the power source and the test signal interfere with each other to generate noise, causing the power source to be interfered. , causing a decline in Power Performance. As described above, the power conductor piece and the ground conductor piece 130 can provide sufficient space to mount the capacitance, thereby filtering out noise in the power signal. In addition, since the power conductor piece and the grounding conductor piece 130 are disposed at a position close enough to the object to be tested, the capacitance can also be installed at a position close enough to the object to be tested, so that the noise is not easily in the path of the capacitance to the object to be tested. produce.

As shown in FIGS. 2 and 3, in the present embodiment, the number of electronic circuits 150 is plural, and they are all arranged on the power/signal conductor piece 120 and the ground conductor piece 130. For example, when the power/signal conductor piece 120 is a power conductor piece and the electronic circuit 150 is a capacitor, a plurality of capacitors arranged on the power conductor piece and the ground conductor piece 130 can improve the power conductor piece and the ground conductor piece 130. The capacitance between the two can further improve the effect of filtering noise, but the invention is not limited thereto. Further, the capacitance value of the power conductor piece and the grounding conductor piece 130 can be increased according to the number of arrays, so that the effect of filtering noise can be effectively improved, but in the prior art, one end of the power supply probe must be electrically charged. The connection is made to the printed circuit board 110, so that a large number of capacitors cannot be set in space, and therefore, the capacitance value cannot be higher than the embodiment of the present invention.

It should be understood that the selection of the above-mentioned electronic circuit 150 for the capacitor is merely an example, and is not intended to limit the present invention. If there is general knowledge, the type of electronic circuit 150 should be appropriately selected depending on actual needs. For example, the electronic circuit 150 can be a voltage regulator circuit, a filter circuit, an electrostatic discharge protection circuit, or an impedance matching circuit, but the invention is not limited thereto.

Structurally, the power/signal probe 160 and the grounding probe 170 respectively have a tip 160r/170r and a pin tail 160s/170s, and a portion between the tip 160r of the power/signal probe 160 and the pin tail 160s is connected and fixed to the connection. The chip 300 is used to touch the power/signal contacts on the object to be tested, and the pin tails 160s are used for direct or indirect electrical connection with the printed circuit board 110. Similarly, the portion between the tip 170r of the grounding probe 170 and the tail 170s is also connected and fixed to the connector 300, and the tip 170r is used to touch the ground contact on the object to be tested, and the tail 170s is used for printing. The circuit board 110 is electrically connected directly or indirectly. The power/signal probe 160 and the grounding probe 170 respectively have an inclined extending portion 160t/170t and a bent portion 160u/170u at a portion of the connecting member 300 to the tip 160r/170r, and the inclined extending portions 160t/170t are respectively power/signal The probe 160 and the grounding probe 170 are extended by the connecting member 300 toward the needle tip 160r/170r, and the bent portion 160u/170u is bent between the inclined extending portion 160t/170t and the needle tip 160r/170r, respectively. It is an inclined extension 160t/170t and a needle tip 160r/170r. The power/signal conductor piece 120 and the ground conductor piece 130 are located between the connector 300 and the printed circuit board 110.

As shown in FIG. 1, the printed circuit board 110 has an input area 113, a wiring area 115, and a probe area 117 from the outside. The input area 113 has a plurality of contacts for inputting signals to the test machine. Generally, the input area 113 A plurality of contacts are disposed on one side of the printed circuit board 110, such as the upper surface of the printed circuit board 110. These signals are routed through the wiring in the trace area 115 and finally supplied from the probe in the probe area 117 to the object to be tested. The wiring end of the wiring area 115 is connected to the contact of the input area 113, and the other end is connected to The contacts of the probe region 117, in general, the plurality of contacts of the probe region 117 are disposed on the other side of the printed circuit board 110, such as the lower surface of the printed circuit board 110, and the probes in the probe region 117 One end of the needle is electrically connected to the contact of the probe area 117, and the other end is used as a contact for measuring the object to be tested. More specifically, the printed circuit board 110 further includes a plurality of metal pads 117a. The metal solder joint 117a is located in the probe area 117, and the power/signal probe 160 and the grounding probe 170 are both located in the probe area 117, and the metal solder joint 117a and the power/signal probe 160 are respectively connected to the two ends of the power/signal conductor piece 120. The needle tail 160s, the two ends of the grounding conductor piece 130 are respectively connected with the metal pad 117a and the needle tail 170s of the grounding probe 170, and the power/signal probe 160 and the grounding probe 170 are at the portion of the connecting member 300 to the tail of the needle 160s/170s. The tilting manner extends toward the power/signal conductor piece 120 and the grounding conductor piece 130, respectively. The power/signal conductor piece 120 and the grounding conductor piece 130 are obliquely connected by the connecting member 300 (or the power/signal probe 160 and the pin tail 160s/170s portion of the grounding probe 170) toward the metal pad 117a of the printed circuit board 110. extend.

In addition, the power/signal conductor piece 120 and the grounding conductor piece 130 can be used as an alternative signal line or ground line, so that the user can skip the signal line or the ground line inside the printed circuit board 110, and the power/signal conductor piece 120 or the grounding conductor piece 130 is electrically connected to the signal or the ground potential.

In addition, in the present embodiment, the power/signal conductor piece 120 is The ground conductor pieces 130 may each be a conductor layer in a flexible coated conductor plate. More specifically, the power/signal conductor piece 120 and the grounding conductor piece 130 may each be a copper foil in a flexible copper clad laminate, but the invention is not limited thereto. In some embodiments of the present invention, the power/signal conductor piece 120 and the grounding conductor piece 130 may also be copper pieces.

In some embodiments of the present invention, the ground conductor piece 130 may be located between the power/signal conductor piece 120 and the printed circuit board 110. Thereby, the grounding conductor piece 130 can function as a shield to avoid interference of the power signal in the power/signal conductor piece 120, and also to prevent power or signal in the power/signal conductor piece 120 from interfering with other signals. In addition, in practical applications, the power/signal conductor piece 120 may also be disposed between the ground conductor piece 130 and the printed circuit board 110, depending on the needs of the test.

A fixing manner such as double-sided tape, dispensing or soldering may be employed between the grounding conductor piece 130 and the printed circuit board 110 to place at least a portion of the grounding conductor piece 130 on the printed circuit board 110.

In some embodiments of the invention, the insulator 140 may actually be a double-sided tape. In this way, in addition to the insulation function, the insulator 140 can bond the power/signal conductor piece 120 and the grounding conductor piece 130.

In some embodiments of the present invention, the power/signal probe 160 and the grounding probe 170 may be connected to the printed circuit board 110 by the connector 300. The connector 300 described above may be, for example, a black glue.

As shown in Fig. 2, the power supply/signal conductor piece 120a, the ground conductor piece 130a, and the insulator 140a have a first width W1, a second width W2, and a third width W3, respectively. In this embodiment, the first width W1, the second The width W2 and the third width W3 may be 4 mm, 2 mm, and 3 mm, respectively, but the invention is not limited thereto.

FIG. 4 is a partial schematic view showing the power/signal probes 160a and 160b and the grounding probes 170a and 170b of FIG. 2 touching the object to be tested 200. As shown in FIG. 4, in the present embodiment, the object to be tested 200 has a plurality of functional blocks, each of which has its own power/signal contacts 201a, 201b and ground contacts 202a, 202b. A test object 200 will have a plurality of power/signal contacts 201a, 201b and ground contacts 202a, 202b. In some test specifications, the power/signal contacts 201a, 201b of each functional block are electrically independent of the ground contacts 202a, 202b. In order to meet these test specifications, the present embodiment provides multiple sets of power/signal conductor pieces 120a, 120b, 120c, ground conductor pieces 130a, 130b, 130c, insulators 140a, 140b, 140c, electronic circuits 150a, 150b, 150c, power/signal The probes 160a, 160b, and 160c and the grounding probes 170a, 170b, and 170c, and the power/signal probes 160a and 160b and the grounding probes 170a and 170b of the respective groups respectively correspond to the power/signal contacts of the functional blocks. 201a, 201b and ground contacts 202a, 202b. As shown in FIG. 4, the power/signal probe 160a touches the power/signal contact 201a, the power/signal probe 160b touches the power/signal contact 201b, the ground probe 170a touches the ground contact 202a, and is grounded. Probe 170b touches ground contact 202b. Thereby, the power/signal and ground potential obtained by each functional block will be electrically independent to avoid affecting the test results. Further, if the power/signal contacts 201a, 201b refer to the power contacts, the ground contacts 202a refer to the ground contacts used by the corresponding power contacts 201a, and the ground contacts 202b refer to the corresponding power contacts. The grounding contact used by 201b indicates that the power supply and ground potential obtained by each functional block will be electrically independent, and the ground potential of the signal and signal will be the same.

FIG. 5 is a partial schematic view showing the power/signal probes 160a and 160b and the grounding probes 170a and 170b of FIG. 2 touching the objects to be tested 200a and 200b. As shown in FIG. 5, when the probe card 100 of FIG. 1 is applied to simultaneously test a plurality of test objects 200a, 200b, since each of the objects to be tested 200a, 200b has its own power/signal contact 201a, 201b and ground contacts 202a, 202b, and in some test specifications, the power/signal contacts 201a, 201b of each of the objects 200a, 200b are electrically independent from the ground contacts 202a, 202b, so These test specifications, the probe card 100 of the present embodiment provides a plurality of sets of power/signal conductor pieces 120a, 120b, 120c, ground conductor pieces 130a, 130b, 130c, insulators 140a, 140b, 140c, electronic circuits 150a, 150b, 150c, Power/signal probes 160a, 160b, 160c and ground probes 170a, 170b, 170c. The power/signal probes 160a, 160b and the ground probes 170a, 170b of the respective groups respectively correspond to the power/signal contacts 201a, 201b and the ground contacts 202a, 202b of the respective objects to be tested 200a, 200b. As shown in FIG. 5, the power/signal probe 160a touches the power/signal contact 201a, the power/signal probe 160b touches the power/signal contact 201b, the ground probe 170a touches the ground contact 202a, and the ground probe The needle 170b touches the ground contact 202b. Thereby, the power/signal and ground potential obtained by each of the objects to be tested 200a, 200b are electrically independent to avoid affecting the test result.

Please refer to FIG. 6, which illustrates a front view of a probe card 100 in accordance with another embodiment of the present invention. The difference between this embodiment and the previous embodiment is that, because part of the test specification is electrically independent of the ground potential There is a requirement, so the manufacturer can also choose to use a single grounding conductor piece 130 to match a plurality of power/signal conductor pieces 120a, 120b, 120c, and a plurality of grounding probes 170a, 170b, 170c are electrically connected to the same grounding conductor. The slice 130, thereby making the configuration of the space more flexible.

Figure 7 is a front elevational view of a probe card 100 in accordance with yet another embodiment of the present invention. Figure 8 is a side elevational view of the probe card 100 of Figure 7. As shown in FIGS. 7-8, the plurality of sets of power/signal conductor pieces 120a, 120b, 120c and the ground conductor pieces 130a, 130b, 130c can be stacked on each other, so that the probe card 100 can be more space-saving in use.

In addition, since the power/signal conductor pieces 120a, 120b, 120c and the ground conductor pieces 130a, 130b, 130c can be stacked on each other, the ground conductor pieces 130a, 130b, 130c can function as a shield to avoid the power/signal conductor piece 120a. The power/signals in 120b, 120c interfere with each other.

The power/signal conductor piece and the grounding conductor piece used in the invention can be easily obtained. Compared with the structure of the flexible circuit board, the cost is undoubtedly saved. In addition, the power supply/signal conductor piece and the grounding conductor piece are two conductors. There is no need for a flexible circuit board for the previous design of the circuit layout, the production time is also shortened a lot, and no extra time is required to design the circuit layout, which can save a lot of man-hours and costs.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

110‧‧‧Printed circuit board

117‧‧‧ probe area

117a‧‧‧metal solder joints

120‧‧‧Power/Signal Conductor

130‧‧‧ Grounding conductor piece

140‧‧‧Insulator

150‧‧‧Electronic circuit

160‧‧‧Power/Signal Probe

160r, 170r‧‧‧ needle tip

160s, 170s‧‧‧ needle tail

160t, 170t‧‧‧ oblique extension

160u, 170u‧‧‧ bends

170‧‧‧ Grounding probe

300‧‧‧Connecting parts

M‧‧‧ partial

Claims (15)

A probe card comprising: a printed circuit board; at least one power/signal conductor piece electrically connected to a power source or a signal; at least one grounding conductor piece electrically connected to a ground potential; at least one insulator located at the power source/signal Between the conductor piece and the grounding conductor piece; at least one electronic circuit is arranged on the power/signal conductor piece and the grounding conductor piece, and the two ends are electrically connected to the power source/signal conductor piece and the grounding conductor piece respectively; at least one power source a signal probe electrically connected to the power/signal conductor piece, and the power source/signal probe is directly or indirectly connected to the printed circuit board for touching at least one power source/signal contact of at least one object to be tested, The power/signal conductor piece is located between the printed circuit board and the power/signal probe; and at least one grounding probe is electrically connected to the grounding conductor piece, and the grounding probe is directly or indirectly connected to the printed circuit board. The grounding conductor piece is located between the printed circuit board and the grounding probe by touching at least one grounding contact of the object to be tested. The probe card of claim 1, wherein the number of the electronic circuits is plural. The probe card of claim 1, wherein the power/signal conductor piece is a conductor layer in a flexible conductor plate. The probe card of claim 1, wherein the ground conductor piece is a conductor layer in a flexible conductor plate. The probe card of claim 1, wherein the ground conductor piece is located between the power/signal conductor piece and the printed circuit board. The probe card of claim 1, wherein the electronic circuit can be a capacitor, a voltage stabilizing circuit, a filter circuit, an electrostatic discharge protection circuit or an impedance matching circuit. The probe card of claim 1, wherein the number of the power/signal contacts of the object to be tested is plural, and the number of the power/signal probes is plural, and the number of the power/signal conductors is The power/signal probes are electrically connected to the power/signal conductors respectively, and are respectively used to touch the power/signal contacts of the object to be tested. The probe card of claim 1, wherein the number of the ground contacts of the object to be tested is plural, the number of the ground probes is plural, and the number of the ground conductor pieces is plural, and the grounding is The probes are electrically connected to the grounding conductor strips, and are respectively used to touch the grounding contacts of the object to be tested. The probe card of claim 1, wherein the number of the ground contacts of the object to be tested is plural, and the number of the grounding probes is plural, and the grounding probes are electrically connected to the grounding conductor piece. And separately used to touch the The grounding contacts of the object to be tested. The probe card of claim 1, wherein the number of the test objects is plural, the number of the power/signal probes is plural, and the number of the power/signal conductor pieces is plural, and the power sources/ The signal probes are electrically connected to the power/signal conductors respectively, and are respectively used to touch the power/signal contacts of the objects to be tested. The probe card of claim 1, wherein the number of the objects to be tested is plural, the number of the grounding probes is plural, and the number of the grounding conductor pieces is plural, and the grounding probes are respectively electrically The grounding conductor pieces are connected to respectively touch the grounding contacts of the objects to be tested. The probe card of claim 1, wherein the number of the power/signal conductor strips and the ground conductor strips is plural, and the power/signal conductor strips and the ground conductor strips are stacked on each other. The probe card of claim 1, wherein the printed circuit board has a probe area, the printed circuit board includes a plurality of metal pads located in the probe area, and the power/signal probe and the ground probe are both Located in the probe area, the power/signal conductor piece and the grounding conductor piece are respectively connected to the metal solder joints. The probe card of claim 1, further comprising a connector, the The power/signal probe and the grounding probe respectively have a tip and a tail. The power/signal probe and the corresponding tip of the grounding probe are connected to and fixed to the connecting portion of the needle. The power/signal probe and the grounding probe respectively have an inclined extending portion and a bent portion at a portion of the connecting member to the corresponding needle tip, and each of the inclined extending portions corresponds to the power source/signal a probe or a corresponding grounding probe extending from the connecting member to a corresponding direction of the needle tip, each of the bending portions being bent between the corresponding inclined extending portion and the corresponding needle tip Corresponding to the connection of the inclined extension portion and the corresponding needle tip. The probe card of claim 14, wherein the printed circuit board has a probe area, the printed circuit board includes a plurality of metal pads located in the probe area, and the power/signal probe and the ground probe are both Located at the probe area, the two ends of the power/signal conductor are respectively connected to the metal solder joints and the pin tail of the power/signal probe, and the two ends of the ground conductor strip are respectively connected to the metal solder joints and the ground probe The pin tail of the pin, the power/signal probe and the grounding probe extend from the connecting member to the corresponding pin tail in an inclined manner toward the power/signal conductor piece and the grounding conductor piece, respectively.