TWI541128B - Method for manufacturing laminated body and light-emitting diode with wavelength conversion layer - Google Patents
Method for manufacturing laminated body and light-emitting diode with wavelength conversion layer Download PDFInfo
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- TWI541128B TWI541128B TW101146944A TW101146944A TWI541128B TW I541128 B TWI541128 B TW I541128B TW 101146944 A TW101146944 A TW 101146944A TW 101146944 A TW101146944 A TW 101146944A TW I541128 B TWI541128 B TW I541128B
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- phosphor
- phosphor sheet
- resin
- sheet
- fluorenone
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
- C08J2381/04—Polysulfides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
- Laminated Bodies (AREA)
Description
本發明是有關於一種作為用以變換發光二極體(Light Emitting Diode,LED)晶片(chip)的發光波長的片材狀材料的積層體、及帶有波長變換層的發光二極體的製造方法。 The present invention relates to a laminate which is a sheet-like material for converting an emission wavelength of a light-emitting diode (LED) chip, and a light-emitting diode having a wavelength conversion layer. method.
發光二極體(Light Emitting Diode,LED)以其發光效率的顯著提高為背景,以低消耗電力、高壽命、創意性等為特點,不但於液晶顯示器(Liquid Crystal Display,LCD)的背光裝置(back light)用、或車的頭燈等車載領域,而且於一般照明用的市場亦迅速地擴大。 Light Emitting Diode (LED) is characterized by its low luminous efficiency, low power consumption, high lifetime, and creativity. It is not only a liquid crystal display (LCD) backlight device ( The back light) is used in the automotive field such as the headlights of the car, and the market for general lighting is also rapidly expanding.
LED的發光光譜依存於形成LED晶片的半導體材料,因此其發光色受限。因此,為了使用LED獲得LCD背光或一般照明用的白色光,而需要在LED晶片上配置適合於各晶片的螢光體,而將發光波長變換。具體而言提出:在發藍色光的LED晶片上設置黃色螢光體的方法、在發藍色光的LED晶片上設置紅及綠螢光體的方法、在發紫外線的LED晶片上設置紅、綠、藍螢光體的方法等。這些中,就LED晶片的發光效率或成本的方面而言,目前最廣泛採用在藍色LED上設置黃色螢光體的方法、及在藍色LED上設置紅及綠螢光體的方法。 The luminescence spectrum of the LED depends on the semiconductor material forming the LED wafer, and thus its luminescent color is limited. Therefore, in order to obtain white light for LCD backlight or general illumination using an LED, it is necessary to arrange a phosphor suitable for each wafer on the LED wafer, and to convert the emission wavelength. Specifically, a method of disposing a yellow phosphor on a blue-emitting LED wafer, a method of disposing red and green phosphors on a blue-emitting LED wafer, and setting red and green on an ultraviolet-emitting LED wafer are proposed. , the method of blue phosphor, etc. Among these, in terms of luminous efficiency or cost of the LED wafer, a method of providing a yellow phosphor on a blue LED and a method of providing a red and green phosphor on a blue LED are most widely used.
作為在LED晶片上設置螢光體的具體的方法之一,提出有在LED晶片上貼合含有螢光體粒子的矽酮樹脂片材 (以下稱為螢光體片材)的方法(例如參照專利文獻1~專利文獻4)。該方法與現有的實用化的將分散有螢光體的液狀樹脂分配於LED晶片上進行硬化的方法相比,將固定量的螢光體配置於LED晶片上會更容易,結果在可使所得的白色LED的色彩或亮度達到均勻的方面優異。 As one of specific methods for providing a phosphor on an LED wafer, it is proposed to laminate an anthrone resin sheet containing phosphor particles on an LED wafer. (hereinafter referred to as a phosphor sheet) (for example, refer to Patent Document 1 to Patent Document 4). This method is easier to arrange a fixed amount of phosphor on the LED wafer than in the conventional method in which the liquid resin in which the phosphor is dispersed is distributed and cured on the LED wafer. The color of the obtained white LED is excellent in that the color or brightness is uniform.
現有技術文獻 Prior art literature
專利文獻 Patent literature
專利文獻1:日本專利特開2009-235368號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-235368
專利文獻2:日本專利特開2010-123802號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2010-123802
專利文獻3:日本專利2011-102004號公報 Patent Document 3: Japanese Patent No. 2011-102004
專利文獻4:日本專利特開2010-159411號公報 Patent Document 4: Japanese Patent Laid-Open Publication No. 2010-159411
將螢光體片材貼合於LED晶片的方法如前所述般,色彩或亮度較使用液狀螢光體樹脂更穩定,因此是優異的方法,但難以將分散有螢光體粒子的樹脂均勻地片材化。另外,此種片材通常藉由塗佈於包含聚對苯二甲酸乙二酯等的膜狀基材上而形成。以矽酮樹脂為主成分的螢光體片材本身的彈性模數並不那麼高,因此存在操作中變形、破損的情況。因此,螢光體片材在塗佈於基材上後,直至貼附於LED晶片為止,以與基材成為一體的積層體的狀態操作。積層於基材上的螢光體片材在貼合於LED晶片後將基材剝離,若基材與螢光體片材的密接強度高,則有剝離時使螢光體片材破損之虞。 The method of bonding a phosphor sheet to an LED wafer is as described above, and the color or brightness is more stable than using a liquid phosphor resin, so that it is an excellent method, but it is difficult to disperse the resin in which the phosphor particles are dispersed. Evenly sheeted. Further, such a sheet is usually formed by being applied onto a film-form substrate including polyethylene terephthalate or the like. The phosphor sheet having the fluorenone resin as a main component has a modulus of elasticity which is not so high, and thus may be deformed or broken during handling. Therefore, after the phosphor sheet is applied onto the substrate, it is operated in a state of being integrated with the substrate until it is attached to the LED wafer. The phosphor sheet laminated on the substrate is peeled off after bonding to the LED wafer, and if the adhesion strength between the substrate and the phosphor sheet is high, the phosphor sheet is broken at the time of peeling. .
為了防止基材剝離時的螢光體片材的破損,通常對基材實施被稱為脫模處理的處理。脫模處理是對基材表面實 施矽酮系有機化合物或氟系有機化合物等表面能量非常低的物質的薄膜,並使形成於其上的螢光體片材的剝離變得容易。然而,用於螢光體片材的矽酮樹脂的塗敷性差,在塗敷於藉由此種表面能量低的藥劑處理的表面時,產生收縮或不均,因此均勻地塗佈變得非常困難。 In order to prevent breakage of the phosphor sheet at the time of peeling of the substrate, a treatment called a mold release treatment is usually performed on the substrate. Demolding treatment is on the surface of the substrate A film of a substance having a very low surface energy such as a ketone-based organic compound or a fluorine-based organic compound, and facilitation of peeling of the phosphor sheet formed thereon. However, the fluorenone resin used for the phosphor sheet has poor coatability, and when applied to a surface treated with such a low surface energy agent, shrinkage or unevenness occurs, so that uniform coating becomes very uniform. difficult.
而且,形成有螢光體片材的積層體,有時實施如下的機械加工:在貼附於LED晶片之前切成LED晶片的大小,或預先在積層體與LED晶片的電極連接墊抵接的部分進行開孔加工等。對在實施了脫模處理的基材上形成包含矽酮樹脂與螢光體的螢光體片材而得的積層體實施機械加工時,導致螢光體片材自基材剝離,並導致破損,此類情況亦為課題。 Further, the laminated body in which the phosphor sheet is formed may be subjected to mechanical processing such as cutting the size of the LED wafer before being attached to the LED wafer, or preliminarily contacting the laminated body with the electrode connection pad of the LED wafer. Part of the drilling process. When the laminated body obtained by forming the phosphor sheet containing the fluorenone resin and the phosphor on the substrate subjected to the release treatment is machined, the phosphor sheet is peeled off from the substrate and causes breakage. Such a situation is also a subject.
本發明是鑒於上述情況而成,且提供一種積層體、及帶有波長變換層的發光二極體的製造方法,上述積層體在將塗佈性差的矽酮樹脂系的片材製作用樹脂液塗佈於基材上形成螢光體片材時,在塗佈步驟中不產生片材製作用樹脂液的收縮或不均,且在剝離步驟中可容易地將基材與螢光體片材剝離。 In view of the above, the present invention provides a laminate body and a method for producing a light-emitting diode having a wavelength conversion layer, wherein the laminate is a resin liquid for forming an anthrone resin-based sheet having poor coatability. When a phosphor sheet is formed on a substrate, shrinkage or unevenness of the resin liquid for sheet production is not generated in the coating step, and the substrate and the phosphor sheet can be easily removed in the peeling step. Stripped.
本發明的積層體的特徵在於包含:含有聚苯硫醚的基材、及積層於上述基材上的至少含有矽酮樹脂及螢光體的螢光體片材。 The laminate according to the present invention includes a base material containing polyphenylene sulfide and a phosphor sheet containing at least an fluorenone resin and a phosphor laminated on the base material.
於在基材上塗佈包含螢光體的片材製作用樹脂液時, 本發明的積層體可獲得良好的塗佈性,因此可獲得膜厚均勻的螢光體片材,並且基材與螢光體片材的剝離容易,且可防止螢光體片材的破損。 When a resin liquid for sheet production containing a phosphor is applied onto a substrate, Since the laminate of the present invention can obtain good coatability, a phosphor sheet having a uniform film thickness can be obtained, and the substrate and the phosphor sheet can be easily peeled off, and the damage of the phosphor sheet can be prevented.
本發明中的螢光體片材若主要含有矽酮樹脂、以及螢光體,則並無特別限定,可使用各種螢光體片材。根據需要可包含其他成分。 The phosphor sheet of the present invention is not particularly limited as long as it mainly contains an fluorenone resin and a phosphor, and various phosphor sheets can be used. Other ingredients may be included as needed.
本發明所使用的矽酮樹脂是內部含有螢光體的黏合劑樹脂,是形成螢光體片材的形態的成分。因此,若是在內部均質地分散螢光體,且可形成為片材狀者,則並無特別限制。另外,就用於LED發光裝置時的耐久性或可靠性而言,要求機械強度、透明性、耐熱性、耐光性優異者。而且,本發明中所用的矽酮樹脂較佳為硬化型矽酮橡膠。可使用一液型、二液型(三液型)的任一種液構成。硬化型矽酮橡膠中,因空氣中的水分或觸媒而引起縮合反應的類型有:脫醇型、脫肟型、脫乙酸型、脫羥基胺型等。另外,因觸媒引起矽氫化反應的類型有加成反應型。亦可使用這些的任一種類型的硬化型矽酮橡膠。特別是在無伴隨硬化反應的副產物,難以受水分的影響,並且硬化收縮小,容易藉由加熱而加快硬化的方面而言,為了進行片材化而更佳為加成反應型矽酮橡膠。 The fluorenone resin used in the present invention is a binder resin containing a phosphor inside, and is a component which forms a form of a phosphor sheet. Therefore, there is no particular limitation on the case where the phosphor is uniformly dispersed inside and can be formed into a sheet shape. Further, in terms of durability and reliability when used in an LED light-emitting device, it is required to have excellent mechanical strength, transparency, heat resistance, and light resistance. Further, the fluorenone resin used in the present invention is preferably a hardenable fluorenone rubber. It can be composed of one liquid type or two liquid type (three liquid type). Among the hardened fluorenone rubbers, types of condensation reactions due to moisture or a catalyst in the air include a dealcoholization type, a dehydration type, a deacetic acid type, and a dehydroxyamine type. Further, the type of the hydrazine hydrogenation reaction caused by the catalyst has an addition reaction type. Any of these types of hardened fluorenone rubbers can also be used. In particular, in the case where the by-product which does not accompany the hardening reaction is hardly affected by moisture, and the hardening shrinkage is small, and it is easy to accelerate hardening by heating, it is more preferable to add the reaction type fluorenone rubber for sheet formation. .
加成反應型矽酮橡膠的一例,是藉由含有與矽原子鍵結的烯基的化合物、和具有與矽原子鍵結的氫原子的化合物的矽氫化反應而形成。此種材料可列舉:藉由乙烯基三 甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷、丙烯基三甲氧基矽烷、降冰片烯基三甲氧基矽烷、辛烯基三甲氧基矽烷等含有與矽原子鍵結的烯基的化合物,和甲基氫聚矽氧烷(methyl hydrogen polysiloxane)、二甲基聚矽氧烷-CO-甲基氫聚矽氧烷、乙基氫聚矽氧烷、甲基氫聚矽氧烷-CO-甲基苯基聚矽氧烷等具有與矽原子鍵結的氫原子的化合物的矽氫化反應而形成者。 An example of the addition reaction type fluorenone rubber is formed by hydrogenation reaction of a compound containing an alkenyl group bonded to a ruthenium atom and a compound having a hydrogen atom bonded to a ruthenium atom. Such materials can be cited: by vinyl three Methoxy decane, vinyl triethoxy decane, allyl trimethoxy decane, propylene trimethoxy decane, norbornene trimethoxy decane, octenyl trimethoxy decane, etc. a compound of an alkenyl group, and a methyl hydrogen polysiloxane, dimethyl polyoxyalkylene-CO-methylhydropolysiloxane, ethyl hydrogen polyoxyalkylene, methyl hydrogen It is formed by a hydrogenation reaction of a compound having a hydrogen atom bonded to a ruthenium atom such as a polyoxyalkylene-CO-methylphenyl polysiloxane.
另外,本發明所使用的矽酮樹脂例如亦可使用日本專利特開2010-159411號公報所記載者。日本專利特開2010-159411號公報所記載的矽酮樹脂是藉由縮合反應與加成反應而硬化的矽酮樹脂,可藉由以下方式而得:使包含具有可進行縮合反應的取代基的矽化合物、及具有可進行加成反應的取代基的矽化合物的矽酮樹脂用組成物,進行縮合反應。 Further, the fluorenone resin used in the present invention may be, for example, those described in JP-A-2010-159411. The anthrone resin described in Japanese Laid-Open Patent Publication No. 2010-159411 is an anthrone resin which is cured by a condensation reaction and an addition reaction, and can be obtained by including a substituent having a condensation reaction. A composition for an anthracene resin having a ruthenium compound and a ruthenium compound having a substituent capable of undergoing an addition reaction is subjected to a condensation reaction.
具有可進行縮合反應的取代基的矽化合物例如可例示:具有羥基、胺基、烷氧基、羧基、酯基、鹵素原子等取代基的矽化合物。較佳為可列舉具有羥基、烷氧基的矽化合物。1分子中所含有的取代基數並無特別限定。 The ruthenium compound having a substituent capable of undergoing a condensation reaction is, for example, a ruthenium compound having a substituent such as a hydroxyl group, an amine group, an alkoxy group, a carboxyl group, an ester group or a halogen atom. Preferably, an anthracene compound having a hydroxyl group or an alkoxy group is exemplified. The number of substituents contained in one molecule is not particularly limited.
具有可進行縮合反應的取代基的矽化合物例如,較佳為下述式(1)所示的兩末端矽烷醇型矽化合物。 The ruthenium compound having a substituent capable of undergoing a condensation reaction is, for example, a two-terminal stanol type ruthenium compound represented by the following formula (1).
式中,R1為1價烴基、例如碳數為1~20、較佳為1~10的1價烴基。可列示:甲基、乙基、丙基、丁基、戊基、己基、苯基、萘基、環己基、環戊基等。其中就透明性及耐光性的觀點而言,較佳為甲基。另外,式(1)中,全部的R1可相同亦可不同,較佳為全部的R1為甲基。 In the formula, R 1 is a monovalent hydrocarbon group, for example, 1 to 20 carbon atoms, preferably a monovalent hydrocarbon group having 1 to 10. Listed are: methyl, ethyl, propyl, butyl, pentyl, hexyl, phenyl, naphthyl, cyclohexyl, cyclopentyl and the like. Among them, from the viewpoint of transparency and light resistance, a methyl group is preferred. Further, the formula (1), all of R 1 may be the same or different, preferably all of the R 1 is methyl.
上述式(1)中,n為1以上的整數,就穩定性或操作性的觀點而言,n為1~10000,更佳為1~1000的整數。 In the above formula (1), n is an integer of 1 or more, and n is from 1 to 10,000, more preferably from 1 to 1,000, from the viewpoint of stability or workability.
式(1)所示的化合物可列舉:兩末端矽烷醇型聚二甲基矽氧烷、兩末端矽烷醇型聚甲基苯基矽氧烷、兩末端矽烷醇型聚二苯基矽氧烷等,這些可單獨使用或將2種以上加以組合而使用。這些中,較佳為R1全為甲基、n為1~1000的整數的化合物。 The compound represented by the formula (1) may, for example, be a terminal stanol type polydimethyl siloxane, a terminal stanol type polymethylphenyl siloxane, or a terminal stanol type polydiphenyl fluorene oxide. These may be used alone or in combination of two or more. Among these, preferred is a R & lt whole is methyl, the compound is an integer of from 1 to 1000 and n is.
縮合反應系單體中的式(1)所示的化合物的含量,較佳為50質量%以上,更佳為80質量%以上,尤佳為實質上為100質量%。 The content of the compound represented by the formula (1) in the condensation reaction-based monomer is preferably 50% by mass or more, more preferably 80% by mass or more, and still more preferably 100% by mass.
矽酮樹脂中的縮合反應系單體的比例較佳為1質量%~99質量%,更佳為50質量%~99質量%,尤佳為80質量%~99質量%。 The proportion of the condensation reaction-based monomer in the fluorenone resin is preferably from 1% by mass to 99% by mass, more preferably from 50% by mass to 99% by mass, even more preferably from 80% by mass to 99% by mass.
具有可進行加成反應的取代基的矽化合物(以下亦稱為加成反應系單體)例如可例示:具有烯基、氫原子、炔基、羰基、硫醇基、環氧基、胺基、羥基、硫醚基等取代基的矽化合物,較佳為具有氫原子、烯基的矽化合物。1分子中所含有的取代基數並無特別限制。 The hydrazine compound having a substituent capable of undergoing an addition reaction (hereinafter also referred to as an addition reaction-based monomer) may, for example, be an alkenyl group, a hydrogen atom, an alkynyl group, a carbonyl group, a thiol group, an epoxy group or an amine group. The ruthenium compound having a substituent such as a hydroxyl group or a thioether group is preferably a ruthenium compound having a hydrogen atom or an alkenyl group. The number of substituents contained in one molecule is not particularly limited.
具有氫原子、或烯基的矽化合物可列舉:作為上述加成反應型矽酮橡膠所例示的含有與矽原子鍵結的烯基的化合物、或具有與矽原子鍵結的氫原子的化合物。 The ruthenium compound having a hydrogen atom or an alkenyl group may be a compound containing an alkenyl group bonded to a ruthenium atom exemplified as the above-described addition reaction type fluorenone rubber, or a compound having a hydrogen atom bonded to a ruthenium atom.
矽酮樹脂中的加成反應系單體的含量較佳為0.1質量%~99質量%,更佳為0.1質量%~90質量%,尤佳為0.1質量%~80質量%。 The content of the addition reaction-based monomer in the fluorenone resin is preferably from 0.1% by mass to 99% by mass, more preferably from 0.1% by mass to 90% by mass, even more preferably from 0.1% by mass to 80% by mass.
另外,就片材化時的黏彈性的觀點而言,縮合反應系單體與加成反應系單體的調配比(縮合反應系單體/加成反應系單體)較佳為99.9/0.1~1/99,更佳為99.9/0.1~50/50,尤佳為99.9/0.1~90/10。 Further, from the viewpoint of the viscoelasticity at the time of sheet formation, the ratio of the condensation reaction monomer to the addition reaction monomer (condensation reaction monomer/addition reaction monomer) is preferably 99.9/0.1. ~1/99, more preferably 99.9/0.1~50/50, especially 99.9/0.1~90/10.
另外較佳為,除了上述縮合反應系單體與加成反應系單體外,日本專利特開2010-159411號公報所記載的矽酮樹脂進一步含有可與縮合反應系單體與加成反應系單體的任一種反應系單體反應的化合物(以下亦稱為縮合/加成單體)。 Further, in addition to the above condensation reaction monomer and addition reaction monomer, the fluorenone resin described in JP-A-2010-159411 further contains a condensation reaction monomer and an addition reaction system. Any one of the monomers is a monomer-reactive compound (hereinafter also referred to as a condensation/addition monomer).
縮合/加成單體是1分子中具有可與縮合反應系單體反應的官能基、及可與加成反應系單體反應的官能基者。 可與縮合反應系單體反應的官能基可列舉:與前述的可進行縮合反應的取代基同樣的取代基,1分子中的該官能基數並無特別限定。可與加成反應系單體反應的官能基可列舉:與前述的可進行加成反應的取代基同樣的取代基,1分子中的該官能基數並無特別限定。 The condensation/addition monomer is a functional group having a functional group reactive with a condensation reaction monomer in one molecule and a functional group reactive with an addition reaction monomer. The functional group which can react with the condensation reaction type monomer is the same as the substituent which can be subjected to the condensation reaction described above, and the number of the functional groups in one molecule is not particularly limited. The functional group which can react with the addition reaction type monomer is the same as the substituent which can be subjected to the addition reaction described above, and the number of the functional groups in one molecule is not particularly limited.
該化合物例如較佳為含有烯基的三烷氧基矽烷。上述化合物中,烯基與加成反應系單體進行加成反應,烷氧基 與縮合反應系單體進行縮合反應。 The compound is preferably, for example, an alkenyl group-containing trialkoxy decane. In the above compound, an alkenyl group is subjected to an addition reaction with an addition reaction monomer, and an alkoxy group The condensation reaction is carried out with a condensation reaction monomer.
含有烯基的三烷氧基矽烷的烯基,其碳數為1~20、較佳為1~10,具體而言,可例示:乙烯基、烯丙基、丙烯基、丁烯基、戊烯基、己烯基、庚烯基、辛烯基、降冰片烯基、環己烯基等。其中,就對矽氫化反應的反應性的觀點而言,較佳為乙烯基。 The alkenyl group of the alkenyl group-containing trialkoxy decane has a carbon number of 1 to 20, preferably 1 to 10, and specific examples thereof include a vinyl group, an allyl group, a propenyl group, a butenyl group and a pentyl group. Alkenyl, hexenyl, heptenyl, octenyl, norbornenyl, cyclohexenyl and the like. Among them, from the viewpoint of reactivity with the hydrogenation reaction, a vinyl group is preferred.
含有烯基的三烷氧基矽烷的烷氧基,是碳數為1~10、較佳為1~6的烷氧基,具體而言,可例示:甲氧基、乙氧基、丙氧基、丁氧基、戊氧基、己氧基等。其中,就對縮合反應的反應性的觀點而言,較佳為甲氧基。另外,全部的烷氧基可相同亦可不同,較佳為全為甲氧基。 The alkoxy group of the alkenyl group-containing trialkoxy decane is an alkoxy group having a carbon number of 1 to 10, preferably 1 to 6, and specific examples thereof include a methoxy group, an ethoxy group, and a propoxy group. Base, butoxy, pentyloxy, hexyloxy and the like. Among them, from the viewpoint of reactivity to the condensation reaction, a methoxy group is preferred. Further, all of the alkoxy groups may be the same or different, and are preferably all methoxy groups.
含有烯基的三烷氧基矽烷可列舉:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷、丙烯基三甲氧基矽烷、降冰片烯基三甲氧基矽烷、辛烯基三甲氧基矽烷等,這些可單獨使用或將2種以上加以組合而使用。這些中,較佳為乙烯基三甲氧基矽烷。 Examples of the alkenyl group-containing trialkoxy decane include vinyltrimethoxydecane, vinyltriethoxydecane, allyltrimethoxydecane, allyltrimethoxynonane, norbornene-l-methoxydecane. And octenyltrimethoxydecane, etc., These can be used individually or in combination of 2 or more types. Among these, vinyltrimethoxydecane is preferred.
縮合/加成單體中的含有烯基的三烷氧基矽烷的含量,較佳為50質量%以上,更佳為80質量%以上,尤佳為實質上為100質量%。 The content of the alkenyl group-containing trialkoxysilane in the condensation/addition monomer is preferably 50% by mass or more, more preferably 80% by mass or more, and still more preferably 100% by mass.
矽酮樹脂中的縮合/加成單體的含量較佳為0.01質量%~90質量%,更佳為0.01質量%~50質量%,尤佳為0.01質量%~10質量%。 The content of the condensation/addition monomer in the fluorenone resin is preferably from 0.01% by mass to 90% by mass, more preferably from 0.01% by mass to 50% by mass, even more preferably from 0.01% by mass to 10% by mass.
另外,在使用式(1)所示的兩末端矽烷醇型矽油作為縮合反應系單體,使用含有烯基的三烷氧基矽烷作為縮合/ 加成單體時,就使兩末端矽烷醇型矽油的矽烷醇基、與含有烯基的三烷氧基矽烷的烷氧基比例恰當地反應的觀點而言,兩者的調配比較佳為,上述官能基的莫耳比(矽烷醇基/烷氧基)為20/1~0.2/1,更佳為10/1~0.5/1,尤佳為實質上為當量(1/1)。 Further, in the case of using the two-terminal stanol type eucalyptus oil represented by the formula (1) as a condensation reaction-based monomer, an alkenyl group-containing trialkoxy decane is used as the condensation/ When the monomer is added, the ratio of the decyl alcohol group of the decyl alcohol type eucalyptus oil to the alkoxy group of the alkenyl group-containing trialkoxy decane is appropriately reacted, and the preparation of the two is preferable. The molar ratio (stanol group/alkoxy group) of the above functional group is from 20/1 to 0.2/1, more preferably from 10/1 to 0.5/1, and still more preferably substantially equivalent (1/1).
在使用日本專利特開2010-159411號公報所記載的矽酮樹脂時,由於分2個階段將矽酮樹脂硬化,因此無須在螢光體片材上形成黏著層。 When the fluorenone resin described in Japanese Laid-Open Patent Publication No. 2010-159411 is used, since the fluorenone resin is cured in two stages, it is not necessary to form an adhesive layer on the phosphor sheet.
螢光體是吸收自LED晶片釋放的光而變換波長,並釋放與LED晶片的光不同的波長的光的螢光體。藉此,自LED晶片釋放的光的一部分、與自螢光體釋放的光的一部分混合,而獲得包括白色的多色系LED。具體而言,藉由將藍色系LED、與因來自藍色系LED的光而發出黃色系光的螢光體進行光學組合,而可使用單一LED晶片發出白色系光。 The phosphor is a phosphor that absorbs light emitted from the LED wafer, converts the wavelength, and discharges light of a wavelength different from that of the LED wafer. Thereby, a part of the light emitted from the LED wafer is mixed with a part of the light released from the phosphor to obtain a multicolor LED including white. Specifically, by combining the blue LED and the phosphor that emits yellow light by the light from the blue LED, a single LED wafer can be used to emit white light.
如上所述的螢光體有:發出綠色光的螢光體、發出藍色光的螢光體、發出黃色光的螢光體、發出紅色光的螢光體等各種螢光體。本發明所用的具體的螢光體可列舉:無機螢光體、有機螢光體、螢光顏料、螢光染料等公知的螢光體。有機螢光體可列舉:烯丙基磺醯胺-三聚氰胺甲醛共縮合染色物或苝系螢光體等,就可長期使用的方面而言,較佳為使用苝系螢光體。本發明中可特佳地使用的螢光物質可列舉無機螢光體。以下對本發明中所用的無機螢光體進行記載。 The phosphor described above includes various phosphors such as a phosphor that emits green light, a phosphor that emits blue light, a phosphor that emits yellow light, and a phosphor that emits red light. Specific examples of the phosphor used in the present invention include known phosphors such as inorganic phosphors, organic phosphors, fluorescent pigments, and fluorescent dyes. The organic phosphor may, for example, be an allylsulfonamide-melamine formaldehyde co-condensation dye or a fluorene-based phosphor. For the long-term use, it is preferred to use a lanthanide-based phosphor. The fluorescent material which can be particularly preferably used in the present invention is an inorganic phosphor. The inorganic phosphor used in the present invention will be described below.
發出綠色光的螢光體例如有:SrAl2O4:Eu、Y2SiO5:Ce,Tb、MgAl11O19:Ce,Tb、Sr7Al12O25:Eu、(Mg、Ca、Sr、Ba中至少1種以上)Ga2S4:Eu等。 Examples of the phosphor that emits green light include: SrAl 2 O 4 :Eu, Y 2 SiO 5 :Ce, Tb, MgAl 11 O 1 9:Ce, Tb, Sr 7 Al 12 O 25 :Eu, (Mg, Ca, At least one or more of Sr and Ba) Ga 2 S 4 :Eu or the like.
發出藍色光的螢光體例如有:Sr5(PO4)3Cl:Eu、(SrCaBa)5(PO4)3Cl:Eu、(BaCa)5(PO4)3Cl:Eu、(Mg、Ca、Sr、Ba中至少1種以上)2B5O9Cl:Eu,Mn、(Mg、Ca、Sr、Ba中至少1種以上)(PO4)6Cl2:Eu,Mn等。 Examples of the phosphor that emits blue light include: Sr 5 (PO 4 ) 3 Cl:Eu, (SrCaBa) 5 (PO 4 ) 3 Cl:Eu, (BaCa) 5 (PO 4 ) 3 Cl:Eu, (Mg, At least one of Ca, Sr, and Ba) 2 B 5 O 9 Cl: Eu, Mn, (at least one of Mg, Ca, Sr, and Ba) (PO 4 ) 6 Cl 2 : Eu, Mn, or the like.
發出綠色光~黃色光的螢光體有:至少經鈰活化的釔-鋁氧化物螢光體、至少經鈰活化的釔-釓-鋁氧化物螢光體、至少經鈰活化的釔-鋁-石榴石氧化物螢光體、及至少經鈰活化的釔-鎵-鋁氧化物螢光體等(所謂的YAG系螢光體)。具體而言,可使用:Ln3M5O12:R(Ln為選自Y、Gd、La的至少1種以上。M包含Al、Ca的至少任一種。R為鑭系。)、(Y1-XGaX)3(Al1-yGay)5O12:R(R為選自Ce、Tb、Pr、Sm、Eu、Dy、Ho的至少1種以上。為0<x<0.5、0<y<0.5。)。 Phosphors emitting green light to yellow light include: at least a cerium-activated cerium-aluminum oxide phosphor, at least a cerium-activated cerium-lanthanum-aluminum oxide phosphor, at least cerium-activated cerium-aluminum a garnet oxide phosphor, and a yttrium-gallium-aluminum oxide phosphor activated at least by ruthenium (so-called YAG-based phosphor). Specifically, Ln 3 M 5 O 12 : R (Ln is at least one selected from the group consisting of Y, Gd, and La. M includes at least one of Al and Ca. R is an anthracene system.), (Y 1-X Ga X) 3 ( Al 1-y Ga y) 5 O 12: R (R is selected from Ce, Tb, Pr, Sm, at least Eu, Dy, Ho species 1 0 <x <0.5. , 0 < y < 0.5.).
發出紅色光的螢光體例如有:Y2O2S:Eu、La2O2S:Eu、Y2O3:Eu、Gd2O2S:Eu等。 Examples of the phosphor that emits red light include Y 2 O 2 S:Eu, La 2 O 2 S:Eu, Y 2 O 3 :Eu, Gd 2 O 2 S:Eu, and the like.
另外,目前與主流的藍色LED對應而發光的螢光體可列舉:Y3(Al,Ga)5O12:Ce、(Y,Gd)3Al5O12:Ce、Lu3Al5O12:Ce、Y3Al5O12:Ce等YAG系螢光體、Tb3Al5O12:Ce等TAG系螢光體、(Ba,Sr)2SiO4:Eu系螢光體或Ca3Sc2Si3O12:Ce系螢光體、(Sr,Ba,Mg)2SiO4:Eu等矽酸鹽系螢光體、(Ca,Sr)2Si5N8:Eu、(Ca,Sr)AlSiN3:Eu、CaSiAlN3:Eu等氮化 物系螢光體、Cax(Si,Al)12(O,N)16:Eu等氮氧化物系螢光體、以及(Ba,Sr,Ca)Si2O2N2:Eu系螢光體、Ca8MgSi4O16Cl2:Eu系螢光體、SrAl2O4:Eu、Sr4Al14O25:Eu等螢光體。 Moreover, the current mainstream blue LED emitting light corresponding to the phosphor include: Y 3 (Al, Ga) 5 O 12: Ce, (Y, Gd) 3 Al 5 O 12: Ce, Lu 3 Al 5 O 12 : Ce, Y 3 Al 5 O 12 : Ye, YAG-based phosphor, Tb 3 Al 5 O 12 : Ce, etc. TAG-based phosphor, (Ba, Sr) 2 SiO 4 : Eu-based phosphor or Ca 3 Sc 2 Si 3 O 12 : Ce-based phosphor, (Sr, Ba, Mg) 2 SiO 4 : Eu-based citrate-based phosphor, (Ca, Sr) 2 Si 5 N 8 : Eu, (Ca , Sr)AlSiN 3 : nitride, nitride-based phosphor such as Eu, CaSiAlN 3 :Eu, oxynitride phosphor such as Ca x (Si,Al) 12 (O,N) 16 :Eu, and (Ba,Sr , Ca)Si 2 O 2 N 2 :Eu-based phosphor, Ca 8 MgSi 4 O 16 Cl 2 :Eu-based phosphor, SrAl 2 O 4 :Eu, Sr 4 Al 14 O 25 :Eu, etc. .
這些中,就發光效率或亮度等的方面而言,較佳為使用YAG系螢光體、TAG系螢光體、矽酸鹽系螢光體。 Among these, YAG-based phosphors, TAG-based phosphors, and citrate-based phosphors are preferably used in terms of luminous efficiency, brightness, and the like.
除了上述以外,亦可根據用途或目標發光色而使用公知的螢光體。 In addition to the above, a known phosphor may be used depending on the use or the target luminescent color.
本發明中所使用的螢光體的平均粒徑並無特別限制,較佳為1μm以上者。另外,較佳為平均粒徑為20μm以下者。此處,本發明中所謂平均粒徑,是指中值粒徑、即D50。螢光體片材中所含的螢光體的D50是藉由以下方法而測定:對片材剖面的掃描型電子顯微鏡(Scanning Electron Microscope,SEM)的測定圖像進行圖像處理,而求出粒徑分布,在由此所得的體積基準粒度分布中,將自小粒徑側起的累計通過率(cumulative percent passing)50%的粒徑設為中值粒徑D50。藉由該方法求出的D50的值,成為比直接觀察螢光體粉末時小的值,但本發明中的螢光體的平均粒徑定義為藉由上述測定方法而求出的值。若平均粒徑為上述範圍,則螢光體片材中的螢光體的分散性良好,而可獲得穩定的發光。 The average particle diameter of the phosphor used in the present invention is not particularly limited, but is preferably 1 μm or more. Further, it is preferred that the average particle diameter is 20 μm or less. Here, the average particle diameter in the present invention means a median diameter, that is, D50. The D50 of the phosphor contained in the phosphor sheet is measured by image processing of a measurement image of a Scanning Electron Microscope (SEM) of a sheet cross section. In the particle size distribution, the volume-based particle size distribution thus obtained has a particle diameter of 50% from the small particle size side as a median diameter D50. The value of D50 obtained by this method is smaller than that when the phosphor powder is directly observed. However, the average particle diameter of the phosphor in the present invention is defined as a value obtained by the above-described measurement method. When the average particle diameter is in the above range, the dispersibility of the phosphor in the phosphor sheet is good, and stable luminescence can be obtained.
另外,上述D50的值成為小於直接觀察螢光體粉末時的值的理由,是因為在直接觀察粉末時,雖然可準確地測定直徑,但在測定螢光體片材的剖面所存在的螢光體的粒徑時,螢光體粒子未必限定在赤道面切割。若假定螢光體 粒子為球狀,且在其任意部位進行切割,則其表觀直徑在理論上為真實直徑的78.5%(相當於直徑為1的圓的面積與一邊為1的正方形的面積之比)。實際上由於螢光體粒子並非圓球,因此經驗上而言大約為真實直徑的70%~85%。 In addition, the reason why the value of D50 is smaller than the value when the phosphor powder is directly observed is because the diameter of the phosphor sheet can be accurately measured, but the fluorescence of the cross section of the phosphor sheet is measured. In the case of the particle size of the body, the phosphor particles are not necessarily limited to the equatorial plane. If a phosphor is assumed When the particles are spherical and cut at any portion thereof, the apparent diameter is theoretically 78.5% of the true diameter (corresponding to the ratio of the area of the circle having a diameter of 1 to the area of a square having one side). In fact, since the phosphor particles are not spheres, they are empirically about 70% to 85% of the true diameter.
本發明中,螢光體的含量較佳為螢光體片材整體的53質量%以上,更佳為57質量%以上,尤佳為60質量%以上。 藉由將螢光體片材中的螢光體含量設為上述範圍,則可提高螢光體片材的耐光性。另外,就容易製作螢光體片材的作業性的觀點而言,較佳為螢光體片材整體的95質量%以下,更佳為90質量%以下,尤佳為85質量%以下,特佳為80質量%以下。 In the present invention, the content of the phosphor is preferably 53% by mass or more, more preferably 57% by mass or more, and particularly preferably 60% by mass or more based on the entire phosphor sheet. By setting the content of the phosphor in the phosphor sheet to the above range, the light resistance of the phosphor sheet can be improved. In addition, from the viewpoint of easiness of production of the phosphor sheet, it is preferably 95% by mass or less, more preferably 90% by mass or less, and particularly preferably 85% by mass or less, particularly preferably 90% by mass or less, of the entire phosphor sheet. Good is 80% by mass or less.
本發明中的螢光體片材是藉由以下方式而形成:在含有聚苯硫醚的基材上塗佈用以形成螢光體片材的片材製作用樹脂液,並對經塗佈的片材製作用樹脂液進行熱乾燥、硬化。聚苯硫醚是含有下述通式(2)所示的結構作為必須的重複單元的高分子。 The phosphor sheet of the present invention is formed by coating a resin liquid for forming a sheet of a phosphor sheet on a substrate containing polyphenylene sulfide and coating the same. The sheet is prepared by thermal drying and hardening with a resin liquid. Polyphenylene sulfide is a polymer containing a structure represented by the following formula (2) as an essential repeating unit.
本發明中所使用的聚苯硫醚是含有較佳為70莫耳%以上、更佳為90莫耳%以上的通式(2)所示的重複單元的聚合物。在聚苯硫醚含有70莫耳%以上的通式(2)所示的重複單元時,耐熱性優異,因此較佳。 The polyphenylene sulfide used in the present invention is a polymer containing a repeating unit represented by the formula (2), preferably 70 mol% or more, more preferably 90 mol% or more. When the polyphenylene sulfide contains 70 mol% or more of the repeating unit represented by the formula (2), the heat resistance is excellent, which is preferable.
另外,本發明中所使用的聚苯硫醚的重複單元的30莫耳%以下,可由下述結構式所示的重複單元等構成。本發明中所使用的聚苯硫醚可為包含上述通式(2)所示的重複單元、以及下述結構式所示的重複單元的至少1種的無規共聚物、嵌段共聚物,或亦可為具有上述通式(2)所示的重複單元的聚合物、以及具有下述結構式所示的重複單元的至少1種的聚合物的混合物。 In addition, 30 mol% or less of the repeating unit of the polyphenylene sulfide used in the present invention may be composed of a repeating unit or the like represented by the following structural formula. The polyphenylene sulfide used in the present invention may be at least one random copolymer or block copolymer comprising a repeating unit represented by the above formula (2) and a repeating unit represented by the following structural formula. Alternatively, it may be a mixture of a polymer having a repeating unit represented by the above formula (2) and at least one polymer having a repeating unit represented by the following structural formula.
另外,本發明的聚苯硫醚除了包含上述重複單元的直鏈型聚苯硫醚外,亦可使用交聯型聚苯硫醚,但本發明中所使用的基材較理想為具備柔軟性的膜形狀,因此較佳為可使用包含直鏈型聚苯硫醚的膜狀者。 Further, the polyphenylene sulfide of the present invention may be a crosslinked polyphenylene sulfide in addition to the linear polyphenylene sulfide containing the above repeating unit, but the substrate used in the present invention is preferably provided with flexibility. Since it has a film shape, it is preferable to use a film type containing a linear polyphenylene sulfide.
只要不損及本發明的效果,基材可包含聚苯硫醚以外的成分。例如可包含聚苯硫醚以外的樹脂成分、或無機成 分。聚苯硫醚以外的樹脂成分可列舉:聚乙烯、聚丙烯、乙烯共聚合樹脂等聚烯烴,聚苯乙烯、丙烯腈-丁二烯-苯乙烯(Acrylonitrile Butadiene Styrene,ABS)樹脂等苯乙烯系樹脂,聚氯乙烯、偏二氯乙烯、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯、聚四氟乙烯等熱塑性樹脂,或聚丙烯酸酯樹脂、聚氧苯甲醯、聚碳酸酯、聚縮醛、聚苯醚、聚醯亞胺等高耐熱性樹脂等。將聚苯硫醚與其他樹脂混合的方法有:成膜時進行混合而合金化的方法、在聚苯硫醚基質中分散其他樹脂的微粒子的方法。 成形體的用途已知,為了改善滑動性而與聚四氟乙烯合金化的聚苯硫醚。 The substrate may contain components other than polyphenylene sulfide as long as the effects of the present invention are not impaired. For example, it may contain a resin component other than polyphenylene sulfide or inorganic Minute. Examples of the resin component other than the polyphenylene sulfide include polyolefins such as polyethylene, polypropylene, and ethylene copolymer resins, and styrenes such as polystyrene and acrylonitrile butadiene styrene (ABS) resins. Resin, thermoplastic resin such as polyvinyl chloride, vinylidene chloride, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polytetrafluoroethylene, or polyacrylate resin A high heat resistant resin such as polyoxybenzoic acid, polycarbonate, polyacetal, polyphenylene ether or polyimide. A method of mixing polyphenylene sulfide with another resin is a method of mixing and alloying at the time of film formation, and a method of dispersing fine particles of another resin in a polyphenylene sulfide matrix. The use of a molded body is known as a polyphenylene sulfide which is alloyed with polytetrafluoroethylene in order to improve slidability.
無機成分可列舉玻璃纖維或無機微粒子。藉由包含這些無機成分,而可降低熱膨脹係數、提高韌性、提高彈性模數等改良機械特性。玻璃纖維亦可使用任一種,就難以引起機械特性的劣化的方面而言,較佳為包含石英玻璃、E玻璃等無鹼玻璃、低鹼玻璃者。例如可列舉:二氧化矽、氧化鋁、氧化鈣、氧化硼、氧化鋅、氧化鈦、氧化鋯等無機氧化物微粒子,或玻璃粉末、石英粉末、或鈦酸鋇、碳酸鈣、碳酸鋇、硫酸鈣、硫酸鋇等氧化物以外的無機化合物粉末,滑石、蒙脫石(montmorillonite)、雲母等來自天然物的無機微粒子,這些無機微粒子中,根據需要可實施表面處理。表面處理的具體例可列舉:使用矽油等的撥水處理、使用矽烷偶合劑等表面處理劑的疏水化處理、親水化處理、或在微粒子表面導入羥基、胺基、羧基、環氧基、 丙烯醯基(acryl group)、乙烯基、烷基、芳基等有機官能基等,為了提高與所使用的樹脂的親和性、或界面的密接性或分散性等,這些表面處理可適當選擇。 Examples of the inorganic component include glass fibers or inorganic fine particles. By including these inorganic components, it is possible to reduce the thermal expansion coefficient, improve the toughness, and improve the mechanical properties such as the elastic modulus. Any one of the glass fibers may be used, and it is preferable to include an alkali-free glass such as quartz glass or E glass or a low alkali glass in terms of difficulty in causing deterioration of mechanical properties. For example, inorganic oxide fine particles such as cerium oxide, aluminum oxide, calcium oxide, boron oxide, zinc oxide, titanium oxide, or zirconium oxide, or glass powder, quartz powder, or barium titanate, calcium carbonate, barium carbonate, sulfuric acid may be mentioned. An inorganic compound powder other than an oxide such as calcium or barium sulfate, or inorganic fine particles derived from natural materials such as talc, montmorillonite or mica, and these inorganic fine particles may be subjected to surface treatment as needed. Specific examples of the surface treatment include hydrophobization treatment using an oil such as eucalyptus oil, hydrophobization treatment using a surface treatment agent such as a decane coupling agent, hydrophilization treatment, or introduction of a hydroxyl group, an amine group, a carboxyl group, or an epoxy group on the surface of the fine particles. An organic functional group such as an acryl group, a vinyl group, an alkyl group or an aryl group can be appropriately selected in order to improve the affinity with the resin to be used, or the adhesion or dispersibility of the interface.
本發明的基材可包含上述任一種成分,藉由包含聚苯硫醚作為主成分,而塗佈後述螢光體片材製作用樹脂液時,可獲得無收縮或不均的塗佈膜,而且,在LED晶片上貼附螢光體片材後,將基材剝離時可容易地剝離。 The substrate of the present invention may contain any of the above-mentioned components, and when a resin liquid for producing a phosphor sheet to be described later is applied by containing polyphenylene sulfide as a main component, a coating film having no shrinkage or unevenness can be obtained. Further, after the phosphor sheet is attached to the LED wafer, the substrate can be easily peeled off when the substrate is peeled off.
另外,本發明的基材可為具有聚苯硫醚層的積層體。 例如日本專利特開2006-21372號公報所揭示的在熱變形溫度為70℃~150℃的聚烯烴系樹脂層的單面或兩面,積層以聚苯硫醚為主成分的層而成的積層體,亦可用作本發明的基材。 Further, the substrate of the present invention may be a laminate having a polyphenylene sulfide layer. For example, a layer formed of a layer mainly composed of polyphenylene sulfide as a main component of a polyolefin resin layer having a heat distortion temperature of 70 ° C to 150 ° C disclosed in Japanese Laid-Open Patent Publication No. 2006-21372 The body can also be used as a substrate of the present invention.
為了提高後述的螢光體片材製作用樹脂液的流動性而使塗佈性良好,本發明的螢光體片材可含有矽酮微粒子。 所含有的矽酮微粒子較佳為包含矽酮樹脂及/或矽酮橡膠的微粒子。特佳為藉由以下方法而得的矽酮微粒子:將有機三烷氧基矽烷或有機二烷氧基矽烷、有機三乙醯氧基矽烷、有機二乙醯氧基矽烷、有機三肟矽烷、有機二肟矽烷等有機矽烷水解,接著進行縮合。 In order to improve the fluidity of the resin liquid for producing a phosphor sheet to be described later, the coating property is good, and the phosphor sheet of the present invention may contain an anthrone fine particle. The fluorenone fine particles contained are preferably fine particles containing an fluorenone resin and/or an anthrone rubber. Particularly preferred are fluorenone microparticles obtained by the following methods: an organic trialkoxy decane or an organic dialkoxy decane, an organic triethoxy decane, an organic diethyl methoxy decane, an organic trioxane, The organic decane such as organic dioxane is hydrolyzed, followed by condensation.
有機三烷氧基矽烷可例示:甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三正丙氧基矽烷、甲基三異丙氧基矽烷、甲基三正丁氧基矽烷、甲基三異丁氧基矽烷、甲基三第二丁氧基矽烷、甲基三第三丁氧基矽烷、乙基三甲氧基矽烷、正丙基三甲氧基矽烷、異丙基三甲氧基矽烷、正丁 基三丁氧基矽烷、異丁基三丁氧基矽烷、第二丁基三甲氧基矽烷、第三丁基三丁氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、乙烯基三甲氧基矽烷、苯基三甲氧基矽烷等。 The organotrialkoxydecane can be exemplified by methyltrimethoxydecane, methyltriethoxydecane, methyltri-n-propoxydecane, methyltriisopropoxydecane, methyltri-n-butoxydecane. , methyl triisobutoxy decane, methyl tri-tert-butoxy decane, methyl tri-tert-butoxy decane, ethyl trimethoxy decane, n-propyl trimethoxy decane, isopropyl trimethoxy Base decane Tributoxy decane, isobutyl tributoxy decane, second butyl trimethoxy decane, tert-butyl tributoxy decane, N-(2-aminoethyl)-3-amino Propyltrimethoxydecane, 3-glycidoxypropyltrimethoxydecane, vinyltrimethoxydecane, phenyltrimethoxydecane, and the like.
有機二烷氧基矽烷可例示:二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、二乙基二乙氧基矽烷、二乙基二甲氧基矽烷、3-胺基丙基甲基二乙氧基矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)-3-胺基異丁基甲基二甲氧基矽烷、N-乙基胺基異丁基甲基二乙氧基矽烷、(苯基胺基甲基)甲基二甲氧基矽烷、乙烯基甲基二乙氧基矽烷等。 The organic dialkoxy decane can be exemplified by dimethyl dimethoxy decane, dimethyl diethoxy decane, methyl ethyl dimethoxy decane, methyl ethyl diethoxy decane, and diethyl. Diethoxydecane, diethyldimethoxydecane, 3-aminopropylmethyldiethoxydecane, N-(2-aminoethyl)-3-aminopropylmethyldimethyl Oxydecane, N-(2-aminoethyl)-3-aminoisobutylmethyldimethoxydecane, N-ethylaminoisobutylmethyldiethoxydecane, (phenylaminomethyl) And methyl dimethoxy decane, vinyl methyl diethoxy decane, and the like.
有機三乙醯氧基矽烷可例示:甲基三乙醯氧基矽烷、乙基三乙醯氧基矽烷、乙烯基三乙醯氧基矽烷等。 The organic triethoxydecane can be exemplified by methyltriethoxydecane, ethyltriethoxydecane, vinyltriethoxydecane or the like.
有機二乙醯氧基矽烷可例示:二甲基二乙醯氧基矽烷、甲基乙基二乙醯氧基矽烷、乙烯基甲基二乙醯氧基矽烷、乙烯基乙基二乙醯氧基矽烷等。 The organic diethoxy decane can be exemplified by dimethyldiethoxydecane, methylethyldiethoxydecane, vinylmethyldiethoxydecane, vinylethyldiethoxycarbonyl. Base decane and the like.
有機三肟矽烷可例示:甲基三甲基乙基酮肟矽烷、乙烯基三甲基乙基酮肟矽烷,有機二肟矽烷可例示:甲基乙基二甲基乙基酮肟矽烷等。 The organic trioxane is exemplified by methyl trimethyl ethyl ketone decane and vinyl trimethyl ethyl ketone decane, and the organic dioxane is exemplified by methyl ethyl dimethyl ethyl ketone decane.
此種粒子具體而言可藉由以下方法而得:日本專利特開昭63-77940號公報中所報告的方法、日本專利特開平6-248081號公報中所報告的方法、日本專利特開2003-342370號公報中所報告的方法、日本專利特開平 4-88022號公報中所報告的方法等。另外亦已知:將有機三烷氧基矽烷或有機二烷氧基矽烷、有機三乙醯氧基矽烷、有機二乙醯氧基矽烷、有機三肟矽烷、有機二肟矽烷等有機矽烷及/或其部分水解物添加於鹼性水溶液中,進行水解、縮合而獲得粒子的方法;或在水或酸性溶液中添加有機矽烷及/或其部分水解物,而獲得該有機矽烷及/或其部分水解物的水解部分縮合物後,添加鹼進行縮合反應而獲得粒子的方法;使有機矽烷及/或其水解物為上層,使鹼或鹼與有機溶劑的混合液為下層,在這些層的界面將該有機矽烷及/或其水解物水解、聚縮合而獲得粒子的方法等,這些任一種方法中,均可獲得本發明所用的粒子。 Specifically, such a particle can be obtained by the method described in Japanese Laid-Open Patent Publication No. SHO-63-77940, the method of Japanese Patent Application Laid-Open No. Hei. Method reported in the Gazette No. -342370, Japanese Patent Special Open The method and the like reported in the publication No. 4-88022. Further, it is also known to use an organic decane such as an organic trialkoxy decane or an organic dialkoxy decane, an organic triethoxy decane, an organic diethyl methoxy decane, an organic trioxane or an organic dioxane. Or a partial hydrolyzate thereof is added to an alkaline aqueous solution to carry out hydrolysis or condensation to obtain particles; or an organic decane and/or a partial hydrolyzate thereof is added to water or an acidic solution to obtain the organodecane and/or a part thereof. After hydrolyzing a partial condensate of the hydrolyzate, a method of obtaining a particle by adding a base to carry out a condensation reaction; making the organic decane and/or its hydrolyzate an upper layer, and a mixture of a base or a base and an organic solvent as a lower layer, at the interface of these layers The method of obtaining the particles by hydrolyzing and polycondensing the organodecane and/or its hydrolyzate, and the like, can obtain the particles used in the present invention in any of the methods.
這些中,在使有機矽烷及/或其部分水解物水解、縮合,而製造球狀有機聚倍半矽氧烷微粒子(spherical organic polysilsesquioxane particle)時,較佳為使用藉由在如日本專利特開2003-342370號公報中所報告的反應溶液內添加高分子分散劑的方法而得的矽酮微粒子。 Among these, when the organodecane and/or a partial hydrolyzate thereof is hydrolyzed and condensed to produce spherical organic polysilsesquioxane particles, it is preferably used by, for example, Japanese Patent Laid-Open An anthrone fine particle obtained by a method of adding a polymer dispersant to a reaction solution reported in Japanese Laid-Open Patent Publication No. 2003-342370.
另外,在製造粒子時,亦可使用藉由以下方式製造的矽酮微粒子:使有機矽烷及/或其部分水解物水解、縮合,以在酸性水溶液中存在能於溶劑中發揮出作為保護膠體的作用的高分子分散劑及鹽的狀態,添加有機矽烷及/或其水解物而獲得水解物後,添加鹼進行縮合反應。 Further, in the production of the particles, an anthrone fine particle produced by hydrolyzing and condensing the organic decane and/or a partial hydrolyzate thereof in the presence of an acidic colloid can be used as a protective colloid in a solvent. In the state of the polymer dispersant and the salt to be acted on, an organic decane and/or a hydrolyzate thereof is added to obtain a hydrolyzate, and then a base is added to carry out a condensation reaction.
高分子分散劑若為水溶性高分子,且在溶劑中發揮出作為保護膠體的作用者,則亦可使用合成高分子、天然高分子的任一種,具體而言,可例示聚乙烯醇、聚乙烯吡咯 啶酮等。高分子分散劑的添加方法可例示:預先添加於反應初液中的方法、同時添加有機三烷氧基矽烷及/或其部分水解物的方法、使有機三烷氧基矽烷及/或其部分水解物水解部分縮合後添加的方法,亦可選擇這些的任一種方法。 此處,相對於反應液容量1質量份,高分子分散劑的添加量較佳為5×10-7~5×10-2質量份的範圍,若高分子分散劑的添加量為該範圍,則粒子彼此難以引起凝聚。 When the polymer dispersant is a water-soluble polymer and exhibits a role as a protective colloid in a solvent, any of a synthetic polymer and a natural polymer may be used. Specifically, polyvinyl alcohol or poly(poly) can be exemplified. Vinyl pyrrolidone and the like. The method of adding the polymer dispersant may be exemplified by a method of previously adding to the reaction liquid, a method of simultaneously adding an organic trialkoxysilane and/or a partial hydrolyzate thereof, and an organic trialkoxysilane and/or a portion thereof. The method of adding the hydrolyzate to the partial condensation of the hydrolysis may also be selected from any of these methods. Here, the amount of the polymer dispersant to be added is preferably in the range of 5 × 10 -7 to 5 × 10 -2 parts by mass based on 1 part by mass of the reaction liquid, and when the amount of the polymer dispersant added is in the range, Then particles are hard to cause agglomeration with each other.
矽酮微粒子所含的有機取代基較佳為甲基、苯基,可藉由這些取代基的含量來調整矽酮微粒子的折射率。在為了不使LED發光裝置的亮度降低,而欲不使通過作為黏合劑樹脂的矽酮樹脂的光散射而使用時,較佳為矽酮微粒子的折射率d1、與該矽酮微粒子及螢光體以外的成分的折射率d2的折射率差為小。矽酮微粒子的折射率d1、與矽酮微粒子及螢光體以外的成分的折射率d2的折射率差,較佳為小於0.10,更佳為0.03以下。藉由以成為此種範圍的方式,控制矽酮樹脂與矽酮微粒子的折射率,而降低矽酮微粒子與矽酮樹脂的界面的反射、散射,並獲得高透明性、透光率,而不會使LED發光裝置的亮度降低。 The organic substituent contained in the fluorenone microparticles is preferably a methyl group or a phenyl group, and the refractive index of the fluorenone microparticles can be adjusted by the content of these substituents. In order to reduce the brightness of the LED light-emitting device without using the light scattering of the fluorenone resin as the binder resin, the refractive index d1 of the fluorenone fine particles and the fluorenone fine particles and the fluorescent light are preferably used. The refractive index difference of the refractive index d2 of the component other than the body is small. The refractive index difference between the refractive index d1 of the fluorene ketone fine particles and the refractive index d2 of the fluorenone fine particles and the components other than the fluorescent material is preferably less than 0.10, more preferably 0.03 or less. By controlling the refractive index of the fluorenone resin and the fluorenone microparticles in such a range, the reflection and scattering of the interface between the fluorenone microparticles and the fluorenone resin are lowered, and high transparency and light transmittance are obtained without This will reduce the brightness of the LED lighting device.
關於折射率的測定,全反射法可使用阿貝(Abbe)折射計、浦耳弗里奇(Pulfrich)折射計、液浸型折射計、液浸法、最小偏向角法等,但矽酮組成物的折射率測定中有效使用Abbe折射計,矽酮微粒子的折射率測定中有效使用液浸法。 For the measurement of the refractive index, the total reflection method may use an Abbe refractometer, a Pulfrich refractometer, a liquid immersion refractometer, a liquid immersion method, a minimum deflection angle method, etc., but an anthrone composition. The Abbe refractometer is effectively used for the measurement of the refractive index of the object, and the liquid immersion method is effectively used for the measurement of the refractive index of the fluorenone microparticles.
另外,用以控制上述折射率差的方法,可藉由改變構 成矽酮微粒子的原料的調配比來進行調整。即例如在使用甲基三烷氧基矽烷與苯基三烷氧基矽烷的混合物作為原料時,增加甲基的構成比,即增加甲基三烷氧基矽烷的調配量,從而可實現接近1.4的低折射率化。反之,藉由增加苯基的構成比,即增加苯基三烷氧基矽烷的調配量,而可實現相對高折射率化。 In addition, the method for controlling the above refractive index difference can be modified by The blending ratio of the raw materials of the ketone ketone fine particles is adjusted. That is, for example, when a mixture of methyl trialkoxy decane and phenyltrialkoxy decane is used as a raw material, the composition ratio of methyl groups is increased, that is, the amount of methyl trialkoxy decane is increased, thereby achieving a ratio of 1.4. Low refractive index. On the other hand, by increasing the composition ratio of the phenyl group, that is, increasing the amount of the phenyltrialkoxydecane, a relatively high refractive index can be achieved.
本發明中,矽酮微粒子的平均粒徑以中值粒徑(D50)表示,該平均粒徑的下限較佳為0.01μm以上,更佳為0.05μm以上。另外,上限較佳為2.0μm以下,更佳為1.0μm以下。若平均粒徑為0.01μm以上,則容易製造控制了粒徑的粒子,另外,藉由平均粒徑為2.0μm以下,而螢光體片材的光學特性變得良好。另外,藉由平均粒徑為0.01μm以上、2.0μm以下,而可充分獲得螢光體片材製造用樹脂液的流動性提高效果。另外,較佳為以單分散使用圓球狀粒子。本發明中,螢光體片材所含的矽酮微粒子的平均粒徑、即中值粒徑(D50)及粒度分布,可藉由片材剖面的SEM觀察進行測定。對SEM的測定圖像進行圖像處理而求出粒徑分布,在由此獲得的粒度分布中,將自小粒徑側起的累計通過率50%的粒徑作為中值粒徑D50而求出。此時,亦與螢光體粒子的情形相同,根據螢光體片材的剖面SEM圖像求出的矽酮微粒子的平均粒徑,與真實的平均粒徑相比,理論上為真實的平均粒徑的78.5%、實際上大約為70%~85%的值,但本發明中的矽酮微粒子的平均粒徑定義為藉由上述測定方法而求出的值。 In the present invention, the average particle diameter of the fluorenone fine particles is represented by a median diameter (D50), and the lower limit of the average particle diameter is preferably 0.01 μm or more, and more preferably 0.05 μm or more. Further, the upper limit is preferably 2.0 μm or less, more preferably 1.0 μm or less. When the average particle diameter is 0.01 μm or more, it is easy to produce particles having a controlled particle diameter, and the average particle diameter is 2.0 μm or less, and the optical characteristics of the phosphor sheet are excellent. In addition, by having an average particle diameter of 0.01 μm or more and 2.0 μm or less, the fluidity improving effect of the resin liquid for producing a phosphor sheet can be sufficiently obtained. Further, it is preferred to use spherical particles in a single dispersion. In the present invention, the average particle diameter of the fluorenone fine particles contained in the phosphor sheet, that is, the median diameter (D50) and the particle size distribution can be measured by SEM observation of the sheet cross section. The measurement image of the SEM was subjected to image processing to obtain a particle size distribution, and in the particle size distribution thus obtained, the particle diameter of 50% of the cumulative throughput rate from the small particle diameter side was determined as the median diameter D50. Out. At this time, also in the same manner as in the case of the phosphor particles, the average particle diameter of the fluorenone microparticles obtained from the cross-sectional SEM image of the phosphor sheet is theoretically a true average compared with the true average particle diameter. The value of 78.5% of the particle diameter is actually about 70% to 85%. However, the average particle diameter of the fluorenone fine particles in the present invention is defined as a value obtained by the above measurement method.
本發明的螢光體片材中,矽酮微粒子的含量相對於矽酮樹脂與矽酮微粒子的合計量,下限較佳為0.5質量%以上,更佳為1質量%以上,尤佳為2質量%以上。另外,上限較佳為20質量%以下,更佳為10質量%以下。藉由含有1質量%以上的矽酮微粒子,而可獲得特別良好的螢光體分散穩定化效果,另一方面,藉由含有20質量%以下的矽酮微粒子,而不會使片材製作用樹脂液的黏度過度上升。 In the phosphor sheet of the present invention, the content of the fluorenone fine particles is preferably 0.5% by mass or more, more preferably 1% by mass or more, and particularly preferably 2% by mass based on the total amount of the fluorenone resin and the fluorenone fine particles. %the above. Further, the upper limit is preferably 20% by mass or less, and more preferably 10% by mass or less. By containing 1% by mass or more of the fluorenone fine particles, a particularly excellent phosphor dispersion stabilizing effect can be obtained, and on the other hand, by containing 20% by mass or less of the fluorenone fine particles, the sheet can be produced. The viscosity of the resin liquid rises excessively.
本發明的螢光體片材製作用樹脂液中,作為其他成分,為了抑制片材製作用樹脂液在常溫下硬化而延長適用期(pot life),較佳為調配乙炔醇等矽氫化反應延遲劑。 In the resin liquid for producing a phosphor sheet of the present invention, in order to suppress the hardening of the resin liquid for sheet production at room temperature and to extend the pot life, it is preferable to adjust the hydrogenation reaction delay such as acetylene alcohol. Agent.
另外,在不損及本發明的效果的範圍內,在片材製作用樹脂液中,可根據需要調配:燻矽(fumed silica)、玻璃粉末、石英粉末等微粒子,氧化鈦、氧化鋯、鈦酸鋇、氧化鋅等無機填充劑或顏料,阻燃劑、耐熱劑、抗氧化劑、分散劑、溶劑、矽烷偶合劑或鈦偶合劑等黏接性賦予劑等。 In addition, in the resin liquid for sheet production, fine particles such as fumed silica, glass powder, and quartz powder, titanium oxide, zirconium oxide, and titanium can be blended as needed in the range of the effect of the present invention. An inorganic filler or pigment such as strontium or zinc oxide, or an adhesion-imparting agent such as a flame retardant, a heat-resistant agent, an antioxidant, a dispersant, a solvent, a decane coupling agent or a titanium coupling agent.
特別是就螢光體片材的表面平滑性的方面而言,較佳為在螢光體片材製作用樹脂液中添加低分子量聚二甲基矽氧烷成分、矽油等。此種成分在片材製作用樹脂液中(包含溶劑時溶劑量除外),較佳為添加100ppm~2,000ppm,更佳為添加500ppm~1,000ppm。 In particular, in terms of surface smoothness of the phosphor sheet, it is preferred to add a low molecular weight polydimethyl siloxane component, eucalyptus oil, or the like to the resin liquid for producing a phosphor sheet. Such a component is preferably added in an amount of from 100 ppm to 2,000 ppm, more preferably from 500 ppm to 1,000 ppm, in the resin liquid for sheet production (excluding the solvent amount when the solvent is contained).
本發明中的螢光體片材的膜厚根據螢光體含量、以及所期望的光學特性而確定。為了獲得所期望的光學特性,而需要螢光體片材含有特定量的螢光體,但若螢光體片材 中的螢光體量為過高濃度,則就作業性的觀點而言,存在極限,因此螢光體片材的膜厚較佳為10μm以上。另外,本發明中的螢光體片材由於螢光體含量多,因此即便膜厚為厚時,耐光性亦優異。另一方面,就提高螢光體片材的光學特性、耐熱性的觀點而言,螢光體片材的膜厚較佳為200μm以下,更佳為100μm以下。藉由使螢光體片材為200μm以下的膜厚,而可降低黏合劑樹脂的光吸收或光散射,因此成為光學性優異的螢光體片材。 The film thickness of the phosphor sheet in the present invention is determined in accordance with the phosphor content and the desired optical characteristics. In order to obtain the desired optical characteristics, it is required that the phosphor sheet contains a specific amount of phosphor, but if the phosphor sheet is used When the amount of the phosphor in the medium is too high, there is a limit in terms of workability, and therefore the thickness of the phosphor sheet is preferably 10 μm or more. Further, since the phosphor sheet of the present invention has a large content of the phosphor, the light resistance is excellent even when the film thickness is thick. On the other hand, from the viewpoint of improving the optical characteristics and heat resistance of the phosphor sheet, the thickness of the phosphor sheet is preferably 200 μm or less, and more preferably 100 μm or less. By making the phosphor sheet a film thickness of 200 μm or less, light absorption or light scattering of the binder resin can be reduced, and thus the phosphor sheet is excellent in optical properties.
本發明中的螢光體片材的膜厚,是指根據JIS K7130(1999)塑膠-膜及片材-厚度測定方法中藉由機械掃描的厚度的測定方法A法而測定的膜厚(平均膜厚)。 The film thickness of the phosphor sheet in the present invention is a film thickness measured by the method A for measuring the thickness by mechanical scanning in the plastic-film and sheet-thickness measurement method of JIS K7130 (1999). Film thickness).
LED處在小空間且產生大量熱的環境中,特別是高功率LED時,發熱明顯。由於此種發熱而螢光體的溫度上升,從而LED的亮度降低。因此,重要的是如何將所產生的熱高效地散熱。本發明中,藉由使螢光體片材的膜厚為上述範圍,而可獲得耐熱性優異的螢光體片材。另外,若螢光體片材的膜厚存在偏差,則每個LED晶片的螢光體量產生差異,結果發光光譜(色溫度、亮度、色度)產生偏差。因此,片材膜厚的偏差較佳為±5%以內,更佳為±3%以內。另外,此處所謂的膜厚偏差,是根據JIS K7130(1999)塑膠-膜及片材-厚度測定方法中藉由機械掃描的厚度的測定方法A法而測定膜厚,根據下述所示的式子而算出。 The LED is in a small space and generates a lot of heat, especially in high-power LEDs, the heat is obvious. Due to such heat generation, the temperature of the phosphor rises, and the brightness of the LED decreases. Therefore, it is important how to efficiently dissipate the generated heat. In the present invention, by setting the film thickness of the phosphor sheet to the above range, a phosphor sheet excellent in heat resistance can be obtained. Further, when the film thickness of the phosphor sheet varies, the amount of phosphor per LED wafer varies, and as a result, the emission spectrum (color temperature, luminance, and chromaticity) varies. Therefore, the deviation of the film thickness of the sheet is preferably within ±5%, more preferably within ±3%. In addition, the film thickness variation here is measured by the method A of the thickness of the mechanical scanning by the method A of the plastic-film and sheet-thickness measurement method of JIS K7130 (1999), and it is shown below. Calculated by the formula.
更具體而言,使用藉由機械掃描的厚度的測定方法A法的測定條件,使用市售的接觸式厚度計等測微計 (micrometer)測定膜厚,計算所得的膜厚的最大值或最 小值與平均膜厚之差,將該值除以平均膜厚而以百分率表示的值成為膜厚偏差B(%)。 More specifically, the measurement conditions of the thickness measurement method by mechanical scanning are used, and a micrometer such as a commercially available contact thickness meter is used. (micrometer) measure the film thickness, calculate the maximum or maximum film thickness The difference between the small value and the average film thickness is divided by the average film thickness, and the value expressed as a percentage is the film thickness deviation B (%).
膜厚偏差B(%)={(最大膜厚偏差值*-平均膜厚)/平均膜厚}×100 Film thickness deviation B (%) = {(maximum film thickness deviation value * - average film thickness) / average film thickness} × 100
*最大膜厚偏差值是選擇膜厚的最大值或最小值中與平均膜厚之差大的值。 * The maximum film thickness deviation value is a value at which the difference between the maximum value and the minimum value of the film thickness and the average film thickness is large.
以下,列舉具體例對本發明的積層體的製作方法進行說明。另外,以下為一例,本發明的積層體的製作方法並不限定於此。 Hereinafter, a method of producing the laminated body of the present invention will be described by way of specific examples. In addition, the following is an example, and the manufacturing method of the laminated body of this invention is not limited to this.
首先,製作將螢光體粒子、與根據需要而使用的矽酮微粒子分散於矽酮樹脂材料中而成的樹脂液(以下稱為「片材製作用樹脂液」)來作為螢光體片材製作用塗佈液。片材製作用樹脂液藉由將螢光體粒子、矽酮樹脂材料及根據需要的矽酮微粒子無溶劑地或在適當的溶劑中混合而得。在使用加成反應型矽酮樹脂時,若將作為矽酮樹脂材料的含有與矽原子鍵結的烯基的化合物、和具有與矽原子鍵結的氫原子的化合物混合,則在室溫下亦會開始硬化反應,因此亦可進一步將乙炔化合物等矽氫化反應延遲劑調配至片材製作用樹脂液中,而提高保存穩定性。另外,就保存穩定性的方面而言,有效的是不將具有與矽原子鍵結的烯基的化合物、具有與矽原子鍵結的氫原子的化合物、以及加 成反應觸媒(鉑系觸媒)全部混合,而是預先分離為2液。 例如將具有與矽原子鍵結的烯基的矽氧烷化合物和鉑系觸媒設為A液,將具有與矽原子鍵結的氫基的化合物設為B液,在A液中分散螢光體粒子與矽酮微粒子後,在將要片材化前混合B液。 First, a resin liquid obtained by dispersing the phosphor particles and the fluorenone fine particles used as needed in the fluorenone resin material (hereinafter referred to as "resin liquid for sheet production") is prepared as a phosphor sheet. The coating liquid is applied. The resin liquid for sheet production is obtained by mixing the phosphor particles, the fluorenone resin material, and, if necessary, the fluorenone fine particles in a solvent-free manner or in a suitable solvent. When an addition reaction type fluorenone resin is used, if a compound containing an alkenyl group bonded to a ruthenium atom as a fluorene ketone resin material and a compound having a hydrogen atom bonded to a ruthenium atom are mixed, at room temperature Since the hardening reaction is also started, the hydrogenation reaction retarder such as an acetylene compound can be further blended into the resin liquid for sheet production to improve storage stability. Further, in terms of storage stability, it is effective to not have a compound having an alkenyl group bonded to a ruthenium atom, a compound having a hydrogen atom bonded to a ruthenium atom, and The reaction catalyst (platinum-based catalyst) was all mixed, but was separated into two liquids in advance. For example, a siloxane compound having an alkenyl group bonded to a ruthenium atom and a platinum-based catalyst are used as the liquid A, and a compound having a hydrogen group bonded to a ruthenium atom is used as the liquid B, and the fluorination is dispersed in the liquid A. After the bulk particles and the fluorene ketone fine particles, the liquid B is mixed before the sheet is to be formed.
亦可將作為添加劑的用以使塗佈膜穩定化的分散劑或均化劑、作為片材表面的改質劑的矽烷偶合劑等黏接輔助劑等混合於片材製作用樹脂液中。 A dispersing agent or a leveling agent for stabilizing the coating film as an additive, a bonding aid such as a decane coupling agent as a modifier of the surface of the sheet, and the like may be mixed in the resin liquid for sheet production.
為了調整片材製作用樹脂液的黏度而添加溶劑時,若為可調整流動狀態的樹脂的黏度者,則溶劑的種類並無特別限定。例如可列舉:甲苯、甲基乙基酮、甲基異丁基酮、己烷、庚烷、環己烷、丙酮、松脂醇、丁基卡必醇、丁基卡必醇乙酸酯、乙二醇二甲醚、二乙二醇二甲醚等。 When the solvent is added to adjust the viscosity of the resin liquid for sheet production, the type of the solvent is not particularly limited as long as the viscosity of the resin in the flow state can be adjusted. For example, toluene, methyl ethyl ketone, methyl isobutyl ketone, hexane, heptane, cyclohexane, acetone, rosinol, butyl carbitol, butyl carbitol acetate, B Diol dimethyl ether, diethylene glycol dimethyl ether, and the like.
在以成為特定組成的方式調合這些成分後,利用均質器、自轉公轉型攪拌機、三輥機(roller)、球磨機、行星式球磨機、珠磨機、捏合機等攪拌、混練機均質地進行混合分散,從而獲得片材製作用樹脂液。亦較佳為在混合分散後,或混合分散的過程中,在真空或減壓條件下進行脫泡。 After blending these components in a specific composition, the mixture is homogenized and homogenized by a homogenizer, a self-rotating mixer, a three-roller, a ball mill, a planetary ball mill, a bead mill, a kneader, and the like. Thus, a resin liquid for sheet production was obtained. It is also preferred to carry out defoaming under vacuum or reduced pressure after mixing and dispersion, or during mixing and dispersion.
接著,將片材製作用樹脂液塗佈於聚苯硫醚樹脂膜基材上進行乾燥。塗佈可藉由以下裝置來進行:逆輥塗佈機(reverse roll coater)、刮刀塗佈機(blade coater)、狹縫式塗佈機(slit die coater)、直接凹版印刷塗佈機(direct gravure coater)、套版凹版印刷塗佈機(offset gravure coater)、吻合式塗佈機(kiss coater)、網版印刷、自然輥塗機(natural roll coater)、氣刀塗佈機(air-knife coater)、輥式刮刀塗佈機、可調刮棒輥式刮刀塗佈機(vari-bar roll blade coater)、雙流塗佈機(two-stream coater)、桿式塗佈機、線棒塗機、敷料器(applicator)、浸塗機、簾幕式塗佈機、旋塗機、刀式塗佈機等。為了獲得片材膜厚的均勻性,較佳為藉由狹縫式塗佈機進行塗佈。另外,本發明的螢光體片材亦可使用網版印刷或凹版印刷、平版印刷等印刷法進行製作。特佳為使用網版印刷。 Next, the resin liquid for sheet production is applied onto a polyphenylene sulfide resin film substrate and dried. Coating can be carried out by means of a reverse roll coater, a blade coater, a slit die coater, a direct gravure coater (direct Gravure coater), gravure coater (offset gravure) Coater), kiss coater, screen printing, natural roll coater, air-knife coater, roll coater, adjustable scraper Vor-bar roll blade coater, two-stream coater, rod coater, bar coater, applicator, dip coater, curtain type A coater, a spin coater, a knife coater, and the like. In order to obtain uniformity of the film thickness of the sheet, it is preferred to apply it by a slit coater. Further, the phosphor sheet of the present invention can also be produced by a printing method such as screen printing, gravure printing or lithography. It is especially good to use screen printing.
本發明中所使用的基材的膜厚並無特別限制,下限較佳為40μm以上,更佳為60μm以上。另外,上限較佳為5000μm以下,更佳為3000μm以下。 The film thickness of the substrate used in the present invention is not particularly limited, and the lower limit is preferably 40 μm or more, and more preferably 60 μm or more. Further, the upper limit is preferably 5,000 μm or less, more preferably 3,000 μm or less.
塗佈於基材上的片材製作用樹脂液的加熱硬化,可使用熱風乾燥機或紅外線乾燥機等通常的加熱裝置來進行。 片材製作用樹脂液的加熱硬化條件,是使用熱風乾燥機或紅外線乾燥機等通常的加熱裝置,通常在40℃~250℃下為1分鐘~5小時、較佳為在100℃~200℃下為2分鐘~3小時。 The resin liquid for sheet production applied to the substrate is heat-cured, and can be carried out by a usual heating device such as a hot air dryer or an infrared dryer. The heat curing condition of the resin liquid for sheet production is a normal heating device such as a hot air dryer or an infrared dryer, and is usually from 1 minute to 5 hours, preferably from 100 ° C to 200 ° C at 40 ° C to 250 ° C. The next is 2 minutes to 3 hours.
本發明的積層體中,可在螢光體片材側設置用以提高與LED晶片的黏接性的黏著層。黏著層的材料並無特別限制,可列舉通常的橡膠系、丙烯酸系、胺基甲酸酯系、矽酮系黏著劑等。雖然可使用任意者,但作為適於耐熱性、絕緣性、透明性的黏著劑,有用的是矽酮系黏著劑。 In the laminate of the present invention, an adhesive layer for improving the adhesion to the LED wafer can be provided on the side of the phosphor sheet. The material of the adhesive layer is not particularly limited, and examples thereof include a usual rubber-based, acrylic-based, urethane-based, anthrone-based adhesive. Although any of them can be used, an anthrone-based adhesive is useful as an adhesive suitable for heat resistance, insulation, and transparency.
另外,本發明的積層體中,可在螢光體片材側設置保 護膜。保護膜的材料並無特別限制,可列舉:聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚乙烯、聚丙烯、聚氯乙烯、賽璐玢(cellophane)、聚苯硫醚等。另外,保護膜可藉由矽酮系或氟系等公知的脫模劑進行脫模處理。 In addition, in the laminate of the present invention, it can be provided on the side of the phosphor sheet. Protective film. The material of the protective film is not particularly limited, and examples thereof include polyethylene terephthalate (PET), polyethylene, polypropylene, polyvinyl chloride, cellophane, and polyphenylene sulfide. Further, the protective film can be subjected to a release treatment by a known release agent such as an anthrone or a fluorine.
作為可應用本發明中的螢光體片材的LED晶片,可列舉:面朝上型(face up type)LED晶片或倒裝晶片型(flip chip type)LED晶片等,特佳為倒裝晶片型LED晶片。倒裝晶片型LED晶片的發光效率高,且散熱性亦高。因此,藉由使用本發明中的螢光體片材,而容易製作耐光性優異的照明用途的高功率LED。 As the LED wafer to which the phosphor sheet of the present invention can be applied, a face up type LED chip or a flip chip type LED chip, etc., particularly preferably a flip chip LED chip. The flip chip type LED wafer has high luminous efficiency and high heat dissipation. Therefore, by using the phosphor sheet of the present invention, it is easy to produce a high-power LED for illumination use having excellent light resistance.
本發明中的螢光體片材可作為波長變換片材安裝於LED元件中而使用。目前主流的照明用白色LED,藉由使用螢光體材料將藍色LED元件的藍色光的一部分波長變換為黃色、綠色、或紅色,並與藍色LED元件的藍色光混合而獲得白色光。將螢光體材料安裝於藍色LED元件中的方法,主要採用:在對藍色LED元件進行樹脂密封時使所用的液狀透明密封材中預先含有螢光體的方法。該方法雖然簡便,但難以在個別的藍色LED元件上精密地塗佈含有固定量螢光體的液狀密封樹脂,而導致色偏差。相對於此,根據本發明,可獲得膜厚均勻的螢光體片材,因此在藍色LED元件上可容易地安裝固定厚度的螢光體片材,因此可使藍色LED元件上的螢光體量為固定。藉由安裝本發明的螢光體片材而進行藍色LED元件的波長變換,而可獲得無 色偏差或亮度偏差的優異的白色LED發光裝置。 The phosphor sheet of the present invention can be used as a wavelength conversion sheet to be mounted on an LED element. At present, the mainstream white LED for illumination converts a part of the wavelength of the blue light of the blue LED element into yellow, green, or red by using a phosphor material, and mixes with the blue light of the blue LED element to obtain white light. The method of attaching a phosphor material to a blue LED element mainly employs a method of preliminarily containing a phosphor in a liquid transparent sealing material used when resin sealing a blue LED element. Although this method is simple, it is difficult to precisely apply a liquid sealing resin containing a fixed amount of phosphor to individual blue LED elements, resulting in color deviation. On the other hand, according to the present invention, since a phosphor sheet having a uniform film thickness can be obtained, a phosphor sheet having a fixed thickness can be easily attached to the blue LED element, so that the phosphor on the blue LED element can be obtained. The amount of light is fixed. By performing the wavelength conversion of the blue LED element by mounting the phosphor sheet of the present invention, no Excellent white LED light-emitting device with color deviation or brightness deviation.
接著,對使用本發明的積層體製造LED發光裝置的方法進行說明。另外,以下的說明為一例,密封製造方法並不限定於這些說明。 Next, a method of manufacturing an LED light-emitting device using the laminated body of the present invention will be described. In addition, the following description is an example, and the sealing manufacturing method is not limited to these description.
在倒裝晶片型LED晶片應用本發明的積層體時,首先,根據進行密封的LED晶片的大小將積層體小片化。小片化可藉由切割來進行。在積層體具有保護膜時,可在剝離後進行小片化,亦可連保護膜一起進行小片化。另外,在LED晶片在發光面(光出射面)側具有電極墊時,較理想為在貼附前對積層體實施加工,而預先在相當於電極墊的部分開孔。 When the laminate of the present invention is applied to a flip chip type LED wafer, first, the laminate is diced according to the size of the LED wafer to be sealed. The dicing can be performed by cutting. When the laminated body has a protective film, it may be diced after peeling, or may be diced together with the protective film. Further, when the LED wafer has an electrode pad on the light-emitting surface (light-emitting surface) side, it is preferable to perform processing on the laminated body before attaching, and to open a hole in a portion corresponding to the electrode pad in advance.
接著,在積層體具有保護膜時,將保護膜剝離後,在LED晶片的發光面貼合經小片化的積層體。此時,積層體的螢光體片材可為半硬化狀態,亦可預先進行硬化。貼合較佳為使用黏接劑,可使用公知的黏晶劑(die bond agent)或黏接劑,例如:丙烯酸系樹脂系、環氧樹脂系、胺基甲酸酯樹脂系、矽酮樹脂系、改質矽酮樹脂系、酚樹脂系、聚醯亞胺系、聚乙烯醇系、聚甲基丙烯酸酯樹脂系、三聚氰胺樹脂系、脲樹脂系的黏接劑。在螢光體片材本身具有黏著性時、或具有黏著劑層時,亦可利用其本身。另外,為經半硬化的螢光體片材時,亦可利用加熱的硬化。另外,在螢光體片材於硬化後具有熱軟化性時,亦可藉由熱融著而黏接。 Next, when the laminated body has a protective film, after the protective film is peeled off, a small-sized laminated body is bonded to the light-emitting surface of the LED chip. At this time, the phosphor sheet of the laminate may be in a semi-hardened state or may be hardened in advance. The bonding is preferably carried out by using an adhesive, and a known die bond agent or an adhesive such as an acrylic resin, an epoxy resin, a urethane resin or an anthranone resin can be used. A modified ketone resin system, a phenol resin system, a polyamidene system, a polyvinyl alcohol system, a polymethacrylate resin system, a melamine resin system, or a urea resin type binder. When the phosphor sheet itself has adhesiveness or has an adhesive layer, it is also possible to use itself. Further, in the case of a semi-cured phosphor sheet, it may be cured by heating. Further, when the phosphor sheet has thermal softening property after curing, it can be bonded by heat fusion.
接著,將聚苯硫醚樹脂膜基材自積層體剝離。若基材 為聚苯硫醚,則不會引起螢光體片材的損傷或自LED晶片剝離,而可容易地取下基材。亦可與剝離保護膜的時刻(timing)一致,預先剝離基材後,將螢光體片材貼合於LED晶片上,在螢光體片材的強度弱時,若先剝離基材,則螢光體片材有可能破損,因此較佳為貼合於LED晶片後剝離基材。 Next, the polyphenylene sulfide resin film substrate was peeled off from the laminate. If the substrate In the case of polyphenylene sulfide, the phosphor sheet is not damaged or peeled off from the LED wafer, and the substrate can be easily removed. It is also possible to bond the phosphor sheet to the LED wafer after the substrate is peeled off in advance, in accordance with the timing of peeling off the protective film. When the strength of the phosphor sheet is weak, if the substrate is first peeled off, Since the phosphor sheet may be damaged, it is preferable to peel the substrate after bonding to the LED wafer.
然後,藉由公知的方法將LED晶片的電極與電路基板的配線進行電性連接,從而可獲得發光裝置。在LED晶片於發光面側具有電極時,將LED晶片以發光面為上而藉由黏晶材等固定於電路基板後,藉由焊線接合(wire bonding)將LED晶片上面的電極與電路基板的配線連接。另外,在LED晶片為於發光面的相反面具有電極墊的倒裝晶片型時,使LED晶片的電極面與電路基板的配線對接,藉由一次性接合進行連接。在螢光體片材以半硬化狀態與LED晶片貼合時,可在該電性連接之前或之後的恰當時刻進行硬化。例如,將倒裝晶片型進行一次性接合時,在進行熱壓接的接合時,可藉由該加熱而同時使螢光體片材硬化。另外,在更大的電路基板表面上安裝連接有LED晶片與電路基板的封裝時,在藉由回流焊進行焊接的同時,可使螢光體片材硬化。 Then, the electrode of the LED wafer and the wiring of the circuit board are electrically connected by a known method, whereby a light-emitting device can be obtained. When the LED chip has an electrode on the light-emitting surface side, the LED chip is fixed to the circuit board by a bonding material or the like with the light-emitting surface as the upper surface, and the electrode and the circuit substrate on the LED wafer are bonded by wire bonding. Wiring connection. Further, when the LED chip is a flip chip type having an electrode pad on the opposite surface of the light-emitting surface, the electrode surface of the LED chip is brought into contact with the wiring of the circuit board, and the connection is performed by one-time bonding. When the phosphor sheet is bonded to the LED wafer in a semi-hardened state, it can be cured at an appropriate timing before or after the electrical connection. For example, when the flip chip type is subjected to one-time bonding, the bonding of the thermocompression bonding can simultaneously cure the phosphor sheet by the heating. Further, when a package in which an LED chip and a circuit board are connected is mounted on a surface of a larger circuit board, the phosphor sheet can be cured while being welded by reflow soldering.
螢光體片材可兼作LED晶片的密封劑,亦可進一步使用公知的矽酮樹脂等作為透光性密封材,將貼附了螢光體片材的LED晶片密封。另外,在藉由透光性密封材將LED晶片密封後,亦可在該密封材上貼附螢光體片材而使用。 The phosphor sheet can also serve as a sealant for the LED wafer, and a well-known fluorenone resin or the like can be further used as the light-transmitting sealing material to seal the LED wafer to which the phosphor sheet is attached. Further, after the LED wafer is sealed by a translucent sealing material, a phosphor sheet may be attached to the sealing material and used.
另外,在將LED晶片構築到表面的半導體晶圓中,貼附未小片化的積層體,然後,亦可將半導體晶圓與積層體一次性地個體化(切割)。 Further, in the semiconductor wafer on which the LED wafer is mounted on the surface, a laminate which is not small-sized is attached, and then the semiconductor wafer and the laminated body can be individually (cut).
可應用使用本發明中的螢光體片材而得的LED晶片的發光裝置,並無特別限制,可廣泛應用於:電視機、電腦、行動電話、遊戲機等所用的顯示器的背光裝置,或車的頭燈等車載領域,建築物的一般照明等。 The light-emitting device of the LED chip which can be obtained by using the phosphor sheet of the present invention is not particularly limited, and can be widely applied to a backlight of a display used for a television, a computer, a mobile phone, a game machine, or the like, or Vehicle headlights and other automotive fields, general lighting of buildings, etc.
實施例 Example
以下,藉由實施例對本發明進行具體說明。但本發明並不限定於這些實施例。 Hereinafter, the present invention will be specifically described by way of examples. However, the invention is not limited to the embodiments.
〈膜厚測定〉 <Measurement of film thickness>
預先藉由測微計對形成螢光體片材的基材的特定位置進行膜厚測定,並預先標記。將螢光體片材積層後,再次藉由測微計測定標記部分,由所得的膜厚,減去預先測定的基材的膜厚,而獲得螢光體片材的膜厚。膜厚是將110mm見方的片材作為測定樣品,以10mm間隔成網格狀並測定100點,求出各樣品的最大值、最小值、平均值,藉由下述式求出膜厚偏差B。 The film thickness of the specific position of the substrate on which the phosphor sheet is formed is measured in advance by a micrometer, and is marked in advance. After the phosphor sheet was laminated, the mark portion was again measured by a micrometer, and the film thickness of the substrate measured in advance was subtracted from the obtained film thickness to obtain the film thickness of the phosphor sheet. In the film thickness, a sheet of 110 mm square was used as a measurement sample, and a grid was formed at intervals of 10 mm, and 100 points were measured. The maximum value, the minimum value, and the average value of each sample were determined, and the film thickness deviation B was obtained by the following formula. .
膜厚偏差B(%)={(最大膜厚偏差值*-平均膜厚)/平均膜厚}×100 Film thickness deviation B (%) = {(maximum film thickness deviation value * - average film thickness) / average film thickness} × 100
*最大膜厚偏差值是選擇膜厚的最大值或最小值中與平均膜厚之差大者。 * The maximum film thickness deviation value is the difference between the maximum value and the minimum value of the selected film thickness and the average film thickness.
〈相關色溫度偏差〉 <Correlated color temperature deviation>
對將各螢光體片材搭載於藍色LED元件的發光裝置流通400mA的電流,而使LED晶片點亮,使用瞬間多重測光系統(MCPD-3000、大塚電子公司製造),測定試驗剛開始後的相關色溫度。對各螢光體片材的1種分別逐個製作100個LED發光裝置,求出100個中的平均值、最大值、最小值,並根據下述式評價偏差。 A current of 400 mA was applied to a light-emitting device in which each of the phosphor sheets was mounted on a blue LED element, and the LED chip was turned on, and an instantaneous multi-photometry system (MCPD-3000, manufactured by Otsuka Electronics Co., Ltd.) was used, and immediately after the start of the measurement test The relevant color temperature. One hundred LED light-emitting devices were produced one by one for each of the phosphor sheets, and the average value, the maximum value, and the minimum value among the 100 samples were obtained, and the variation was evaluated according to the following formula.
相關色溫度偏差(K)=相關色溫度最大偏差值-平均相關色溫度 Correlated color temperature deviation (K)=correlation color temperature maximum deviation value-average correlation color temperature
*相關色溫度最大偏差值是選擇相關色溫度的最大值或最小值中與平均值之差大者。 * The maximum deviation value of the correlated color temperature is the difference between the maximum value and the minimum value of the selected color temperature and the average value.
<矽酮微粒子的合成例:矽酮微粒子1> <Synthesis Example of Anthrone Microparticles: Anthrone Microparticles 1>
在2L四口圓底燒瓶中安裝攪拌機、溫度計、回流管、滴液漏斗,在燒瓶中加入包含1ppm的作為界面活性劑的聚醚改質矽氧烷「BYK333」的2.5%的氨水2L,一邊以300rpm攪拌,一邊藉由油浴升溫。在到達內溫50℃後,歷時30分鐘自滴液漏斗滴加甲基三甲氧基矽烷與苯基三甲氧基矽烷的混合物(23mol%/77mol%)200g。接著在該溫度下,繼續攪拌60分鐘後,添加乙酸(試劑特級)約5g,並攪拌混合後,進行過濾。對過濾器上的生成粒子添加水600mL 2次,添加甲醇200mL 1次,進行過濾、清洗。將過濾器上的濾餅取出,碎解後,歷時10小時進行冷 凍乾燥,藉此獲得白色粉末60g。所得的粒子是中值粒徑(D50)為0.5μm的單分散球狀微粒子。藉由液浸法對該微粒子進行折射率測定,結果為1.54。藉由剖面TEM觀察該粒子,結果可確認到粒子內為單一結構的粒子。 A stirrer, a thermometer, a reflux tube, and a dropping funnel were placed in a 2 L four-neck round bottom flask, and 2 ml of 2.5% ammonia water containing 1 ppm of a polyether modified oxirane "BYK333" as a surfactant was added to the flask. The mixture was stirred at 300 rpm while being heated by an oil bath. After reaching an internal temperature of 50 ° C, a mixture (23 mol% / 77 mol%) of methyltrimethoxydecane and phenyltrimethoxydecane (200 g) was added dropwise from the dropping funnel over 30 minutes. Then, stirring was continued at this temperature for 60 minutes, and then about 5 g of acetic acid (reagent grade) was added thereto, and the mixture was stirred and mixed, followed by filtration. 600 mL of water was added to the generated particles on the filter twice, and 200 mL of methanol was added once, and the mixture was filtered and washed. Remove the filter cake from the filter and disintegrate it for 10 hours. It was freeze-dried, whereby 60 g of a white powder was obtained. The obtained particles were monodisperse spherical fine particles having a median diameter (D50) of 0.5 μm. The refractive index of the fine particles was measured by a liquid immersion method and found to be 1.54. When the particles were observed by a cross-sectional TEM, it was confirmed that particles within a particle have a single structure.
(實施例1) (Example 1)
使用容積300ml的聚乙烯製容器,混合40.0質量%比率的作為矽酮樹脂的「OE-6630A/B」(東麗道康寧(TORAY.DOW CORNING)公司製造、折射率1.53)、60.0質量%比率的作為螢光體的「NYAG-02」(英特美(Intematix)公司製造:摻雜Ce的YAG系螢光體、比重:4.8g/cm3、D50:7μm)。 A container of polyethylene having a volume of 300 ml was used, and a ratio of 40.0% by mass of "OE-6630A/B" (manufactured by TORAY.DOW CORNING, refractive index of 1.53) and a ratio of 60.0% by mass was mixed as a ketone resin. as phosphors "NYAG-02" (Intel US (Intematix) manufactured by: Ce-doped YAG phosphor system, specific gravity: 4.8g / cm 3, D50: 7μm).
然後,使用行星式攪拌-脫泡裝置「Mazerustar(註冊商標)」KK-400(倉紡(Kurabo)製造),以1000rpm進行20分鐘攪拌、脫泡而獲得螢光體片材製作液。使用狹縫式塗佈機,將片材製作用樹脂液塗佈於聚苯硫醚膜「TORELINA(註冊商標)」(東麗股份有限公司製造)上,以130℃加熱、乾燥2小時,而獲得形成有平均膜厚約100μm的螢光體片材的積層體。所得的積層體是螢光體片材均勻地塗佈於基材的膜上,未見到針孔(pinhole),且膜厚均勻性亦良好。 Then, using a planetary stirring-deaerator "Mazerustar (registered trademark)" KK-400 (manufactured by Kurabo), the mixture was stirred at 1000 rpm for 20 minutes, and defoamed to obtain a phosphor sheet preparation liquid. The resin liquid for sheet production was applied to a polyphenylene sulfide film "TORELINA (registered trademark)" (manufactured by Toray Industries, Inc.) using a slit coater, and heated and dried at 130 ° C for 2 hours. A laminate in which a phosphor sheet having an average film thickness of about 100 μm was formed was obtained. The obtained laminated body was such that the phosphor sheet was uniformly applied to the film of the substrate, no pinhole was observed, and the film thickness uniformity was also good.
在螢光體片材上塗佈「SD4580」(東麗道康寧公司製造的矽酮黏著劑),以100℃加熱乾燥15分鐘而獲得黏著層。 "SD4580" (anthraquinone adhesive manufactured by Toray Dow Corning Co., Ltd.) was applied to the phosphor sheet, and dried by heating at 100 ° C for 15 minutes to obtain an adhesive layer.
在黏著層上對「Cerapeel(註冊商標)」BLK(東麗膜 加工(TORAY ADVANCED FILM)股份有限公司製造)進行常溫層壓而作為覆蓋膜。 "Cerapeel (registered trademark)" BLK (Toray film) on the adhesive layer The processing (manufactured by TORAY ADVANCED FILM Co., Ltd.) was carried out at room temperature to form a cover film.
接著,為了對所得的積層體的基材剝離性進行試驗,而在玻璃基板上進行轉印層壓。 Next, in order to test the substrate releasability of the obtained laminated body, transfer lamination was performed on the glass substrate.
將積層體切成100mm×50mm,並將覆蓋膜剝離。接著,使剝離覆蓋膜而露出黏著層的面與玻璃基板接觸,藉由橡膠製手壓輥以不進入氣泡的方式進行密接。然後,若將基材的「TORELINA(註冊商標)」膜剝離,則螢光體片材會一直與玻璃基板密接而不會剝離或損傷,從而可容易地僅將基材膜剝離。 The laminate was cut into 100 mm × 50 mm, and the cover film was peeled off. Next, the surface on which the cover film was peeled off and the adhesive layer was peeled off was brought into contact with the glass substrate, and the rubber hand roll was adhered so as not to enter the air bubbles. Then, when the "TORELINA (registered trademark)" film of the substrate is peeled off, the phosphor sheet is always in close contact with the glass substrate without being peeled off or damaged, and the base film can be easily peeled off.
另外,以相同的方式在LED元件上貼附螢光體片材,進行點亮並測定發光色,結果,相關色溫度的偏差小,且可獲得良好的白色LED。 Further, the phosphor sheet is attached to the LED element in the same manner, and the light is emitted and measured, and as a result, the variation in the correlated color temperature is small, and a good white LED can be obtained.
(實施例2~實施例4) (Example 2 to Example 4)
以成為表1所記載的量的方式,添加矽酮微粒子1,以螢光體片材中的螢光體粒子的含量保持60.0質量%的方式調整各成分的量,此外,以與實施例1相同的方式製作螢光體片材。在螢光體片材上塗佈「SD4580」(東麗道康寧公司製造的矽酮黏著劑),以100℃加熱乾燥15分鐘,而獲得黏著層。 The fluorenone fine particles 1 were added so as to be in an amount shown in Table 1, and the amount of each component was adjusted so that the content of the phosphor particles in the phosphor sheet was kept at 60.0% by mass, and Example 1 was used. A phosphor sheet was produced in the same manner. "SD4580" (an anthrone adhesive manufactured by Toray Dow Corning Co., Ltd.) was applied to the phosphor sheet, and dried by heating at 100 ° C for 15 minutes to obtain an adhesive layer.
在黏著層上,對「Cerapeel(註冊商標)」BLK(東麗膜加工股份有限公司製造)進行常溫層壓作為覆蓋膜。 On the adhesive layer, "Cerapeel (registered trademark)" BLK (manufactured by Toray Film Processing Co., Ltd.) was laminated at room temperature as a cover film.
接著,為了對所得的積層體的基材剝離性進行試驗,而在玻璃基板上進行轉印層壓。 Next, in order to test the substrate releasability of the obtained laminated body, transfer lamination was performed on the glass substrate.
將積層體切成100mm×50mm,並將覆蓋膜剝離。接著,使剝離覆蓋膜而露出黏著層的面與玻璃基板接觸,藉由橡膠製手壓輥以不進入氣泡的方式進行密接。然後,若將基材的「TORELINA(註冊商標)」膜剝離,則螢光體片材會一直與玻璃基板密接而不會剝離或損傷,從而可容易地僅將基材膜剝離。 The laminate was cut into 100 mm × 50 mm, and the cover film was peeled off. Next, the surface on which the cover film was peeled off and the adhesive layer was peeled off was brought into contact with the glass substrate, and the rubber hand roll was adhered so as not to enter the air bubbles. Then, when the "TORELINA (registered trademark)" film of the substrate is peeled off, the phosphor sheet is always in close contact with the glass substrate without being peeled off or damaged, and the base film can be easily peeled off.
另外,以相同的方式在LED元件上貼附螢光體片材,進行點亮並測定發光色,結果,相關色溫度的偏差非常小,且可獲得良好的白色LED。 Further, the phosphor sheet is attached to the LED element in the same manner, and the luminescent color is measured by lighting. As a result, the variation in the correlated color temperature is extremely small, and a good white LED can be obtained.
(比較例1) (Comparative Example 1)
將基材膜變更為聚對苯二甲酸乙二酯膜「Lumirror(註冊商標)」(東麗股份有限公司製造),除此以外,以與實施例1相同的方式製作積層體,並確認片材製作用樹脂液的塗佈性、及基材剝離性。塗佈性為良好,無針孔,且可獲得膜厚均勻性良好的螢光體片材,但將積層體轉印至玻璃基板後,若將基材膜剝離,則未能以螢光體片材的一部分附著在基材膜側的狀態剝離,而損傷並導致自玻璃基板剝離。 A laminate was produced in the same manner as in Example 1 except that the base film was changed to a polyethylene terephthalate film "Lumirror (registered trademark)" (manufactured by Toray Industries, Inc.), and the sheet was confirmed. The coating property of the resin liquid for material production and the peelability of the substrate. The coating property is good, there is no pinhole, and a phosphor sheet having good film thickness uniformity can be obtained. However, when the laminated body is transferred to a glass substrate, if the base film is peeled off, the phosphor is not obtained. A part of the sheet adhered to the side of the substrate film and peeled off, resulting in damage and peeling from the glass substrate.
另外,以相同的方式在LED元件上貼附積層體,若將基材剝離,則導致絕大部分的螢光體片材自LED元件剝離,無法進行點亮而測定發光色。 Further, the laminate was attached to the LED element in the same manner, and when the substrate was peeled off, most of the phosphor sheet was peeled off from the LED element, and the luminescent color could not be measured by lighting.
(比較例2) (Comparative Example 2)
將基材膜變更為經脫模處理的聚對苯二甲酸乙二酯膜「Cerapeel(註冊商標)」HP2(東麗膜加工股份有限公司 製造),除此以外,以與實施例1相同的方式製作螢光體片材,並確認片材製作用樹脂液的塗佈性、及基材剝離性。 塗佈時產生螢光體片材製作用樹脂液的收縮,藉由加熱、硬化而得的螢光體片材的膜厚不均勻。將積層體轉印至玻璃基板後,若將基材膜剝離,則螢光體片材會一直與玻璃基板密接而不會剝離或損傷,從而可容易地僅將基材膜剝離。 The base film was changed to a release-treated polyethylene terephthalate film "Cerapeel (registered trademark)" HP2 (Dongli Film Processing Co., Ltd. In the same manner as in Example 1, a phosphor sheet was produced in the same manner as in Example 1, and the coating property of the resin liquid for sheet production and the substrate peeling property were confirmed. At the time of coating, shrinkage of the resin liquid for producing a phosphor sheet is caused, and the thickness of the phosphor sheet obtained by heating and hardening is not uniform. When the laminated body is transferred to the glass substrate, when the base film is peeled off, the phosphor sheet is always in close contact with the glass substrate without being peeled off or damaged, and the base film can be easily peeled off.
以相同的方式在LED元件上貼附螢光體片材,進行點亮並測定發光色,結果,由於膜厚偏差大,因此相關色溫度的偏差亦大於實施例1~實施例4,白色LED無法獲得充分的均勻性。 The phosphor sheet is attached to the LED element in the same manner, and the luminescent color is measured by lighting. As a result, the variation in the correlated color temperature is larger than that of the first to fourth embodiments, and the white LED is larger. Unable to achieve sufficient uniformity.
(比較例3、比較例4) (Comparative Example 3, Comparative Example 4)
以成為表1所記載的量的方式,添加矽酮微粒子1,並以螢光體片材中的螢光體粒子的含量保持60.0質量%的方式調整各成分的量,此外,以與比較例2相同的方式製作螢光體片材,並確認片材製作用樹脂液的塗佈性、及基材剝離性。塗佈時產生螢光體片材製作用樹脂液的收縮,藉由加熱、硬化而得的螢光體片材的膜厚不均勻。將積層體轉印至玻璃基板後,若將基材膜剝離,則螢光體片材會一直與玻璃基板密接而不會剝離或損傷,從而可容易地僅將基材膜剝離。 The fluorenone fine particles 1 were added in an amount as shown in Table 1, and the amount of each component was adjusted so that the content of the phosphor particles in the phosphor sheet was kept at 60.0% by mass, and the comparative example was used. 2 A phosphor sheet was produced in the same manner, and the coating property of the resin liquid for sheet production and the peelability of the substrate were confirmed. At the time of coating, shrinkage of the resin liquid for producing a phosphor sheet is caused, and the thickness of the phosphor sheet obtained by heating and hardening is not uniform. When the laminated body is transferred to the glass substrate, when the base film is peeled off, the phosphor sheet is always in close contact with the glass substrate without being peeled off or damaged, and the base film can be easily peeled off.
以相同的方式在LED元件上貼附螢光體片材,進行點亮並測定發光色,結果,由於膜厚偏差大,因此相關色溫度的偏差大於實施例1~實施例4,白色LED無法獲得充 分的均勻性。 In the same manner, the phosphor sheet is attached to the LED element, and the luminescent color is measured by lighting. As a result, since the film thickness variation is large, the variation in the correlated color temperature is larger than that of the first to fourth embodiments, and the white LED cannot be used. Get charged The uniformity of the points.
(比較例5) (Comparative Example 5)
將基材膜變更為經脫模處理的聚對苯二甲酸乙二酯膜「Cerapeel(註冊商標)」BLK(東麗膜加工股份有限公司製造),除此以外,以與實施例1相同的方式製作螢光體片材,並確認片材製作用樹脂液的塗佈性、及基材剝離性。 塗佈時產生螢光體片材製作用樹脂液的收縮,針孔大量產生,藉由加熱、硬化而得的螢光體片材的膜厚不均勻。將積層體轉印至玻璃基板後,若將基材膜剝離,則螢光體片材會一直與玻璃基板密接而不會剝離或損傷,從而可容易地僅將基材膜剝離。 The same as in the first embodiment except that the base film was changed to a release-treated polyethylene terephthalate film "Cerapeel (registered trademark)" BLK (manufactured by Toray Film Processing Co., Ltd.). In the manner of producing a phosphor sheet, the coating property of the resin liquid for sheet production and the peelability of the substrate were confirmed. At the time of coating, shrinkage of the resin liquid for producing a phosphor sheet occurs, and pinholes are generated in a large amount, and the thickness of the phosphor sheet obtained by heating and hardening is not uniform. When the laminated body is transferred to the glass substrate, when the base film is peeled off, the phosphor sheet is always in close contact with the glass substrate without being peeled off or damaged, and the base film can be easily peeled off.
以相同的方式在LED元件上貼附螢光體片材,進行點亮並測定發光色,結果,由於膜厚偏差大,因此相關色溫度的偏差與實施例1~實施例4相比亦非常大,白色LED無法獲得充分的均勻性。 In the same manner, the phosphor sheet is attached to the LED element, and the luminescent color is measured by lighting. As a result, the variation in the correlated color temperature is also very large as compared with the first to fourth embodiments. Large, white LEDs do not achieve sufficient uniformity.
(比較例6) (Comparative Example 6)
以成為表1所記載的量的方式添加矽酮微粒子1,並以螢光體片材中的螢光體粒子的含量保持60.0質量%的方式調整各成分的量,此外,以與比較例5相同的方式製作螢光體片材,並確認片材製作用樹脂液的塗佈性、及基材剝離性。塗佈時產生螢光體片材製作用樹脂液的收縮,藉由加熱、硬化而得的螢光體片材的膜厚不均勻。將積層體轉印至玻璃基板後,若將基材膜剝離,則螢光體片材會一直與玻璃基板密接而不會剝離或損傷,從而可容易地僅將 基材膜剝離。 The fluorenone fine particles 1 were added in an amount as shown in Table 1, and the amount of each component was adjusted so that the content of the phosphor particles in the phosphor sheet was kept at 60.0% by mass, and Comparative Example 5 was used. In the same manner, a phosphor sheet was produced, and the coatability of the resin liquid for sheet production and the peelability of the substrate were confirmed. At the time of coating, shrinkage of the resin liquid for producing a phosphor sheet is caused, and the thickness of the phosphor sheet obtained by heating and hardening is not uniform. After the laminated body is transferred to the glass substrate, when the base film is peeled off, the phosphor sheet is always in close contact with the glass substrate without being peeled off or damaged, so that it can be easily The base film is peeled off.
以相同的方式在LED元件上貼附螢光體片材,進行點亮並測定發光色,結果,由於膜厚偏差大,因此相關色溫度的偏差亦大於實施例1~實施例4,白色LED無法獲得充分的均勻性。 The phosphor sheet is attached to the LED element in the same manner, and the luminescent color is measured by lighting. As a result, the variation in the correlated color temperature is larger than that of the first to fourth embodiments, and the white LED is larger. Unable to achieve sufficient uniformity.
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| JP6481154B2 (en) * | 2014-10-18 | 2019-03-13 | エムテックスマート株式会社 | How to apply powder |
| WO2018235447A1 (en) * | 2017-06-21 | 2018-12-27 | 積水ポリマテック株式会社 | Composite molded body |
| TWI848915B (en) * | 2017-07-28 | 2024-07-21 | 日商杜邦東麗特殊材料股份有限公司 | Resin sheet for optical component, optical component, laminate or light-emitting element having the same, and method for producing resin sheet for optical component |
| US10879431B2 (en) * | 2017-12-22 | 2020-12-29 | Lumileds Llc | Wavelength converting layer patterning for LED arrays |
| US10590339B2 (en) * | 2018-05-16 | 2020-03-17 | Osram Opto Semiconductors Gmbh | Method for producing a converter element, converter element and light emitting device |
| KR102038228B1 (en) * | 2018-07-31 | 2019-10-29 | 도레이첨단소재 주식회사 | Color change sheet and backlight unit including the same |
| JP2020029525A (en) * | 2018-08-23 | 2020-02-27 | 株式会社オリジン | Coating composition, coated article, and method for producing coated article |
| US20230104278A1 (en) * | 2020-03-24 | 2023-04-06 | Denka Company Limited | Phosphor particle, composite, light- emitting device, and self-light-emitting display |
| WO2022030400A1 (en) * | 2020-08-07 | 2022-02-10 | デンカ株式会社 | Fluorescent coating material, coating film, fluorescent substrate, and illumination device |
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