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TWI540182B - A hardened silicone resin composition and a hardened product thereof, and a light-cured semiconductor device - Google Patents

A hardened silicone resin composition and a hardened product thereof, and a light-cured semiconductor device Download PDF

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Publication number
TWI540182B
TWI540182B TW104124159A TW104124159A TWI540182B TW I540182 B TWI540182 B TW I540182B TW 104124159 A TW104124159 A TW 104124159A TW 104124159 A TW104124159 A TW 104124159A TW I540182 B TWI540182 B TW I540182B
Authority
TW
Taiwan
Prior art keywords
group
component
sio
composition
resin
Prior art date
Application number
TW104124159A
Other languages
English (en)
Chinese (zh)
Other versions
TW201609977A (zh
Inventor
河合亘
秋山勝宏
松野佑
中辻惇也
情野真
Original Assignee
中央硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015131140A external-priority patent/JP2016169358A/ja
Application filed by 中央硝子股份有限公司 filed Critical 中央硝子股份有限公司
Publication of TW201609977A publication Critical patent/TW201609977A/zh
Application granted granted Critical
Publication of TWI540182B publication Critical patent/TWI540182B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H10W74/10—
    • H10W74/40—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW104124159A 2014-07-24 2015-07-24 A hardened silicone resin composition and a hardened product thereof, and a light-cured semiconductor device TWI540182B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014150494 2014-07-24
JP2015050137 2015-03-13
JP2015131140A JP2016169358A (ja) 2014-07-24 2015-06-30 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置

Publications (2)

Publication Number Publication Date
TW201609977A TW201609977A (zh) 2016-03-16
TWI540182B true TWI540182B (zh) 2016-07-01

Family

ID=55162950

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104124159A TWI540182B (zh) 2014-07-24 2015-07-24 A hardened silicone resin composition and a hardened product thereof, and a light-cured semiconductor device

Country Status (2)

Country Link
TW (1) TWI540182B (fr)
WO (1) WO2016013421A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6656045B2 (ja) * 2016-03-29 2020-03-04 信越化学工業株式会社 担持白金触媒を含有する樹脂組成物、及びそれを用いた熱硬化性オルガノポリシロキサン組成物ならびにその硬化方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5132027B2 (ja) * 2004-05-12 2013-01-30 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP4841846B2 (ja) * 2005-02-02 2011-12-21 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP4636242B2 (ja) * 2005-04-21 2011-02-23 信越化学工業株式会社 光半導体素子封止材及び光半導体素子
JP5259947B2 (ja) * 2006-11-24 2013-08-07 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 半導体封止用シリコーン組成物および半導体装置
JP2009114365A (ja) * 2007-11-08 2009-05-28 Momentive Performance Materials Japan Kk 光半導体用シリコーン接着剤組成物及びそれを用いた光半導体装置
JP5693063B2 (ja) * 2010-07-01 2015-04-01 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP6213257B2 (ja) * 2013-01-25 2017-10-18 セントラル硝子株式会社 シリコーンを含む硬化性組成物およびその硬化物

Also Published As

Publication number Publication date
TW201609977A (zh) 2016-03-16
WO2016013421A1 (fr) 2016-01-28

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MM4A Annulment or lapse of patent due to non-payment of fees