TWI541565B - Display panel - Google Patents

Description

Display panel

The present invention relates to a flexible circuit board.

A liquid crystal display (LCD) is a flat thin display device composed of a certain number of color or black and white pixels placed in front of a light source or a reflecting surface. Liquid crystal displays have low power consumption and are therefore favored as the current mainstream display devices.

Usually, a flexible circuit board is disposed on the liquid crystal display panel, and the flexible circuit board is used to electrically connect different modules in the display panel. Circuit components are usually provided on the flexible circuit board. In order to avoid short circuit when the circuit components are in contact with other conductive components in the display panel, insulating tape is attached to the circuit components to isolate the circuit components.

However, there is a height difference between the circuit components and the flexible circuit board, and there is also a height difference between the circuit components, and the height difference causes the tape to generate a rebound force. In addition, the upper surface of the circuit component is small, so the contact area of the tape with the circuit component is also small. All of the above cases make the tape easy to fall off, and thus it is impossible to isolate the circuit components to prevent short circuit.

The present invention provides a flexible circuit board by shorting a second block of a flexible circuit board over a first block, thereby isolating circuit components on the first block and avoiding contact of the circuit elements with other conductive elements.

According to an embodiment of the present invention, a flexible circuit board is applied to a display panel. The flexible circuit board includes a first block, a second block, and at least one circuit component. The second block is adjacent and connected to the first block. The circuit component is disposed in the first block and electrically connected to the first block, and the circuit component is electrically insulated from the second block. The second block may be bent over the first block such that the circuit component is wrapped between the first block and the second block.

In one or more embodiments of the invention, the thickness of the first block is different from the thickness of the second block.

In one or more embodiments of the invention, the second block is only an insulating material.

In one or more embodiments of the invention, the second block comprises a metallic material.

In one or more embodiments of the present invention, a virtual cut line is formed at the junction of the first block and the second block.

In one or more embodiments of the invention, the flexible circuit board further comprises an elastic bonding layer. The elastic bonding layer is located between the first block and the second block for bonding the first block when the second block covers the circuit component.

In one or more embodiments of the invention, the second single layer panel block is only an insulating material.

According to another embodiment of the present invention, a display panel includes a display The panel module and the aforementioned flexible circuit board. The flexible circuit board is disposed on the display panel module, wherein the first block is physically or electrically connected to the display panel module.

According to still another embodiment of the present invention, a display panel includes a display Panel modules and flexible boards. The flexible circuit board is disposed on the display panel module. The flexible circuit board includes a multi-layer board block, at least one circuit component, and a single-layer board block. The multi-layer board block is in physical contact with the display panel module. The circuit components are disposed on the multi-layer board block. The single-layer board block is connected to the multi-layer board block and can be bent over the multi-layer board block to cover the circuit components.

According to still another embodiment of the present invention, a display panel includes a display panel module and a flexible circuit board. The flexible circuit board is disposed on the display panel module. The flexible circuit board includes a first single layer board block, at least one circuit component, and a second single layer board block. The first single layer panel is in physical contact with the display panel module. The circuit component is disposed on the first single layer board block. The second single-layer board block is connected to the first single-layer board block and can be bent relative to the first single-layer board block to cover the circuit components.

The above embodiment of the present invention covers the first block and the second block by covering the second block over the first block, thereby isolating the circuit components and avoiding the circuit components and other conductive components. Short circuit due to contact. In addition, since the material required for the first block and the second block is required in the conventional process for manufacturing a flexible circuit board, the new process for manufacturing the flexible circuit board does not require additional preparation materials, and the material cost can be increased without increasing the material cost. The case is completed.

3‧‧‧ line segment

100, 100', 400‧‧‧ flexible circuit boards

111‧‧‧ first major surface

112‧‧‧Second major surface

120‧‧‧First block

130‧‧‧ circuit components

140‧‧‧Second block

144‧‧‧ first end

145‧‧‧ second end

150‧‧‧ virtual knife line

160‧‧‧Flexible adhesive layer

160a‧‧‧First elastic bonding layer

160b‧‧‧Second elastic bonding layer

471‧‧‧Card fasteners

471e‧‧‧Extension

471p‧‧‧protrusion

472‧‧‧ buckle structure

472e‧‧‧Care Department

472o‧‧‧ openings

181‧‧‧Line block

182‧‧‧Circuit component setting area

183‧‧‧Wireless Road Block

184‧‧‧ Coverage block

185‧‧‧Border blocks

191, 191a, 191b‧‧‧ substrate layer

192, 192a, 192b‧‧‧ metal layers

193‧‧ ‧ protective layer

194‧‧‧Adhesive layer

200‧‧‧Display panel module

300‧‧‧ display panel

M1, M2‧‧‧ local

FIG. 1 is a side view of a display panel in accordance with an embodiment of the present invention.

FIG. 2A is a top view of the flexible circuit board not assembled to the display panel module according to an embodiment of the invention.

FIG. 2B is a top view showing the flexible circuit board in FIG. 2A when the second block covers the circuit component.

Figure 3 is a cross-sectional view along line 3 of Figure 2B.

4A is a cross-sectional view of a substrate layer in accordance with an embodiment of the present invention.

4B is a cross-sectional view showing the structure of a single layer board according to an embodiment of the present invention.

4C is a cross-sectional view showing the structure of a multilayer board in accordance with an embodiment of the present invention.

Figure 5 is a top view of a flexible circuit board that has not been cut in accordance with an embodiment of the present invention.

FIG. 6A is a top view of the flexible circuit board not assembled to the display panel module according to another embodiment of the present invention.

FIG. 6B is a top view of the flexible circuit board in FIG. 6A when the second block covers the circuit component.

In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of explanation, many practical details will be explained in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Please refer to FIG. 1 , which illustrates an embodiment of the present invention. A side view of the display panel 300. The display panel 300 of the present embodiment includes a display panel module 200 and a flexible circuit board 100. The flexible circuit board 100 is applied to the display panel 300, and the flexible circuit board 100 is disposed on the display panel module 200.

Specifically, the display panel module 200 includes a display panel and a back Light module. The display panel module 200 further includes a plastic frame, wherein the plastic frame surrounds the display panel and the periphery of the backlight module.

FIG. 2A is a top view of the flexible circuit board 100 not assembled to the display panel module 200 according to an embodiment of the invention. FIG. 2B is a top view showing the second block 140 of the flexible circuit board 100 in FIG. 2A covering the circuit component 130 (the first block 120). As shown in FIGS. 2A and 2B, the flexible circuit board 100 includes a first block 120, a second block 140, and at least one circuit component 130. The second block 140 is adjacent and connected to the first block 120. The circuit component 130 is disposed in the first block 120 and electrically connected to the first block 120, and the circuit component 130 and the second block 140 are electrically insulated. Specifically, the circuit component 130 can pass through the first block. The electrical or signal is transmitted to the display panel, and the electrical or signal is not transmitted to the display panel through the second block 140. The second block 140 can be bent in the first zone Above block 120, as shown in Figure 2B. In other words, the second block 140 can be bent relative to the first block 120 to cover the circuit component 130.

As shown in FIG. 1 , the first block 120 and the display panel module 200 physical contact or electrical connection. Specifically, the first block 120 has a first main surface 111 and a second main surface 112 opposite to each other, and the circuit component 130 is disposed on the first main surface 111 , and the second main surface 112 faces the display panel module 200 . Therefore, the circuit component 130 is exposed to the display panel module 200, and thus the circuit component 130 may be short-circuited by contacting a conductive member (not shown) such as a metal mechanism of the display panel 300.

As shown in FIG. 1 and FIG. 2B, by using the second block 140 Covering the first block 120, the circuit component 130 is wrapped between the first block 120 and the second block 140, thereby isolating the circuit component 130 and avoiding short circuiting of the circuit component 130 in contact with other conductive components.

Specifically, the first block 120 is adhered to the bottom surface of the display panel module 200, and thus the flexible circuit board 100 is relatively fixed to the display panel module 200, but the invention is not limited thereto. In other embodiments, the flexible circuit board 100 may be attached to the side of the display panel module 200, or the flexible circuit board 100 may be attached to the extended lug portion of the plastic frame, as long as the flexible circuit board 100 can be relatively fixed to the display. The panel module 200 can be used.

Figure 3 is a cross-sectional view along line 3 of Figure 2B. As shown in FIG. 3, the flexible circuit board 100 further includes an elastic bonding layer 160. The elastic bonding layer 160 is located between the first block 120 and the second block 140 for bonding the first block 120 and the second block 140 when the second block 140 covers the circuit component 130.

The thickness of the elastic bonding layer 160 may be greater than or equal to the circuit component 130 the height of. It should be understood that the specific embodiments of the elastic adhesive layer 160 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should elastically select the elastic adhesive layer 160 according to actual needs. detailed description.

Bonding the elastic bonding layer 160 to the first block 120 and the second block At 140 o'clock, since the thickness of the elastic bonding layer 160 is greater than or equal to the height of the circuit component 130, the circuit component 130 does not abut against the second block 140, and a tensile force is generated on the elastic bonding layer 160. Therefore, the elastic bonding layer 160 can firmly adhere the first block 120 and the second block 140 to avoid the situation that the elastic bonding layer 160 is separated from the first block 120 or the second block 140. In addition, when an uneven external force is applied to the flexible circuit board 100, the elastic adhesive layer 160 can be deformed to cancel the external force, so that the elastic adhesive layer 160 will not be bonded by the external force to bond the first block 120 and the second. The capacity of block 140 is degraded.

The material of the elastic adhesive layer 160 may be a foam material, or the elastic adhesive layer 160 may be a foam tape. It should be understood that the specific embodiments of the elastic adhesive layer 160 are merely illustrative and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should elastically select the elastic adhesive layer 160 according to actual needs. detailed description.

As shown in FIG. 2A and FIG. 3 , the second block 140 may further have a first end 144 and a second end 145 opposite to each other, and the first end 144 is connected to the first block 120 . The elastic adhesive layer 160 further includes a first elastic adhesive layer 160a and a second elastic adhesive layer respectively disposed at the first end 144 and the second end 145. 160b. When the first elastic bonding layer 160a and the second elastic bonding layer 160b fix the first block 120 and the second block 140, the circuit component 130 is located between the first elastic bonding layer 160a and the second elastic bonding layer 160b. As a result, the first end 144 and the second end 145 of the second block 140 are securely fixed on the first block 120, thereby allowing the second block 140 to completely cover and isolate the circuit component 130.

4A is a cross-sectional view of a substrate layer 191 in accordance with an embodiment of the present invention. 4B is a cross-sectional view showing the structure of a single layer board according to an embodiment of the present invention. 4C is a cross-sectional view showing the structure of a multilayer board in accordance with an embodiment of the present invention. As shown in FIG. 3, FIG. 4A, FIG. 4B, and FIG. 4C, the first block 120 may be a single-layer plate structure or a multi-layer plate structure, and the second block 140 may be only one substrate layer 191 or Single layer board structure. In other words, the part M2 in Fig. 3 may be the structure in Fig. 4B or Fig. 4C, and the part M1 in Fig. 3 may be the structure in Fig. 4A or Fig. 4B (the configuration is upside down).

As shown in FIG. 4B, the single layer plate structure may include a substrate layer 191, a metal layer 192, and a protective layer 193. The metal layer 192 is disposed on the substrate layer 191. The protective layer 193 is disposed on the metal layer 192. The metal layer 192 is located between the substrate layer 191 and the protective layer 193.

As shown in FIG. 4C, the multilayer board structure may include substrate layers 191a, 191b, an adhesive layer 194, metal layers 192a, 192b, and a protective layer 193. The adhesive layer 194, the metal layer 192a, the substrate layer 191b, the metal layer 192b, and the protective layer 193 are sequentially disposed on the substrate layer 191a. In addition, one side of the substrate layer 191a where no other layer is provided may be provided with another metal layer or protection. Floor.

The thickness of the first block 120 may be the same as the thickness of the second block 140 Or different. When the thickness of the first block 120 is the same as the thickness of the second block 140, the first block 120 and the second block 140 may be a single layer plate structure at the same time, and the first block 120 may be referred to as a first single block. The layer block, the second block 140 may be referred to as a second single layer board block.

When the thickness of the first block 120 is different from the thickness of the second block 140 There are two situations when there are. When the first block 120 is a single-layer board structure, the second block 140 is only one substrate layer 191. When the first block 120 is a multi-layer board structure, the second block 140 is a single-layer board structure, and the first block 120 may be referred to as a multi-layer board block, and the second block 140 may be referred to as a single-layer board block. .

Since the second block 140 is a single layer plate structure or only one substrate Layer 191, the thickness of second block 140 will be approximately equal to or less than the thickness of the insulating tape (about 49 μm). Therefore, the second block 140 does not interfere with the arrangement of other components in the overall configuration of the display panel 300 as compared with the conventional use of the insulating tape.

When the second block 140 is only a substrate layer 191, the second block 140 has the function of insulating, that is, the isolation circuit element 130 prevents the circuit element 130 from being short-circuited by contact with other conductive elements. When the second block 140 is a single-layer board structure, the second block 140 has the function of insulation and shielding, that is, the isolating circuit component 130 prevents the circuit component 130 from being short-circuited by contacting other conductive components, and shielding the external electric field to make the circuit Element 130 is not disturbed by an external electric field.

The material of the substrate layer 191 may be an insulating material. Specifically, the substrate The material of the layer 191 may be Polyimide (PI). The material of the metal layer 192 may be a metal material. Specifically, the material of the metal layer 192 may be copper. The material of the protective layer 193 may be an insulating material. Specifically, the material of the protective layer 193 may be Polyimide (PI). The material of the adhesive layer 194 can be an adhesive. Specifically, the material of the adhesive layer 194 may be epoxy resin (Epoxy). Figure 5 is a top plan view of a flexible circuit board 100' that has not been cut in accordance with an embodiment of the present invention. As shown in Figs. 2A and 5, the flexible circuit board 100 in Fig. 2A has been cut, and the flexible circuit board 100' in Fig. 5 has not been cut. The flexible circuit board 100' that has not been cut is a single piece, and the flexible circuit board 100' includes a line block 181 and a wireless way block 183. The line block 181 will have circuitry disposed thereon after cutting and become the first block 120. The line block 181 has a circuit component setting area 182 for setting the circuit element 130. The no-line block 183 is adjacent and connected to the line block 181. The no-line block 183 includes a coverage block 184 and a border block 185. A portion of the coverage block 184 becomes the second block 140 after cutting. Most or all of the bezel block 185 is removed after cutting, but the invention is not limited thereto.

In a conventional process, the wireless way block 183 will be removed after cutting. In contrast, in various embodiments of the present invention, portions of the wireless way block 183 may be retained and a second block 140 may be formed. It can be seen that the material required for the second block 140 can be formed when the flexible circuit board 100 is manufactured, and thus can be completed without increasing the material cost. At the same time, the second block is formed through the originally discarded material to apply and replace The effect of the edge tape can save costs. In addition, the use of the folded second block can reduce the chance of misalignment of the used insulating tape and electronic components, greatly improving the effectiveness of insulation and shielding.

In the process of cutting, in the first block 120 and the second block 140 The joint is shallowly cut, but the joint between the first block 120 and the second block 140 is not cut, so that a virtual cut line 150 is formed at the junction of the first block 120 and the second block 140. (or called the stitching line). As a result, the first block 120 will be easier to bend relative to the second block 140, and after the bending, the second block 140 is less likely to rebound.

2, 4A, 4B, 4C, and 5 As shown in the figure, since the flexible circuit board 100' is a whole piece, the substrate layer 191, the metal layer 192 or the protective layer 193 in the first block 120 and the second block 140 may be formed in the flexible circuit board 100'. Formed in the same process. Even if the first block 120 and the second block 140 have different structures, some structures may be formed in the same process. For example, when the first block 120 is a multi-layer board structure and the second block 140 is a single-layer board structure, the single-layer board structure and the substrate layer 191b, the metal layer 192b and the protection in the multi-layer board structure can be simultaneously formed. Layer 193 is then formed into other portions of the multilayer board structure.

FIG. 6A is a top view of the flexible circuit board 400 not assembled to the display panel module 200 according to another embodiment of the present invention. FIG. 6B is a top view of the flexible circuit board 400 in FIG. 6A when the second block 140 covers the circuit component 130. As shown in FIG. 6A and FIG. 6B , the flexible circuit board 400 further includes a snap member 471 and a snap structure 472 . Fastener 471 The second end 145 is connected. The latching structure 472 is disposed on the first block 120 and corresponds to the latching member 471 for fixing the first block 120 by the snap-in latching member 471 when the second block 140 covers the circuit component 130. The second block 140. In addition, since the flexible circuit board 400 fixes the first block 120 and the second block 140 by the snap member 471 and the snap structure 472, it is not necessary to provide the elastic adhesive layer 160.

Specifically, the latching member 471 includes an extending portion 471e connected to each other. The second end 145 is connected to the at least one protruding portion 471p and the extending portion 471e. In this embodiment, the latching member 471 is formed on the side of the second block 140, and the latching member 471 is T-shaped, but the invention is not limited thereto, and may be other shapes that can achieve the same effect. , such as L-shaped. The snap structure 472 has an opening 472o and an engaging portion 472e adjacent to the opening 472o (at the dashed line of FIG. 6A). In the embodiment, the buckle structure 472 is formed on the side of the first block 120, wherein when the second block 140 is folded over the first block 120 and covers the first block 120, the fastening component The position of 471 may correspond to snap structure 472. In detail, when the second block 140 covers the circuit component 130, the set position of the opening 472o corresponds to the set position of the extending portion 471e, and the set position of the engaging portion 472e corresponds to the set position of the protruding portion 471p. Thus, when the second block 140 covers the circuit component 130, the extension portion 471e is located at the opening 472o, the protrusion portion 471p is disposed through the opening 472o and disposed on the second major surface 112 (see FIG. 1), and the protrusion portion 471p contacts Engagement portion 472e. Since the second block 140 is disposed on the first main surface 111, the protruding portion 471p and the engaging portion 472e are engaged with each other, and the second block 140 is relatively fixed to the first block 120.

As shown in FIG. 5 and FIG. 6A, the bezel block 185 of the flexible circuit board 100' that has not been cut may become the snap member 471 after cutting, and the opening 472o is cut on the first block 120 to form a buckle. Structure 472. Since the frame block 185 is generally a multi-layer plate structure, the snap member 471 can also be a multi-layer plate structure. Since the thickness of the multi-layer board structure is thick and the hardness is also high, the snap member 471 can be more stably engaged with the snap structure 472.

The above embodiment of the present invention covers the first block 120 and the second block 140 by covering the second block 140 over the first block 120, thereby isolating the circuit component 130 and avoiding Circuit element 130 is shorted in contact with other conductive elements. In addition, since the material required for the first block 120 and the second block 140 is required in the conventional process for manufacturing a flexible circuit board, the new process for manufacturing the flexible circuit board 100 does not require additional preparation materials, and may not Complete with the increase in material costs.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Soft circuit board

120‧‧‧First block

130‧‧‧ circuit components

140‧‧‧Second block

144‧‧‧ first end

145‧‧‧ second end

160a‧‧‧First elastic bonding layer

160b‧‧‧Second elastic bonding layer

M1, M2‧‧‧ local

Claims (2)

A display panel comprising: a display panel module; and a flexible circuit board disposed on the display panel module, the flexible circuit board comprising: a multi-layer board block, physically contacting the display panel module; a circuit component disposed on the multi-layer board block; a single-layer board block connected to the multi-layer board block and being bendable to cover the circuit component with respect to the multi-layer board block; and an elastic bonding layer, Between the multi-layer board block and the single-layer board block, for bonding the multi-layer board block when the single-layer board block covers the circuit component, wherein the thickness of the elastic adhesive layer is greater than or equal to the circuit component the height of. A display panel comprising: a display panel module; and a flexible circuit board disposed on the display panel module, the flexible circuit board comprising: a first single layer board block, physically contacting the display panel module At least one circuit component disposed on the first single-layer board block; a second single-layer board block connected to the first single-layer board block and bendable relative to the first single-layer board block Folding to cover the circuit component; and an elastic bonding layer located in the first single layer panel and the second Between the single-layer board blocks, the first single-layer board block is bonded when the second single-layer board block covers the circuit component, wherein the thickness of the elastic adhesive layer is greater than or equal to the height of the circuit component.