TWI540741B - Solar cellmanufacturing method - Google Patents

Description

Solar cell manufacturing method 【0001】

The present invention relates to a solar cell manufacturing method, and more particularly to a solar cell manufacturing method using a copper alloy slurry as a material of an electrode layer.

【0002】

Recently, countries around the world have gradually paid attention to the development of alternative energy sources. Among them, solar cell systems that use photoelectric conversion technology to convert solar energy into electrical energy are one of the research and development priorities.

[0003]

In the conventional solar cell, the material of the electrode layer is mostly silver, that is, the electrode layer is formed on the substrate by silver paste printing.

[0004]

However, it is conventional to use a silver paste to form an electrode layer, which will greatly increase the overall manufacturing cost of the solar cell. Therefore, how to improve the structure and process of the solar cell and effectively reduce the cost is an urgent problem to be solved in the industry.

[0005]

In view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a solar cell manufacturing method to solve the problems to be improved.

[0006]

In accordance with the purpose of the present invention, a method of fabricating a solar cell is provided that includes the steps of providing a substrate. A semiconductor layer is formed on the substrate. An antireflection layer is formed on the semiconductor layer. The electrode layer is formed on one side of the substrate opposite to the semiconductor layer. An aluminum metal layer is formed on the face of the substrate opposite the semiconductor layer. A plurality of trenches are formed on the anti-reflective layer by a laser process. A copper alloy electrode layer contacting the semiconductor layer is formed in the plurality of trenches by a printing process.

【0007】

Preferably, the substrate may be a single crystal germanium substrate, a polycrystalline germanium substrate or an amorphous germanium substrate.

[0008]

Preferably, the material of the anti-reflection layer may be tantalum nitride, hafnium oxynitride or hafnium oxide.

【0009】

Preferably, the electrode layer can be formed by printing a copper alloy slurry or a silver paste.

[0010]

In accordance with the purpose of the present invention, a solar cell manufacturing method is further provided which comprises the steps of providing a substrate. A semiconductor layer is formed on the substrate. An antireflection layer is formed on the semiconductor layer. The electrode layer is formed on one side of the substrate opposite to the semiconductor layer. An aluminum metal layer is formed on the face of the substrate opposite the semiconductor layer. A silver paste layer is formed on the partial anti-reflection layer. A copper alloy electrode layer is formed on the silver paste layer by a printing process. The silver paste layer is penetrated through the anti-reflection layer by a sintering process and contacts the semiconductor layer.

[0011]

According to an object of the present invention, there is further provided a solar cell manufacturing method comprising the steps of: providing a substrate. A semiconductor layer is formed on the substrate. An antireflection layer is formed on the semiconductor layer. A copper alloy electrode layer is formed on one side of the substrate opposite to the semiconductor layer. An aluminum metal layer is formed on the face of the substrate opposite the semiconductor layer. An electrode layer is formed on the antireflection layer.

[0012]

Preferably, the electrode layer can be formed by printing a copper alloy slurry, a silver paste, or a combination thereof.

[0013]

As described above, the method for manufacturing a solar cell of the present invention can form an electrode layer by printing a copper alloy paste instead of the conventional silver paste printing, thereby achieving the purpose of greatly reducing the overall manufacturing cost, and the solar energy produced thereby. The conductive resistance of the battery can be lower than that of the conventional solar battery, and the conversion efficiency is similar to that of the conventional solar battery. In addition, the present invention discards the electroplating method, and the copper alloy slurry is formed on the substrate by the printing method to avoid the environment. The problem of pollution arises.

[0055]

11‧‧‧Substrate
12‧‧‧Semiconductor layer
13‧‧‧Anti-reflective layer
131‧‧‧ trench
14‧‧‧Electrode layer
15‧‧‧Aluminum metal layer
16‧‧‧ copper alloy electrode layer
17‧‧‧ Silver layer
Steps S11 to S17, S31 to S38, S51 to S56‧‧

[0014]

Fig. 1 is a first flow chart of a method of manufacturing a solar cell of the present invention.
2A to 2D are schematic views showing the manufacturing process of the first embodiment of the solar cell manufacturing method of the present invention.
Fig. 3 is a second flow chart of the solar cell manufacturing method of the present invention.
4A and 4B are schematic views showing the manufacturing process of the second embodiment of the solar cell manufacturing method of the present invention.
Fig. 5 is a third flow chart of the solar cell manufacturing method of the present invention.
Fig. 6 is a schematic view showing the structure of a solar cell of the solar cell manufacturing method of the present invention.

[0015]

The technical features, contents, and advantages of the present invention and the efficacies thereof can be understood by the present inventors. The present invention will be described in conjunction with the drawings and will be described in detail with reference to the embodiments. The subject matter is only for the purpose of illustration and description. It is not intended to be a true proportion and precise configuration after the implementation of the present invention. Therefore, the scope and configuration relationship of the attached drawings should not be interpreted or limited. First described.

[0016]

Please refer to FIG. 1 , which is a first flow chart of a method for manufacturing a solar cell of the present invention. As shown in the figure, the solar cell manufacturing method of the present invention comprises the following steps:

[0017]

In step S11: a substrate is provided. The substrate may be a single crystal germanium substrate, a polycrystalline germanium substrate or an amorphous germanium substrate.

[0018]

In step S12, a semiconductor layer is formed on the substrate.

[0019]

In step S13: an anti-reflection layer is formed on the semiconductor layer. The material of the anti-reflection layer may be tantalum nitride, hafnium oxynitride or hafnium oxide.

[0020]

In step S14, the electrode layer is formed on one side of the substrate opposite to the semiconductor layer. The electrode layer can be formed by printing a copper alloy slurry or a silver paste.

[0021]

In step S15, an aluminum metal layer is formed on the face of the substrate opposite to the semiconductor layer.

[0022]

In step S16, a plurality of trenches are formed on the anti-reflection layer by a laser process.

[0023]

In step S17, a copper alloy electrode layer contacting the semiconductor layer is formed in the plurality of trenches by a printing process.

[0024]

Please refer to FIGS. 2A to 2D, which are schematic diagrams showing the manufacturing process of the first embodiment of the solar cell manufacturing method of the present invention. As shown in FIG. 2A, first, a semiconductor layer 12 is formed on the substrate 11, and an anti-reflection layer 13 is formed on the semiconductor layer 12; wherein the semiconductor layer 12 is formed on the substrate 11 by a diffusion process, and the substrate is bonded to the substrate A PN junction is formed between 11 and, in other words, when the substrate 11 is a P-type semiconductor substrate, the semiconductor layer 12 is an N-type semiconductor layer; conversely, if the substrate 11 is an N-type semiconductor substrate, the semiconductor layer 12 is a P-type semiconductor. Floor.

[0025]

On the other side of the substrate 11, an electrode layer 14 is formed, that is, on one side of the opposite semiconductor layer 12; and an aluminum metal layer 15 is additionally formed on the surface of the substrate 11 opposite to the semiconductor layer 12 (as shown in FIG. 2B).

[0026]

Then, a plurality of trenches 131 are formed on the anti-reflective layer 13 by a laser process (as shown in FIG. 2C); and the copper alloy paste is printed in the plurality of trenches 131 by a printing process after precise alignment. Further, a copper alloy electrode layer 16 is formed in contact with the semiconductor layer 12 (as shown in FIG. 2D); in other words, in order to make the copper alloy electrode layer 16 in ohmic contact with the semiconductor layer 12, the trench 131 must be formed via the laser. The copper alloy electrode layer 16 can be in contact with the semiconductor layer 12 through the anti-reflection layer 13.

[0027]

Please refer to FIG. 3, which is a second flow chart of the solar cell manufacturing method of the present invention. As shown in the figure, in the second embodiment of the present invention, the solar cell manufacturing method comprises the following steps:

[0028]

In step S31: a substrate is provided. The substrate may be a single crystal germanium substrate, a polycrystalline germanium substrate or an amorphous germanium substrate.

[0029]

In step S32, a semiconductor layer is formed on the substrate.

[0030]

In step S33, an antireflection layer is formed on the semiconductor layer. The material of the anti-reflection layer may be tantalum nitride, hafnium oxynitride or hafnium oxide.

[0031]

In step S34, an electrode layer is formed on one side of the substrate opposite to the semiconductor layer. The electrode layer can be formed by printing a copper alloy slurry or a silver paste.

[0032]

In step S35, an aluminum metal layer is formed on the face of the substrate opposite to the semiconductor layer.

[0033]

In step S36, a silver paste layer is formed on the partial anti-reflection layer.

[0034]

In step S37, a copper alloy electrode layer is formed on the silver paste layer by a printing process.

[0035]

In step S38, the silver paste layer is penetrated through the anti-reflection layer by a sintering process and contacts the semiconductor layer.

[0036]

It can be seen from the above process that the solar cell manufacturing method proposed in the second embodiment initially forms the semiconductor layer 12 and the anti-reflection layer 13 on the substrate 11 as in the first embodiment, and forms the electrode layer 14 on the other surface of the substrate 11. And an aluminum metal layer 15.

[0037]

4A and 4B are schematic views showing the manufacturing process of the second embodiment of the solar cell manufacturing method of the present invention. As shown in FIG. 4A, in the manufacturing process, the silver paste layer 17 is formed on the partial anti-reflection layer 13 and the copper alloy electrode layer 16 is formed on the silver paste layer 17.

[0038]

As shown in FIG. 4B, further, through the sintering process, the silver paste layer 17 (containing the glass powder in the silver paste) penetrates (burns through) the anti-reflection layer 13 during the sintering process, and is in phase with the semiconductor layer 12. Contacting, in turn, causes the copper alloy electrode layer 16 to make an ohmic contact with the semiconductor layer 12 by the silver paste layer 17.

[0039]

Please refer to FIG. 5, which is a third flowchart of the solar cell manufacturing method of the present invention. As shown in the figure, in the third embodiment, the solar cell manufacturing method of the present invention comprises the following steps:

[0040]

In step S51, a substrate is provided. The substrate may be a single crystal germanium substrate, a polycrystalline germanium substrate or an amorphous germanium substrate.

[0041]

In step S52, a semiconductor layer is formed on the substrate.

[0042]

In step S53, an anti-reflection layer is formed on the semiconductor layer. The material of the anti-reflection layer may be tantalum nitride, hafnium oxynitride or hafnium oxide.

[0043]

In step S54, a copper alloy electrode layer is formed on one side of the substrate opposite to the semiconductor layer.

[0044]

In step S55, an aluminum metal layer is formed on the surface of the substrate opposite to the semiconductor layer.

[0045]

In step S56, an electrode layer is formed on the anti-reflection layer. The electrode layer can be formed by printing a copper alloy slurry, a silver paste, or a combination thereof. If the electrode layer is printed by a copper alloy slurry, please refer to the first embodiment or the second embodiment for the detailed formation process, and no further details will be described herein.

[0046]

Continuingly, in the third embodiment, the solar cell has a structural portion similar to that of the first embodiment and the second embodiment, but as shown in FIG. 6, it is printed by using a copper alloy paste. On the one surface of the substrate 11 with respect to the semiconductor layer 12, a copper alloy electrode layer 16 is formed on the other surface of the substrate 11, which is different from the solar cell described above.

[0047]

Next, please refer to Table 1, which is a comparison of the relevant parameters of two different proportions of copper alloy slurry and solar cells made by conventional silver paste.

[0048]

Table I

[0049]

[0050]

Series resistance conversion efficiency component insulation capacity copper alloy 1 2.65 17.53% 219 copper alloy 2 2.74 17.32% 185 silver 2.74 17.72% 185 Among them, it should be noted that the series resistance value in Table 1 is low, the conversion efficiency value is high. Preferably, the component insulation capability value is also high; and the copper alloy 1 and copper alloy 2 groups of different ratios as shown in Table 1 have been tested, and the relevant parameters are slightly lower than the conventional conversion efficiency. Group, other parameters are no worse than conventional solar cells.

[0051]

Further, it is understood that the method for producing a solar cell of the present invention is formed by replacing the conventional silver paste printing with a copper alloy paste to form an electrode layer, thereby achieving a purpose of greatly reducing the overall manufacturing cost.

[0052]

The solar cell made of the copper alloy slurry instead of the silver paste can have lower conductivity than the conventional solar cell, and the component insulating ability is higher than that of the conventional solar cell, and the conversion efficiency is almost the same as that of the conventional solar cell; The performance of the solar cell made by replacing the silver paste with a copper alloy slurry is not inferior to that of the conventional solar cell, and has the advantage of low cost.

[0053]

In addition, it is worth mentioning that the present invention uses a copper alloy slurry to discard the plating method, but uses a copper alloy slurry to form an electrode layer on the substrate by printing to avoid the problem of environmental pollution.

[0054]

In view of the above, the solar cell manufacturing method of the present invention is unattainable by the prior art, and has indeed achieved the desired effect, and is not familiar with the skill of the artist, and is highly progressive and practical. Sexuality, obviously has met the requirements of the patent application, 提出 filed a patent application according to law, and asks your office to approve the invention patent application, in order to encourage creation, to the sense of virtue.

Domestic registration information [please note according to the registration authority, date, number order]
No foreign deposit information [please note according to the country, organization, date, number order]
no

no

Steps S11 to S17‧‧

Claims (12)

[Item 1] A solar cell manufacturing method comprising the following steps:
Providing a substrate;
Forming a semiconductor layer on the substrate;
Forming an anti-reflection layer on the semiconductor layer;
Forming an electrode layer on a side of the substrate opposite to the semiconductor layer;
Forming an aluminum metal layer on the side of the substrate opposite to the semiconductor layer;
Forming a plurality of trenches on the anti-reflective layer by a laser process; and forming a copper alloy electrode layer contacting the semiconductor layer in the plurality of trenches by a printing process. [Item 2] The solar cell manufacturing method according to claim 1, wherein the substrate is a single crystal germanium substrate, a polycrystalline germanium substrate or an amorphous germanium substrate. [Item 3] The method for manufacturing a solar cell according to claim 1, wherein the anti-reflection layer is made of tantalum nitride, hafnium oxynitride or hafnium oxide. [Item 4] The method of manufacturing a solar cell according to claim 1, wherein the electrode layer is formed by printing a copper alloy slurry or a silver paste. [Item 5] A solar cell manufacturing method comprising the following steps:
Providing a substrate;
Forming a semiconductor layer on the substrate;
Forming an anti-reflection layer on the semiconductor layer;
Forming an electrode layer on a side of the substrate opposite to the semiconductor layer;
Forming an aluminum metal layer on the side of the substrate opposite to the semiconductor layer;
Forming a silver paste layer on a portion of the anti-reflective layer;
Forming a copper alloy electrode layer on the silver paste layer by a printing process; and passing the silver paste layer through the anti-reflection layer by a sintering process and contacting the semiconductor layer. [Item 6] The solar cell manufacturing method according to claim 5, wherein the substrate is a single crystal germanium substrate, a polycrystalline germanium substrate or an amorphous germanium substrate. [Item 7] The method for manufacturing a solar cell according to claim 5, wherein the anti-reflection layer is made of tantalum nitride, hafnium oxynitride or hafnium oxide. [Item 8] The method of manufacturing a solar cell according to claim 5, wherein the electrode layer is formed by printing a copper alloy slurry or a silver paste. [Item 9] A solar cell manufacturing method comprising the following steps:
Providing a substrate;
Forming a semiconductor layer on the substrate;
Forming an anti-reflection layer on the semiconductor layer;
Forming a copper alloy electrode layer on a side of the substrate opposite to the semiconductor layer;
Forming an aluminum metal layer on the surface of the substrate opposite to the semiconductor layer; and forming an electrode layer on the anti-reflection layer. [Item 10] The solar cell manufacturing method according to claim 9, wherein the substrate is a single crystal germanium substrate, a polycrystalline germanium substrate or an amorphous germanium substrate. [Item 11] The solar cell manufacturing method according to claim 9, wherein the anti-reflection layer is made of tantalum nitride, hafnium oxynitride or hafnium oxide. [Item 12] The method of manufacturing a solar cell according to claim 9, wherein the electrode layer is formed by printing a copper alloy slurry, a silver paste, or a combination thereof.